Rapid cooling and shaping device for water chamber

Abstract

The utility model relates to the technical field of plastic processing and forming equipment, and discloses a rapid cooling and shaping device for a water chamber, which comprises a fixedly arranged tool table, and a shaping clamp for limiting deformation of a water chamber part is arranged on the tool table. The shaping clamp comprises a shaping filling block and a shaping pressing block, wherein the shaping filling block is fixed to the workbench and matched with a cavity of the water chamber part in an inserted mode, a matching gap allowing cooling water to flow in is reserved after insertion, and the shaping pressing block is located above the tool table in a lifting mode and presses the upper end face and the two ends of the water chamber part when the shaping pressing block descends. The water chamber part can be driven to be completely immersed in cooling water or completely separated from the cooling water through lifting of the water pool, a cooling assembly for absorbing heat of the cooling water in the matching gap is embedded in the shaping filling block, and the rapid cooling and shaping device for the water chamber can reduce the temperature of the cooling water flowing into the water chamber part so as to improve the cooling and shaping speed of the water chamber.

Description

Technical Field

[0001] The utility model relates to the technical field of plastic processing and molding equipment, in particular to a water chamber rapid cooling and molding device. Background Art

[0002] The radiator is an important component in the engine water cooling system. The existing radiator structure includes a radiator body and water chambers located at the upper and lower ends of the radiator body. The water chamber is a chamber-like shell part, and an opening is provided at the bottom thereof to be fixedly mounted on the radiator. A water inlet interface connected to a water pipe is provided on the outer wall of the shell. Existing manufacturers usually choose injection molding to produce water chamber parts. After injection molding, the water chamber parts need to be cooled in time to shape the material and prevent the parts from deformation. The existing water chamber cooling and shaping device can refer to the announcement number CN216373233 U's Chinese patent discloses a car water chamber shaping device, which includes a water pool with cooling water inside. A mounting frame is provided above the water pool for guiding and lifting. A driving cylinder is fixed above the water pool for driving the mounting frame to guide and lift. When the mounting frame descends, the tooling block will be completely sunk into the cooling water in the water pool. The mounting frame is provided with a tooling block that is plugged in with the water chamber parts and a clamping cylinder that can approach the tooling block to press the water chamber parts to prevent them from floating in the water. The function of the clamping cylinder is to prevent the water chamber parts from floating and to prevent the two ends of the water chamber parts from warping and deformation.

[0003] According to the above structure, it can be known that the device cools and shapes by contacting the cooling water with the water chamber parts. In order to ensure that the inside and outside of the water chamber parts can be fully cooled, when designing the tooling block, the side wall of the tooling block is plugged into the inner wall of the water chamber part, and a cavity will be left between the top of the tooling block and the inner wall of the water chamber part. When the tooling block sinks into the water pool, cooling water can flow into the cavity from the water inlet interface of the water chamber part, so that the inside and outside of the water chamber part are filled with cooling water. After the cooling water outside the water chamber part absorbs heat, the heat will be quickly dispersed into the cooling water in the entire water pool, but the cooling water in the cavity is blocked by the water chamber parts and it is difficult to contact the external cooling water. Therefore, the cooling water flowing into the cavity will gradually increase in temperature after heat exchange with the water chamber parts. When the temperature of the cooling water in the cavity increases, the speed of heat exchange will also decrease, resulting in a decrease in the overall cooling and shaping speed of the water chamber parts, thereby affecting the production speed. Utility Model Content

[0004] In view of the disadvantage that when the existing water chamber molding device is used, the temperature of the cooling water flowing into the water chamber parts will gradually increase, thereby reducing the overall cooling and molding speed of the water chamber parts. The purpose of the utility model is to provide a device for increasing the water chamber cooling and molding speed by reducing the temperature of the cooling water flowing into the water chamber parts.

