Electronic equipment shell and electronic equipment

Abstract

The embodiment of the utility model provides an electronic equipment shell and electronic equipment. The electronic equipment shell comprises a first shell and a second shell, the second shell and the first shell are arranged in a spaced mode, and a heat dissipation mechanism is arranged between the second shell and the first shell. According to the electronic equipment shell disclosed by the embodiment of the invention, the first shell and the second shell are arranged at an interval, and the heat dissipation mechanism is formed between the first shell and the second shell, so that when the electronic equipment is used or charged, heat generated by partial electronic elements in the electronic equipment is dissipated through the first shell, the heat dissipation mechanism and the second shell in sequence; and the heat dissipation effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment accessories, in particular to an electronic equipment housing and an electronic equipment. Background Art

[0002] With the improvement of living standards, people use more and more types of electronic devices. Mobile phones, tablets, computers, chargers and other electronic devices are usually provided with shells on their surfaces to protect the components inside the electronic devices. When mobile phones, tablets, computers, chargers and other electronic devices are used or charged, the internal components of the electronic devices generate too much heat, and the heat is not easily dissipated by the shell, which not only makes the shell temperature too high, but also damages the electronic components inside the electronic devices. Utility Model Content

[0003] Therefore, in order to overcome at least some of the defects and shortcomings in the prior art, the embodiments of the present invention provide an electronic device housing and an electronic device to solve the technical problem that the existing housing has a poor heat dissipation effect.

[0004] Specifically, on the one hand, the electronic device housing provided by the embodiment of the utility model, at least part of the electronic device housing includes: a first housing; a second housing, which is spaced apart from the first housing and is away from the side of the accommodating cavity, the second housing is spaced apart from the first housing, and a heat dissipation mechanism is provided between the first housing and the second housing.

[0005] In a specific embodiment of the present utility model, the heat dissipation mechanism includes a dielectric layer, and the dielectric layer is connected to the first shell and the second shell.

[0006] In a specific embodiment of the present invention, the dielectric layer includes a metal layer, and the metal layer is disposed between the first shell and the second shell.

[0007] In a specific embodiment of the present invention, the dielectric layer includes a graphene layer, and the graphene layer is disposed between the first shell and the second shell.

[0008] In a specific embodiment of the present invention, the dielectric layer further includes a graphene layer, and the graphene layer is disposed on the metal layer, or a side surface of the graphene layer is spliced ​​with a side surface of the metal layer.

[0009] In a specific embodiment of the present invention, the graphene layer is disposed between the second shell and the metal layer, and the second shell is made of a light-transmitting material.

[0010] In a specific embodiment of the present invention, the second shell is made of a light-transmitting material.

[0011] In a specific embodiment of the present invention, the medium layer includes an air layer, and the air layer is arranged between the first shell and the second shell.

[0012] In a specific embodiment of the present invention, the thickness of the air layer ranges from 0.2 to 2 mm.

[0013] In a specific embodiment of the present invention, the dielectric layer includes a phase change material layer, and the phase change material layer is disposed between the first shell and the second shell.

[0014] In a specific embodiment of the present invention, the first shell, the heat dissipation mechanism and the second shell are an integrally formed structure.

[0015] On the other hand, in an embodiment of the present invention, the electronic device housing has a housing cavity, the electric control component is disposed in the housing cavity, and the first housing is disposed close to the electric control component.

[0016] As can be seen from the above, the embodiment of the utility model sets the first shell and the second shell at intervals, and a heat dissipation mechanism is provided between the first shell and the second shell, so that when the electronic device is used or charged, the heat generated by some of the electronic components inside it is dissipated through the first shell, the heat dissipation mechanism, and the second shell in sequence. During the heat conduction process, the heat dissipation mechanism absorbs the heat and quickly and evenly dissipates it, which can quickly dissipate the heat of the electronic components inside the electronic device, so that the temperature of the electronic device shell provided by this embodiment is effectively controlled, which is conducive to maintaining the normal operation of the electronic device, improving the safety of the electronic device, and avoiding the user's feeling of being hot when touching the shell when using the electronic device, thereby improving the user's comfort when using the electronic device. In addition, the electronic device shell provided by this embodiment has a simple structure, is easy to implement, and is suitable for various types of electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic cross-sectional view of an electronic device housing provided in one embodiment.

