Degumming device and semiconductor manufacturing equipment

Abstract

The utility model provides a degumming device and semiconductor manufacturing equipment. The degumming device comprises a bearing module, a degumming module, a driving module and a control module, measuring modules are arranged at the two ends of the bearing module in the axial direction of the bearing module, and the measuring modules are used for measuring the distance from a crystal bar to the side edge of the bearing module in the axial direction of the bearing module; the driving module is connected with the degumming module and is used for driving the degumming module to rotate around a shaft and / or move along a preset direction; the control module is in communication connection with the measuring module and the driving module, and the control module is used for adjusting the moving track of the degumming module based on data measured by the measuring module. According to the configuration, the measuring modules are arranged at the two ends of the bearing module, and the moving track of the degumming module is adjusted based on the measured parameters, so that the degumming module is prevented from colliding with the crystal bar to be degummed in the degumming operation process, the probability of subfissure of the crystal bar is reduced, and the production efficiency and the product yield are further improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a degumming device and semiconductor manufacturing equipment. Background Art

[0002] In the existing debonding process, the hot air knife is an indispensable device, which can separate the glue between the bonded crystal rod and the resin plate by heating. However, due to different product requirements, the bonding angle of the crystal rod on the X-axis is also different, which will cause the crystal rod and the resin plate and the workpiece plate to be not on the same center line. Therefore, during the debonding process, in order to avoid the collision between the hot air knife and the crystal rod to be debonded, thereby reducing the risk of hidden cracks in the crystal rod, it is required that the hot air knife can swing with different bonding angles, while the angle of the existing hot air knife is fixed.

[0003] Based on this, how to prevent the hot air knife from colliding with the crystal rod to be debonded during the debonding process and affecting the product yield has become a technical problem that technical personnel in this field need to solve. Utility Model Content

[0004] The utility model aims to provide a debonding device and semiconductor manufacturing equipment to solve the problem in the prior art that a hot air knife is prone to collide with a crystal rod to be debonded, thereby affecting the product yield.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a degumming device, comprising: a bearing module, a degumming module, a driving module and a control module;

[0006] The carrying module is used to carry the crystal rod to be debonded; the carrying module is provided with measuring modules at both ends along its own axial direction, the carrying module has a side edge provided along its own axial direction, and the measuring module is used to measure the distance from the crystal rod to the side edge;

[0007] The driving module is connected to the debonding module, and the driving module is used to drive the debonding module to rotate around an axis and / or move along a predetermined direction; the debonding module is used to perform a debonding operation on the crystal rod to be debonded;

[0008] The control module is respectively connected to the measuring module and the driving module for communication, and the control module is used to adjust the running track of the degumming module based on the data measured by the measuring module.

[0009] Optionally, the crystal rod is bonded to a resin plate, the resin plate covers at least a portion of the outer surface of the crystal rod, and a bonding direction between the crystal rod and the resin plate is set at an angle to the axial direction of the carrier module.

[0010] Optionally, when the extension direction of the crystal rod is parallel to the axial direction of the carrier module, the extension direction of the resin plate is set at an angle to the axial direction of the carrier module; when the extension direction of the resin plate is parallel to the axial direction of the carrier module, the extension direction of the crystal rod is set at an angle to the axial direction of the carrier module.

[0011] Optionally, when the extension direction of the crystal rod is parallel to the axial direction of the carrier module, the data measured by the measurement module includes: the distance from the side of the resin plate to the side of the carrier module; when the extension direction of the resin plate is parallel to the axial direction of the carrier module, the data measured by the measurement module includes: the distance from the crystal rod to the side of the carrier module.

[0012] Optionally, the extension direction of the crystal rod and the extension direction of the resin plate are both set at an angle to the axial direction of the carrier module, and the data measured by the measurement module includes: the distance from the connection part of the crystal rod and the resin plate to the side of the carrier module.

[0013] Optionally, the running track of the debonding module is arranged parallel to the bonding direction of the crystal rod and the resin plate.

[0014] Optionally, the resin plate has a first surface and a second surface that are arranged opposite to each other, the first surface is bonded to the crystal rod, and the second surface is in contact with the supporting module.

[0015] Optionally, the cross-sectional shape of the crystal rod is circular, and the first surface is a curved surface that matches the curvature of the outer surface of the crystal rod.

[0016] Optionally, the degumming device also includes a carrier, the degumming module is arranged on the carrier, the driving module is connected to the carrier, and the driving module drives the carrier to rotate around the axis and / or move along the predetermined direction to drive the degumming module to rotate and / or move.