[0005] In order to solve the above technical problems, the utility model is solved by the following technical solutions:

[0006] A water chamber rapid cooling and shaping device comprises a fixed workbench, on which a shaping fixture for limiting the deformation of a water chamber part is arranged, the shaping fixture comprising a shaping filling block fixed on the workbench and plugged into the cavity of the water chamber part and reserving a matching gap for cooling water to flow in after plugging, and a shaping pressing block which is arranged to be lifted above the workbench and presses the upper end surface and both ends of the water chamber part when descending, a water pool is arranged to be lifted below the workbench, and the lifting of the water pool can drive the water chamber part to be completely immersed in cooling water or completely separated from the cooling water, and a cooling component for absorbing the heat of the cooling water in the matching gap is embedded in the shaping filling block.

[0007] By adopting the above scheme, when the cooling and shaping device is working, the water pool rises, and the cooling water can enter the cavity formed by the water chamber part and the tooling block. At this time, the heat of the water chamber part is transferred to the cooling water in the cavity, and the cooling component can reduce the temperature of the tooling block so that it absorbs the heat of the cooling water. Compared with the prior art, the cooling component in this scheme can indirectly slow down the temperature rise of the cooling water in the cavity or indirectly reduce the temperature of the cooling water in the cavity, thereby increasing the cooling speed inside the water chamber part, thereby improving the overall cooling and shaping efficiency of the water chamber part.

[0008] Preferably, the cooling assembly comprises a plurality of semiconductor refrigeration plates, which are connected in series in sequence, and the two sides of the semiconductor refrigeration plates are respectively a cooling surface and a heating surface, and the cooling surface and the heating surface face the fitting gap and the water pool respectively.

[0009] Using the above scheme, semiconductor refrigeration is a relatively common heat transfer tool. After direct current is passed into the semiconductor refrigeration, both ends of the semiconductor refrigeration continuously absorb and release heat. This scheme uses its heat absorption phenomenon to cool the tooling block, thereby achieving the effect of slowing down the temperature rise of cooling water or lowering the temperature of cooling water. However, when the cooling surface and the heating surface reach a certain temperature difference, the amount of heat transfer reaches a balance point, and the temperature will not continue to change at this time. Generally, it is necessary to set a corresponding heat dissipation component on the heating surface for continuous heat dissipation so that the cooling surface can be reduced to a lower temperature. In this scheme, the semiconductor refrigeration plate is built into the shaped filling block. When the heating surface heats up, the shaped filling block will be locally heated up. During the cooling process, the tooling table and the shaped filling block are immersed in water throughout the process. The heat of the shaped filling block can be introduced into the cooling water in the pool to play a heat dissipation role.

[0010] Preferably, a receiving groove for a built-in semiconductor cooling plate is recessed on one side of the shaped filling block facing toward or away from the fitting gap, and a sealing cover which can seal or open the receiving groove is provided on the receiving groove.

[0011] By adopting the above solution, the sealing cover can not only seal the accommodating groove but also open the accommodating groove for the operator to subsequently dismantle, replace and repair the semiconductor cooling plate.

[0012] Preferably, the accommodating groove is filled with a sealing medium for sealing the semiconductor cooling plate, and the sealing medium includes electronic potting glue.

[0013] Using the above scheme, the semiconductor refrigeration chip is an electrical component. If cooling water leaks into the receiving groove, it may cause damage to the semiconductor refrigeration chip and the internal connection circuit. In this scheme, electronic potting glue is used to seal the inside of the receiving groove. The electronic potting glue is fluid when it is not solidified. When the semiconductor refrigeration chip is installed in the receiving groove, the electronic potting glue is poured into the receiving groove, and then solidified by drying or natural air drying, which can play a role in waterproofing and insulation.

[0014] Preferably, a heat dissipation component is provided on the shaped filling block for quickly dissipating the heat of the heating surface to the cooling water in the water pool.

[0015] Preferably, the heat dissipation assembly includes a plurality of metal heat conductive sheets arranged on the side of the shaped filling block facing the workbench, and a through groove is vertically penetrated on the workbench for the heat dissipation sheets to be placed in and for the cooling water in the water pool to enter.

