Optical module

Abstract

According to the optical module provided by the embodiment of the invention, the first heat dissipation piece is arranged on the circuit board, the optical chip is attached to one end of the first heat dissipation piece, and the optical chip is covered with the lens assembly. The other end of the first heat dissipation piece extends out of the coverage area of the lens assembly so that heat generated by the optical chip can be diffused to the outside of the lens assembly from the bottom of the lens assembly and conducted to the surface of one side of the circuit board through the second heat dissipation piece. The first heat conduction piece is arranged on the first heat dissipation piece and located on the outer side of the lens assembly, and the lower surface of the first heat conduction piece is in heat conduction connection with the first heat dissipation piece; the upper surface of the first heat-conducting piece is in heat-conducting connection with the upper shell; the first heat conduction piece conducts heat of the first heat dissipation piece to the upper shell, and the heat dissipation effect is improved. The circuit board is provided with an isolation groove, the isolation groove is located between the optical chip and the electric chip, the isolation groove prevents heat generated by the electric chip from being conducted to the optical chip in the length direction of the circuit board, interference to the optical chip is reduced, and stability is improved.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] With the advent of the 5G era, in order to achieve 5G's requirements of large bandwidth capacity, low latency, network slicing, etc., it is necessary to improve the transmission rate of optical communications. In order to improve the transmission rate of optical communications, the field has begun to use 400G optical modules to realize the transmission and reception of light of different wavelengths.

[0003] The 400G optical module includes a printed circuit board (PCB), a laser, a detector, and a driver chip for driving the laser and the detector, etc., which are installed on the printed circuit board. Each device is soldered on the corresponding pad of the printed circuit board. Each device will generate heat during operation. If the heat cannot be quickly dissipated, the ambient temperature will continue to rise, affecting the performance of the optical module. Utility Model Content

[0004] The present application provides an optical module to improve the heat dissipation efficiency of the optical module.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] On the one hand, an embodiment of the present application discloses an optical module, including: an upper housing;

[0007] A lower shell body, which is covered with the upper shell body to form a cavity;

[0008] A circuit board is located between the upper shell and the lower shell, and a circuit is arranged on the circuit board;

[0009] An optical chip, electrically connected to the circuit board, for transmitting and / or receiving optical signals;

[0010] an electric chip, electrically connected to the circuit board and used to drive the optical chip;

[0011] An optical fiber ribbon is located between the first heat sink and the upper housing;

[0012] A lens assembly connected to the optical fiber ribbon, the lens assembly covers the optical chip and is used for propagation of the light beam;

[0013] A first heat sink, a portion of which is located below the lens assembly and another portion of which is located outside the lens assembly; the optical chip is attached to one end of the first heat sink, and the first heat sink can conduct heat generated by the optical chip to outside the coverage area of ​​the lens assembly;

[0014] A first heat-conducting member is attached to the first heat dissipating member and is located outside the lens assembly, wherein the lower surface of the first heat-conducting member is thermally connected to the first heat dissipating member; and the upper surface of the first heat-conducting member is thermally connected to the upper housing;

[0015] A second heat sink is located below the electric chip, and the second heat sink is embedded in the circuit board;

[0016] The circuit board is provided with an isolation groove, and the isolation groove is located between the optical chip and the electrical chip.

[0017] On the other hand, an embodiment of the present application discloses an optical module, including: an upper housing;

[0018] A lower shell body, which is covered with the upper shell body to form a cavity;

[0019] A circuit board is located in the cavity, and a circuit is arranged on the circuit board;

[0020] An optical chip, electrically connected to the circuit board, for transmitting and / or receiving optical signals;

[0021] an electric chip, electrically connected to the circuit board and used to drive the optical chip;

[0022] An optical fiber ribbon is located between the first heat sink and the upper housing;

[0023] A lens assembly connected to the optical fiber ribbon, the lens assembly covers the optical chip and is used for propagation of the light beam;

