Computer

Abstract

The utility model relates to the technical field of electronic equipment, and discloses a computer, which comprises a case, an opening is formed in one side of the case, and a plurality of elastic pieces are arranged on the inner side wall surface of the case; the support is arranged in the case and comprises at least three side walls, the at least three side walls are sequentially connected to define a containing space used for containing the mechanical hard disk, the mechanical hard disk is fixedly connected with the side walls, and the at least three side walls are fixedly connected with the elastic pieces respectively; the heat dissipation substrate is fixedly connected with the at least two side walls, a gap exists between the heat dissipation substrate and the inner wall of the case, one side of the heat dissipation substrate is attached to the heating surface of the mechanical hard disk, the other side of the heat dissipation substrate is provided with heat dissipation fins, the heat dissipation fins penetrate through the opening, and a gap exists between the heat dissipation fins and the edge of the opening. By means of the mode, natural convection heat dissipation of the mechanical hard disk can be achieved, and the mechanical hard disk can be used in a vibration environment.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic equipment, and specifically to a computer. Background Art

[0002] Modern industrial production has continuously increased the requirements for the computing power and data storage capacity of enclosed small-scale industrial embedded computer equipment. In this case, the embedded computer equipment can be equipped with a mechanical hard disk with a larger storage capacity to meet the computing power and data storage capacity requirements.

[0003] However, the internal space of a closed small-scale industrial embedded computer device is small and compact, and the internal environment temperature is relatively high. The heat dissipation method of the mechanical hard disk through direct contact with the inner wall of the chassis of the embedded computer device cannot meet the application of the embedded computer device in a vibration environment. Utility Model Content

[0004] In view of the above problems, an embodiment of the present application provides a computer that can not only achieve natural convection heat dissipation for a mechanical hard disk, but also enable the use of the mechanical hard disk in a vibration environment.

[0005] According to one aspect of an embodiment of the present application, a computer is provided, which includes: a chassis having an opening on one side, and a plurality of elastic members are provided on the inner wall surface of the chassis; a bracket, which is arranged in the chassis, and includes at least three side walls, and the at least three side walls are connected in sequence to enclose a storage space for accommodating a mechanical hard disk, the mechanical hard disk is fixedly connected to the side walls, and the at least three side walls are respectively fixedly connected to the plurality of elastic members; a heat dissipation substrate, which is fixedly connected to at least two side walls, and there is a gap between the heat dissipation substrate and the inner wall of the chassis, one side of the heat dissipation substrate is in contact with the heating surface of the mechanical hard disk, and the other side is provided with heat dissipation fins, the heat dissipation fins pass through the opening, and there is a gap between the heat dissipation fins and the edge of the opening.

[0006] In an optional embodiment, the computer also includes an annular buffer, which is arranged around the edges of the heat dissipation substrate. One side of the annular buffer is fixedly connected to the heat dissipation substrate, and the other side is fixedly connected to a panel with an opening in the chassis. The annular buffer is used to deform with the relative displacement of the heat dissipation substrate and the chassis.

[0007] In an optional manner, the annular buffer includes a first adhesive layer, a second adhesive layer and a folded section; the first adhesive layer is bonded and fixed to the heat dissipation substrate, and the second adhesive layer is bonded and fixed to a panel with an opening in the chassis; the two ends of the folded section are respectively connected to the first adhesive layer and the second adhesive layer, so as to deform with the relative displacement between the heat dissipation substrate and the chassis.

[0008] In an optional manner, the annular buffer is made of conductive cloth, and the heat dissipation substrate and the chassis are made of metal material.

[0009] In an optional manner, an L-shaped plate is provided on the inner wall of the chassis, and the L-shaped plate includes a first plate body and a second plate body, the first plate body is fixedly connected to the inner wall of the chassis, and the second plate body is fixedly connected to the elastic member.

[0010] In an optional embodiment, a first through hole is provided on the second plate body; the elastic member is a soft rubber block, and a first metal hole and a second metal hole are respectively provided on the bottom and the top of the elastic member, and the first metal hole and the second metal hole are arranged at intervals; the elastic member is fixedly connected to the second plate body by passing through the first metal hole and the first through hole by a first fastener, and at least three side walls are fixedly connected to the elastic member by passing through the second metal hole by a second fastener.

[0011] In an optional manner, a through hole penetrating through two ends of the elastic member is provided between the first metal hole and the second metal hole.

[0012] In an optional manner, a first fixing plate is provided on the top or bottom of the side wall, a third through hole is opened in the first fixing plate, and the first fixing plate is fixedly connected to the elastic member through a second fastener passing through the second metal hole and the third through hole.

[0013] In an optional manner, a second fixing plate is extended from the top of two opposite side walls, the second fixing plate is flush with the heating surface of the mechanical hard disk, and the heat dissipation substrate is fixedly connected to the second fixing plate so that one side of the heat dissipation substrate is in contact with the heating surface of the mechanical hard disk.

[0014] In an optional manner, an insulating layer is provided on the heat dissipation substrate in a region corresponding to the heating surface of the mechanical hard disk, and a heat conducting layer is sandwiched between the insulating layer and the heating surface of the mechanical hard disk.