[0016] By adopting the above scheme, the heat sink in this scheme directly contacts the cooling water after the water pool rises, and can quickly transfer the heat released by the heating surface to the cooling water, thereby playing a role of continuous heat dissipation.

[0017] Preferably, thermal conductive coating is applied between the accommodating groove, the semiconductor cooling plate, the sealing cover and the heat sink.

[0018] By adopting the above solution, the thermal conductive coating can further accelerate the heat transfer speed and enhance the cooling effect.

[0019] The utility model has significant technical effects due to the adoption of the above technical scheme: when the cooling and shaping device is working, the water pool rises, and the cooling water can enter the cavity formed by the water chamber parts and the tooling blocks. At this time, the heat of the water chamber parts is transferred to the cooling water in the cavity, and the cooling component can reduce the temperature of the tooling block so that it absorbs the heat of the cooling water. Compared with the prior art, the cooling component in the present scheme can indirectly slow down the temperature rise of the cooling water in the cavity or indirectly reduce the temperature of the cooling water in the cavity, thereby increasing the cooling speed inside the water chamber parts, thereby improving the overall cooling and shaping efficiency of the water chamber parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a three-dimensional diagram of a water chamber rapid cooling and shaping device of this embodiment;

[0021] Figure 2 yes Figure 1 A partial enlarged view of a in FIG.

[0022] Figure 3It is a structural schematic diagram of a tooling block, water chamber parts and cooling components on a water chamber rapid cooling and shaping device of this embodiment;

[0023] Figure 4 yes Figure 3 A partial enlarged view of b in FIG.

[0024] Figure 5 It is a structural schematic diagram of a tooling block, water chamber parts and cooling components on a water chamber rapid cooling and shaping device of this embodiment;

[0025] Figure 6 yes Figure 5 The cross-sectional view about AA in FIG.

[0026] Figure 7 yes Figure 6 A partial enlarged view of c in FIG.

[0027] Figure 8 yes Figure 7 A partial enlarged view of d in FIG.

[0028] Fig. 9 It is a structural schematic diagram of a tooling block, water chamber parts and cooling components on a water chamber rapid cooling and shaping device of this embodiment;

[0029] Fig.10 yes Fig. 9 The stepped cross-sectional view of BB;

[0030] Fig.11 yes Fig.10 A partial enlarged view of e.

[0031] The names of the parts indicated by the numerical labels in the above drawings are as follows: 1. Workbench; 2. Water chamber parts; 201. Water inlet interface; 3. Molded filling block; 4. Molded pressing block; 5. Water tank; 6. Semiconductor refrigeration plate; 601. Cooling surface; 602. Heating surface; 7. Receiving groove; 8. Sealing cover; 9. Metal heat conductive plate; 10. Through groove; 11. Rack; 12. Clamping cylinder; 13. Lifting cylinder; 14. Step surface; 1401. Threaded hole; 15. Screw; 16. Rubber sealing ring; 17. Threading hole; 18. Rubber sealing sleeve. DETAILED DESCRIPTION

[0032] The utility model is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0033] Example

[0034] A water chamber rapid cooling and shaping device, according to Figure 1 or Figure 2As shown, it includes a frame 11, a workbench 1 is fixedly arranged on the frame 11, a forming fixture for deformation of a limited-position water chamber part 2 is arranged on the workbench 1, the forming fixture includes a forming block 4 fixed on the workbench, a forming filling block 3 is plugged into and matched with the cavity of the water chamber part 2 and a matching gap is reserved for cooling water to flow in after plugging, the forming fixture also includes a clamping cylinder 12 fixed on the frame 11 and located above the workbench 1, the telescopic end of the clamping cylinder 12 is provided with a forming block 4 that presses the upper end surface and both ends of the water chamber part 2 when it is lowered, a water pool 5 is provided for lifting below the workbench 1, the lifting of the water pool 5 can drive the water chamber part 2 to be completely immersed in cooling water or completely separated from cooling water, the lifting of the water pool 5 is controlled by a lifting cylinder 13 arranged on the frame 11, the above is the prior art and will not be repeated in this embodiment.