[0019] Figure 2 A schematic cross-sectional view of an electronic device housing provided in one embodiment.

[0020] Figure 3A schematic cross-sectional view of an electronic device housing provided in one embodiment.

[0021] Figure 4 A schematic structural diagram of an electronic device housing provided in an embodiment.

[0022] Figure 5 for Figure 4 Schematic diagram of the cross-section of the electronic device housing.

[0023] Figure 6 A schematic diagram of the structure of an electronic device provided by an embodiment.

[0024] Figure 7 for Figure 6 Schematic diagram of the exploded structure of the electronic equipment in.

[0025] [Description of Reference Numerals]

[0026] 1: electronic device; 10: electronic device housing; 100: first housing; 110: accommodating cavity; 200: second housing; 300: dielectric layer; 310: metal layer; 320: graphene layer; 330: phase change material layer; 340: air layer; 400: electric control component; 800: cover. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the utility model, not all embodiments. Based on the embodiments described in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the utility model.

[0028] It should be noted that all directional indications (such as up, down, left, right, front, back, top, bottom) in the embodiments of the utility model are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the drawings). If the specific posture changes, the directional indication will also change accordingly. In addition, the term "vertical" involved in the utility model embodiments and claims means that the angle between the two elements is 90° or there is a deviation of -5° to +5°, and the term "parallel" involved means that the angle between the two elements is 0° or there is a deviation of -5° to +5°.

[0029] In the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0030] The electronic device housing 10 provided in this embodiment can be applied to electronic devices such as mobile phones, tablet computers, chargers, power banks, etc. The embodiment of the utility model is described by taking the electronic device as a charger as an example.

[0031] Reference Figure 1 , Figure 2 and Figure 3 The embodiment of the utility model provides an electronic device housing 10. The electronic device housing 10 includes, for example, a first housing 100, a second housing 200 and a heat dissipation mechanism.

[0032] Specifically, refer to Figure 1 , Figure 2 , Figure 3 and Figure 5 The second shell 200 and the first shell 100 are, for example, spaced apart from each other by two shell surfaces. The first shell 100 and the second shell 200 are, for example, rectangular shells. Of course, in other embodiments, they may also be cube shells, cylindrical shells, or shells of other shapes, which are not limited here. In some embodiments, refer to Figure 4 The electronic device housing 10 has a housing cavity 110, and the housing cavity 110 is used to accommodate electronic components of the electronic device. The first housing 100 is arranged near the housing cavity 110. The second housing 200 is, for example, arranged on a side of the first housing 100 away from the housing cavity 110, and the second housing 200 is spaced apart from the first housing 100. A heat dissipation mechanism is, for example, formed between the first housing 100 and the second housing 200. In other embodiments, the second housing 200 is, for example, arranged near the electronic components of the electronic device, and the first housing 100 is, for example, arranged on a side of the second housing 200 away from the electronic components of the electronic device. The specific structures and positions of the second housing 200 and the first housing 100 are not limited here.

[0033] Among them, the first shell 100 and the second shell 200 are made of insulating materials with good thermal conductivity, such as plastic materials, for example, to protect the electronic components inside the electronic device and prevent the electronic components from leaking electricity and causing safety hazards. Taking the electronic device as a charger as an example, the electronic components inside the electronic device include, for example, electronic control components, which may include, for example, components such as a control circuit board, an input circuit board, an output circuit board, and a transformer. The control chip on the control circuit board will generate heat when working, and the transformer and functional chip will generate a lot of heat when working, which is the main heating area. The electronic control component is used to realize the charging function of the charger, and the electronic control component will generate heat when working. The setting of the second shell 200 increases the heat dissipation area, which is conducive to the dissipation of heat.