[0024] A first heat sink, a portion of which is located below the lens assembly and another portion of which is located outside the lens assembly; the optical chip is attached to one end of the first heat sink, and the first heat sink can conduct heat generated by the optical chip to outside the coverage area of ​​the lens assembly;

[0025] A first heat-conducting member is attached to the first heat dissipating member and is located outside the lens assembly, wherein the lower surface of the first heat-conducting member is thermally connected to the first heat dissipating member; and the upper surface of the first heat-conducting member is thermally connected to the upper housing;

[0026] A second heat sink is located below the electric chip, and the second heat sink is embedded in the circuit board;

[0027] The circuit board is provided with an isolation groove, and the isolation groove is located between the optical chip and the electrical chip;

[0028] The lower surface of the lower housing is provided with heat dissipation fins, and the heat dissipation fins cover the second heat dissipation element.

[0029] Compared with the prior art, the present invention has the following advantages:

[0030] An optical module provided in an embodiment of the present application comprises a first heat sink on a circuit board, an optical chip is attached to one end of the first heat sink, and a lens assembly covers the optical chip. The other end of the first heat sink extends beyond the coverage area of ​​the lens assembly to diffuse the heat generated by the optical chip from the bottom of the lens assembly to the outside of the lens assembly, and to conduct the heat to one side of the circuit board through the second heat sink. The first heat conductor is on the first heat sink and is located on the outside of the lens assembly. The lower surface of the first heat conductor is thermally connected to the first heat sink; the upper surface of the first heat conductor is thermally connected to the upper shell; the first heat conductor conducts the heat of the first heat sink to the upper shell to increase the heat dissipation effect. The circuit board is provided with an isolation groove, which is located between the optical chip and the electrical chip. The isolation groove prevents the heat generated by the electrical chip from being conducted to the optical chip along the length direction of the circuit board, thereby reducing interference with the optical chip and improving stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0032] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments;

[0033] Figure 2 is a partial structural diagram of a host computer according to some embodiments;

[0034] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0035] Figure 4 is an exploded view of an optical module according to some embodiments;

[0036] Figure 5 is a schematic diagram of the internal structure of an optical module according to some embodiments;

[0037] Figure 6 A schematic diagram of an internal decomposition structure of an optical module provided according to some embodiments;

[0038] Figure 7 A schematic diagram of the decomposed structure of a heat dissipation structure provided according to some embodiments;

[0039] Figure 8A schematic diagram of a cross-sectional structure of a heat dissipation structure and a circuit board provided according to some embodiments;

[0040] Fig. 9 A partial cross-sectional schematic diagram of a heat dissipation structure and a circuit board provided according to some embodiments;

[0041] Fig.10 A schematic diagram of a heat dissipation path of a heat dissipation structure provided according to some embodiments;

[0042] Fig.11 A schematic diagram of a lower shell structure provided according to some embodiments. DETAILED DESCRIPTION

[0043] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

[0044] The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0045] Figure 1 FIG. 1 is a partial architecture diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system is partially presented as a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0046] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

[0047] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0048] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0049] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional / bidirectional electrical signal connection.

[0050] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and Data Center Server are common host computers.

[0051] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0052] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0053] For example, a first optical signal from the direction of a remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0054] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

[0055] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structures related to the host computer 100 and the optical module 200 are shown. Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0056] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0057] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 is an exploded view of an optical module according to some embodiments. Figure 5 FIG. 1 is a schematic diagram of the internal structure of an optical module according to some embodiments. Figure 3 , Figure 4 and Figure 5 As shown, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, a light emitting component and a light receiving component. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component and the light receiving component.

[0058] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0059] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0060] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0061] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger 301 of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component and / or the optical receiving component in the optical module 200.

[0062] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, so that the components such as the circuit board 300, the light emitting component, and the light receiving component can be easily installed in the above shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling the components such as the circuit board 300, the light emitting component and the light receiving component, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated production.

[0063] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0064] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0065] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the snap-fit ​​fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0066] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (MOSFET), etc. The chips may include microcontroller units (MCU), laser driver chips, transimpedance amplifiers (TIA), limiting amplifiers, clock and data recovery chips (CDR), power management chips, and digital signal processing (DSP) chips.