[0035] The improvement of this embodiment is that according to Figure 7 , Figure 8 or Fig.11 As shown, a receiving groove 7 is recessed on one side of the shaped filling block 3 away from the fitting gap, and a sealing cover 8 is provided on the receiving groove 7 to seal or open the receiving groove 7. Fig.11 As shown, in this embodiment, a step surface 14 for placing the sealing cover 8 is provided at the opening of the accommodating groove 7, a rubber sealing ring 16 is provided between the sealing cover 8 and the step surface 14 to prevent cooling water from entering the accommodating groove 7, threaded holes 1401 are provided at the four corners of the step surface 14, and screws 15 matching the threaded holes 1401 are pierced on the sealing cover 8. After the screws 15 are tightened, the sealing cover 8 is driven close to the step surface 14 and the rubber sealing ring 16 is squeezed and deformed to play a waterproof role. A plurality of semiconductor cooling sheets 6 are provided in the accommodating groove 7, and the semiconductor cooling sheets 6 are connected in series in sequence. The two sides of the semiconductor cooling sheet 6 are respectively a cooling surface 601 and a heating surface 602. In this embodiment, the cooling surface 601 faces the matching gap and fits on the bottom of the accommodating groove 7, and the heating surface 602 fits on the sealing cover 8. The semiconductor cooling sheet 6 needs to be supplied with direct current to work. In this embodiment, an electric wire is used to connect the semiconductor cooling sheet 6 from the outside of the stereotyped filling block 3. According to Figure 8 As shown, the sealing cover 8 is provided with a threading hole 17 for passing the power line, and a rubber sealing sleeve 18 is provided in the threading hole 17 to prevent cooling water from entering the accommodating groove 7. The outer ring of the rubber sealing sleeve 18 is interference fit with the inner wall of the threading hole 17, and the inner ring is interference fit with the wire. In this embodiment, the wire is waterproof wire, and the accommodating groove 7 is filled with a sealing medium for sealing the semiconductor refrigeration plate 6, and the sealing medium includes electronic potting glue.

[0036] The shaped filling block 3 is provided with a heat dissipation component for quickly dissipating the heat of the heating surface 602 to the cooling water in the pool 5. The heat dissipation component includes a plurality of metal heat conducting sheets 9 arranged on the side of the shaped filling block 3 facing the workbench 1. Figure 7As shown, since the opening direction of the receiving groove 7 is consistent with the direction of the heating surface 602 and the heating surface 602 is attached to the sealing cover 8, in this embodiment, the heat sink is arranged on the side of the sealing cover 8 facing away from the heating surface 602, and a through groove 10 is vertically penetrated on the workbench 1 for the metal heat conductive sheet 9 to be placed. When the water pool 5 rises, the cooling water in the water pool 5 can enter the through groove 10, so that the heat on the metal heat conductive sheet 9 is quickly introduced into the cooling water in the water pool 5, and the receiving groove 7, the semiconductor cooling sheet 6, the sealing cover 8 and the heat sink are all coated with a thermal conductive coating that can accelerate the heat transfer speed. In this embodiment, the thermal conductive coating is thermal conductive silicone grease.

[0037] Combined with the above structure, reference Figures 1 to 11 It can be seen that the installation steps of the shaping filling block 3 and the cooling assembly on a water chamber rapid cooling shaping device in this embodiment are as follows:

[0038] First, install the semiconductor refrigeration sheet 6, and evenly apply thermal grease on the cooling surface 601 and the heating surface 602 of the semiconductor refrigeration sheet 6, then put the cooling surface 601 toward the bottom of the accommodating groove 7 into the accommodating groove 7, and connect the semiconductor refrigeration sheets 6 in series in turn, and then fill the electronic potting glue into the accommodating groove 7 and solidify it. Next, insert the wire into the rubber sealing sleeve 18 and pass the wire through the threading hole 17, and then insert the rubber sealing sleeve 18 into the threading hole 17; next, install the sealing cover 8, first place the rubber sealing ring 16 on the step surface 14, then put in the sealing cover 8, and then pass the screw 15 through the sealing cover 8 and match it with the threaded hole 1401 and tighten it; finally, install the metal thermal conductive sheet 9, apply thermal grease on the bottom film of the metal thermal conductive sheet 9 and fix it on the sealing cover 8.

