Heat dissipation device for air conditioner and air conditioner

Abstract

The utility model relates to the technical field of household appliances, and discloses a heat dissipation device for an air conditioner, the air conditioner comprises a refrigerant circulation loop and a to-be-cooled element, and the heat dissipation device comprises a shell and a refrigerant heat dissipation assembly. The shell is provided with a mounting cavity for mounting a to-be-cooled element; the refrigerant heat dissipation assembly comprises a liquid inlet pipe, a liquid outlet pipe and a heat dissipation part, the heat dissipation part is installed at the position, corresponding to the element to be cooled, of the installation cavity, and the heat dissipation part communicates with the refrigerant circulation loop through the liquid inlet pipe and the liquid outlet pipe. And a refrigerant flowing into the liquid inlet pipe from the refrigerant circulation loop is a low-temperature refrigerant. Through the arrangement, the heat dissipation efficiency of the to-be-cooled element can be improved, and the to-be-cooled element is prevented from being in a high-temperature state. Meanwhile, the utility model further discloses the air conditioner.

Description

Technical Field

[0001] The present application relates to the technical field of household appliances, for example, to a heat dissipation device for an air conditioner and an air conditioner. Background Art

[0002] At present, air conditioners have been widely used in people's daily life. People can use air conditioners to cool or heat the room to adjust the indoor temperature. However, with the development of society and the improvement of living standards, people's requirements for the quality of life are getting higher and higher. For example, people now also set up main control boards such as IPM (intelligent power module) in air conditioners to integrate multiple functions into one module, thereby achieving more accurate and efficient control of the motor, which is crucial for variable frequency air conditioners. However, during use, the above-mentioned main control board will generate heat and keep itself in a high temperature state. If it is in a high temperature state for a long time, its life will be reduced.

[0003] In the related art, for example, a heat dissipation hole is generally provided on the housing where the main control board is installed, and a fan is provided at the position corresponding to the main control board of the air conditioner. In this way, if the temperature of the main control board is high, the fan can be turned on to allow the air in the housing to flow through the heat dissipation hole, thereby achieving the effect of cooling the main control board.

[0004] In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art:

[0005] In the related art, the existing air conditioner is provided with a fan and heat dissipation holes, which can only remove the heat dissipated by the main control board through air flow, and the heat dissipation effect is poor. The main control board may still be in a high temperature state for a long time.

[0006] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present application, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0007] In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. The summary is not an extensive review, nor is it intended to identify key / critical components or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

[0008] The disclosed embodiment provides a heat dissipation device for an air conditioner and an air conditioner. When the temperature of the heat dissipation element to be cooled by the main control board in the air conditioner is high, the low-temperature refrigerant in the refrigerant circulation loop can be introduced into the heat dissipation device, and the heat dissipation element to be cooled in the air conditioner can be cooled by the heat dissipation device. Such a configuration can improve the heat dissipation efficiency of the heat dissipation element to be cooled, thereby preventing the heat dissipation element from being in a high temperature state.

[0009] The embodiment of the present disclosure provides a heat dissipation device for an air conditioner, the air conditioner includes a refrigerant circulation loop and a heat dissipation element to be dissipated, and the heat dissipation device includes: a housing and a refrigerant heat dissipation assembly. The housing is provided with an installation cavity for installing the heat dissipation element to be dissipated; the refrigerant heat dissipation assembly includes a liquid inlet pipe, a liquid outlet pipe and a heat dissipation part, the heat dissipation part is installed at a position corresponding to the installation cavity and the heat dissipation element to be dissipated, and the heat dissipation part is connected to the refrigerant circulation loop through the liquid inlet pipe and the liquid outlet pipe.

[0010] In some embodiments, the heat dissipation device further comprises: a valve element. The valve element is disposed on the liquid inlet pipe of the refrigerant heat dissipation component and is used to open or block the liquid inlet pipe; when the valve element opens the liquid inlet pipe, the opening of the valve element can also be controlled to control the refrigerant flow in the liquid inlet pipe.

[0011] In some embodiments, the heat dissipation device further includes: a temperature sensor and a control unit. The temperature sensor is used to obtain the temperature of the element to be cooled; the control unit is electrically connected to the temperature sensor and the valve element respectively to control the valve element to conduct or block the liquid inlet pipe according to the temperature of the element to be cooled.