[0017] In order to achieve the above object, the utility model also provides a semiconductor manufacturing equipment, including the degumming device as described above.

[0018] Compared with the existing degumming device, the degumming device and semiconductor manufacturing equipment provided by the present application have the following advantages:

[0019] The degumming device provided in the present application sets measuring modules at both ends of the carrying module, and measures the relative position parameters between the crystal rod and the carrying module. Based on the relative position parameters, the driving module is controlled to drive the degumming module to rotate around the axis and / or move in a predetermined direction, thereby adjusting the running trajectory of the degumming module to avoid the degumming module colliding with the crystal rod to be degummed during the degumming operation, causing hidden cracks in the crystal rod, and affecting the production efficiency and product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A front view of the structure in which the crystal rod provided by the embodiment of the utility model is placed on the supporting module;

[0021] Figure 2 A side view of a structure in which a crystal rod provided by an embodiment of the utility model is placed on a supporting module;

[0022] Figure 3 A top view of the structure in which the crystal rod provided by the embodiment of the utility model is placed on the supporting module;

[0023] Figure 4 A schematic diagram of the structure of a degumming module provided in an embodiment of the utility model;

[0024] The description of each reference numeral is as follows:

[0025] 10-carrying module; 20-debonding module; 30-driving module; 40-measuring module; 50-crystal rod; 60-resin plate; 70-carrying platform;

[0026] X-axis direction. DETAILED DESCRIPTION

[0027] In order to make the purpose, advantages and features of the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different scales are used.

[0028] As used in this specification, the singular forms "a", "an" and "the" include plural objects, the term "or" is generally used to include the meaning of "and / or", the term "several" is generally used to include the meaning of "at least one", and the term "at least two" is generally used to include the meaning of "two or more". In addition, the terms "first", "second" and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" and "third" may explicitly or implicitly include one or at least two of the features, "one end" and "the other end" and "the proximal end" and "the distal end" generally refer to two corresponding parts, which include not only the endpoints, and the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral body; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. In addition, as used in this specification, an element disposed on another element generally only indicates that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements may be direct or indirect through an intermediate element, and it cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element may be in any orientation such as inside, outside, above, below or on one side of another element, unless the content clearly indicates otherwise. The terms "upper", "lower", "top" and "bottom" are generally relative position relationships arranged in the direction of gravity; the terms "vertical, vertical direction" generally refer to the direction of gravity, which is generally perpendicular to the ground, and "horizontal, horizontal plane direction" generally refers to the direction parallel to the ground; for ordinary technicians in this field, the specific meanings of the above terms in this specification can be understood according to specific circumstances.

[0029] The utility model aims to provide a debonding device and semiconductor manufacturing equipment to solve the problem in the prior art that a hot air knife is prone to collide with a crystal rod to be debonded, thereby affecting the product yield.

[0030] It can be understood by those skilled in the art that in the existing degumming process, the hot air knife is a more common degumming device, which has the functions of a heater and a high-speed air knife, and can blow out a high-speed and high-temperature airflow at the air knife mouth, thereby heating and cutting the glue between the crystal rod and the resin plate to achieve degumming. However, since the existing hot air knife is mostly fixed, that is, the angle of the hot air knife is not adjustable, and the existing products often have different bonding angles between the crystal rod and the resin plate due to different needs (that is, the crystal rod, the resin plate and the workpiece plate are not on the same center line), therefore, in the process of the hot air knife degumming along a predetermined trajectory (usually a linear trajectory), there is a possibility of collision with the crystal rod, which is easy to cause the crystal rod to produce hidden cracks and defects, affecting the product yield. Based on this, the present application provides a degumming device and a semiconductor manufacturing equipment, which can adjust the running trajectory of the degumming module in real time based on the data measured by the measurement module by adding a measurement module and a control module, avoid collision with the crystal rod, reduce the possibility of hidden cracks in the crystal rod, thereby improving production efficiency and product yield.

