Hybrid integrated four-way optical transceiver
By adopting a hybrid integrated four-way optical transceiver device design at the transmitting end of Combo PON OLT devices, using the combination of BOX housing and semiconductor refrigerator, the problems of low device bandwidth, high power consumption and large size are solved, and a higher bandwidth, lower power consumption and smaller size.
Patent Information
- Application Number
- CN202421445758.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-24
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-06-24
AI Technical Summary
The existing Combo PON OLT devices have low bandwidth, high power consumption and large size for the transmitter ends of the coaxial package.
Adopt a hybrid integrated four-way optical transceiver device, laser components and semiconductor refrigerators are arranged in the BOX housing, and two laser chips are controlled by a semiconductor refrigerator, and only one electric chip is needed to perform the semiconductor refrigerator in the circuit layout. control.
This improves the bandwidth of the device, saves power consumption, and greatly reduces the overall size, optimizing the overall layout of the device.
Smart Images
Figure CN222529547U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical communication, in particular to a hybrid integrated four-way optical transceiver. Background Art
[0002] The current traditional Combo passive optical network (Passive Optical Network, abbreviated as PON) optical line terminal (Optical Line Terminal, abbreviated as OLT) device optical sub-assembly (Optical Sub-Assembly, abbreviated as OSA) design is composed of 4 pure transistor outline packages (Transistor Out-line, abbreviated as TO) seats and some other structural parts. There are many components, the manufacturing process is complicated, and the cost is relatively high. In addition, the existing Combo PON OLT device simultaneously encapsulates the transmitter and the receiver into the same BOX structure. The signal at the transmitter is easy to affect the receiver, causing large electrical and optical crosstalk. With the development of communication technology, there are also higher requirements for the bandwidth of OLT devices. For example, for a 50Gb / s symmetrical transmission and reception Combo PON OLT device, TO-encapsulated devices are difficult to meet their bandwidth requirements.
[0003] like Figure 1a As shown, the existing single-line four-way devices mostly use coaxial packaging, that is, they are composed of 4 TO shells, tube bodies and corresponding optical port adapters. Since the wavelength range of the 50Gb / s 1342nm laser is relatively narrow, tuned from 1340nm to 1344nm, it is necessary to set a semiconductor cooler in the TO shell to control the temperature of the laser chip, so as to adjust the wavelength range. Similarly, since the wavelength range of the 10Gb / s 1577nm laser is also relatively narrow, tuned from 1575nm to 1580nm, it is necessary to set a semiconductor cooler in the corresponding TO shell to control the temperature of the laser chip, so as to adjust the wavelength range. Therefore, two semiconductor coolers are required, which greatly increases the overall size of the device, and the coaxial semiconductor coolers are mostly vertical structures. There is no direct contact between the semiconductor cooler and the base of the TO shell, but the heat is dissipated through the outer diameter of the TO shell. While increasing the overall power consumption of the device, the cooling effect will also be greatly reduced.
[0004] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in the field of this technology. Utility Model Content
[0005] The problem to be solved by the utility model is how to solve the problems of low bandwidth, high power consumption and large size of the coaxial package transmitting end of the existing Combo PON OLT device.
[0006] The utility model adopts the following technical solutions:
[0007] The utility model provides a hybrid integrated four-way optical transceiver device, comprising: a BOX shell 1, a round square tube body 2 and an optical port adapter 3 coupled in sequence along an optical path, the hybrid integrated four-way optical transceiver device also includes a first coaxial component 4 and a second coaxial component 5; the first coaxial component 4 and the second coaxial component 5 are respectively coupled on both sides of the round square tube body 2;
[0008] The BOX housing 1 is provided with a laser assembly 10 and a semiconductor refrigerator 11. The laser assembly 10 is provided on the heat dissipation surface of the semiconductor refrigerator 11 to dissipate heat for the laser assembly 10.
