Silicon wafer cutting, cooling and spraying mechanism
By designing a height adjustment mechanism, the problem of the spray pipe blocking the line of sight during the silicon wafer cutting process is solved, and the height of the spray pipe is flexible, which improves the cutting accuracy and achieves the cooling and cooling effect.
Patent Information
- Application Number
- CN202420985532.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-09
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-05-09
AI Technical Summary
During the cutting process of silicon wafers, the spray pipe can easily block the line of sight, affecting the accuracy of the cutting.
A height adjustment mechanism is designed. Through the cooperation of the T-shaped block and the T-shaped groove, the spray pipe can adjust the height according to needs to avoid obstructing the line of sight.
It effectively avoids the line of sight blockage caused by the spray pipe when cutting the silicon wafer, improves the cutting accuracy, and achieves cooling and cooling of the silicon wafer and workbench.
Smart Images
Figure CN222521739U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon slice cutting, in particular to a silicon slice cutting cooling spray mechanism. Background Art
[0002] Silicon wafers are mostly cut by laser, which uses a high-energy laser beam to irradiate the surface of the silicon wafer, causing it to partially melt and vaporize, thereby achieving cutting of the silicon wafer. However, high temperatures are often generated during the cutting process, affecting the quality of the silicon wafer, and long-term cutting will also increase the overall temperature of the workbench. Therefore, a spraying method is used to cool the silicon wafer and the workbench.
[0003] In order to achieve a good cooling effect on the silicon wafer, the spray pipe is usually very close to the cutting head so that it can spray accurately on the cutting point of the silicon wafer. However, sometimes the spray pipe will block the observation of the silicon wafer during the cutting process, thereby affecting the cutting accuracy. Utility Model Content
[0004] The utility model aims to solve the shortcomings of the prior art and proposes a silicon wafer cutting cooling spray mechanism, which can adjust the height of the spray pipe to avoid the spray pipe causing obstruction to the line of sight when cutting silicon wafers.
[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0006] A silicon wafer cutting cooling spray mechanism comprises a machine base, a frame is installed on one side above the machine base, a cutting machine head is connected to one side of the frame, a water storage tank is installed on one side of the cutting machine head, a water outlet pipe is fixed below the water storage tank, a hose is connected to the water outlet end of the water outlet pipe, a spray pipe is connected to the water outlet end of the hose, and the spray pipe is connected to the cutting machine head through a height adjustment mechanism;
[0007] The height adjustment mechanism includes a T-block and a T-slot, one end of the T-block is fixed with a pipe sleeve, the pipe sleeve is sleeved and fixed to the outside of the spray pipe, one side of the T-slot is provided with a damping groove, some of the T-block corresponding to the damping groove are provided with receiving grooves, a spring is connected in the receiving groove, and one end of the spring is connected to a damping block;
[0008] A collection box is arranged in the middle of the upper part of the machine base, and a workbench is fixed above the collection box.
[0009] Preferably, the damping block is engaged with the damping groove, and the outer wall of the damping block slides against the inner wall of the receiving groove, and the two ends of the spring are fixedly connected to the receiving groove and the damping block respectively.
[0010] Preferably, a slide groove is provided on the inner wall of the collection box, and a filter screen is slidably connected in the slide groove.
[0011] Preferably, water leakage holes are evenly formed on the edge of the workbench.
[0012] Preferably, a convex edge is fixed to the upper edge of the workbench.
[0013] Preferably, a solenoid valve is installed on the water outlet pipe, and a switch button is installed outside the water storage tank, and the switch button is electrically connected to the solenoid valve.
[0014] Preferably, a water inlet pipe is fixedly connected to the top of the water tank, and a visual window is opened on the surface of the water tank.
[0015] Preferably, the collection box is fixedly connected to the base via legs, and a drainage pipe is fixedly connected to the bottom of the collection box.