[0015] In the computer provided in the embodiment of the present application, the mechanical hard disk can be fixed in the accommodating space surrounded by at least three side walls by fixedly connecting the side wall to the mechanical hard disk; by fixedly connecting the heat dissipation substrate to at least two side walls respectively, one side of the heat dissipation substrate can be in contact with the heating surface of the mechanical hard disk to realize heat conduction between the heat dissipation substrate and the heating surface of the mechanical hard disk; and, by fixedly connecting at least three side walls respectively to a plurality of elastic members arranged on the inner wall surface of the chassis, and making a gap between the heat dissipation substrate and the inner wall of the chassis, and making the heat dissipation fins arranged on the other side of the heat dissipation substrate pass through the opening opened on one side of the chassis and having a gap with the edge of the opening, not only can the heat dissipation fins directly contact with the outside air to exchange heat with the outside air, thereby quickly dissipating the heat of the mechanical hard disk, but also when the heat dissipation substrate vibrates in any direction with the bracket, the heat dissipation substrate will not collide with the inner wall of the chassis, and the heat dissipation fins will not collide with the opening, thereby realizing the vibration reduction effect of the heat dissipation substrate and the heat dissipation fins, thereby improving the vibration resistance of the mechanical hard disk, so as to realize the use of the mechanical hard disk in a vibration environment.

[0016] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0018] Figure 1 A schematic diagram of the installation of a computer provided in an embodiment of the present application;

[0019] Figure 2 A three-dimensional diagram of a computer provided in an embodiment of the present application;

[0020] Figure 3 A schematic diagram of the structure of the bracket provided in the embodiment of the present application;

[0021] Figure 4 A schematic diagram of a structure in which a mechanical hard disk provided in an embodiment of the present application is installed on a bracket;

[0022] Figure 5 A schematic diagram of a structure in which a bracket provided in an embodiment of the present application is installed in a chassis;

[0023] Figure 6 A three-dimensional diagram of a mechanical hard disk provided in an embodiment of the present application;

[0024] Figure 7 A schematic diagram of the structure of a heat dissipation substrate provided in an embodiment of the present application;

[0025] Figure 8 A schematic diagram of the structure of the annular buffer provided in an embodiment of the present application;

[0026] Fig. 9 A schematic diagram of a partial structure of a side view of an annular buffer provided in an embodiment of the present application;

[0027] Fig.10 A schematic diagram of the structure of a chassis provided in an embodiment of the present application;

[0028] Fig.11 A three-dimensional diagram of an elastic member provided in an embodiment of the present application;

[0029] Fig.12 A three-dimensional view of an elastic member from another perspective provided in an embodiment of the present application;

[0030] Fig.13 A perspective structural diagram of an elastic member provided in an embodiment of the present application;

[0031] Fig.14 A schematic diagram of the structure in which the bracket provided in an embodiment of the present application is installed on a heat dissipation substrate.

[0032] The reference numerals in the specific implementation manner are as follows:

[0033] 10. Computer;

[0034] 100, chassis; 110, opening; 120, elastic member; 121, first metal hole; 122, second metal hole; 123, second through hole; 130, tripod; 140, L-shaped plate; 141, first plate body; 142, second plate body; 1421, first through hole;

[0035] 200, bracket; 210, side wall; 211, accommodating space; 220, first fixing plate; 221, third through hole; 230, second fixing plate;

[0036] 300, heat dissipation substrate; 310, heat dissipation fins; 320, insulation layer;

[0037] 400, annular buffer; 410, first adhesive layer; 420, second adhesive layer; 430, folded section;

[0038] 20. Mechanical hard disk; 21. Heating surface. DETAILED DESCRIPTION

[0039] The following embodiments of the technical solution of the present application will be described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0041] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0042] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0043] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists, A and B exist at the same time, and B exists. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0044] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0045] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0046] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0047] A mechanical hard disk is a data storage device with a rectangular shape. It is mainly composed of a disk, a magnetic head, a disk shaft, a control motor, a magnetic head controller, a data converter, an interface, and a cache. The magnetic head can move along the radius of the disk. With the high-speed rotation of the disk at several thousand revolutions per minute, the magnetic head can be positioned at a specified position on the disk to read and write data. The advantages of a mechanical hard disk are large data storage capacity and high cost performance.

[0048] During the operation of a mechanical hard disk, the motor and disk inside the mechanical hard disk are in a state of rotation and friction contact, so a large amount of heat is generated. However, due to the restrictions on the size of embedded computer devices in the installation environment, most embedded computer devices use fanless natural convection cooling. In addition, the internal space of closed small industrial embedded computer devices is small and compact, and the internal ambient temperature is relatively high. Therefore, a suitable solution has not yet been found for the heat dissipation problem of mechanical hard disks in the closed space of embedded computer devices.

[0049] In addition, mechanical hard disks have poor vibration resistance and are easily damaged by vibration. The heat dissipation method of mechanical hard disks through direct contact with the inner wall of the chassis of embedded computer equipment cannot meet the application of embedded computer equipment in vibration environments, such as vehicle environments, embedded environments of intelligent manufacturing equipment, and monitoring environments along highways and railways. Based on the above situation, closed small-scale industrial embedded computer equipment has not been able to achieve configuration upgrades in terms of data storage capacity.