[0034] In some embodiments, the heat dissipation mechanism includes a medium reference Figures 1 to 3 , the heat dissipation mechanism is located in the dielectric layer 300, that is, the dielectric layer 300 is arranged between the first shell 100 and the second shell 200, and is arranged closely with the first shell 100 and the second shell 200. The dielectric layer 300 has good thermal conductivity, at least stronger than the thermal conductivity of insulating materials and plastic materials. The heat generated by the electronic control component is a local high temperature. The heat is first transferred to the first shell 100 and then quickly and evenly dispersed in the dielectric layer 300, and then conducted to the second shell. The dielectric layer 300 plays a role in rapid heat dissipation to reduce the temperature of the first shell 100, the electronic control component and even the entire electronic device. The dielectric layer can be formed by splicing one or more of the material layers with good thermal conductivity such as the air layer 340, the metal layer 310, the graphene layer, the phase change material layer 330. In other embodiments, the heat dissipation mechanism includes a fan, which is arranged between the first shell 100 and the second shell 200. The operation of the fan causes air convection between the first shell 100 and the second shell 200 to quickly disperse the heat. The heat dissipation mechanism is not limited here.

[0035] In some embodiments, reference Figure 3, the dielectric layer 300 includes, for example, an air layer 340, that is, the first shell 100 and the second shell 200 are arranged in the air, and the dielectric layer 300 is, for example, a gap between the first shell 100 and the second shell 200, and the gap is, for example, filled with air to form an air layer 340. With air as the heat-conducting medium, an air convection channel is formed between the first shell 100 and the second shell 200, which helps to quickly disperse the heat through the flow of air and conduct it to the shell, and the heat is quickly dispersed, thereby cooling down. Specifically, when the electronic device is working, the heat generated by the electronic control component is first transferred to the first shell 100, and the air layer 340 between the first shell 100 and the second shell 200 absorbs the heat to form hot air. Since the density of hot air is less than that of cold air, the hot air will naturally rise, and then the hot and cold air will form convection, and the heat will quickly disperse with the air convection, so that the first shell 100, the heat on the first shell 100 is evenly dispersed, thereby reducing the temperature of the electronic device shell 10.

[0036] Specifically, the thickness range of the air layer 340 is, for example, 0.2 to 2 mm, which can achieve effective heat conduction and air convection, thereby optimizing the heat dissipation performance. When the thickness of the air layer 340 is 0.2 mm, the first shell 100 and the second shell 200 can be made relatively close, which helps to improve the structural stability and reduce heat accumulation. When the thickness of the air layer 340 is 2 mm, more air convection space can be provided, which helps to improve the heat dissipation efficiency, and the manufacturing process is relatively easy and the cost is low. When the thickness of the air layer 340 is 1 mm, a good balance between heat dissipation performance and structural stability can be achieved. It should be noted that the thickness range of the air layer 340 can select the most suitable spacing according to the heating characteristics and usage environment of the specific electronic device to achieve the best heat dissipation performance and structural stability.

[0037] Specifically, the thickness range of the first shell 100 is, for example, 1.2 to 2.5 mm and / or the thickness range of the second shell 200 is, for example, 0.8 to 1.5 mm. A thinner shell can make the structure of the electronic device shell 10 provided in this embodiment more compact, which is conducive to improving the convenience of the device. A thicker shell can have a larger heat capacity, so that the electronic device shell 10 provided in this embodiment has a better heat dissipation effect. It should be noted that the thickness range of the first shell 100 and the second shell 200 can be set according to the actual needs of the user and different application scenarios, and is not limited here.