[0067] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0068] The circuit board 300 also includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (for example, Figure 4The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0069] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0070] The light emitting component and / or the light receiving component are located on a side of the circuit board 300 away from the gold finger 301; in some embodiments, the light emitting component and the light receiving component are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0071] For the convenience of description, in this application, the optical transceiver component 400 includes one or both of the optical emitting component or the optical receiving component. The optical transceiver component 400 includes a lens assembly 401, an optical fiber ribbon 403, an optical interface 405, an optical chip 406 and an electrical chip 407. The optical chip 406 includes a laser and / or a detector; the electrical chip 407 includes a laser driver chip and / or a detector driver chip. Both driver chips are electrically connected to the signal circuit of the circuit board 300, the laser driver chip drives the laser to generate an optical signal and transmits it into the optical fiber ribbon through the lens assembly, and the detector driver chip drives the detector to receive the optical signal from the optical fiber ribbon.

[0072] In order to realize the optical coupling of the optical module, the lens assembly 401 is covered on the optical chip 406. The lens assembly 401 is used for the propagation of the light beam, such as the collimation and convergence of the light. The lens assembly 401 is connected to the optical interface 405 through the optical fiber ribbon 403. During the light emission process, the optical signal emitted by the laser in the optical chip 406 is collimated and converged by the lens assembly 401, and then emitted through the optical fiber ribbon 403; during the light receiving process, the optical signal generated by the optical interface 405 is transmitted into the optical fiber ribbon 403, and then received by the detector in the optical chip 406.

[0073] In order to improve the transmission rate of the optical module, multiple groups of optical transceiver devices may be arranged in the optical module, that is, one group of optical transceiver devices, two groups of optical transceiver devices or three groups of optical transceiver devices, and the arrangement of the multiple groups of optical transceiver devices may be the same or similar to the arrangement of one group of optical transceiver devices. Taking the arrangement of two groups of optical transceiver devices as an example, a first group of optical transceiver devices including a lens assembly 401, an optical fiber ribbon 403 and an optical chip 406, and a second group of optical transceiver devices including a second lens assembly, a second optical fiber ribbon and a second optical chip.

[0074] Devices such as lasers in the optical chip will generate heat during operation. If the heat cannot be quickly dissipated, the ambient temperature will continue to rise, affecting the performance of the optical module. Since the two optical chips are covered with lens assemblies, and the shell of the lens assembly is made of plastic material, the thermal conductivity is poor. To this end, in order to dissipate the heat of the optical module and improve the heat dissipation effect, the embodiment of the present application adopts a heat dissipation structure 500 and a heat conductor to conduct the heat generated by the optical chip to the upper shell 201 via the surface of the circuit board 300. The upper shell 201 can receive the heat conducted by the heat conductor and dissipate it to the surrounding environment. Since in the optical module provided by the embodiment of the present application, when multiple groups of optical transceiver devices are set, the heat dissipation principle of the multiple groups of optical transceiver devices is the same as the heat dissipation principle provided in the embodiment of the present application, it will not be repeated here. And only the heat dissipation of the laser is used as an example for explanation, and the solution for the heat dissipation of the detector, as well as the solution for the heat dissipation of the laser, the laser driver chip, the detector and the detector driver chip at the same time can refer to the solution for the heat dissipation of the laser, which will not be repeated here.

[0075] For the convenience of expression, Figure 5 The X direction is defined as the length direction of the circuit board, the Y direction is defined as the width direction of the circuit board, and the Z direction is defined as the thickness direction of the circuit board.