[0050] Based on this, the present application provides a computer, which forms a mechanical hard disk heat dissipation module by installing a bracket for mounting and fixing a mechanical hard disk on a heat dissipation substrate, and by passing the heat dissipation fins arranged on the heat dissipation substrate through an opening opened on one side of the chassis, so that the heat dissipation substrate, as a part of the chassis wall, can achieve natural convection heat dissipation of the mechanical hard disk in an environment without ventilation and heat dissipation conditions; further, by fixing the bracket on an elastic part on the inner wall of the chassis to fix the mechanical hard disk heat dissipation module inside the chassis, and by arranging the heat dissipation substrate and the inner wall of the chassis, and the heat dissipation fins and the opening without contact, the mechanical hard disk heat dissipation module can vibrate in any direction with the elastic part without collision, thereby realizing the use of the mechanical hard disk in a vibrating environment.

[0051] See also Figure 1 , Figure 1 The figure shows a schematic diagram of the installation of a computer provided in an embodiment of the present application. Figure 2 A three-dimensional diagram of a computer provided by an embodiment of the present application is shown. Figure 3 The structure diagram of the bracket provided in the embodiment of the present application is shown. Figure 4 A schematic diagram showing a structure in which a mechanical hard disk provided in an embodiment of the present application is installed on a bracket is shown. Figure 5A structural schematic diagram showing a bracket provided in an embodiment of the present application installed in a chassis is shown.

[0052] As shown in the figure, the computer 10 includes a chassis 100, a bracket 200 and a heat dissipation substrate 300. An opening 110 is provided on one side of the chassis 100, and a plurality of elastic members 120 are provided on the inner wall surface of the chassis 100. The bracket 200 is arranged in the chassis 100, and includes at least three side walls 210, and at least three side walls 210 are connected in sequence to enclose a receiving space 211 for receiving a mechanical hard disk 20, and the mechanical hard disk 20 is fixedly connected to the side walls 210, and at least three side walls 210 are respectively fixedly connected to the plurality of elastic members 120. The heat dissipation substrate 300 is fixedly connected to at least two side walls 210, and there is a gap between the heat dissipation substrate 300 and the inner wall of the chassis 100, one side of the heat dissipation substrate 300 is in contact with the heating surface 21 of the mechanical hard disk 20, and the other side is provided with heat dissipation fins 310, and the heat dissipation fins 310 pass through the opening 110, and there is a gap between the heat dissipation fins 310 and the edge of the opening 110.

[0053] In the embodiment of the present application, the heat dissipation substrate 300 can be made of a metal material with good thermal conductivity, and the chassis 100 and the bracket 200 can be made of aluminum alloy extrusion, die-cast aluminum alloy, magnesium aluminum alloy, copper alloy or porous ceramic. The fixed connection between the side wall 210 and the plurality of elastic members 120, between the side wall 210 and the mechanical hard disk 20, and between the side wall 210 and the heat dissipation substrate 300 can be adhesive fixation, welding fixation, or detachable fixation.

[0054] Specifically, an opening 110 may be provided on any side panel of the chassis 100, wherein the shape of the opening 110 is preferably rectangular. Figure 2 As shown in FIG. 1 , an opening 110 is provided on the bottom plate of the chassis 100. In this case, the Figure 1 As shown, stands 130 are respectively provided on both sides of the bottom plate of the chassis 100 . The computer 10 can be installed on the installation plane through the installation holes provided on the stands 130 , and a certain reserved space is ensured between the chassis 100 and the installation plane.

[0055] In the embodiment of the present application, the elastic member 120 can be foam, foam, silicone block, rubber block (made of materials such as nitrile rubber, butyl rubber, silicone rubber, fluororubber or polyurethane rubber), plastic block (made of plastic material) or spring, etc. Specifically, the elastic member 120 can be installed on the inner wall of the chassis 100, or on any two opposite inner walls of the chassis 100 to save the use of the elastic member 120, for example, four elastic members 120 can be installed on the inner walls of both sides, or as Figure 5As shown, one elastic member 120 is installed on one inner wall, and two elastic members 120 are installed on the inner wall of the opposite side. The elastic member 120 can be directly bonded to the inner wall of the chassis 100, or a fixing plate can be integrally formed on the inner wall of the chassis 100, and then the elastic member 120 is placed and fixed on the fixing plate.

[0056] like Figure 6 In the stereoscopic view of the mechanical hard disk shown, the heating area of ​​the mechanical hard disk 20 is concentrated on the motor and the circuit board, and these two parts are on the same surface, namely the heating surface 21. The motor and the circuit board both work with electricity, and the objects in contact with them need to be insulated or be poor conductors of electricity. The mechanical hard disk 20 is a hexahedron, and three of its faces, namely the heating surface 21 and two of the side faces (the left side and the right side) perpendicular to the heating surface 21, are provided with multiple threaded holes for installation. For example, four threaded holes are provided on the heating surface 21, and two threaded holes are provided on the left side and the right side respectively.