[0038] Reference Figure 2, the dielectric layer 300 includes, for example, a phase change material layer 330. Phase change material (PCM) refers to a substance that changes physical properties with temperature and can provide latent heat. The process of changing physical properties is called a phase change process. During the phase change process, the phase change material will absorb or release a large amount of latent heat. Common phase change materials include organic phase change materials and inorganic phase change materials. When these materials are converted between solid and liquid states, they can absorb or release a large amount of heat, thereby achieving temperature regulation. The temperature regulation speed of the phase change material layer 330 is relatively fast, and the temperature can be quickly raised or lowered to improve the temperature control efficiency. The phase change material layer 330 can achieve more stable temperature control and improve the user experience by adjusting parameters such as the type of phase change material, phase change temperature, and phase change heat.

[0039] Specifically, the thickness range of the phase change material layer 330 is, for example, 0.02 to 1 mm. Within the thickness range of 0.02 to 1 mm, the phase change material layer 330 can provide good temperature stability and controllability, and the thinner material layer can reduce the volume of the device and improve portability. When the thickness of the phase change material layer 330 is 0.02 mm, the phase change material layer 330 can absorb or release heat very quickly. When the thickness of the phase change material layer 330 is 1 mm, the phase change material layer 330 is relatively thick, has a larger heat capacity, and can adjust the temperature for a longer time. When the thickness of the phase change material layer 330 is 0.5 mm, the phase change material layer 330 has a certain heat capacity and maintains a faster heat transfer speed, which can achieve a fast response while providing a longer time of heat regulation.

[0040] In some embodiments, the dielectric layer 300 includes, for example, a metal layer 310. The metal layer 310 is composed of, for example, a metal material with good thermal conductivity, such as copper or aluminum. The metal layer 310 can achieve temperature regulation through its thermal conductivity and thermal expansion coefficient. The selection of specific metal materials can be determined according to specific application requirements. Different metal materials have different thermal properties, such as thermal conductivity, specific heat capacity, thermal expansion coefficient, etc., which are not limited here. When the dielectric layer 300 is a metal layer 310, based on the thermal conductivity of the metal material, heat will be quickly transferred from the first shell 100 to the second shell 200 through the metal layer 310, so that the temperature of the high temperature side is reduced and the temperature of the low temperature side is increased, thereby achieving temperature regulation.

[0041] Specifically, the thickness of the metal layer 310 ranges from 0.02 to 1 mm, for example. When the thickness of the metal layer 310 is 0.2 mm, the material layer can achieve very fast heat transfer. When the thickness of the metal layer 310 is 1 mm, the heat transfer speed is relatively slow, but more stable. When the thickness of the metal layer 310 is 0.6 mm, the material layer has a good thermal response speed and has good thermal conductivity.

[0042] In some embodiments, reference Figure 1 The dielectric layer 300 includes, for example, a metal layer 310 and a graphene layer 320. Specifically, the metal layer 310 is disposed, for example, close to the first housing 100. The graphene layer 320 is disposed on the metal layer 310, for example, the graphene layer 320 is disposed on a side of the metal layer 310 close to the second housing 200, or the side surface of the graphene layer 320 is spliced ​​with the side surface of the metal layer 310, and the graphene layer 320 and the metal layer 310 are both disposed between the first housing 100 and the second housing 200. It can be understood that, taking the relative positions of up and down, left and right as an example, the graphene layer 320 and the metal layer 310 can be connected up and down, or left and right; when the graphene layer 320 and the metal layer 310 are connected up and down, the first shell 100, the metal layer 310, the graphene layer 320, and the second shell 200 are sequentially attached; when the graphene layer 320 and the metal layer 310 are connected left and right, the first shell 100 and the second shell 200 simultaneously connect the metal layer 310 and the graphene layer 320, and at least part of the electronic device shell 10 presents that the first shell 100, the metal layer 310, and the second shell 200 are sequentially connected.