[0076] Figure 6 A schematic diagram of an internal decomposition structure of an optical module provided according to some embodiments; Figure 7 A schematic diagram of the decomposed structure of a heat dissipation structure provided according to some embodiments; Figure 8 A schematic diagram of a cross-sectional structure of a heat dissipation structure and a circuit board provided according to some embodiments; Fig. 9 A partial cross-sectional schematic diagram of a heat dissipation structure and a circuit board provided according to some embodiments. Fig.10 FIG. 1 is a schematic diagram of a heat dissipation path of a heat dissipation structure provided according to some embodiments. Figure 6 , Figure 7 , Figure 8 , Fig. 9 and Fig.10 The heat dissipation structure 500 provided in the embodiment of the present application includes a first heat dissipation element 501 and a second heat dissipation element 502 .

[0077] The first heat sink 501 is located on the surface of the circuit board, and the optical chip 406 is located on the first heat sink 501. In order to make one end of the first heat sink 501 extend outside the coverage area of ​​the lens assembly 401, the heat generated by the optical chip under the lens assembly 401 is diffused outside the coverage area of ​​the lens assembly 401. The first heat sink 501 is arranged on the circuit board 300. The first heat sink 501 can be attached to the surface of the circuit board 300 along the length direction of the circuit board 300, or can be built into the circuit board 300. The first heat sink 501 is used to diffuse the heat generated by the optical chip 406 along the circuit board 300 out of the coverage area of ​​the lens assembly 401, that is, to diffuse the heat generated by the optical chip along the circuit board 300 out of the coverage area of ​​the lens assembly 401. The first heat sink 501 can be made of a material with a thermal conductive effect, such as a copper layer or a copper block, or other materials, which are not specifically limited in this embodiment.

[0078] The first heat sink 501 can be mounted on the surface of the circuit board 300. When the first heat sink 501 is a copper layer, the copper layer can be attached to the surface of the circuit board 300 to form a copper layer on the surface of the circuit board 300 with a thickness of about 20 microns. The heat generated by the optical chip 406 diffuses along the copper layer, so that the heat is diffused from the surface of the circuit board 300 to outside the coverage area of ​​the lens assembly 401.

[0079] In order to improve the heat dissipation effect of the first heat sink 501, a first heat conducting member 510 is provided on the upper surface of the first heat sink 501. The first heat conducting member 510 is located between the first heat sink 501 and the upper housing 201. The first heat conducting member 510 not only conducts heat, but also supports the upper housing 201. The first heat conducting member 510 can conduct the heat located at the circuit board 300 to the upper housing 201, which is the main heat dissipation surface of the optical module, and has a better heat dissipation effect.

[0080] In order to make the first heat-conducting member 510 play a supporting role, in some embodiments, the first heat-conducting member 510 is made into a hard structure. The circuit board 300 is also a hard structure, and the first heat sink 501 is laid on the circuit board 300. When the first heat-conducting member 510 contacts the first heat sink 501, a phenomenon of hard structure contacting hard structure is presented, which easily causes wear of the first heat-conducting member 510 or the first heat sink 501. Therefore, in order to avoid wear, in this embodiment, when the first heat-conducting member 510 contacts the second heat sink 502, a heat-conducting adhesive layer is provided between the two to achieve soft contact between the first heat-conducting member 510 and the first heat sink 501.

[0081] In some embodiments, the first heat sink 501 extends to both sides of the width of the coverage area of ​​the lens assembly 401. The first heat conductive member 510 includes a first sub-heat conductive portion 511 and a second sub-heat conductive portion 512; the first sub-heat conductive portion 511 and the second sub-heat conductive portion 512 are respectively located on both sides of the lens assembly 401, and the heat generated by the optical chip is diffused to the surface of the circuit board through the first heat sink, and then conducted to the upper housing through the first sub-heat conductive portion 511 and the second sub-heat conductive portion 512, and the heat is dissipated by the upper housing 201.

[0082] The first heat-conducting sub-part 511 and the second heat-conducting sub-part 512 can be separately arranged, the first heat-conducting sub-part 511 is located on one side of the lens assembly 401, and the second heat-conducting sub-part 512 is located on the other side of the lens assembly 401. The lower surface of the first heat-conducting sub-part 511 is connected to the first heat sink 501, and the upper surface of the first heat-conducting sub-part 511 is thermally connected to the upper shell. The lower surface of the second heat-conducting sub-part 512 is connected to the first heat sink 501, and the upper surface of the second heat-conducting sub-part 512 is thermally connected to the upper shell. After the heat generated by the optical chip 406 passes through the first heat sink 501, part of it is transferred to the upper shell through the first heat-conducting sub-part 511, and the other part is transferred to the upper shell through the second heat-conducting sub-part 512, and the heat is dissipated through the upper shell.