[0057] The bracket 200 may be Figure 3 The illustrated embodiment includes three side walls 210 connected in sequence, and may also include four side walls 210 connected end to end in sequence, wherein all the side walls 210 are an integrally formed structure. Specifically, the sizes of all the side walls 210 may be designed according to the size of the mechanical hard disk 20 to be accommodated, so as to enclose a storage space 211 that can accommodate the mechanical hard disk 20. Among them, mounting holes may be provided on the two opposite side walls 210 at positions corresponding to the threaded holes on the left and right sides of the mechanical hard disk 20. After the mechanical hard disk 20 is placed in the storage space 211, screws may be passed through the mounting holes and screwed into the threaded holes on the two sides of the mechanical hard disk 20, so that the mechanical hard disk 20 can be fixedly connected to the two opposite side walls 210 respectively, thereby installing and fixing the mechanical hard disk 20 on the bracket 200.

[0058] The function of the heat dissipation substrate 300 is to achieve heat dissipation of the mechanical hard disk 20 through heat exchange without ventilation and heat dissipation. Optionally, the heat dissipation substrate 300 can be fixedly connected to any two side walls 210 respectively, or the heat dissipation substrate 300 can be fixedly connected to all side walls 210 respectively. Specifically, the heat dissipation substrate 300 can be fixed to the side walls 210 by pasting or welding, or threaded holes can be opened on the heat dissipation substrate 300 and the side walls 210, and then the heat dissipation substrate 300 and the side walls 210 can be detachably fixedly connected by screws or bolts.

[0059] When the heat dissipation substrate 300 is fixedly connected to the side wall 210, one side of the heat dissipation substrate 300 is in contact with the heating surface 21 of the mechanical hard disk 20 to absorb the heat generated by the mechanical hard disk 20, and the heat is transferred to the outside through the heat dissipation fins 310 provided on the other side of the heat dissipation substrate 300. The heat dissipation fins 310 can increase the surface area in contact with the external air to improve the heat dissipation efficiency, thereby improving the heat dissipation capacity of the heat dissipation substrate 300 for the mechanical hard disk 20.

[0060] Optionally, see Figure 7 As shown in the structural schematic diagram of the heat dissipation substrate, since the motor and circuit board located on the heating surface 21 of the mechanical hard disk 20 are both powered when working, objects in contact with them need to be insulated. Therefore, an insulating layer 320 can be set in the area of ​​the heat dissipation substrate 300 corresponding to the heating surface 21 of the mechanical hard disk 20. For example, the area can be subjected to insulating anodizing treatment, or can be coated with insulating materials such as insulating paint and insulating glue, or can be fixed with an insulating layer 320 made of rubber, plastic or plastic products, so as to insulate the heat dissipation substrate 300 from the motor and circuit board of the mechanical hard disk 20 without affecting the heat conduction between the heat dissipation substrate 300 and the heating surface 21 of the mechanical hard disk 20, thereby improving the safety of the mechanical hard disk 20.

[0061] In some embodiments, through holes can be opened at positions corresponding to the threaded holes opened on the heat dissipation substrate 300 and the heating surface 21 of the mechanical hard disk 20, and then screws can be passed through the through holes and screwed into the corresponding threaded holes to fix the heat dissipation substrate 300 and the mechanical hard disk 20. This can not only improve the structural stability between the bracket 200, the mechanical hard disk 20 and the heat dissipation substrate 300, but also improve the contact stability between the heating surface 21 of the mechanical hard disk 20 and the insulating layer 320 of the heat dissipation substrate 300, thereby ensuring that heat conduction between the heating surface of the mechanical hard disk 20 and the heat dissipation substrate 300 can proceed normally.

[0062] Furthermore, a heat-conducting layer may be sandwiched between the insulating layer 320 and the heating surface 21 of the mechanical hard disk 20. For example, a heat-conducting gel or a heat-conducting paste may be filled between the insulating layer 320 and the heating surface 21 of the mechanical hard disk 20, or a heat-conducting silica gel may be sandwiched between the insulating layer 320 and the heating surface 21 of the mechanical hard disk 20 to increase the contact area between the insulating layer 320 and the heating surface 21 of the mechanical hard disk 20, thereby improving the heat transfer efficiency between the heat dissipation substrate 300 and the heating surface 21 of the mechanical hard disk 20, and quickly dissipating the heat of the mechanical hard disk 20.

[0063] When a natural convection heat dissipation method without a fan is adopted, in order to improve the heat dissipation efficiency of the heat dissipation fins 310, the heat dissipation fins 310 are used as part of the side wall of the chassis 100, so that the heat dissipation fins 310 can be directly in contact with the external air, thereby enhancing the heat exchange efficiency of the heat dissipation fins 310, and then the mechanical hard disk 20 can be quickly cooled. Specifically, after the bracket 200 is fixedly connected to the heat dissipation substrate 300, the heat dissipation fins 310 are kept facing the opening 110, each side wall 210 is fixedly connected to a plurality of elastic members 120 provided on the inner wall of the chassis 100, and the heat dissipation fins 310 are passed through the opening 110, so that the heat dissipation substrate 300 and the heat dissipation fins 310 provided thereon can become part of the panel of the chassis 100.