[0031] Please refer to Figures 1 to 4 The utility model provides a debonding device, comprising: a carrying module 10, a debonding module 20, a driving module 30 and a control module (not shown in the figure); the carrying module 10 is used to carry a crystal rod 50 to be debonded; both ends of the carrying module 10 along its own axial direction X are provided with measuring modules 40, the carrying module 10 has a side arranged along its own axial direction X, and the measuring module 40 is used to measure the distance from the crystal rod 50 to the side; the driving module 30 is connected to the debonding module 20, and the driving module 30 is used to drive the debonding module 20 to rotate around the axis and / or move along a predetermined direction; the debonding module 20 is used to perform a debonding operation on the crystal rod 50 to be debonded; the control module is respectively communicated with the measuring module 40 and the driving module 30, and the control module is used to adjust the running trajectory of the debonding module 20 based on the data measured by the measuring module 40. It should be noted that in this embodiment, the carrying module 10 is a workpiece table, the degumming module 20 is a fixed hot air knife, the measuring module 40 is a laser distance sensor, the control module is a PLC (Programmable Logic Controller) controller, and the driving module 30 is a servo motor. Those skilled in the art can reasonably configure the above components according to actual conditions. In a specific embodiment, please refer to Figures 1 to 4 The crystal rod 50 to be debonded is bonded to a resin plate 60. According to the requirements of different products, the bonding direction of the crystal rod 50 and the resin plate 60 is set at an angle to the extension direction of the crystal rod 50 itself. The bonding direction of the crystal rod 50 and the resin plate 60 refers to the extension direction of the bonding part between the side of the resin plate 60 and the outer surface of the crystal rod 50 (usually with the extension direction of the bonding part of the side of the resin plate 60 and the outer surface of the crystal rod 50). Figure 3The side of the carrier module 10 shown in FIG. 1 is set at an angle), and the measuring modules 40 located at both ends of the carrier module 10 along its own axial direction X respectively measure the distance L1 and L2 from the crystal rod 50 to the side of the carrier module 10 at the current position (please refer to Figure 3 ), and transmits the measured data to the PLC controller, which can calculate the angle α between the bonding direction of the crystal rod 50 and the resin plate 60 and the side of the supporting module 10 according to L1, L2 and the distance L3 between the two measuring modules 40 (which can be set when configuring the measuring module 40), and drive the driving module 30 to drive the debonding module 20 to rotate the corresponding angle, and move along the direction as shown in FIG. Figure 3 The debonding module 20 moves in the direction of the straight line A shown in the figure to make the distance between the debonding module 20 and the crystal rod 50 uniform, and the debonding module 20 sprays a high-temperature and high-speed airflow to the bonding part of the crystal rod 50 and the resin plate 60, thereby realizing the debonding operation. The structure and working principle of the PLC controller, the servo motor and the laser distance sensor can be referred to the prior art, and will not be described in detail in this embodiment.

[0032] In this configuration, by setting measuring modules 40 at both ends of the supporting module 10 and measuring the relative position parameters between the crystal rod 50 and the supporting module 10, based on the relative position parameters, the driving module 30 is controlled to drive the debonding module 20 to rotate around the axis and / or move along a predetermined direction, thereby adjusting the running trajectory of the debonding module 20, avoiding the debonding module 20 from colliding with the crystal rod 50 to be debonded during the debonding operation, reducing the probability of hidden cracks in the crystal rod 50, and further improving production efficiency and product yield.

[0033] As an alternative embodiment, please refer to Figure 1 to Figure 2 , the crystal rod 50 is bonded to a resin plate 60, the resin plate 60 covers at least a portion of the outer surface of the crystal rod 50, and the bonding direction of the crystal rod 50 and the resin plate 60 is set at an angle to the axial direction X of the carrier module 10. Further, the resin plate 60 has a first surface and a second surface that are arranged opposite to each other, the first surface is bonded to the crystal rod 50, and the second surface is in contact with the carrier module 10. Furthermore, the cross-sectional shape of the crystal rod 50 is circular, and the first surface is an arc surface that matches the curvature of the outer surface of the crystal rod 50. It can be understood by those skilled in the art that when bonding the crystal rod 50, the resin plate 60 (or frosted glass, etc.) is usually first glued to the carrier module 10 (such as a tray, a workpiece table, etc.) with glue, and after the glue is completely cured, the carrier assembly is obtained, and then the crystal rod 50 is glued to the carrier assembly with glue. Therefore, the resin plate 60 is only bonded to a portion of the outer surface of the crystal rod 50, and is arranged between the crystal rod 50 and the carrier module 10. The first surface of the resin plate 60 (at Figure 1 The top surface of the resin plate 60 in the middle is set to a curved surface and matches the curvature of the outer surface of the crystal rod 50, thereby improving the bonding strength between the resin plate 60 and the crystal rod 50. Figure 1 The bottom surface of the resin plate 60 (in the figure) is set as a plane and directly bonded to the top surface of the carrier module 10, and the bonding direction between the first surface of the resin plate 60 and the crystal rod 50 can be adjusted according to needs to facilitate accurate cutting of the crystal rod 50, further improving the product yield.