[0009] The laser assembly 10 is used to emit optical signals of different wavelengths, and transmit them to the opposite side device through the round square tube body 2 and the optical port adapter 3 in turn; the first coaxial assembly 4 and the second coaxial assembly 5 are used to receive different optical signals from the optical port adapter 3 respectively.
[0010] Preferably, the laser assembly 10 comprises a first laser chip 100 and a second laser chip 101 , and the first laser chip 100 and the second laser chip 101 are both arranged on the heat dissipation surface of the semiconductor refrigerator 11 .
[0011] Preferably, the wavelength of the optical signal emitted by the first laser chip 100 is 1340 nm to 1344 nm; the wavelength of the optical signal emitted by the second laser chip 101 is 1575 nm to 1580 nm.
[0012] Preferably, the first laser chip 100 and the second laser chip 101 are both electro-absorption modulated laser (EML) chips.
[0013] Preferably, the BOX housing 1 is further provided with a first collimating lens 12, a second collimating lens 13 and a light combining assembly 14;
[0014] The first collimating lens 12 is coupled to the light output end of the first laser chip 100, and the second collimating lens 13 is coupled to the light output end of the second laser chip 101;
[0015] The light combining component 14 is coupled to the light emitting surfaces of the first collimating lens 12 and the second collimating lens 13 .
[0016] Preferably, the light combining component 14 includes a dual-channel isolator 140 and a turning prism 141 coupled in sequence along the optical path;
[0017] The dual-channel isolator 140 is used to receive optical signals from the first collimating lens 12 and the second collimating lens 13 respectively;
[0018] The refractive surface of the turning prism 141 is used to receive the light signal from the first collimating lens 12 and refract it to the light-emitting surface of the turning prism 141 ; the transmissive surface of the turning prism 141 is used to receive the light signal from the second collimating lens 13 and transmit it to the light-emitting surface of the turning prism 141 .
[0019] Preferably, a first lens 20 , a second lens 21 and a third lens 22 are provided in the round square tube body 2 ; the first lens 20 is coupled to the first coaxial component 4 , the second lens 21 is coupled to the second coaxial component 5 , and the third lens 22 is coupled to the optical port adapter 3 .
[0020] Preferably, the round square tube body 2 is further provided with a first filter 23, a second filter 24 and a third filter 25;
[0021] The filtering surface of the first filter 23 is coupled to the first lens 20 , the filtering surface of the second filter 24 is coupled to the second lens 21 , and the filtering surface of the third filter 25 is coupled to the third lens 22 .
[0022] Preferably, the deflection angle of the first filter 23 is 30°-35°, the deflection angle of the second filter 24 is 10°-15°, and the deflection angle of the third filter 25 is 43°-47°.
[0023] Preferably, the first coaxial component 4 is a 10G avalanche photodiode (APD) component, and the second coaxial component 5 is a 25G APD component.
[0024] Compared with the prior art, the beneficial effects of the present invention are:
[0025] The utility model adopts BOX packaging for the transmitting end of the optical device, and the high-frequency routing is cascaded with the laser component 10, thereby optimizing the shortest bonding path and improving the bandwidth of the overall device; secondly, by placing the laser component 10 on the same semiconductor refrigerator 11, the temperature of the laser chips of the two channels on the laser component 10 is controlled by the semiconductor refrigerator 11 at the same time, and the heat dissipation surface of the semiconductor refrigerator 11 is in direct contact with the BOX shell 1, thereby ensuring its good heat dissipation and thermal performance. At the same time, in terms of circuit layout, only one electric chip is needed to control the semiconductor refrigerator 11, thereby saving the power consumption of the overall device and greatly reducing the overall size, thereby saving space for the overall layout of the device. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0027] Figure 1a It is a structural schematic diagram of a single-line four-way optical transceiver device;
[0028] Figure 1 It is a structural schematic diagram of a hybrid integrated four-directional optical transceiver device provided by an embodiment of the utility model;
[0029] Figure 2 It is a structural schematic diagram of a BOX shell of a hybrid integrated four-way optical transceiver device provided by an embodiment of the utility model;
[0030] Figure 3 It is a structural schematic diagram of a light combining component of a hybrid integrated four-directional optical transceiver device provided by an embodiment of the utility model;
[0031] Figure 4 It is a schematic diagram of the structure inside a round square tube body of a hybrid integrated four-directional optical transceiver device provided by an embodiment of the utility model;
[0032] Figure 5 This is another structural schematic diagram of the interior of a round square tube body of a hybrid integrated four-directional optical transceiver provided by an embodiment of the utility model.