[0012] In some embodiments, the air conditioner also includes a fan; the side wall of the shell is provided with an air inlet and an air outlet, and the air inlet and the air outlet are relatively arranged on both sides of the heat dissipation element; wherein the fan is arranged at a position of the air conditioner corresponding to the air outlet, and the air supply direction of the fan is limited to away from the air outlet.

[0013] In some embodiments, the air outlet of the shell is further provided with a water baffle, and the water baffle is arranged corresponding to the fan.

[0014] In some embodiments, the water retaining plate includes: a first water retaining portion. One side of the first water retaining portion is connected to the lower end of the air outlet, and the other side of the first water retaining portion is extended obliquely upward in a direction close to the installation cavity.

[0015] In some embodiments, the fan is located below the air outlet; the water retaining part further includes: a second water retaining part. One side of the second water retaining part is connected to the lower end of the air outlet, and the other side of the second water retaining part is extended in a direction away from the installation cavity.

[0016] In some embodiments, the installation cavity and the liquid inlet pipe and the liquid outlet pipe are provided with buckles corresponding to each other, and the liquid inlet pipe and the liquid outlet pipe can be buckled to the buckles.

[0017] The disclosed embodiment also provides an air conditioner comprising: an air conditioner body and the above-mentioned heat dissipation device for the air conditioner; wherein the air conditioner body comprises a component to be cooled, and the above-mentioned heat dissipation device for the air conditioner is installed at a position corresponding to the air conditioner body and the component to be cooled.

[0018] In some embodiments, the heat dissipation device includes a housing provided with an air outlet; the air conditioner body further includes a fan installed at a position of the air conditioner body corresponding to the air outlet; wherein the air supply direction of the fan is limited to away from the air outlet.

[0019] The heat dissipation device for an air conditioner and the air conditioner provided in the embodiments of the present disclosure can achieve the following technical effects:

[0020] The embodiment of the present disclosure provides a heat dissipation device for an air conditioner, the air conditioner includes a refrigerant circulation loop and a heat dissipation element to be dissipated, and the heat dissipation device includes: a housing and a refrigerant heat dissipation assembly. The housing is provided with an installation cavity for installing the heat dissipation element to be dissipated; the refrigerant heat dissipation assembly includes a liquid inlet pipe, a liquid outlet pipe and a heat dissipation part, the heat dissipation part is installed at a position corresponding to the installation cavity and the heat dissipation element to be dissipated, and the heat dissipation part is connected to the refrigerant circulation loop through the liquid inlet pipe and the liquid outlet pipe. Among them, the refrigerant flowing into the liquid inlet pipe of the refrigerant circulation loop is a low-temperature refrigerant. In this way, if the temperature of the heat dissipation element to be dissipated in the air conditioner is greater than or equal to the temperature threshold, the low-temperature refrigerant in the refrigerant circulation loop can flow into the heat dissipation part through the liquid inlet pipe. At this time, the low-temperature refrigerant in the heat dissipation part can absorb the heat of the heat dissipation element to be dissipated, so as to achieve heat dissipation of the heat dissipation element. After the low-temperature refrigerant in the heat dissipation part absorbs the heat, it can flow back into the refrigerant circulation loop through the liquid outlet pipe to complete the refrigerant circulation. Such a configuration can improve the heat dissipation efficiency of the heat dissipation element to be dissipated, thereby avoiding the heat dissipation element to be in a high temperature state.

[0021] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] One or more embodiments are exemplarily described by corresponding drawings, which do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements, and the drawings do not constitute a scale limitation, and wherein:

[0023] Figure 1 is a structural schematic diagram of a heat dissipation device for an air conditioner provided by an embodiment of the present disclosure;

[0024] Figure 2 is a top view of a heat dissipation device for an air conditioner provided by an embodiment of the present disclosure;

[0025] Figure 3 is a schematic structural diagram of a refrigerant heat dissipation component provided by an embodiment of the present disclosure;

[0026] Figure 4 is a structural schematic diagram of a housing provided by an embodiment of the present disclosure;

[0027] Figure 5is an airflow direction diagram in an installation cavity provided by an embodiment of the present disclosure;

[0028] Figure 6 It is a schematic diagram of the partial structure of a shell provided in an embodiment of the present disclosure.