[0064] After the bracket 200 is fixedly connected to the elastic member 120, a certain distance is left between the heat dissipation substrate 300 and the inner wall of the chassis 100, and a certain distance is left between the heat dissipation fins 310 and the edge of the opening 110, so that the bracket 200 can vibrate in any direction (front, back, left, right, up, and down) along with the elastic member 120, and drive the heat dissipation substrate 300 and the heat dissipation fins 310 to vibrate in any direction (front, back, left, right, up, and down), the vibration displacement of the heat dissipation substrate 300 and the heat dissipation fins 310 are all within the distance range, that is, the heat dissipation substrate 300 will not collide with the inner wall of the chassis 100, and the heat dissipation fins 310 will not collide with the opening 110, so as to ensure that the mechanical hard disk 20 does not vibrate violently, thereby realizing the use of the mechanical hard disk 20 in a vibration environment and improving the vibration resistance of the mechanical hard disk 20.

[0065] In some embodiments, Figure 1 and 2 As shown, when the opening 110 of the chassis 100 is set on the bottom plate, it is also necessary to ensure that there is a certain distance between the heat sink fins 310 and the installation plane, so that when the heat sink fins 310 vibrate up and down, they can vibrate in the reserved space between the chassis 100 and the installation plane, thereby avoiding collision with the installation plane and further avoiding affecting the mechanical hard disk 20.

[0066] In the computer 10 provided in the embodiment of the present application, by fixing the side wall 210 with the mechanical hard disk 20, the mechanical hard disk 20 can be fixed in the accommodating space 211 surrounded by at least three side walls 210; by fixing the heat dissipation substrate 300 with at least two side walls 210 respectively, one side of the heat dissipation substrate 300 can be attached to the heating surface 21 of the mechanical hard disk 20, so as to achieve heat conduction between the heat dissipation substrate 300 and the heating surface 21 of the mechanical hard disk 20; and, by fixing at least three side walls 210 respectively with a plurality of elastic members 120 provided on the inner wall surface of the chassis 100, so that there is a gap between the heat dissipation substrate 300 and the inner wall of the chassis 100, and so that The heat sink fins 310 arranged on the other side of the heat sink substrate 300 pass through the opening 110 opened on one side of the chassis 100 and there is a gap with the edge of the opening 110. This not only allows the heat sink fins 310 to directly contact the external air to exchange heat with the external air, thereby quickly dissipating the heat of the mechanical hard disk 20, but also allows the heat sink 300 to not collide with the inner wall of the chassis 100 and the heat sink fins 310 to not collide with the opening 110 when the heat sink substrate 300 vibrates in any direction with the bracket 200, thereby achieving the vibration reduction effect of the heat sink substrate 300 and the heat sink fins 310, thereby improving the anti-vibration effect of the mechanical hard disk 20, so as to enable the use of the mechanical hard disk in a vibration environment.

[0067] In order to achieve the sealing effect of the computer 10 and improve the anti-vibration effect of the mechanical hard disk 20, the present application further proposes an implementation method, see Figure 8 , Figure 8 A schematic diagram of the structure of the annular buffer provided in an embodiment of the present application is shown. As shown in the figure, the computer also includes an annular buffer 400, which is arranged around the edges of the heat dissipation substrate 300. One side of the annular buffer 400 is fixedly connected to the heat dissipation substrate 300, and the other side is fixedly connected to a panel of the chassis 100 with an opening 110. The annular buffer 400 is used to deform with the relative displacement of the heat dissipation substrate 300 and the chassis 100.

[0068] Specifically, the annular buffer 400 can be made of foam, foam cotton, silicone, rubber or plastic.

[0069] The annular buffer 400 is arranged around the edges of the heat dissipation substrate 300, and the heat dissipation fins 310 can be arranged inside the annular buffer 400. One side of the annular buffer 400 is fixedly connected to the heat dissipation substrate 300, and the other side is fixedly connected to the inner wall of the side plate with the opening 110. On the one hand, the gap between the chassis 100 and the heat dissipation substrate 300 can be closed to achieve the sealing effect of the chassis 100 and prevent dust from entering the chassis 100 to damage the electronic components. On the other hand, when the heat dissipation substrate 300 vibrates with the bracket 200, that is, when the heat dissipation substrate 300 and the chassis 100 are relatively displaced, the heat dissipation substrate 300 can be deformed to reduce the vibration amplitude of the heat dissipation substrate 300.

[0070] For example, when the heat dissipation substrate 300 vibrates and displaces toward the opening 110, the annular buffer 400 can absorb and alleviate the impact energy of the heat dissipation substrate 300, thereby reducing the vibration amplitude of the heat dissipation substrate 300 and reducing the vibration displacement of the heat dissipation substrate 300, avoiding direct collision between the heat dissipation substrate 300 and the chassis 100, thereby improving the anti-vibration effect of the mechanical hard disk 20.

[0071] In order to improve the buffering effect of the annular buffer 400, the present application further proposes an implementation method, please continue to refer to Figure 8 , and combined with Fig. 9 , Fig. 9 A schematic diagram of a partial side structure of an annular buffer provided by an embodiment of the present application is shown. As shown in the figure, the annular buffer 400 includes a first adhesive layer 410, a second adhesive layer 420 and a folding section 430. The first adhesive layer 410 is bonded and fixed to the heat dissipation substrate 300, and the second adhesive layer 420 is bonded and fixed to the panel of the chassis 100 with the opening 110. The two ends of the folding section 430 are respectively connected to the first adhesive layer 410 and the second adhesive layer 420, and are used to deform with the relative displacement of the heat dissipation substrate 300 and the chassis 100.