[0033] In all drawings, the same reference numerals refer to the same structure, wherein:
[0034] BOX shell 1, laser component 10, first laser chip 100, second laser chip 101, semiconductor refrigerator 11, first collimating lens 12, second collimating lens 13, light combining component 14, dual-channel isolator 140, turning prism 141, round square tube body 2, first lens 20, second lens 21, third lens 22, first filter 23, second filter 24, third filter 25, optical port adapter 3, first coaxial component 4, second coaxial component 5. DETAILED DESCRIPTION
[0035] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0036] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above terms due to reasons such as the order and position of appearance, it is not limited to that they can be carried in combination by one embodiment or example.
[0037] In the description of the present utility model, the terms "first" and "second" are used for descriptive purposes only, and shall not be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, the meaning of "multiple" is two or more. In addition, for example, the description may also use the method of adding "A" and "B" at the end to describe the same type of nouns as two independent individuals. In this case, the corresponding features defined as "A" and "B" are only used to distinguish the same type of individuals for description purposes, and shall not be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.
[0038] When describing some embodiments, the expressions "coupling", "coupling" and "connection" and their derivatives may be used. For example, when describing some embodiments, the term "connection" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupling" may be used to indicate that two or more components are in direct physical or electrical contact. However, the terms "connection" or "coupling" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other, such as "optical path coupling", "wireless connection", etc. The embodiments disclosed here are not necessarily limited to the contents of the present utility model.
[0039] In addition, the technical features involved in each embodiment of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0040] Embodiment 1:
[0041] The present utility model embodiment provides a hybrid integrated four-way optical transceiver device, such as Figure 1 As shown, it includes: a BOX shell 1, a square tube body 2 and an optical port adapter 3 coupled in sequence along the optical path, and the hybrid integrated four-way optical transceiver device also includes a first coaxial component 4 and a second coaxial component 5; the first coaxial component 4 and the second coaxial component 5 are respectively coupled on both sides of the square tube body 2; a laser component 10 and a semiconductor refrigerator 11 are arranged in the BOX shell 1, and the laser component 10 is arranged on the heat dissipation surface of the semiconductor refrigerator 11 to dissipate heat for the laser component 10; the laser component 10 is used to emit optical signals of different wavelengths, and transmit them to the opposite side device in sequence through the square tube body 2 and the optical port adapter 3; the first coaxial component 4 and the second coaxial component 5 are used to receive different optical signals from the optical port adapter 3 respectively.
[0042] Among them, the BOX shell 1 is the main body of the entire hybrid integrated four-way optical transceiver device transmitting end, and contains key components inside. It provides a protective environment to avoid the influence of external interference on internal components. The BOX shell 1 adopts butterfly packaging, which needs to be packaged by a parallel sealing machine. The shell and cover of the ceramic shell are "seam welded" under a certain pressure using the principle of resistance welding. The specific process of butterfly packaging will not be explained in detail in this embodiment.
[0043] The round square tube body 2 is a structural component for transmitting optical signals, which can help to efficiently transmit optical signals. The optical port adapter 3 is an interface connected to the opposite device. The main function of the optical port adapter 3 is to transmit the optical signal generated inside to the opposite device, or to receive the optical signal from the opposite device.