[0083] The first sub-heat-conducting part 511 and the second sub-heat-conducting part 512 can be connected through the third sub-heat-conducting part, the third sub-heat-conducting part is located in the direction of the optical port, and the optical fiber ribbon 403 is located above the third sub-heat-conducting part. In order to reduce the heat carried by the first heat sink 501 at the corresponding position below the optical fiber ribbon 403 and transferred to the optical fiber ribbon 403, the height of the third sub-heat-conducting part is lower than the height of the first sub-heat-conducting part 511. When the heat is conducted to the bottom of the optical fiber ribbon 403 through the first heat sink 501, it is conducted to the first sub-heat-conducting part 511 and the second sub-heat-conducting part 512 through the third sub-heat-conducting part, and then transferred upward to the upper shell through the first sub-heat-conducting part 511 and the second sub-heat-conducting part 512.

[0084] In some embodiments, the heat conduction efficiency of the third sub-heat conducting portion is greater than the heat conduction efficiency of the optical fiber ribbon 403, so that the heat is conducted through the third sub-heat conducting portion to the first sub-heat conducting portion 511 and the second sub-heat conducting portion 512. A portion of the heat generated by the optical chip 406 first diffuses along the surface of the circuit board in the length and width direction of the circuit board through the first heat sink 501, diffuses to the upper housing through the heat conducting portion, and is dissipated by the upper housing.

[0085] The third sub-heat conducting part is used to support the optical fiber ribbon 403, so that the optical fiber ribbon 403 is suspended above the first heat dissipating member 501 to prevent the optical fiber ribbon 403 from contacting the first heat dissipating member 501 and thus affecting the heat dissipation effect; and the optical fiber ribbon 403 is suspended above the first heat dissipating member 501 to reduce the interference of heat on the optical fiber ribbon 403. The heat diffused to the third sub-heat conducting part along the surface of the circuit board to the length of the circuit board is conducted to the first sub-heat conducting part 511 and the second sub-heat conducting part 512 along the third sub-heat conducting part, and then conducted to the upper housing through the first sub-heat conducting part 511 and the second sub-heat conducting part 512.

[0086] The second heat sink 502 is located below the optical chip 406 , and an upper surface of the second heat sink 502 is connected to the first heat sink 501 .

[0087] The second heat sink 502 is embedded in the circuit board. One end of the second heat sink 502 is connected to the first heat sink 501. The second heat sink 502 may be a copper block, which may be built into the circuit board 300, that is, a groove or a hole is dug in the thickness direction of the circuit board 300, and the copper block is built into the groove so that the upper surface of the copper block is exposed on the surface of the circuit board 300. If the upper and lower surfaces of the circuit board 300 are dug through, at this time, the second heat sink 502 of the copper block structure passes through the circuit board 300, and the upper surface of the copper block is connected to the first heat sink; the lower surface of the second heat sink 502 needs to be exposed on the lower surface of the circuit board 300, so that heat can be dissipated along the upper and lower surfaces of the circuit board at the same time. The upper surface of the second heat sink 502 is connected to the first heat sink, and part of the heat generated by the laser diffuses along the first heat sink to outside the coverage area of ​​the lens assembly 401; the other part of the heat diffuses downward along the second heat sink 502, and at this time, the lower surface of the second heat sink 502 also exposes the lower surface of the circuit board 300, and the lower surface of the circuit board 300 is thermally connected to the lower shell 202 of the optical module. Therefore, the heat conducted downward can be conducted to the lower shell 202 again, and then the heat is dissipated by the lower shell 202.