[0072] Specifically, the first adhesive layer 410 and the second adhesive layer 420 can be respectively bonded and fixed to the heat dissipation substrate 300 and the panel of the chassis 100 with the opening 110 by glue or adhesive.

[0073] like Fig. 9As shown, the folding section 430 includes a plurality of V-shaped structures, which can more easily undergo compression deformation or tensile deformation in the vertical direction. Since the two ends of the folding section 430 are respectively connected to the first adhesive layer 410 and the second adhesive layer 420, when the heat dissipation substrate 300 moves toward the chassis 100, the folding section 430 will undergo compression deformation, and timely buffer the heat dissipation substrate 300 to avoid collision between the heat dissipation substrate 300 and the chassis 100; when the heat dissipation substrate 300 moves away from the chassis 100, the folding section 430 will undergo tensile deformation, and then a force opposite to the displacement direction of the heat dissipation substrate 300 can be applied to the heat dissipation substrate 300, so as to reduce the vibration amplitude of the heat dissipation substrate 300, thereby alleviating the vibration of the mechanical hard disk 20.

[0074] In order to achieve the electromagnetic compatibility function of the computer 10, the present application further proposes an implementation mode. Optionally, the annular buffer 400 is made of conductive cloth, and the heat dissipation substrate 300 and the chassis 100 are made of metal materials.

[0075] The conductive part is made of flexible material and can undergo compression deformation and tension deformation in any direction.

[0076] The heat dissipation substrate 300, the annular buffer 400 and the side wall of the chassis 100 are interconnected, making the chassis 100 a closed space. In addition, the heat dissipation substrate 300, the annular buffer 400 and the side panel of the chassis 100 are in conductive contact, which can enable the computer 10 to generate electromagnetic compatibility function, that is, anti-electromagnetic interference function and anti-electromagnetic radiation function.

[0077] Since the elastic member 120 is fixedly connected to the bracket 200, the elastic member 120 vibrates with the vibration of the bracket 200. Therefore, if the elastic member 120 is directly attached to the inner wall of the chassis 100, the elastic member 120 is easy to fall off and lose the fixing effect on the bracket 200. Furthermore, by integrally forming a fixing plate on the chassis to install and fix the elastic member 120, the production process of the chassis 100 is required to be high, resulting in an increase in the production cost of the chassis 100.

[0078] Therefore, in order to improve the installation stability of the elastic member 120, the present application further proposes an implementation method, please continue to refer to Figure 5 , and combined with Fig.10 , Fig.10 A structural schematic diagram of the chassis provided in an embodiment of the present application is shown. As shown in the figure, an L-shaped plate 140 is provided on the inner wall of the chassis 100. The L-shaped plate 140 includes a first plate body 141 and a second plate body 142. The first plate body 141 is fixedly connected to the inner wall of the chassis 100, and the second plate body 142 is fixedly connected to the elastic member 120.

[0079] Specifically, the first plate 141 and the inner wall of the chassis and the second plate 142 and the elastic member 120 can be fixedly connected by welding, detachable fixing, etc., so as to improve the connection stability between the L-shaped plate 140 and the chassis 100 and the elastic member 120 respectively.

[0080] Optionally, when a plurality of elastic members 120 are installed on the same side wall of the chassis 100 , a same L-shaped plate may be provided to simultaneously fix the plurality of elastic members 120 , or a plurality of L-shaped plates may be provided to respectively fix each elastic member 120 .

[0081] By providing the L-shaped plate 140 , when the elastic member 120 vibrates along with the vibration of the bracket 200 , the second plate body 142 can support the elastic member 120 fixed thereon, thereby improving the installation stability of the elastic member 120 .

[0082] In order to improve the connection stability between the elastic member 120 and the bracket 200, the present application further proposes an implementation method, please continue to refer to Figure 5 and 10 , and combined with Fig.11 and Fig.12 , Fig.11 A three-dimensional diagram of an elastic member provided in an embodiment of the present application is shown. Fig.12 A three-dimensional diagram of an elastic member from another perspective provided by an embodiment of the present application is shown. As shown in the figure, a first through hole 1421 is provided on the second plate body 142. The elastic member 120 is a soft rubber block. The bottom and top of the elastic member 120 are respectively provided with a first metal hole 121 and a second metal hole 122, and the first metal hole 121 and the second metal hole 122 are arranged at intervals. The elastic member 120 is fixedly connected to the second plate body 142 by passing through the first metal hole 121 and the first through hole 1421 through a first fastener, and at least three side walls 210 are fixedly connected to the elastic member 120 by passing through the second metal hole 122 through a second fastener.

[0083] In the embodiment of the present application, the elastic member 120 may be a soft rubber block made of materials such as silicone, rubber or plastic. The volume size of the elastic member 120 may be set so that the elastic member 120 has slots at the bottom and top, or through holes running through the bottom and top, and then by inserting a metal member with a first metal hole 121 into the slot or through hole at the bottom, and inserting a metal member with a second metal hole 122 into the slot or through hole at the top, the elastic member 120 may have first metal holes 121 and second metal holes 122 at the bottom and top, respectively. The slot and through hole may be in the shape of a circle, rectangle, triangle or polygon, etc., and the first metal hole 121 and the second metal hole 122 may be metal threaded holes. In addition, when a through hole is opened on the elastic member 120 to insert metal members having a first metal hole 121 and a second metal hole 122 at the bottom and top of the elastic member 120 respectively, a section of the through hole without a metal member is present between the metal member to which the first metal hole 121 belongs and the metal member to which the second metal hole 122 belongs, so as to ensure the elastic performance of the elastic member 120.