[0044] The first coaxial component 4 and the second coaxial component 5 are located on both sides of the round square tube body 2, and are respectively used to receive different optical signals from the optical port adapter 3. The two coaxial components may correspond to different wavelengths or different signal types. Among them, the first coaxial component 4 and the second coaxial component 5 are both TO-packaged, and the specific process of TO-package is not described in detail in this embodiment. In one embodiment, the first coaxial component 4 is a 10G APD component, and the second coaxial component 5 is a 25G APD component.
[0045] The laser assembly 10 is the core of the transmitting end of the hybrid integrated four-way optical transceiver device, which is used to generate optical signals and can emit light of different wavelengths to meet different communication requirements. In one embodiment, Figure 2 As shown, the laser assembly 10 includes a first laser chip 100 and a second laser chip 101, and the first laser chip 100 and the second laser chip 101 are both arranged on the heat dissipation surface of the semiconductor refrigerator 11. The wavelength of the optical signal emitted by the first laser chip 100 is 1340nm~1344nm; the wavelength of the optical signal emitted by the second laser chip 101 is 1575nm~1580nm. In one embodiment, the first laser chip 100 and the second laser chip 101 are both EML chips.
[0046] In the existing hybrid integrated four-way optical transceiver device, when there are two laser chips and both are packaged through TO, it is necessary to equip each laser chip with a semiconductor refrigerator 11, and two electrical chips are required to control the two semiconductor refrigerators 11 respectively, which will not only increase the overall power consumption of the device, but also increase the overall volume of the device. In one embodiment, the semiconductor refrigerator 11 is located below the laser assembly 10 and is responsible for dissipating heat for the laser assembly 10. Since the laser chip generates heat during operation, the semiconductor refrigerator 11 can effectively control its temperature, thereby ensuring stable operation of the laser. Therefore, in this embodiment, by using BOX packaging for the two laser chips together, only one semiconductor refrigerator 11 is required to control the temperature of the two laser chips, which greatly reduces the power consumption and size of the entire device.
[0047] The workflow of the entire hybrid integrated four-way optical transceiver device is as follows:
[0048] 1. The laser assembly 10 generates light signals of different wavelengths through electronic driving. In this embodiment, two light signals of different wavelengths are generated.
[0049] 2. The generated optical signal first enters the round square tube body 2, and is effectively transmitted through the special geometric structure therein. The optical signal is transmitted to the external opposite-side device through the optical port adapter 3.
[0050] 3. The optical signal emitted by the opposite device is transmitted through the optical port adapter 3 and enters the round square tube body 2, and then receives different optical signals through the first coaxial component 4 and the second coaxial component 5 respectively.
[0051] The transmission of the optical signal in the BOX shell 1 and the round square tube 2 also depends on other components. Next, the other components will be described in detail.
[0052] In one embodiment, Figure 2 As shown, the BOX shell 1 is also provided with a first collimating lens 12, a second collimating lens 13 and a light combining component 14; the first collimating lens 12 is coupled to the light emitting end of the first laser chip 100, and the second collimating lens 13 is coupled to the light emitting end of the second laser chip 101; the light combining component 14 is coupled to the light emitting surfaces of the first collimating lens 12 and the second collimating lens 13.
[0053] The first collimating lens 12 is located at the light output end of the first laser chip 100, and is used to collimate the optical signal emitted by the first laser chip 100. The second collimating lens 13 is located at the light output end of the second laser chip 101, and is used to collimate the optical signal emitted by the second laser chip 101. In one embodiment, Figure 3 As shown, the light combining component 14 includes a dual-channel isolator 140 and a turning prism 141 coupled in sequence along the optical path; the dual-channel isolator 140 is used to receive optical signals from the first collimating lens 12 and the second collimating lens 13 respectively; the refractive surface of the turning prism 141 is used to receive the optical signal from the first collimating lens 12 and refract it to the light exit surface of the turning prism 141; the transmission surface of the turning prism 141 is used to receive the optical signal from the second collimating lens 13 and transmit it to the light exit surface of the turning prism 141.