[0029] Reference numerals:

[0030] 01: Components to be cooled;

[0031] 10: housing; 11: mounting cavity; 12: air inlet; 13: air outlet; 14: water retaining plate; 141: first water retaining part; 142: second water retaining part;

[0032] 20: refrigerant heat dissipation component; 21: liquid inlet pipe; 22: liquid outlet pipe; 23: heat dissipation part. DETAILED DESCRIPTION

[0033] In order to be able to understand the features and technical contents of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0034] The terms "first", "second", etc. in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchanged where appropriate, so that the embodiments of the embodiments of the present disclosure described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0035] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0036] In addition, the terms "disposed", "connected", and "fixed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0037] Unless otherwise stated, the term "plurality" means two or more.

[0038] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B indicates: A or B.

[0039] The term "and / or" is a description of the association relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or, A and B.

[0040] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

[0041] Combination Figures 1 to 6 As shown, the embodiment of the present disclosure provides a heat dissipation device for an air conditioner and an air conditioner. When the temperature of the heat dissipation element 01 to be cooled by the main control board in the air conditioner is high, the low-temperature refrigerant in the refrigerant circulation loop can be introduced into the heat dissipation device, and the heat dissipation element 01 to be cooled in the air conditioner can be cooled by the heat dissipation device. Such a configuration can improve the heat dissipation efficiency of the heat dissipation element 01 to be cooled, thereby preventing the heat dissipation element 01 from being in a high temperature state.

[0042] like Figures 1 to 6 As shown, the embodiment of the present disclosure provides a heat dissipation device for an air conditioner, the air conditioner includes a refrigerant circulation loop and a heat dissipation element 01, and the heat dissipation device includes: a housing 10 and a refrigerant heat dissipation assembly 20. The housing 10 is provided with an installation cavity 11 for installing the heat dissipation element 01; the refrigerant heat dissipation assembly 20 includes a liquid inlet pipe 21, a liquid outlet pipe 22 and a heat dissipation portion 23, the heat dissipation portion 23 is installed at a position corresponding to the installation cavity 11 and the heat dissipation element 01, and the heat dissipation portion 23 is connected to the refrigerant circulation loop through the liquid inlet pipe 21 and the liquid outlet pipe 22.

[0043] Specifically, the pipe section of the refrigerant circulation loop connected to the liquid inlet pipe 21 is used for the circulation of low-temperature refrigerant. The heat dissipation part 23 is provided with a heat dissipation surface, and the heat dissipation surface is attached to the heat dissipation element 01, so that heat exchange is performed between the heat dissipation part 23 and the heat dissipation element 01. A flow cavity is provided in the heat dissipation part 23, and the flow cavity is respectively connected to the liquid inlet pipe 21 and the liquid outlet pipe 22.

[0044] When the temperature of the heat dissipation element 01 is greater than or equal to the temperature threshold, the low-temperature refrigerant in the refrigerant circulation loop can flow into the flow cavity of the heat dissipation portion 23 through the liquid inlet pipe 21. At this time, the low-temperature refrigerant in the flow cavity can absorb the heat of the heat dissipation element 01 through the heat dissipation surface to dissipate the heat of the heat dissipation element 01.

[0045] After the refrigerant in the flow cavity absorbs the heat of the heat dissipation element 01, it can flow back into the refrigerant circulation loop through the liquid outlet pipe 22 to realize the refrigerant circulation.

[0046] In actual applications, the size and shape of the flow cavity can be set according to the actual needs of the user. For example, the user can determine the size and shape of the flow cavity according to the size and shape of the heat dissipation element 01, as long as the range in which the refrigerant in the flow cavity can absorb heat is greater than or equal to the size of the heat dissipation element 01.

[0047] In some practical applications, the flow cavity is a cube or a cuboid, so that more low-temperature refrigerant can be contained in the flow cavity to quickly absorb the heat of the heat dissipation element 01.