[0084] By opening the first through hole 1421 on the second plate 142, the first metal hole 121 and the first through hole 1421 can be fixed by a first fastener, such as a screw, so as to fix the elastic member 120 on the second plate 142. In addition, since the metal hole is opened on the elastic member 120 and fixedly connected with the second plate 142, the elastic member 120 and the second plate 142 are more stably and rigidly connected, which is not easy to loosen, and the connection stability between the elastic member 120 and the second plate 142 is improved, and the risk of the elastic member 120 falling off from the second plate 142 when the bracket 200 vibrates is reduced.

[0085] Similarly, through holes can be respectively formed in all side walls 210, and then the through holes can be connected to the second metal holes 122 by second fasteners (such as screws), so that all side walls 210 can be fixedly connected to the plurality of elastic members 120. In this way, the connection between the bracket 200 and the elastic member 120 can be made more stable, reducing the risk of the bracket 200 becoming loose during vibration.

[0086] In order to improve the elasticity of the elastic member 120, the present application further proposes an implementation method, please continue to refer to Fig.11 and Fig.12 , and combined with Fig.13 , Fig.13 A perspective structural diagram of the elastic member provided in an embodiment of the present application is shown. As shown in the figure, a second through hole 123 penetrating through both ends of the elastic member 120 is provided between the first metal hole 121 and the second metal hole 122 .

[0087] By opening the second through hole 123 between the first metal hole 121 and the second metal hole 122, on the one hand, the elastic member 120 can be deformed more freely when stretched or compressed, thereby improving the fatigue life and overall performance of the elastic member 120. On the other hand, the existence of the second through hole 123 reduces the rigidity and weight of the elastic member 120, thereby improving the deformation range and resilience of the elastic member 120.

[0088] In order to ensure the contact area between the heat dissipation substrate 300 and the heating surface 21 of the mechanical hard disk 20, the present application further proposes an implementation method, please continue to refer to Figure 2 and Figure 4 , and combined with Fig.14 , Fig.14 A structural schematic diagram of the bracket provided in an embodiment of the present application is installed on a heat dissipation substrate. As shown in the figure, a first fixing plate 220 is provided on the top or bottom of the side wall 210, and a third through hole 221 is opened in the first fixing plate 220. The first fixing plate 220 is fixedly connected to the elastic member 120 by a second fastener passing through the second metal hole 122 and the third through hole 221.

[0089] Optionally, a first fixing plate 220 may be provided on the top of each side wall 210, or Figure 4 As shown, a first fixing plate 220 is disposed at the bottom of each side wall 210. The first fixing plate 220 can be formed by bending a portion of the top or bottom of each side wall 210, that is, the first fixing plate 220 and the side wall 210 are an integral structure.

[0090] The first fixing plate 220 may be extended toward the accommodation space 211, or may be extended in a direction away from the accommodation space 211. Figure 4 As shown, the bottoms of the two opposite side walls 210 are both provided with a first fixing plate 220 extending toward the accommodation space 211, and the other side wall 210 is provided with a first fixing plate 220 in a direction away from the accommodation space 211. In this case, the number of the first fixing plates 220 extending from the other side wall 210 can be 1, 2, 3 or more. It should be noted that the position setting of the first fixing plate 220 does not conflict with the position where the mechanical hard disk 20 is installed in the accommodation space 211. The embodiment of the present application does not specifically limit the shape and size of the first fixing plate 220.

[0091] The third through hole 221 may be a hole that passes through the first fixing plate 220 vertically, or may be a hole that passes through the first fixing plate 220 vertically. Figure 4 The third through hole 221 may be a notch formed at one end of the first fixing plate 220. Figure 4 The notch is shown disposed at one end of the first fixing plate 220 away from the accommodating space 211 .

[0092] By using a screw to pass through the third through hole 221 on each first fixing plate 220 and screwing it into the second metal hole 122 on each elastic member 120 on the inner side wall of the chassis 100, each first fixing plate 220 can be fixedly connected to each elastic member 120, thereby fixing the bracket 200 with the mechanical hard disk 20 installed inside the chassis 100. Furthermore, since the first fixing plate 220 of each side wall 210 is simultaneously arranged at the bottom or the top, fixing the bracket 200 inside the chassis 100 through the first fixing plate 220 can also make the bracket 200 clock in a stable state, which helps to reduce the displacement caused by vibration.

[0093] In order to ensure the contact area between the heat dissipation substrate 300 and the heating surface 21 of the mechanical hard disk 20, the present application further proposes an implementation method, please continue to refer to Figure 2 , Figure 4 and Fig.14 As shown in the figure, a second fixing plate 230 is extended from the top of the two opposite side walls 210, and the second fixing plate 230 is flush with the heating surface 21 of the mechanical hard disk 20. The heat dissipation substrate 300 is fixedly connected to the second fixing plate 230 so that one side of the heat dissipation substrate 300 is in contact with the heating surface 21 of the mechanical hard disk 20.