[0034] As an alternative embodiment, please refer to Figure 3 , when the extension direction of the crystal rod 50 is parallel to the axial direction X of the carrier module 10, the extension direction of the resin plate 60 is set at an angle to the axial direction X of the carrier module 10; when the extension direction of the resin plate 60 is parallel to the axial direction X of the carrier module 10, the extension direction of the crystal rod 50 is set at an angle to the axial direction X of the carrier module 10. It should be noted that since the bonding directions of the crystal rod 50 and the resin plate 60 are set at an angle, when one of them is set parallel to the axial direction X of the carrier module 10, the other must be set at an angle to the axial direction X of the carrier module 10. Further, when the extension direction of the crystal rod 50 is parallel to the axial direction X of the carrier module 10, the data measured by the measuring module 40 includes: the distance from the side of the resin plate 60 to the side of the carrier module 10; when the extension direction of the resin plate 60 is parallel to the axial direction X of the carrier module 10, the data measured by the measuring module 40 includes: the distance from the crystal rod 50 to the side of the carrier module 10. It should be noted that when the extension direction of the crystal rod 50 is parallel to the axial direction X of the carrier module 10, the distance from the crystal rod 50 to the side of the carrier module 10 is equal everywhere along the axial direction X of the carrier module 10. At this time, the distance from the side of the resin plate 60 to the side of the carrier module 10 can be measured, thereby calculating the angle between the bonding direction of the crystal rod 50 and the resin plate 60 and the axial direction X of the carrier module 10; correspondingly, when the extension direction of the resin plate 60 is parallel to the axial direction X of the carrier module 10, the distance from the side of the resin plate 60 to the side of the carrier module 10 is equal everywhere along the axial direction X of the carrier module 10. At this time, the maximum distance from the crystal rod 50 to the side of the carrier module 10 can be measured, thereby calculating the angle between the bonding direction of the crystal rod 50 and the resin plate 60 and the axial direction X of the carrier module 10. Of course, in other embodiments, the measuring module 40 can also measure the distance between other positions to determine the angle between the bonding direction of the crystal rod 50 and the resin plate 60 and the axial direction X of the supporting module 10. Those skilled in the art can configure this according to actual conditions, and this embodiment does not limit this.

[0035] As another alternative embodiment, please continue to refer to Figure 3, the extension direction of the crystal rod 50 and the extension direction of the resin plate 60 are both set at an angle to the axial direction X of the carrier module 10, and the data measured by the measuring module 40 include: the distance from the connection part of the crystal rod 50 and the resin plate 60 to the side of the carrier module 10. It should be noted that when the extension direction of the crystal rod 50 and the extension direction of the resin plate 60 are both set at an angle to the axial direction X of the carrier module 10, the measuring module 40 can calculate the angle between the bonding direction of the crystal rod 50 and the resin plate 60 and the carrier module 10 by measuring the distance from the connection part of the crystal rod 50 and the resin plate 60 to the side of the carrier module 10. As a preferred embodiment, the running track of the debonding module 20 is set parallel to the bonding direction of the crystal rod 50 and the resin plate 60. In this configuration, the distance between the debonding module 20 and the crystal rod 50 is uniform, and the debonding module 20 can effectively avoid the collision with the crystal rod 50 during the debonding process, effectively improving the debonding efficiency of the debonding module 20, thereby improving production efficiency and product yield.

[0036] As an alternative embodiment, please refer to Figure 4 The degumming device also includes a carrier 70, the degumming module 20 is arranged on the carrier 70, the driving module 30 is connected to the carrier 70, and the driving module 30 drives the carrier 70 to rotate around the axis and / or move along a predetermined direction to drive the degumming module 20 to rotate and / or move. It should be noted that since the degumming module 20 in this embodiment is a fixed hot air knife, the degumming module 20 can be arranged on the carrier 70, and the driving module 30 drives the carrier 70 to rotate around the axis and / or move along a predetermined direction, thereby adjusting the running trajectory of the degumming module 20. Among them, the predetermined direction can be parallel to the bonding direction of the crystal rod 50 and the resin plate 60.