[0043] Graphene has excellent thermal conductivity and can dissipate heat quickly. Its thermal conductivity is several times that of copper, so it can effectively conduct and dissipate heat. On the other hand, when graphene is heated, the vibration inside its molecules will generate infrared radiation, so that the heat can be better dissipated from the surface. Therefore, the metal layer 310 is a graphene layer 320, which is conducive to the temperature stability of the electronic device housing 10 and the electronic device to prevent overheating.

[0044] When the electronic device is in operation, the temperature is transferred from the first housing 100 to the metal layer 310, the metal layer 310 quickly absorbs the heat and transfers it to the graphene layer 320, and the graphene layer 320 transfers the heat to the second housing 200 to dissipate the heat. Through the synergistic effect of the metal layer 310 and the graphene layer 320, more efficient heat transfer can be achieved, further improving the heat dissipation effect of the electronic device housing 10.

[0045] Specifically, the thickness of the metal layer 310 ranges from 0.2 to 1 mm, and the thickness of the graphene layer 320 ranges from 0.05 to 0.3 mm. When the thickness of the metal layer 310 is 0.2 mm and the thickness of the graphene layer 320 is 0.05 mm, the metal layer 310 and the graphene layer 320 will respond faster to temperature. When the thickness of the metal layer 310 is 0.6 mm and the thickness of the graphene layer 320 is 0.15 mm, the entire device can respond better to temperature changes while maintaining a high thermal efficiency. When the thickness of the metal layer 310 is 1 mm and the thickness of the graphene layer 320 is 0.3 mm, the temperature stability of the entire device can be better. It should be noted that the thickness range of the metal layer 310 and the graphene layer 320 can be adjusted according to different application scenarios and requirements to achieve the optimal thermal management effect.

[0046] In some embodiments, the thickness of the dielectric layer 300 can be set to be smaller than the distance between the first housing 100 and the second housing 200. Through the synergistic effect of the material layer and the air in the distance, more efficient heat transfer can be achieved, further improving the heat dissipation effect of the electronic device housing 10. The specific thickness range of the dielectric layer 300 and the specific structure of the dielectric layer 300 can be selected according to the heating characteristics and use environment of the actual electronic device to select the most suitable thickness and structure to achieve the best heat dissipation performance and structural stability, which is not limited here.

[0047] In some embodiments, the second shell 200 is, for example, a light-transmitting material that allows light to pass through and scatter, and a light-transmitting material that allows infrared rays to pass through. By setting the second shell 200 to be a light-transmitting material, the heat absorbed by the graphene layer 320 can be quickly transferred to the outside of the electronic device shell 10, further enhancing the heat dissipation effect. On the other hand, the light-transmitting material can be a transparent material to enhance the overall visual effect. The second shell 200 is arranged on the side away from the electronic control component. The second shell 200 made of a light-transmitting material radiates the infrared rays generated by the graphene layer 320 to the outside, and transmits part of the heat to the outside through infrared rays, so that the electronic device 1 cools down faster.

[0048] The first shell 100, the second shell 200 and the heat dissipation mechanism are, for example, an integrally formed structure, and the structures of the first shell 100, the second shell 200 and the heat dissipation mechanism are, for example, generated by an injection molding process. In some embodiments, taking the heat dissipation mechanism including the metal layer 310 and the graphene layer 320 as an example, the second shell 200 is firstly injection molded, and then the metal layer 310 is made, and then the graphene layer 320 is sprayed on the metal layer 310, and then the metal layer 310 and the graphene layer 320 are placed in the second shell 200 for in-film injection molding, and finally the first shell 100 is in-sleeve injection molded. In some embodiments, taking the heat dissipation mechanism including the air layer 340 as an example, the first shell 100 and the second shell 200 can be injection molded by a two-color mold, and a gap can be formed between the first shell 100 and the second shell 200 through the two-color mold injection molding process, so that not only the aesthetics of the product is improved, but also the first shell 100, the second shell 200 and the heat dissipation mechanism are integrally formed, which is conducive to strengthening the stability of the structure and improving the reliability of the product.