[0054] Among them, refer to Figure 3 When the first laser chip 100 emits an optical signal with a wavelength of 1342nm and the second laser chip 101 emits an optical signal with a wavelength of 1577nm, the A surface of the turning prism 141 is coated with a film that transmits the optical signal with a wavelength of 1342nm, and the B surface of the turning prism 141 is coated with a film that reflects the optical signal with a wavelength of 1577nm, so as to transmit the optical signals of two different wavelengths to the optical signal input end of the round square tube body 2.
[0055] Compared with the packaging method of the transmitting end TO, the lens in front of the TO cap and the TO shell are integrated into one package, and active coupling cannot be performed. Therefore, the coupling efficiency is limited and it is impossible to achieve a coupling efficiency of 75% or even higher. The power budget for the entire PON module is required to be at least 29dBm, or even 32dBm, and the optical power of the transmitting end is required to be at least greater than 5dBm. For the channel with SOA, it needs to reach 8.2dBm. In order to improve the coupling efficiency, it is obvious that the efficiency of the TO cap cannot meet the requirements. To solve the above problems, in one embodiment, as Figure 4 As shown, the square tube body 2 is provided with a first lens 20 , a second lens 21 and a third lens 22 ; the first lens 20 is coupled to the first coaxial component 4 , the second lens 21 is coupled to the second coaxial component 5 , and the third lens 22 is coupled to the optical port adapter 3 .
[0056] In one embodiment, Figure 4 and Figure 5 As shown, the square tube body 2 is further provided with a first filter 23, a second filter 24 and a third filter 25; the filtering surface of the first filter 23 is coupled with the first lens 20, the filtering surface of the second filter 24 is coupled with the second lens 21, and the filtering surface of the third filter 25 is coupled with the third lens 22.
[0057] The deflection angle of the first filter 23 is 30°-35°, the deflection angle of the second filter 24 is 10°-15°, and the deflection angle of the third filter 25 is 43°-47°.
[0058] The first filter 23, the second filter 24 and the third filter 25 play the role of optical multiplexing / demultiplexing of optical signals with central wavelengths of 1342 nm, 1577 nm, 1286 nm and 1270 nm.
[0059] In one embodiment, the third lens 22 and the first collimating lens 12 in front of the first laser chip 100 form a pair of lens groups, so that the coupling efficiency can reach about 75%; the third lens 22 and the second collimating lens 13 in front of the second laser chip 101 form a pair of lens groups, so that the coupling efficiency can reach about 75%; the TO cap on the first coaxial component 4 and the first lens 20 form a pair of lens groups, so that the coupling efficiency can reach about 70%; the TO cap on the second coaxial component 5 and the second lens 21 form a pair of lens groups, so that the coupling efficiency can reach about 70%.
[0060] In this embodiment, the transmitting end of the optical device is packaged in BOX, and the high-frequency wiring is cascaded with the laser component 10, thereby optimizing the shortest bonding path and improving the bandwidth of the overall device. Secondly, by placing the laser component 10 on the same semiconductor refrigerator 11, the temperature of the laser chips of the two channels on the laser component 10 is controlled by the semiconductor refrigerator 11 at the same time, and the heat dissipation surface of the semiconductor refrigerator 11 is in direct contact with the BOX shell 1, thereby ensuring its good heat dissipation. At the same time, in terms of circuit layout, only one electric chip is needed to control the semiconductor refrigerator 11, thereby saving the power consumption of the overall device and greatly reducing the overall size, thereby saving space for the overall layout of the device.
[0061] Compared with the existing technology of four-way coaxial packaging, this embodiment adopts the technical features of high integration of transmitting end BOX packaging + receiving end TO packaging, which solves the technical problems of device miniaturization packaging and small-angle multi-wavelength division, and produces beneficial technical effects that can be mass-produced.