[0016] Compared with the prior art, the beneficial effects of the utility model are:
[0017] 1. A height adjustment mechanism is provided. Hold the pipe sleeve and pull it upward. During this period, the damping block is acted upon by external force, and under the repeated contraction and rebound of the spring, the damping block can passively move upward on the damping groove. When the spray pipe is moved to a suitable height, loosen the pipe sleeve, and use the elastic force of the spring to make the damping block stuck in the damping groove to fix the height of the spray pipe, so as to avoid the spray pipe causing visual obstruction when cutting silicon wafers;
[0018] 2. After using the cutting machine head to cut silicon wafers for a long time, you can pull down the pipe sleeve again to make the head of the spray pipe close to the cutting position of the silicon wafer, and then spray the cooling water in the water tank to the silicon wafer through the outlet pipe, hose and spray pipe in turn, so as to cool the silicon wafer and the workbench. The cooling water and debris on the workbench then flow into the collection box through the leakage hole. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is a schematic diagram of the structure of a silicon wafer cutting cooling spray mechanism proposed by the utility model;
[0020] Figure 2 This is a schematic cross-sectional structure diagram of a collection box and a workbench in a silicon wafer cutting cooling spray mechanism proposed by the utility model;
[0021] Figure 3 This is a schematic diagram of the structure of a cutting head and a water storage tank in a silicon wafer cutting cooling spray mechanism proposed by the utility model;
[0022] Figure 4 This is a schematic diagram of the structure of a water storage tank in a silicon wafer cutting cooling spray mechanism proposed by the utility model from a bottom view;
[0023] Figure 5 A silicon wafer cutting cooling spray mechanism proposed by the utility model Figure 3 A schematic diagram of the enlarged structure at A in the middle;
[0024] Figure 6 This is a schematic cross-sectional structure diagram of a T-block and a T-slot in a silicon wafer cutting cooling spray mechanism proposed by the utility model;
[0025] Figure 7 A silicon wafer cutting cooling spray mechanism proposed by the utility model Figure 6 Schematic diagram of the enlarged structure at point B in the middle.
[0026] In the figure: 1. base; 2. frame; 3. cutting head; 4. support foot; 5. collection box; 6. slide; 7. filter; 8. workbench; 9. leakage hole; 10. convex edge; 11. drain pipe; 12. water storage tank; 13. water inlet pipe; 14. water outlet pipe; 15. solenoid valve; 16. hose; 17. spray pipe; 18. pipe sleeve; 19. T-block; 20. T-slot; 21. damping slot; 22. receiving slot; 23. spring; 24. damping block. DETAILED DESCRIPTION
[0027] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0028] Reference Figure 1-7A silicon wafer cutting cooling spray mechanism includes a machine base 1, a frame 2 is installed on one side of the upper side of the machine base 1, a cutting head 3 is connected to one side of the frame 2, a water storage tank 12 is installed on one side of the cutting head 3, a water outlet pipe 14 is fixed below the water storage tank 12, a hose 16 is connected to the water outlet end of the water outlet pipe 14, a spray pipe 17 is connected to the water outlet end of the hose 16, the spray pipe 17 is connected to the cutting head 3 through a height adjustment mechanism, the height adjustment mechanism includes a T-block 19 and a T-slot 20, a pipe sleeve 18 is fixed to one end of the T-block 19, the pipe sleeve 18 is sleeved and fixed to the outside of the spray pipe 17, a damping groove 21 is arranged on one side of the T-slot 20, and some of the T-block 19 corresponding to the damping groove 21 are provided with a receiving groove 22, and the receiving groove 22 is provided inside A spring 23 is connected, one end of the spring 23 is connected to a damping block 24, the damping block 24 is meshed with the damping groove 21, and the outer wall of the damping block 24 slides against the inner wall of the accommodating groove 22, the two ends of the spring 23 are respectively fixedly connected to the accommodating groove 22 and the damping block 24, the pipe sleeve 18 is held and pulled upward, during which the damping block 24 is acted upon by an external force, and under the repeated contraction and rebound of the spring 23, the damping block 24 can be passively moved upward on the damping groove 21, when the spray pipe 17 is moved to a suitable height, the pipe sleeve 18 is released, and the elastic force of the spring 23 is used to make the damping block 24 stuck in the damping groove 21, so that the height of the spray pipe 17 is fixed, and the obstruction of the line of sight caused by the spray pipe 17 when cutting silicon wafers can be avoided.
[0029] A solenoid valve 15 is installed on the water outlet pipe 14 , and a switch button is installed outside the water storage tank 12 . The switch button is electrically connected to the solenoid valve 15 . Pressing the switch button controls the opening and closing of the solenoid valve 15 .
[0030] A collecting box 5 is provided in the middle of the upper part of the machine base 1, and the collecting box 5 is fixedly connected to the machine base 1 through the supporting legs 4, and a workbench 8 is fixed above the collecting box 5, a convex edge 10 is fixed to the upper edge of the workbench 8, and leakage holes 9 are evenly opened on the edge of the workbench 8, the convex edge 10 can prevent the cooling water on the workbench 8 from flowing directly to the ground, and the opening of the leakage holes 9 can allow the cooling water on the workbench 8 to flow into the collecting box 5.
[0031] A chute 6 is provided on the inner wall of the collecting box 5, and a filter screen 7 is slidably connected in the chute 6. A drain pipe 11 is fixedly connected to the bottom of the collecting box 5. After the cooling water and debris on the workbench 8 flow into the collecting box 5 through the leakage hole 9, the filter screen 7 filters out the debris generated during the cutting process. The filtered waste water is concentrated in the collecting box 5, and the drain pipe 11 can be opened later to discharge the waste water. The setting of the chute 6 makes it convenient to take out the filter screen 7 and clean up the debris on the filter screen 7.
