Heat dissipation bottom frame for computer auxiliary equipment
By designing a heat dissipation chassis for computer-aided equipment, including frames, temperature sensors, thermal plates, heat sinks, exhaust fans and semiconductor refrigerators, the problem of manually operating the heat dissipation equipment in the existing technology is solved, the continuous automatic heat dissipation of the equipment is realized, and the stability and life of the equipment are improved.
Patent Information
- Application Number
- CN202421240196.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-03
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-06-03
AI Technical Summary
In the prior art, computer-aided equipment needs to manually turn on the heat dissipation fan or water cooler, which cannot continuously and effectively dissipate heat, resulting in too high the temperature of the equipment and may cause damage.
A heat dissipation chassis for computer-aided equipment is designed, including a frame, temperature sensor, thermal plate, heat sink, exhaust fan and semiconductor refrigerator, and continuous heat dissipation is achieved through an automatic control system.
It realizes continuous and automated heat dissipation of computer-aided equipment, avoids the shortcomings of manual operations, and improves the operating stability and life of the equipment.
Smart Images
Figure CN222580487U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of computer technology, and in particular, relates to a heat dissipation chassis for computer-aided equipment. Background Art
[0002] Computers, commonly known as computers, are modern electronic computing machines used for high-speed computing. They can perform numerical calculations, logical calculations, and have storage and memory functions. They are modern intelligent electronic devices that can run according to programs and automatically and quickly process massive amounts of data. Computers are becoming more and more powerful, and matching auxiliary equipment is constantly emerging. These electronic devices will generate heat when working. Once the temperature is too high, it will directly affect its operating efficiency. In severe cases, it will also cause a reduction in the life of the equipment and damage it. Therefore, a corresponding heat dissipation chassis is needed to reduce the temperature of computer-aided equipment when it is working.
[0003] However, most of the existing heat dissipation methods directly use the form of adding a cooling fan or using a water cooler to directly dissipate the heat of the computer-aided equipment. However, when using a cooling fan or a water cooler for heat dissipation, the computer-aided equipment cannot be quickly and effectively cooled. The user needs to manually turn on the cooling fan or the water cooler to dissipate the heat of the computer-aided equipment, which not only reduces the use effect, but also cannot continuously dissipate the heat of the computer-aided equipment, thereby reducing its use effect. If the staff cannot manually dissipate the heat in time, it is still easy to cause damage to the computer-aided equipment.
[0004] Therefore, we propose a heat dissipation chassis for computer-aided equipment to solve the above problems. Utility Model Content
[0005] The purpose of this application is to solve the problem in the prior art that users need to manually turn on the cooling fan or water cooler to dissipate the heat of computer-aided equipment, and the computer-aided equipment cannot be dissipated continuously in time, and a cooling chassis for computer-aided equipment is proposed.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A heat dissipation chassis for computer-aided equipment comprises a chassis, wherein the inner wall of the chassis is respectively fixedly connected with a frame, two exhaust shells and two first temperature sensors, the inner wall of the frame is fixedly connected with a heat conducting plate, the bottom surface of the frame and the bottom surface of the heat conducting plate are jointly fixedly connected with a heat sink, the inner wall of each exhaust shell is fixedly connected with a first exhaust fan, the front of the chassis is respectively fixedly connected with a controller and a refrigeration box, the inner wall of the refrigeration box is respectively fixedly connected with an isolation plate, a second temperature sensor and an exhaust pipe, the inner wall of the isolation plate is fixedly connected with a semiconductor A body refrigerator, the inner wall of the exhaust duct is fixedly connected with a second exhaust fan, the upper surface of the refrigeration box is fixedly connected with an exhaust pump, the input end of the exhaust pump passes through the refrigeration box and extends to the interior of the refrigeration box, the output end of the exhaust pump is fixedly connected with an exhaust pipe, the end of the exhaust pipe away from the exhaust pump passes through the base frame and extends to the interior of the base frame, the outer surface of the exhaust pipe is fixedly connected with a plurality of identical nozzles, and the controller is electrically connected to the two first temperature sensors, the first exhaust fan, the semiconductor refrigerator, the second exhaust fan and the exhaust pump through wires.