[0088] The second heat sink 502 is embedded in the circuit board, and the second heat sink 502 may only penetrate part of the metal layer in the thickness direction of the circuit board, or may penetrate the entire thickness direction of the circuit board. In some embodiments, the second heat sink 502 is the entire thickness direction of the circuit board.

[0089] In some embodiments, the second heat sink 502 is located below the optical chip 406. To improve heat conduction efficiency, the projection of the second heat sink 502 on the circuit board covers the optical chip 406.

[0090] In some embodiments, when the optical module has two or more optical chips 406, multiple second heat sinks 502 may be provided. The number and position of the second heat sinks 502 correspond one-to-one with the optical chips 406. When the optical module has two or more optical chips 406, one second heat sink 502 may be provided, and the second heat sink 502 covers all the optical chips 406.

[0091] In some embodiments, a second heat conductor 520 is provided on the lower surface of the circuit board. The upper surface of the second heat sink 502 is connected to the first heat sink 501, and the lower surface of the second heat sink 502 is thermally connected to the second heat conductor 520. A portion of the heat generated by the optical chip 406 first diffuses along the surface of the circuit board in the length and width directions of the circuit board through the first heat sink 501, diffuses to the upper shell through the heat conduction part, and is dissipated by the upper shell. Another portion of the heat generated by the optical chip 406 diffuses along the thickness direction of the circuit board through the first heat sink 501 to the second heat sink 502. The heat is conducted to the lower shell through the second heat sink 502 and dissipated through the lower shell.

[0092] The upper surface of the second heat conducting member 520 is connected to the second heat dissipating member, and the lower surface of the second heat conducting member 520 is connected to the lower housing. The second heat conducting member 520 not only conducts heat, but also supports the circuit board 300. The second heat conducting member 520 can conduct the heat at the circuit board 300 to the lower housing 202.

[0093] In order to make the second heat-conducting member 520 play a supporting role, in some embodiments, the second heat-conducting member 520 is made into a hard structure. The circuit board 300 is also a hard structure. When the second heat-conducting member 520 contacts the second heat sink 502, a phenomenon of hard structure contacting hard structure is presented, which easily causes wear of the second heat-conducting member 520 and the second heat sink 502. Therefore, in order to avoid wear, in this embodiment, when the second heat-conducting member 520 contacts the second heat sink 502, a heat-conducting adhesive layer is provided between the two to achieve soft contact of the second heat-conducting member 520 and the second heat sink 502.

[0094] In some embodiments, to reduce the heat interference of the electrical chip 407 on the optical chip 406, the circuit board is provided with an isolation groove 302. The isolation groove 302 is located between the optical chip 406 and the electrical chip 407, blocking the direct thermal contact between the optical chip 406 and the electrical chip 407.

[0095] The isolation groove 302 is hollowed out from the upper surface of the circuit board and can penetrate the multi-layer board surface of the circuit board or penetrate the entire thickness direction of the circuit board. To realize the power supply of the optical chip, the wires on the optical chip cross the isolation groove 302 and connect to the circuit board on the side of the electrical chip. The heat generated by the optical chip can be conducted to the side of the electrical chip through the metal wire, or bypass the isolation groove 302 and transfer to the side of the electrical chip through the circuit board, thereby reducing the heat transferred from the optical chip to the electrical chip.

[0096] When the number of optical chips is 1, the length of the isolation slot 302 along the width direction of the circuit board is greater than the length of the optical chip, blocking the path of the heat generated by the electrical chip to be conducted along the length direction of the circuit board toward the optical port, so that the heat is conducted along the length direction of the circuit board toward the optical chip through the metal wire. The metal wire has a small diameter and low thermal conductivity, which reduces the heat transferred from the electrical chip to the optical chip.

[0097] In some embodiments, along the width direction of the circuit board, the length of the isolation groove 302 is greater than the length of the electrical chip, blocking the path for the heat generated by the electrical chip to be conducted along the length direction of the circuit board toward the optical port, so that the heat is transferred through the metal wire when being conducted along the length direction of the circuit board toward the optical chip.