[0048] In other practical applications, the flow cavity is a groove-shaped structure with a bent arrangement, and the two ends of the flow cavity are respectively connected to the liquid inlet pipe 21 and the liquid outlet pipe 22. In this way, the low-temperature refrigerant can flow into the flow cavity from the first end through the liquid inlet pipe 21, and flow into the liquid outlet pipe 22 from the second end of the flow cavity after flowing through the entire flow cavity. In this way, the flow direction of the refrigerant in the flow cavity and the degree of orderliness of the refrigerant flow can be limited, so as to ensure that the refrigerant in the flow cavity flows out of the flow cavity through the liquid outlet pipe 22 in time after absorbing heat.

[0049] In some embodiments, the heat dissipation device further includes: a valve element. The valve element is disposed on the liquid inlet pipe 21 of the refrigerant heat dissipation assembly 20, and is used to conduct or block the liquid inlet pipe 21; when the valve element conducts the liquid inlet pipe 21, the opening of the valve element can also be controlled to control the refrigerant flow rate of the liquid inlet pipe 21.

[0050] Specifically, when the temperature of the heat dissipation element 01 is greater than or equal to the temperature threshold, the valve element can be opened to connect the liquid inlet pipe 21. At this time, the low-temperature refrigerant in the refrigerant circulation loop can flow into the heat dissipation portion 23 through the liquid inlet pipe 21.

[0051] At the same time, when the valve element is opened, the flow rate of the liquid inlet pipe 21 can be controlled by controlling the opening of the valve element, thereby controlling the heat dissipation efficiency of the heat dissipation part 23 to the heat dissipation element 01 .

[0052] It is understandable that when the valve element is open, the heat sink will divert the low-temperature refrigerant in the refrigerant circulation loop. Therefore, the user can control the opening of the valve element according to the operation of the air conditioner to prevent the heat sink from affecting the cooling or heating efficiency of the air conditioner.

[0053] In some embodiments, the heat dissipation device further includes: a temperature sensor and a control unit. The temperature sensor is used to obtain the temperature of the heat dissipation element 01; the control unit is electrically connected to the temperature sensor and the valve element respectively to control the valve element to conduct or block the liquid inlet pipe 21 according to the temperature of the heat dissipation element 01.

[0054] Specifically, the temperature sensor is arranged at a position of the heat dissipation device corresponding to the element 01 to be cooled. For example, the temperature sensor can be installed on the heat dissipation surface of the heat dissipation part 23 to facilitate the temperature sensor to obtain the temperature of the element 01 to be cooled.

[0055] When the temperature sensor obtains that the temperature of the heat dissipation element 01 is greater than or equal to the temperature threshold, the temperature sensor can send a high temperature signal to the control unit. After receiving the high temperature signal, the control unit opens the valve element to conduct the liquid inlet pipe 21.

[0056] At the same time, when the valve element is open, the control unit can also adjust the opening of the valve element according to the temperature of the element to be cooled 01 to achieve dynamic adjustment of the flow rate of the liquid inlet pipe 21.

[0057] When the temperature sensor obtains that the temperature of the heat dissipation element 01 is less than or equal to the temperature threshold, the temperature sensor can send a low temperature signal to the control unit. After receiving the low temperature signal, the control unit closes the valve element to block the liquid inlet pipe 21.

[0058] In some embodiments, the air conditioner also includes a fan (not shown in the figure); the side wall surface of the shell 10 is provided with an air inlet 12 and an air outlet 13, and the air inlet 12 and the air outlet 13 are relatively arranged on both sides of the heat dissipation element 01; wherein the fan is arranged at a position of the air conditioner corresponding to the air outlet 13, and the air supply direction of the fan is limited to away from the air outlet 13.

[0059] Specifically, the air inlet 12 and the air outlet 13 are arranged oppositely on both sides of the heat dissipation element 01 , so that the air flowing into the installation cavity 11 from the air inlet 12 can flow out of the installation cavity 11 from the air outlet 13 after passing through the heat dissipation element 01 .

[0060] When the temperature of the heat dissipation element 01 is greater than or equal to the preset temperature, the fan can be turned on, and the fan makes the vicinity of the air outlet 13 in a negative pressure state, thereby making the air in the installation cavity 11 flow toward the air outlet 13. This arrangement can further improve the heat dissipation efficiency of the heat dissipation element 01.