[0008] Preferably, two sets of universal wheels are fixedly connected to the bottom surface of the base frame, two push handles are fixedly connected to the right side surface of the base frame, and an anti-slip sleeve is fixedly connected to the outer surface of each push handle.
[0009] Preferably, the inner wall of each exhaust shell is fixedly connected with a first dustproof net, and the left side surface of the base frame is movably hinged with a protective door.
[0010] Preferably, two support plates are fixedly connected to the bottom surface of the refrigeration box, and the left side surface of each of the support plates is fixedly connected to the right side surface of the base frame.
[0011] Preferably, a sealing door is movably hinged on the front of the refrigeration box, and a second dustproof net is fixedly connected to the inner wall of the exhaust duct.
[0012] Preferably, two reinforcement plates are fixedly connected to the outer surface of the exhaust pipe, and the outer surface of each reinforcement plate is fixedly connected to the inner wall of the base frame.
[0013] In summary, the technical effects and advantages of this application are:
[0014] By providing a frame, a first temperature sensor, a heat conducting plate, a heat sink, a first row of fans and a controller, the computer-aided equipment can be initially cooled. The heat conducting plate and the heat sink can be continuously used for a long time to dissipate heat, thereby reducing the heat around the auxiliary equipment. The heat conducting plate is used to transfer the heat to the heat sink, and the heat sink transfers the heat to the bottom of the chassis. The heat is then discharged by the first row of fans. By providing a second temperature sensor, a second row of fans, an exhaust pump, an exhaust pipe, a nozzle and a semiconductor refrigerator, the internal heat dissipation performance of the chassis can be further increased to achieve the effect of rapid heat dissipation. The semiconductor refrigerator is used to directly cool the internal temperature of the refrigeration box, and the cold air is discharged to the exhaust pipe through the exhaust pump. Finally, the auxiliary equipment is directly acted on through multiple nozzles, thereby effectively and quickly dissipating the heat of the auxiliary equipment, thereby avoiding the use of a cooling fan or a water cooler for heat dissipation, which requires the user to manually turn on the cooling fan or the water cooler, and the computer-aided equipment cannot be continuously cooled, resulting in a poor heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic diagram of the three-dimensional structure of the heat dissipation chassis for computer-aided equipment of the utility model;
[0016] Figure 2 It is a three-dimensional structural schematic diagram of the semiconductor refrigerator of the utility model;
[0017] Figure 3 This is a schematic diagram of the structure of the utility model in a three-dimensional cutaway view of the underframe;
[0018] Figure 4 It is a schematic structural diagram of a three-dimensional cross-section of the exhaust shell of the utility model.
[0019] In the figure: 1. base frame; 2. first temperature sensor; 3. heat conduction plate; 4. controller; 5. protective door; 6. second dustproof net; 7. universal wheel; 8. exhaust duct; 9. refrigeration box; 10. sealing door; 11. vacuum pump; 12. exhaust pipe; 13. push handle; 14. anti-slip cover; 15. nozzle; 16. reinforcement plate; 17. heat sink; 18. support plate; 19. second temperature sensor; 20. second exhaust fan; 21. semiconductor refrigerator; 22. isolation plate; 23. exhaust shell; 24. frame; 25. first dustproof net; 26. first exhaust fan. DETAILED DESCRIPTION
[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0021] Reference Figure 1-4A heat dissipation chassis for computer-aided equipment includes a chassis 1, the inner walls of the chassis 1 are respectively fixedly connected with a frame 24, two exhaust shells 23 and two first temperature sensors 2, the inner wall of the frame 24 is fixedly connected with a heat conducting plate 3, the bottom surface of the frame 24 and the bottom surface of the heat conducting plate 3 are jointly fixedly connected with a heat sink 17, the bottom surface of the chassis 1 is fixedly connected with two groups of universal wheels 7, the right side of the chassis 1 is fixedly connected with two push handles 13, the outer surface of each push handle 13 is fixedly connected with an anti-slip cover 14, the portability of the device can be increased by the universal wheel 7, the push handle 13 is provided, the device can be conveniently moved to be subjected to force, and the friction between the hand and the push handle 13 can be increased by the anti-slip cover 14.