[0049] In some embodiments, the electronic device housing 10 further includes a color layer, for example, and the color layer is disposed on a side of the second housing 200 close to the first housing 100. The color layer can be disposed on the inner side of the second housing 200, or on a side of the heat dissipation mechanism close to the second housing 200. Taking the heat dissipation mechanism as a composite layer of a metal layer 310 and a graphene layer 320 as an example, the second housing 200 is set to be a light-transmitting material, and the color layer is mixed into the graphene layer 320. The color layer can be, for example, a temperature-variable material, or other applicable color materials, which are not limited here. Among them, the temperature-variable material refers to a material that changes color with changes in temperature. Mixing the temperature-variable material into the graphene layer 320 can increase the aesthetics of the electronic device housing 10. The user can see the color change of the internal temperature-variable material due to the temperature change through the transparent first housing 100, which allows the user to intuitively feel the color change of the temperature-variable material caused by the temperature change of the electronic device, thereby improving the user experience.

[0050] Among them, the temperature-changing material is, for example, a temperature-changing microcapsule, which is mainly composed of a capsule wall, a pigment, a color developer, and wax. When the temperature is lower than the active temperature, the wax solidifies and combines the temperature-changing pigment and the color developer, and the microcapsule shows color; when the temperature is higher than the active temperature, the wax will melt, and the pigment and the color developer will automatically separate, thus losing color. This color change is reversible. Conventional products change from colored at low temperatures to colorless at high temperatures. Colored products can also be customized according to customer needs, and there is no restriction here. It should be noted that the average particle size of the temperature-changing powder is 3±1um, and it is spherical. It is a microcapsule powder composed of multiple formulas. It is simple to use and has a wide range of applicability. It can be used in inks, coatings, injection molding and other fields.

[0051] Reference Figure 6 and Figure 7 The embodiment of the utility model provides an electronic device 1. The electronic device 1 includes, for example, a power bank, a charger, and other electronic devices with an electronic control component. The electronic device 1 includes, for example, the aforementioned electronic device housing 10, a cover 800, and an electronic control component 400. The embodiment of the utility model is described by taking the electronic device 1 as a charger as an example.

[0052] Specifically, the cover body 800 is, for example, connected above the first shell 100 and the second shell 200, and the electric control component 400 is, for example, disposed in the accommodating cavity 110. The electric control component 400 is, for example, similar to the structure of the aforementioned electric control component, and will not be described in detail here. In some embodiments, the cover body 800 includes, for example, a third shell, a fourth shell, and a heat dissipation structure. The third shell is, for example, connected above the first shell 100 and the second shell 200. The fourth shell is, for example, disposed on the side of the third shell away from the accommodating cavity 110, and a heat dissipation structure is disposed between the third shell and the fourth shell. The heat dissipation structure is, for example, similar to the structure of the aforementioned dielectric layer 300, and will not be described in detail here. In some embodiments, the cover body 800 may also be designed as a shell having a layer of applicable heat dissipation structures such as superconducting fins, which is not limited here.

[0053] Further, when the electronic device is working, part of the heat generated by the electric control component 400 can be dissipated through the cover 800, and the first shell 100 and the second shell 200 can also transfer heat with the cover 800, which accelerates the conduction and dissipation of more heat, and further improves the heat dissipation effect of the electronic device housing 10. In some embodiments, the electric control component 400 is arranged close to the cover 800, and most of the heat generated by the electric control component 400 is dissipated through the cover 800, then the thickness of the second temperature adjustment part of the cover 800 can be appropriately thickened to achieve a better heat dissipation effect. In some embodiments, the electric control component 400 is arranged close to the first shell 100, and most of the heat generated by the electric control component 400 is dissipated through the first shell 100 and the second shell 200, then the thickness of the dielectric layer 300 between the first shell 100 and the second shell 200 can be appropriately thickened to ensure a better heat dissipation effect, and the specific thickness setting can be set according to the actual product, which is not limited here. It should be noted that the thickness and structure of the cover 800 can be designed according to the actual structure of the electronic device, which is not limited here.