[0061] In some embodiments, the air outlet 13 of the housing 10 is further provided with a water baffle 14 , and the water baffle 14 is provided corresponding to the fan.

[0062] Specifically, one end of the water baffle 14 is directly connected to the edge of the air outlet 13, and the other end of the water baffle 14 is extended in a direction away from the air outlet 13. The water baffle 14 is arranged on a side of the air outlet 13 close to the fan. For example, if the fan is located below the air outlet 13, one end of the water baffle 14 is connected to the lower edge of the air outlet 13, and the other end is extended in a direction away from the air outlet 13.

[0063] It is understandable that during the operation of the air conditioner, some structural parts may generate condensed water, and the condensed water may drip onto the fan. Therefore, a water baffle 14 is provided at the air outlet 13 to prevent the fan from throwing condensed water into the installation cavity 11 through the air outlet 13 during operation.

[0064] In some embodiments, the water retaining plate 14 includes a first water retaining portion 141 . One side of the first water retaining portion 141 is connected to the lower end of the air outlet 13 , and the other side of the first water retaining portion 141 is extended obliquely upward toward the installation cavity 11 .

[0065] Specifically, one side of the first water retaining portion 141 is bent and connected to the lower edge of the air outlet 13, and the other side of the first water retaining portion 141 extends above the upper edge of the air outlet 13. The angle between the first water retaining portion 141 and the horizontal plane is greater than or equal to 30°, and less than or equal to 80°. For example, the angle between the first water retaining portion 141 and the horizontal plane can be 30°, 45°, 60° or 80°.

[0066] It can be understood that if the angle between the first water retaining portion 141 and the horizontal plane is less than 30°, the gap between the first water retaining portion 141 and the air outlet 13 is large, and the water retaining function cannot be played; if the angle between the first water retaining portion 141 and the horizontal plane is greater than 80°, the gap between the first water retaining portion 141 and the air outlet 13 is small, which will affect the air circulation.

[0067] In some embodiments, the fan is located below the air outlet 13 ; the water retaining part further includes: a second water retaining part 142 . One side of the second water retaining part 142 is connected to the lower end of the air outlet 13 , and the other side extends away from the installation cavity 11 .

[0068] Specifically, the movement direction of the fan blades on the side of the fan close to the air outlet 13 is from bottom to top. One side of the second water retaining portion 142 is connected to the lower edge of the air outlet 13, and the other side of the second water retaining portion 142 is horizontally extended in the direction of the installation cavity 11. The extension length of the second water retaining portion 142 is greater than or equal to the preset length to prevent condensed water on the fan from being thrown into the installation cavity 11.

[0069] In some embodiments, buckles are provided corresponding to the installation cavity 11 and the liquid inlet pipe 21 and the liquid outlet pipe 22 , and the liquid inlet pipe 21 and the liquid outlet pipe 22 can be buckled into the buckles.

[0070] Specifically, the inner wall surface of the mounting cavity 11 is provided with a first buckle and a second buckle, and the first buckle and the second buckle are respectively provided corresponding to the liquid inlet pipe 21 and the liquid outlet pipe 22. In this way, the liquid inlet pipe 21 and the liquid outlet pipe 22 can be respectively connected to the first buckle and the second buckle to prevent the liquid inlet pipe 21 and the liquid outlet pipe 22 from shaking.

[0071] The disclosed embodiment also provides an air conditioner comprising: an air conditioner body and the above-mentioned heat dissipation device for the air conditioner; wherein the air conditioner body comprises a heat dissipation element 01, and the above-mentioned heat dissipation device for the air conditioner is installed at a position corresponding to the air conditioner body and the heat dissipation element 01.

[0072] Specifically, a mounting bracket is provided at a position of the air conditioner corresponding to the element to be cooled 01 , and the heat dissipation device can be mounted on the mounting bracket to dissipate the heat of the element to be cooled 01 .