[0098] When the number of optical chips is 2 or more, the length of the isolation slot 302 along the width direction of the circuit board is greater than the total length of all optical chips, blocking the path for heat generated by the electrical chip to be conducted toward the optical port along the length direction of the circuit board.

[0099] In some embodiments, along the width direction of the circuit board, the length of the isolation groove 302 is greater than the total length of all electrical chips, blocking the path for the heat generated by the optical chip to be conducted along the length direction of the circuit board toward the electrical port, so that the heat is transferred through the metal wire when it is conducted toward the electrical chip along the length direction of the circuit board.

[0100] In some embodiments, the lower housing is provided with a heat-conducting boss, and the upper surface of the heat-conducting boss is connected to the second heat-conducting member, so that the heat conducted along the second heat-dissipating member 502 and the second heat-conducting member 520 is dissipated through the lower housing. The heat-conducting boss covers the second heat-conducting member 520, so that the heat of the second heat-conducting member 520 can be completely conducted out of the heat-conducting boss. The heat-conducting boss covers the second heat-conducting member 520, and the upper surface area of ​​the heat-conducting boss is larger than the second heat-conducting member 520, so as to avoid the second heat-conducting member 520 being partially suspended in the air, resulting in part of the heat being unable to be transferred to the outside of the lower housing through the heat-conducting boss.

[0101] Fig.11 FIG. 1 is a schematic diagram of a lower housing structure provided according to some embodiments. Fig.11 As shown, in some embodiments, the lower surface of the lower housing is provided with heat dissipation fins, and the heat dissipation fins are located below the second heat conducting member 520. After passing through the second heat conducting member 520 and the heat conducting boss, the heat is dissipated through the heat dissipation fins. The heat dissipation fins increase the surface area of ​​the housing, increase the heat dissipation area, and improve the heat dissipation effect.

[0102] In some embodiments, the heat dissipation fins may be strip-shaped protrusion structures, or may be protrusion structures distributed in a dot matrix. When the heat dissipation fins are strip-shaped protrusion structures, the heat dissipation fins include a plurality of strip-shaped protrusions, and there are gaps between the strip-shaped protrusions. The protrusion structure increases the heat dissipation area.

[0103] The coverage area of ​​the first heat sink 501 on the circuit board 300 exceeds the coverage area of ​​the lens assembly 401 on the circuit board 300. When the optical chip on one end of the first heat sink 501 generates heat, a portion of the heat diffuses along the first heat sink 501 from right to left, so that the heat diffuses from the bottom of the lens assembly 401 to the outside of the lens assembly 401. The first heat sink 501 is used to conduct the heat generated by the optical chip 406 to outside the coverage area of ​​the lens assembly 401, for example, to conduct the heat generated by the laser to outside the coverage area of ​​the lens assembly 401.

[0104] Another part of the heat generated by the optical chip is conducted along the first heat sink 501 to the second heat sink 502, along the thickness direction of the circuit board, and transferred to the lower housing through the second heat conducting member. The lower surface of the lower housing is provided with heat dissipation fins, which are located below the second heat conducting member 520. After passing through the second heat conducting member 520 and the heat conducting boss, the heat is dissipated through the heat dissipation fins. The heat dissipation fins increase the surface area of ​​the housing, increase the heat dissipation area, and improve the heat dissipation effect.

[0105] Since the above embodiments are all described by citing and combining with other embodiments, different embodiments have the same parts, and the same and similar parts between the embodiments in this specification can be referred to each other. No further detailed description is given here.

[0106] It should be noted that, in this specification, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such circuit structure, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the circuit structure, article or device including the element.

[0107] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure of the present application. The present application is intended to cover any variation, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the content of the claims.