[0094] The second fixing plate 230 can be formed by bending a portion of the bottom of the two opposite side walls 210, that is, the second fixing plate 230 and the side wall 210 are an integral structure. When the first fixing plate 220 is disposed on the top of each side wall 210, the second fixing plate 230 can be as follows Fig.14 The first fixing plate 220 is shown. The embodiment of the present application does not specifically limit the shape and size of the second fixing plate 230.

[0095] Specifically, the second fixing plate 230 may be respectively disposed at one end of the two opposite side walls 210 away from the other side wall 210, and the second fixing plate 230 may be respectively disposed at the other end of the two opposite side walls 210. The second fixing plate 230 may be extended toward the accommodation space 211, or may be disposed in a direction away from the accommodation space 211. It should be noted that the position of the second fixing plate 230 does not conflict with the position of the mechanical hard disk 20 installed in the accommodation space 211.

[0096] Alternatively, you can Figure 4 As shown in FIG. 1 , threaded holes are respectively provided on the second fixing plate 230, and as shown in FIG. Figure 7 As shown, a through hole is opened at a position corresponding to the above-mentioned threaded hole on the heat dissipation substrate 300, and then a screw or bolt is passed through the through hole and screwed into the threaded hole to fix the bracket 200 and the heat dissipation substrate 300 to improve the structural stability between the bracket 200 and the heat dissipation substrate 300.

[0097] Furthermore, since the second fixed plate 230 is flush with the heating surface 21 of the mechanical hard disk 20, when the heat dissipation substrate 300 is fixedly connected to the second fixed plate 230, one side of the heat dissipation substrate 300 can fit with the heating surface 21 of the mechanical hard disk 20, thereby ensuring that the heat dissipation substrate 300 can contact the heating surface 21 of the mechanical hard disk 20 to conduct heat with the heating surface 21 of the mechanical hard disk 20.

Claims

1. A computer, characterized in that: The computer comprises: A chassis, one side of which is provided with an opening, and the inner wall surface of the chassis is provided with a plurality of elastic members; A bracket, arranged in the chassis, comprising at least three side walls, wherein the at least three side walls are sequentially connected to enclose a receiving space for receiving a mechanical hard disk, the mechanical hard disk is fixedly connected to the side walls, and the at least three side walls are respectively fixedly connected to the plurality of elastic members; A heat dissipation substrate is fixedly connected to at least two of the side walls, and there is a gap between the heat dissipation substrate and the inner wall of the chassis. One side of the heat dissipation substrate is in contact with the heating surface of the mechanical hard disk, and the other side is provided with heat dissipation fins. The heat dissipation fins pass through the opening, and there is a gap between the heat dissipation fins and the edge of the opening.

2. The computer according to claim 1, characterized in that The computer also includes an annular buffer, which is arranged around the edges of the heat dissipation substrate. One side of the annular buffer is fixedly connected to the heat dissipation substrate, and the other side is fixedly connected to a panel of the chassis with the opening. The annular buffer is used to deform with the relative displacement of the heat dissipation substrate and the chassis.

3. The computer according to claim 2, characterized in that The annular buffer comprises a first adhesive layer, a second adhesive layer and a folded section; The first adhesive layer is bonded and fixed to the heat dissipation substrate, and the second adhesive layer is bonded and fixed to the panel of the chassis having the opening; Two ends of the folded section are respectively connected to the first adhesive layer and the second adhesive layer, and are used for deforming along with the relative displacement between the heat dissipation substrate and the chassis.

4. The computer according to claim 2, characterized in that The annular buffer is made of conductive cloth, and the heat dissipation substrate and the chassis are made of metal materials.

5. The computer according to claim 1, characterized in that The inner wall of the chassis is provided with an L-shaped plate, and the L-shaped plate includes a first plate body and a second plate body, the first plate body is fixedly connected to the inner wall of the chassis, and the second plate body is fixedly connected to the elastic member.

6. The computer according to claim 5, characterized in that The second plate body is provided with a first through hole; The elastic member is a soft rubber block, and a first metal hole and a second metal hole are respectively provided at the bottom and the top of the elastic member, and the first metal hole and the second metal hole are spaced apart from each other; The elastic member is fixedly connected to the second plate body by a first fastener passing through the first metal hole and the first through hole, and the at least three side walls are fixedly connected to the elastic member by a second fastener passing through the second metal hole.

7. The computer according to claim 6, characterized in that A second through hole penetrating through two ends of the elastic member is arranged between the first metal hole and the second metal hole.

8. The computer according to claim 6, characterized in that A first fixing plate is arranged on the top or bottom of the side wall, a third through hole is opened on the first fixing plate, and the first fixing plate is fixedly connected to the elastic member through the second fastener passing through the second metal hole and the third through hole.

9. The computer according to claim 1, wherein: A second fixing plate is provided on the top of the two opposite side walls, the second fixing plate is flush with the heating surface of the mechanical hard disk, and the heat dissipation substrate is fixedly connected to the second fixing plate so that one side of the heat dissipation substrate is in contact with the heating surface of the mechanical hard disk.

10. The computer according to claim 1, wherein: The heat dissipation substrate is provided with an insulating layer in a region corresponding to the heating surface of the mechanical hard disk, and a heat conducting layer is sandwiched between the insulating layer and the heating surface of the mechanical hard disk.

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