[0022] The inner wall of each exhaust shell 23 is fixedly connected with a first exhaust fan 26, the front of the base frame 1 is fixedly connected with a controller 4 and a refrigeration box 9, the inner wall of the refrigeration box 9 is fixedly connected with an isolation plate 22, a second temperature sensor 19 and an exhaust pipe 8, and the inner wall of each exhaust shell 23 is fixedly connected with a first dustproof net 25. The left side of the base frame 1 is movably hinged with a protective door 5. The first dustproof net 25 can prevent dust from entering in the reverse direction, and the bottom of the base frame 1 can be conveniently sealed through the protective door 5.
[0023] A semiconductor refrigerator 21 is fixedly connected to the inner wall of the isolation plate 22, a second exhaust fan 20 is fixedly connected to the inner wall of the exhaust duct 8, an exhaust pump 11 is fixedly connected to the upper surface of the refrigeration box 9, an input end of the exhaust pump 11 passes through the refrigeration box 9 and extends to the interior of the refrigeration box 9, an output end of the exhaust pump 11 is fixedly connected to an exhaust pipe 12, two support plates 18 are fixedly connected to the bottom surface of the refrigeration box 9, and the left side surface of each support plate 18 is fixedly connected to the right side surface of the base frame 1. The support plate 18 can facilitate the refrigeration box 9 to be stabilized to prevent shaking.
[0024] One end of the exhaust pipe 12 away from the vacuum pump 11 passes through the base frame 1 and extends to the interior of the base frame 1. The outer surface of the exhaust pipe 12 is fixedly connected to a plurality of identical nozzles 15. A sealing door 10 is movably hinged on the front of the refrigeration box 9. A second dustproof net 6 is fixedly connected to the inner wall of the exhaust pipe 8. The sealing door 10 can be used to seal the refrigeration box 9. The second dustproof net 6 can prevent dust from entering the interior of the refrigeration box 9 through the exhaust pipe 8.
[0025] The controller 4 is electrically connected to the two first temperature sensors 2, the first exhaust fan 26, the semiconductor refrigerator 21, the second exhaust fan 20 and the vacuum pump 11 through wires. The outer surface of the exhaust pipe 12 is fixedly connected to two reinforcement plates 16. The outer surface of each reinforcement plate 16 is fixedly connected to the inner wall of the base frame 1. The reinforcement plates 16 can ensure the stability of the operation of the exhaust pipe 12 and prevent unstable connection.
[0026] The working principle of the utility model is as follows: when in use, the first exhaust fan 26, the second exhaust fan 20, the semiconductor refrigerator 21 and the exhaust pump 11 are first connected to the power supply, and the temperature range values at the bottom of the heat sink 17, the top of the heat conducting plate 3 and the heat dissipation end of the semiconductor refrigerator 21 can be set respectively through the controller 4, and the computer-aided device can be directly placed on the heat conducting plate 3. When the computer-aided device generates heat, its heat is directly transferred to the heat sink 17 through the heat conducting plate 3, and the heat sink 17 can discharge the heat to the bottom of the chassis 1, effectively and continuously dissipating the heat of the computer-aided device, one of the first temperature sensors 2 can detect the temperature at the bottom of the heat sink 17, when the temperature exceeds the standard value, it indicates that the temperature at the bottom of the heat sink 17 is too high, the controller 4 directly controls the first exhaust fan 26 to extract the heat at the bottom of the heat sink 17, and discharges it through the exhaust shell 23, thereby increasing the use effect of the heat conducting plate 3 and the heat sink 17, and initially performing continuous cooling treatment on the computer-aided device, and another first temperature sensor 2 can detect the temperature of the environment above the heat conducting plate 3, that is, the computer-aided surrounding environment temperature is detected, when When the standard range value is exceeded, the controller 4 directly starts the semiconductor refrigerator 21 to run. The right end of the semiconductor refrigerator 21 can cool, and the left end of the semiconductor refrigerator 21 can dissipate heat. The air inside the refrigeration box 9 can be cooled through the refrigeration end of the semiconductor refrigerator 21. The controller 4 controls the operation of the vacuum pump 11 to directly extract the cold air inside the refrigeration box 9, and sprays the cold air on the surface of the computer-aided equipment through the exhaust pipe 12 and the nozzle 15 to directly dissipate the heat. Since the exhaust pipe 12 and the nozzle 15 are evenly distributed inside the chassis 1 in a semi-circular shape, the computer-aided equipment is surrounded, and the surface is effectively and evenly dissipated. Secondly, the second temperature sensor 19 can directly detect the temperature of the heat dissipation end of the semiconductor refrigerator 21. When the standard range value is exceeded, the controller 4 directly controls the second exhaust fan 20 to discharge the heat from the heat dissipation end of the semiconductor refrigerator 21 to prevent heat accumulation and damage to the semiconductor refrigerator 21, and avoid using a cooling fan or a water cooler for heat dissipation. The user needs to manually turn on the cooling fan or the water cooler, and the computer-aided equipment cannot be continuously cooled, resulting in a poor heat dissipation effect.