[0037] In another embodiment, the utility model further provides a semiconductor manufacturing device, including the debonding device as described above. It should be noted that the semiconductor manufacturing device can be a crystal rod cutting device. With such a configuration, by using the debonding device, the debonding module 20 is prevented from colliding with the crystal rod 50 during the debonding process, and the probability of hidden cracks in the crystal rod 50 is reduced, thereby improving production efficiency and product yield.

[0038] In summary, in the degumming device and semiconductor manufacturing equipment provided by the embodiments of the utility model, the degumming device includes: a carrying module, a degumming module, a driving module and a control module; the carrying module is used to carry the crystal rod to be degummed; the carrying module is provided with measuring modules at both ends along its own axial direction, the carrying module has a side edge arranged along its own axial direction, and the measuring module is used to measure the distance from the crystal rod to the side edge; the driving module is connected to the degumming module, and the driving module is used to drive the degumming module to rotate around the axis and / or move in a predetermined direction; the degumming module is used to perform degumming operations on the crystal rod to be degummed; the control module is communicated with the measuring module and the driving module respectively, and the control module is used to adjust the running trajectory of the degumming module based on the data measured by the measuring module.

[0039] With such configuration, by setting measuring modules at both ends of the supporting module and measuring the relative position parameters between the crystal rod and the supporting module, based on the relative position parameters, the driving module is controlled to drive the degumming module to rotate around the axis and / or move in a predetermined direction, thereby adjusting the running trajectory of the degumming module, avoiding the degumming module from colliding with the crystal rod to be degummed during the degumming operation, reducing the probability of hidden cracks in the crystal rod, and further improving production efficiency and product yield.

[0040] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of the utility model. Any changes and modifications made by ordinary technicians in the field of the utility model based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A degumming device, characterized in that: include: Load-bearing module, debonding module, driving module and control module; The carrying module is used to carry the crystal rod to be debonded; The carrying module is provided with measuring modules at both ends along its axial direction, the carrying module has a side edge provided along its axial direction, and the measuring module is used to measure the distance from the crystal rod to the side edge; The driving module is connected to the debonding module, and the driving module is used to drive the debonding module to rotate around an axis and / or move along a predetermined direction; the debonding module is used to perform a debonding operation on the crystal rod to be debonded; The control module is respectively connected to the measuring module and the driving module for communication, and the control module is used to adjust the running track of the degumming module based on the data measured by the measuring module.

2. The degumming device according to claim 1, characterized in that: The crystal rod is bonded to a resin plate, the resin plate covers at least a portion of the outer surface of the crystal rod, and the bonding direction of the crystal rod and the resin plate is set at an angle to the axial direction of the carrier module.

3. The degumming device according to claim 2, characterized in that: When the extension direction of the crystal rod is parallel to the axial direction of the carrier module, the extension direction of the resin plate is set at an angle to the axial direction of the carrier module; when the extension direction of the resin plate is parallel to the axial direction of the carrier module, the extension direction of the crystal rod is set at an angle to the axial direction of the carrier module.

4. The degumming device according to claim 3, characterized in that: When the extension direction of the crystal rod is parallel to the axial direction of the carrier module, the data measured by the measurement module includes: the distance from the side of the resin plate to the side of the carrier module; when the extension direction of the resin plate is parallel to the axial direction of the carrier module, the data measured by the measurement module includes: the distance from the crystal rod to the side of the carrier module.

5. The degumming device according to claim 2, characterized in that: The extension direction of the crystal rod and the extension direction of the resin plate are both set at an angle to the axial direction of the carrier module, and the data measured by the measurement module includes: the distance from the connection part of the crystal rod and the resin plate to the side of the carrier module.

6. The degumming device according to claim 2, characterized in that: The running track of the debonding module is arranged parallel to the bonding direction of the crystal rod and the resin plate.

7. The degumming device according to claim 2, characterized in that: The resin plate has a first surface and a second surface that are oppositely disposed, the first surface is bonded to the crystal rod, and the second surface is in contact with the supporting module.

8. The degumming device according to claim 7, characterized in that: The cross-sectional shape of the crystal rod is circular, and the first surface is a curved surface adapted to the curvature of the outer surface of the crystal rod.

9. The degumming device according to claim 1, characterized in that: The degumming device also includes a carrier, the degumming module is arranged on the carrier, the driving module is connected to the carrier, and the driving module drives the carrier to rotate around the axis and / or move along the predetermined direction to drive the degumming module to rotate and / or move.

10. A semiconductor manufacturing equipment, characterized in that: It comprises the degumming device as described in any one of claims 1 to 9.

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