Computer mainboard radiator

Abstract

The utility model discloses a computer mainboard radiator, which relates to the technical field of computers and comprises a radiating substrate, and a connecting frame is fixedly sleeved at the top of the outer side of the radiating substrate; the fan assembly is used for cooling the heat dissipation substrate; the dustproof mechanism is used for filtering dust in the airflow; the quick dismounting and mounting mechanism comprises a push plate, a first spring, a locking groove, a T-shaped locking plate and a second spring; the push plate is slidably arranged on the inner side of the mounting groove in the vertical direction, the first spring is fixedly connected between the mounting groove and the push plate, the locking groove is formed in the side face of the mounting frame, and the T-shaped locking plate slidably penetrates through the outer wall of the connecting frame and extends to the inner side of the connecting frame. According to the dustproof mechanism, the dustproof mechanism can be disassembled and assembled more conveniently, extra assistance of tools is not needed in the disassembling and assembling process, and the dustproof mechanism is more convenient and faster in actual use.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a computer mainboard radiator. Background Art

[0002] Computers can perform numerical and logical calculations, have storage and memory functions, and can run multiple programs. The computer's computing functions mainly rely on the computer motherboard, and the computer motherboard will generate high temperature during continuous operation, so a radiator is needed to reduce its surface temperature.

[0003] The utility model patent with patent authorization announcement number CN 218413414 U discloses a computer motherboard radiator that is easy to disassemble, including: a mounting seat and a cooling fan, a base is provided on the top of the mounting seat, a cooling substrate is installed on the top of the base, and the cooling fan is installed on the top of the cooling substrate.

[0004] However, the above device still has some shortcomings in actual use. The most obvious one is that when installing the dust filter, the user needs to check and operate the card block first to avoid the card block from blocking the dust filter. When disassembling the dust filter, after removing the block from blocking the dust filter, since the dust filter is located on the inner side of the top opening of the cooling fan, it is inconvenient to operate with fingers. Therefore, a tool is needed to be inserted into the gap between the dust filter and the top opening of the cooling fan to pry the dust filter out, which makes the installation and removal of the dust filter more inconvenient.

[0005] Therefore, it is necessary to invent a computer mainboard radiator to solve the above problems. Utility Model Content

[0006] The utility model aims to provide a computer motherboard heat sink, which is provided with a quick disassembly mechanism, so that when the dustproof mechanism needs to be disassembled, the two T-shaped locking plates are pulled outward, the T-shaped locking plate is forced to move outward and stretch the second spring, and when the end of the T-shaped locking plate is moved out from the inner side of the locking groove, the compressed first spring drives the push plate to move up, and when the push plate moves up, it pushes the installation frame, and then the installation frame drives the dustproof net to move out from the inner side of the installation groove to complete the disassembly, and when the dustproof mechanism needs to be installed, the installation frame is put into the inner side of the installation groove and pushed downward, the installation frame presses the push plate downward, and at the same time pushes the T-shaped locking plate by the inclined surface, and the T-shaped locking plate is pushed outward. The second spring is stretched to release the obstruction to the installation frame. When the installation frame is installed in place, the T-shaped locking plate is inserted into the inner side of the locking groove to lock the installation frame. This solves the problem proposed in the above background technology that when installing the dust filter, the user needs to check and operate the card block first to avoid the card block from blocking the dust filter. When disassembling the dust filter, after removing the obstruction of the card block to the dust filter, since the dust filter is located on the inner side of the top opening of the cooling fan, it is inconvenient to operate with fingers. Therefore, a tool is required to be inserted into the gap between the dust filter and the top opening of the cooling fan to pry the dust filter out. This makes the installation and removal of the dust filter inconvenient.

[0007] According to one aspect of the present disclosure, the following technical solution is provided: a computer motherboard radiator, comprising:

[0008] A heat dissipation substrate, wherein a connection frame is fixedly sleeved on the top of the outer side of the heat dissipation substrate;

[0009] A fan assembly, wherein the fan assembly is used to cool the heat dissipation substrate;

[0010] A dust-proof mechanism, the dust-proof mechanism being used to filter dust in the airflow; and

[0011] A quick disassembly and assembly mechanism, the quick disassembly and assembly mechanism comprising a push plate, a first spring, a locking groove, a T-shaped locking plate and a second spring;

[0012] The push plate is slidably arranged on the inner side of the mounting groove along the vertical direction, the first spring is fixedly connected between the mounting groove and the push plate, the locking groove is opened on the side of the mounting frame, the T-shaped locking plate slides through the outer wall of the connecting frame and extends to the inner side of the connecting frame, and the second spring is fixedly connected between the connecting frame and the T-shaped locking plate.