[0039] When the water chamber rapid cooling and shaping tooling in the present embodiment is working, the water pool 5 rises to allow cooling water to enter the matching gap formed by the water chamber part 2 and the shaping filling block 3, and the heat of the water chamber part 2 is transferred to the cooling water in the matching gap, while the semiconductor refrigeration plate 6 drives the shaping filling block 3 to cool down and absorb the heat of the cooling water in the matching gap, and at the same time, the absorbed heat is discharged to the cooling water in the water pool 5 with the help of the metal heat conductive plate 9. Compared with the prior art, the cooling component in the present scheme can indirectly slow down the temperature rise of the cooling water in the cavity or indirectly reduce the temperature of the cooling water in the cavity, thereby increasing the cooling speed inside the water chamber part 2, thereby improving the overall cooling and shaping efficiency of the water chamber part 2.

[0040] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A water chamber rapid cooling and shaping device, comprising a fixed workbench (1), a shaping fixture for limiting the deformation of a water chamber part (2) is arranged on the workbench (1), the shaping fixture comprising a shaping filling block (3) fixed on the workbench and plugged into the cavity of the water chamber part (2) and reserving a matching gap for cooling water to flow into after plugging, and a shaping pressing block (4) located above the workbench (1) and arranged to be lifted and lowered and pressing the upper end surface and both ends of the water chamber part (2) when descending, a water pool (5) is arranged to be lifted and lowered below the workbench (1), and the lifting and lowering of the water pool (5) can drive the water chamber part (2) to be completely immersed in cooling water or completely separated from the cooling water, characterized in that: A cooling component for absorbing the heat of cooling water in the matching gap is embedded in the shaped filling block (3).

2. A water chamber rapid cooling and shaping device according to claim 1, characterized in that: The cooling component comprises a plurality of semiconductor cooling sheets (6), wherein the semiconductor cooling sheets (6) are connected in series in sequence, and the two sides of the semiconductor cooling sheet (6) are respectively a cooling surface (601) and a heating surface (602), and the cooling surface (601) and the heating surface (602) are respectively facing the fitting gap and the water pool (5).

3. A water chamber rapid cooling and shaping device according to claim 2, characterized in that: A receiving groove (7) for a built-in semiconductor cooling plate (6) is recessed on one side of the shaped filling block (3) facing toward or away from the fitting gap, and a sealing cover (8) capable of sealing or opening the receiving groove (7) is arranged on the receiving groove (7).

4. A water chamber rapid cooling and shaping device according to claim 3, characterized in that: The accommodating groove (7) is filled with a sealing medium for sealing the semiconductor cooling plate (6), and the sealing medium includes electronic potting glue.

5. The water chamber rapid cooling and shaping device according to claim 3, characterized in that: A heat dissipation component is provided on the shaped filling block (3) for quickly dissipating the heat of the heating surface (602) to the cooling water in the water pool (5).

6. A water chamber rapid cooling and shaping device according to claim 5, characterized in that: The heat dissipation assembly comprises a plurality of metal heat conducting sheets (9) arranged on the side of the shaped filling block (3) facing the workbench (1), and a through groove (10) is vertically penetrated on the workbench (1) for the heat dissipation sheets to be placed in and for the cooling water in the water pool (5) to enter.

7. The water chamber rapid cooling and shaping device according to claim 1, characterized in that: The accommodating groove (7), the semiconductor cooling plate (6), the sealing cover (8) and the heat sink are all coated with heat-conducting paint.

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