[0032] A water inlet pipe 13 is fixedly connected to the top of the water tank 12, and a visual window is provided on the surface of the water tank 12. Cooling water is injected into the water tank 12 through the water inlet pipe 13. The setting of the visual window makes it easy to check the water level of the cooling water at any time.
[0033] In the present invention, the silicon wafer is placed on the workbench 8. To avoid the spray pipe 17 from causing visual obstruction during the process of cutting the silicon wafer, the pipe sleeve 18 can be held and pulled upward. During this period, the damping block 24 is subjected to the action of external force, and under the repeated contraction and rebound action of the spring 23, the damping block 24 can be passively moved upward on the damping groove 21. When the spray pipe 17 is moved to a suitable height, the pipe sleeve 18 is released, and the elastic force of the spring 23 is used to make the damping block 24 stuck in the damping groove 21, so that the height of the spray pipe 17 is fixed, and the spray pipe 17 can be prevented from causing visual obstruction during the process of cutting the silicon wafer.
[0034] After using the cutting machine head 3 to cut silicon wafers for a long time, the pipe sleeve 18 can be pulled down again. The operation and principle are the same as above. After the pipe head of the spray pipe 17 is close to the cutting position of the silicon wafer, the switch button is pressed, and the solenoid valve 15 is opened, so that the cooling water in the water storage tank 12 is sprayed to the silicon wafer through the outlet pipe 14, the hose 16 and the spray pipe 17 in turn, thereby cooling the silicon wafer and the workbench 8. The cooling water and debris on the workbench 8 then flow into the collection box 5 through the leakage hole 9. The filter screen 7 filters out the debris generated during the cutting process. The filtered waste water is concentrated in the collection box 5, and the drain pipe 11 can be opened later to discharge the waste water.
[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A silicon wafer cutting cooling spray mechanism, comprising a machine base (1), characterized in that: A frame (2) is installed on one side above the machine base (1); a cutting head (3) is connected to one side of the frame (2); a water storage tank (12) is installed on one side of the cutting head (3); a water outlet pipe (14) is fixed below the water storage tank (12); a hose (16) is connected to the water outlet end of the water outlet pipe (14); a spray pipe (17) is connected to the water outlet end of the hose (16); and the spray pipe (17) is connected to the cutting head (3) via a height adjustment mechanism; The height adjustment mechanism comprises a T-shaped block (19) and a T-shaped slot (20); a pipe sleeve (18) is fixed to one end of the T-shaped block (19); the pipe sleeve (18) is sleeved and fixed to the outside of the spray pipe (17); a damping slot (21) is provided on one side of the T-shaped slot (20); a portion of the T-shaped block (19) corresponding to the damping slot (21) is provided with a receiving slot (22); a spring (23) is connected to the receiving slot (22); and a damping block (24) is connected to one end of the spring (23); A collection box (5) is provided in the middle of the upper part of the machine base (1), and a workbench (8) is fixed above the collection box (5).
2. A silicon wafer cutting cooling spray mechanism according to claim 1, characterized in that: The damping block (24) is meshed with the damping groove (21), and the outer wall of the damping block (24) slides in contact with the inner wall of the receiving groove (22), and the two ends of the spring (23) are fixedly connected to the receiving groove (22) and the damping block (24) respectively.
3. A silicon wafer cutting cooling spray mechanism according to claim 1, characterized in that: The inner wall of the collection box (5) is provided with a slide groove (6), and a filter screen (7) is slidably connected in the slide groove (6).
4. A silicon wafer cutting cooling spray mechanism according to claim 1, characterized in that: Water leakage holes (9) are evenly arranged on the edge of the workbench (8).
5. The silicon wafer cutting cooling spray mechanism according to claim 1, characterized in that: A convex edge (10) is fixed to the upper edge of the workbench (8).
6. The silicon wafer cutting cooling spray mechanism according to claim 1, characterized in that: A solenoid valve (15) is installed on the water outlet pipe (14), and a switch button is installed outside the water storage tank (12), and the switch button is electrically connected to the solenoid valve (15).
7. The silicon wafer cutting cooling spray mechanism according to claim 1, characterized in that: A water inlet pipe (13) is fixedly connected to the top of the water storage tank (12), and a viewing window is provided on the surface of the water storage tank (12).
8. The silicon wafer cutting cooling spray mechanism according to claim 1, characterized in that: The collection box (5) is fixedly connected to the machine base (1) via supporting legs (4), and a drainage pipe (11) is fixedly connected to the bottom of the collection box (5).