[0054] As can be seen from the above, the above technical features of the utility model can have one or more of the following beneficial effects: by setting the first shell 100 and the second shell 200 to be spaced apart, and forming a heat dissipation mechanism between the first shell 100 and the second shell 200, when the electronic device is used or charged, the heat generated by some of the electronic components inside it is dissipated through the first shell 100, the heat dissipation mechanism medium layer 300, and the second shell 200 in sequence. During the heat conduction process, the heat dissipation mechanism absorbs the heat and quickly and evenly disperses it, thereby reducing the temperature of the first shell 100 and / or the second shell 200, and can dissipate the heat of the electronic components inside the electronic device and reduce the temperature of the first shell 100 and / or the second shell 200, so that the temperature of the electronic device shell 10 provided in this embodiment is effectively controlled, which is conducive to maintaining the normal operation of the electronic device, improving the safety of the electronic device, and avoiding the user's feeling of being hot when touching the shell when using the electronic device, thereby improving the user's comfort when using the electronic device. In addition, the electronic device shell 10 provided in this embodiment has a simple structure, is easy to implement, and is suitable for various types of electronic devices.

[0055] In addition, it can be understood that the aforementioned embodiments are merely illustrative descriptions of the present invention. Under the premise that the technical features do not conflict, the structures do not contradict, and the purpose of the present invention is not violated, the technical solutions of the various embodiments can be arbitrarily combined and used in combination.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. An electronic device housing (10), characterized in that: At least part of the electronic device housing (10) comprises: A first housing (100); The second shell (200) is arranged at a distance from the first shell (100), and a heat dissipation mechanism is provided between the first shell (100) and the second shell (200).

2. The electronic device housing (10) according to claim 1, characterized in that: The heat dissipation mechanism comprises a dielectric layer (300), and the dielectric layer (300) is connected to the first shell (100) and the second shell (200).

3. The electronic device housing (10) according to claim 2, characterized in that: The dielectric layer (300) comprises a metal layer (310), and the metal layer (310) is arranged between the first shell (100) and the second shell (200).

4. The electronic device housing (10) according to claim 2, characterized in that: The dielectric layer (300) comprises a graphene layer (320), and the graphene layer (320) is arranged between the first shell (100) and the second shell (200).

5. The electronic device housing (10) according to claim 3, characterized in that: The dielectric layer (300) further comprises a graphene layer (320), wherein the graphene layer (320) is arranged on the metal layer (310), or the side surface of the graphene layer (320) is spliced ​​with the side surface of the metal layer (310).

6. The electronic device housing (10) according to claim 2, characterized in that: The medium layer (300) comprises an air layer (340), and the air layer (340) is arranged between the first shell (100) and the second shell (200).

7. The electronic device housing (10) according to claim 2, characterized in that: The dielectric layer (300) comprises a phase change material layer (330), and the phase change material layer (330) is arranged between the first shell (100) and the second shell (200).

8. The electronic device housing (10) according to claim 1, characterized in that: The first shell (100), the heat dissipation mechanism and the second shell (200) are an integrally formed structure.

9. The electronic device housing (10) according to claim 5, characterized in that: The graphene layer (320) is arranged between the second shell (200) and the metal layer (310), and the second shell (200) is made of a light-transmitting material.

10. The electronic device housing (10) according to any one of claims 1 to 8, characterized in that: The second shell (200) is made of light-transmitting material.

11. An electronic device (1), characterized in that: include: Electronic control assembly (400); The electronic device housing (10) according to any one of claims 1 to 10, characterized in that the electronic device housing (10) has a accommodating cavity (110), the electronic control component (400) is arranged in the accommodating cavity (110), and the first housing (100) is arranged close to the electronic control component (400).

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