[0073] In an air conditioner using the heat dissipation device for air conditioners provided by the present application, when the temperature of the heat dissipation element 01 to be cooled by the main control board in the air conditioner is high, the low-temperature refrigerant in the refrigerant circulation loop can be introduced into the heat dissipation device, and the heat dissipation element 01 to be cooled in the air conditioner can be cooled by the heat dissipation device. Such an arrangement can improve the heat dissipation efficiency of the heat dissipation element 01 to be cooled, thereby preventing the heat dissipation element 01 from being in a high temperature state.

[0074] In some embodiments, the heat dissipation device includes a housing 10 provided with an air outlet 13 ; the air conditioner body further includes a fan installed at a position of the air conditioner body corresponding to the air outlet 13 ; wherein the air supply direction of the fan is limited to away from the air outlet 13 .

[0075] Specifically, by making the air supply direction of the fan away from the air outlet 13, the area outside the air outlet 13 can be in a negative pressure state, so that the air in the installation cavity 11 flows into the installation cavity 11 through the air outlet 13. After the fan causes the air in the installation cavity 11 to flow out, the installation cavity 11 is also in a negative pressure state, and the external air is sucked into the installation cavity 11 through the air inlet 12 to achieve air circulation.

[0076] The above description and the accompanying drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Unless explicitly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A heat dissipation device for an air conditioner, the air conditioner comprising a refrigerant circulation loop and a heat dissipation element, characterized in that: The heat dissipation device comprises: The housing is provided with a mounting cavity for mounting the element to be cooled; and, The refrigerant heat dissipation component includes a liquid inlet pipe, a liquid outlet pipe and a heat dissipation part. The heat dissipation part is installed at a position corresponding to the installation cavity and the element to be cooled, and the heat dissipation part is connected to the refrigerant circulation circuit through the liquid inlet pipe and the liquid outlet pipe.

2. The heat dissipation device according to claim 1, characterized in that: Also includes: The valve body element is arranged on the liquid inlet pipe of the refrigerant heat dissipation component and is used to open or block the liquid inlet pipe; When the valve body element is connected to the liquid inlet pipe, the opening of the valve body element can also be controlled to control the refrigerant flow rate of the liquid inlet pipe.

3. The heat dissipation device according to claim 2, characterized in that: Also includes: A temperature sensor, used to obtain the temperature of the component to be cooled; and, The control part is electrically connected to the temperature sensor and the valve element respectively, so as to control the valve element to conduct or block the liquid inlet pipe according to the temperature of the element to be cooled.

4. The heat dissipation device according to claim 1, characterized in that: The air conditioner also includes a fan; The side wall of the shell is provided with an air inlet and an air outlet, and the air inlet and the air outlet are arranged oppositely on two sides of the element to be cooled; The fan is arranged at a position of the air conditioner corresponding to the air outlet, and the air supply direction of the fan is limited to away from the air outlet.

5. The heat dissipation device according to claim 4, characterized in that: The air outlet of the shell is also provided with a water baffle, and the water baffle is arranged corresponding to the fan.

6. The heat dissipation device according to claim 5, characterized in that: The water retaining plate includes: The first water retaining part has one side connected to the lower end of the air outlet, and the other side extending obliquely upward in a direction close to the installation cavity.

7. The heat dissipation device according to claim 6, characterized in that: The fan is located below the air outlet; the water retaining part also includes: The second water retaining part has one side connected to the lower end of the air outlet and the other side extending in a direction away from the installation cavity.

8. The heat dissipation device according to any one of claims 1 to 7, characterized in that: The installation cavity is provided with buckles corresponding to the liquid inlet pipe and the liquid outlet pipe, and the liquid inlet pipe and the liquid outlet pipe can be buckled to the buckles.

9. An air conditioner, characterized in that: include: Air conditioner body; and, The heat dissipation device for an air conditioner according to any one of claims 1 to 8; The air conditioner body includes a heat dissipation component, and the heat dissipation device for the air conditioner is installed at a position of the air conditioner body corresponding to the heat dissipation component.

10. The air conditioner according to claim 9, characterized in that: The heat dissipation element includes a shell provided with an air outlet; The air conditioner body also includes: The fan is installed at a position corresponding to the air outlet of the air conditioner body; The air supply direction of the fan is limited to away from the air outlet.

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