[0062] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A hybrid integrated four-way optical transceiver device, characterized in that: include: A BOX shell (1), a round square tube body (2) and an optical port adapter (3) are sequentially coupled along an optical path, and the hybrid integrated four-way optical transceiver device further comprises a first coaxial component (4) and a second coaxial component (5); the first coaxial component (4) and the second coaxial component (5) are respectively coupled to two sides of the round square tube body (2); A laser component (10) and a semiconductor refrigerator (11) are arranged in the BOX shell (1); the laser component (10) is arranged on a heat dissipation surface of the semiconductor refrigerator (11) to dissipate heat for the laser component (10); The laser assembly (10) is used to emit optical signals of different wavelengths, and transmit them to the opposite side device through the round square tube (2) and the optical port adapter (3) in sequence; the first coaxial assembly (4) and the second coaxial assembly (5) are used to respectively receive different optical signals from the optical port adapter (3).
2. The hybrid integrated four-directional optical transceiver device according to claim 1, characterized in that: The laser assembly (10) comprises a first laser chip (100) and a second laser chip (101), wherein the first laser chip (100) and the second laser chip (101) are both arranged on a heat dissipation surface of the semiconductor refrigerator (11).
3. The hybrid integrated four-directional optical transceiver device according to claim 2, characterized in that: The wavelength of the optical signal emitted by the first laser chip (100) is 1340nm-1344nm; the wavelength of the optical signal emitted by the second laser chip (101) is 1575nm-1580nm.
4. The hybrid integrated four-directional optical transceiver device according to claim 2, characterized in that: The first laser chip (100) and the second laser chip (101) are both EML chips.
5. The hybrid integrated four-directional optical transceiver device according to claim 2, characterized in that: The BOX shell (1) is also provided with a first collimating lens (12), a second collimating lens (13) and a light combining component (14); The first collimating lens (12) is coupled to the light output end of the first laser chip (100), and the second collimating lens (13) is coupled to the light output end of the second laser chip (101); The light combining component (14) is coupled to the light emitting surfaces of the first collimating lens (12) and the second collimating lens (13).
6. The hybrid integrated four-directional optical transceiver device according to claim 5, characterized in that: The light combining component (14) comprises a dual-channel isolator (140) and a turning prism (141) coupled in sequence along the optical path; The dual-channel isolator (140) is used to receive optical signals from the first collimating lens (12) and the second collimating lens (13) respectively; The refractive surface of the turning prism (141) is used to receive the light signal from the first collimating lens (12) and refract it to the light-emitting surface of the turning prism (141); the transmissive surface of the turning prism (141) is used to receive the light signal from the second collimating lens (13) and transmit it to the light-emitting surface of the turning prism (141).
7. The hybrid integrated four-directional optical transceiver device according to claim 1, characterized in that: The square tube body (2) is provided with a first lens (20), a second lens (21) and a third lens (22); the first lens (20) is coupled to the first coaxial component (4), the second lens (21) is coupled to the second coaxial component (5), and the third lens (22) is coupled to the optical port adapter (3).
8. The hybrid integrated four-directional optical transceiver device according to claim 7, characterized in that: The round square tube body (2) is also provided with a first filter (23), a second filter (24) and a third filter (25); The filtering surface of the first filter (23) is coupled to the first lens (20), the filtering surface of the second filter (24) is coupled to the second lens (21), and the filtering surface of the third filter (25) is coupled to the third lens (22).
9. The hybrid integrated four-directional optical transceiver device according to claim 8, characterized in that: The deflection angle of the first filter (23) is 30°-35°, the deflection angle of the second filter (24) is 10°-15°, and the deflection angle of the third filter (25) is 43°-47°.
10. The hybrid integrated four-directional optical transceiver device according to any one of claims 1 to 9, characterized in that: The first coaxial component (4) is a 10G APD component, and the second coaxial component (5) is a 25G APD component.