[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0028] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The above is only a preferred specific implementation method of the present utility model, but the protection scope of the present utility model is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its utility model concept, shall be covered by the protection scope of the present utility model.
Claims
1. A heat dissipation chassis for computer-aided equipment, comprising a chassis (1), characterized in that: The inner wall of the base frame (1) is respectively fixedly connected with a frame (24), two exhaust shells (23) and two first temperature sensors (2); the inner wall of the frame (24) is fixedly connected with a heat conducting plate (3); the bottom surface of the frame (24) and the bottom surface of the heat conducting plate (3) are jointly fixedly connected with a heat sink (17); the inner wall of each exhaust shell (23) is fixedly connected with a first exhaust fan (26); the front of the base frame (1) is respectively fixedly connected with a controller (4) and a refrigeration box (9); the inner wall of the refrigeration box (9) is respectively fixedly connected with an isolation plate (22), a second temperature sensor (19) and an exhaust pipe (8); the inner wall of the isolation plate (22) is fixedly connected with a semiconductor refrigerator (21); the exhaust pipe (8 ) is fixedly connected to the inner wall of the base frame (1), a second exhaust fan (20) is fixedly connected to the upper surface of the refrigeration box (9), an exhaust pump (11) is fixedly connected, the input end of the exhaust pump (11) passes through the refrigeration box (9) and extends to the interior of the refrigeration box (9), the output end of the exhaust pump (11) is fixedly connected to an exhaust pipe (12), the end of the exhaust pipe (12) away from the exhaust pump (11) passes through the base frame (1) and extends to the interior of the base frame (1), the outer surface of the exhaust pipe (12) is fixedly connected to a plurality of identical nozzles (15), and the controller (4) is electrically connected to the two first temperature sensors (2), the first exhaust fan (26), the semiconductor refrigerator (21), the second exhaust fan (20) and the exhaust pump (11) respectively through wires.
2. The heat dissipation chassis for computer-aided equipment according to claim 1, characterized in that: The bottom surface of the base frame (1) is fixedly connected to two sets of universal wheels (7), the right side surface of the base frame (1) is fixedly connected to two push handles (13), and the outer surface of each push handle (13) is fixedly connected to an anti-slip sleeve (14).
3. The heat dissipation chassis for computer-aided equipment according to claim 1, characterized in that: The inner wall of each exhaust shell (23) is fixedly connected to a first dustproof net (25), and the left side of the base frame (1) is movably hinged with a protective door (5).
4. The heat dissipation chassis for computer-aided equipment according to claim 1, characterized in that: Two support plates (18) are fixedly connected to the bottom surface of the refrigeration box (9), and the left side surface of each support plate (18) is fixedly connected to the right side surface of the bottom frame (1).
5. The heat dissipation chassis for computer-aided equipment according to claim 1, characterized in that: The front of the refrigeration box (9) is movably hinged with a sealing door (10), and the inner wall of the exhaust cylinder (8) is fixedly connected with a second dustproof net (6).
6. The heat dissipation chassis for computer-aided equipment according to claim 1, characterized in that: Two reinforcement plates (16) are fixedly connected to the outer surface of the exhaust pipe (12), and the outer surface of each reinforcement plate (16) is fixedly connected to the inner wall of the base frame (1).