[0108] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: Upper shell; A lower shell body, which is covered with the upper shell body to form a cavity; A circuit board is located in the cavity, and a circuit is arranged on the circuit board; An optical chip, electrically connected to the circuit board, for transmitting and / or receiving optical signals; an electric chip, electrically connected to the circuit board and used to drive the optical chip; The optical fiber ribbon is located between the first heat sink and the upper housing; A lens assembly connected to the optical fiber ribbon, the lens assembly covers the optical chip and is used for propagation of the light beam; A first heat sink, a portion of which is located below the lens assembly and another portion of which is located outside the lens assembly; the optical chip is attached to one end of the first heat sink, and the first heat sink can conduct heat generated by the optical chip to outside the coverage area of ​​the lens assembly; A first heat-conducting member is attached to the first heat-dissipating member and is located outside the lens assembly, wherein a lower surface of the first heat-conducting member is thermally connected to the first heat-dissipating member; The upper surface of the first heat-conducting member is thermally connected to the upper shell; A second heat sink is located below the electric chip, and the second heat sink is embedded in the circuit board; The circuit board is provided with an isolation groove, and the isolation groove is located between the optical chip and the electrical chip.

2. The optical module according to claim 1, characterized in that: The isolation groove passes through the circuit board.

3. The optical module according to claim 1, characterized in that: The length of the isolation groove along the width direction of the circuit board is greater than the length of the optical chip; the length of the isolation groove along the width direction of the circuit board is greater than the length of the electrical chip.

4. The optical module according to claim 1, characterized in that: The first heat sink is embedded in the circuit board, and a surface of the first heat sink is exposed on the surface of the circuit board.

5. The optical module according to claim 1, characterized in that: The first heat-conducting member comprises: a first heat-conducting sub-portion and a second heat-conducting sub-portion; The first sub-heat-conducting portion and the second sub-heat-conducting portion are located on two sides of the lens assembly; The first heat-conducting sub-portion and the second heat-conducting sub-portion are located on a surface of the first heat dissipation element outside a coverage area of ​​the lens assembly.

6. The optical module according to claim 5, characterized in that: The first heat-conducting member further includes: a third heat-conducting sub-portion, one end of which is connected to the first heat-conducting sub-portion, and the other end of which is connected to the second heat-conducting sub-portion; The third heat-conducting sub-portion supports the optical fiber ribbon; The third heat conducting sub-portion has a height lower than that of the first heat conducting sub-portion and the second heat conducting sub-portion.

7. The optical module according to claim 1, characterized in that: Also includes: A second heat conducting member is located on the lower surface of the circuit board; The upper surface of the second heat sink is thermally connected to the first heat sink; The lower surface of the second heat sink is thermally connected to the lower housing; The second heat conducting member covers the second heat dissipating member.

8. An optical module, characterized in that: include: Upper shell; A lower shell body, which is covered with the upper shell body to form a cavity; A circuit board is located between the upper shell and the lower shell, and a circuit is arranged on the circuit board; An optical chip, electrically connected to the circuit board, for transmitting and / or receiving optical signals; an electric chip, electrically connected to the circuit board and used to drive the optical chip; The optical fiber ribbon is located between the first heat sink and the upper housing; A lens assembly connected to the optical fiber ribbon, the lens assembly covers the optical chip and is used for propagation of the light beam; A first heat sink, a portion of which is located below the lens assembly and another portion of which is located outside the lens assembly; the optical chip is attached to one end of the first heat sink, and the first heat sink can conduct heat generated by the optical chip to outside the coverage area of ​​the lens assembly; A first heat-conducting member is attached to the first heat-dissipating member and is located outside the lens assembly, wherein a lower surface of the first heat-conducting member is thermally connected to the first heat-dissipating member; The upper surface of the first heat-conducting member is thermally connected to the upper shell; A second heat sink is located below the electric chip, and the second heat sink is embedded in the circuit board; The circuit board is provided with an isolation groove, and the isolation groove is located between the optical chip and the electrical chip; The lower surface of the lower housing is provided with heat dissipation fins, and the heat dissipation fins cover the second heat dissipation element.

9. The optical module according to claim 8, characterized in that: The isolation groove passes through the circuit board; the length of the isolation groove along the width direction of the circuit board is greater than the length of the optical chip; the length of the isolation groove along the width direction of the circuit board is greater than the length of the electrical chip.

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