[0013] According to the computer motherboard heat sink of at least one embodiment of the present disclosure, four first springs are provided, and the four first springs are respectively fixedly provided at the four corners of the bottom of the push plate, and the end of the T-shaped locking plate is provided with an inclined surface.

[0014] According to at least one embodiment of the computer motherboard radiator disclosed herein, the fan assembly includes a connecting frame, a mounting slot and a cooling fan, the connecting frame is located directly above the cooling substrate and is fixedly connected to the connecting frame, the mounting slot is opened at the top of the connecting frame, and the cooling fan is fixedly arranged at the inner bottom of the connecting frame.

[0015] According to at least one embodiment of the computer motherboard heat sink disclosed herein, the dustproof mechanism includes a mounting frame and a dustproof net, the mounting frame is slidably disposed inside the mounting groove along a vertical direction, and the dustproof net is fixedly disposed inside the mounting frame.

[0016] According to at least one embodiment of the computer motherboard heat sink of the present disclosure, the computer motherboard heat sink further includes a mounting seat, which is fixedly sleeved on the outer bottom of the heat dissipation substrate, and mounting holes are formed through the four corners of the top of the mounting seat.

[0017] Technical effects and advantages of the utility model:

[0018] When the mounting frame is installed in place, the T-shaped locking plate is inserted into the inner side of the locking groove to realize locking of the mounting frame. Compared with the similar device in the prior art, the utility model can more conveniently disassemble and assemble the dustproof mechanism, and no tools are needed for additional assistance during the disassembly and assembly process, so that it is more convenient and quicker to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings illustrate exemplary embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0020] Figure 1 It is a schematic diagram of the overall structure of a computer motherboard radiator according to an embodiment of the present disclosure.

[0021] Figure 2 The figure is a schematic diagram of the structure of a fan assembly of a computer motherboard heat sink according to an embodiment of the present disclosure.

[0022] Figure 3 The figure is a schematic diagram of the structure of a dustproof mechanism of a computer motherboard radiator according to an embodiment of the present disclosure.

[0023] The specific reference numerals in the figure are:

[0024] 1. Mounting seat;

[0025] 2. Heat dissipation substrate;

[0026] 3. Connecting frame;

[0027] 4. Fan assembly; 41. Connection frame; 42. Mounting slot; 43. Cooling fan;

[0028] 5. Dust-proof mechanism; 51. Installation frame; 52. Dust-proof net;

[0029] 6. Quick disassembly and assembly mechanism; 61. Push plate; 62. First spring; 63. Locking groove; 64. T-shaped locking plate; 65. Second spring. DETAILED DESCRIPTION

[0030] For descriptive purposes, the present disclosure may use spatially relative terms such as "under," "beneath," "under," "above," "on," "higher," and "side (e.g., as in "sidewall")," to describe the relationship of one component to another (other) component as shown in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, components described as "under" or "beneath" other components or features would then be positioned "above" the other components or features. Thus, the exemplary term "under" can encompass both the "above" and "below" orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0031] Figure 1 It is a schematic diagram of the overall structure of a computer motherboard radiator according to an embodiment of the present disclosure.

[0032] like Figure 1-Figure 3 As shown, the computer motherboard heat sink disclosed in the present invention may include: a mounting seat 1, a heat dissipation substrate 2, a connecting frame 3, a fan assembly 4, a dustproof mechanism 5 and a quick disassembly mechanism 6 and other components.

[0033] Figure 2 It is a schematic structural diagram of a fan assembly 4 of a computer motherboard radiator according to an embodiment of the present disclosure.

[0034] like Figure 2As shown, in the present disclosure, the fan assembly 4 includes a connecting frame 41, a mounting groove 42 and a cooling fan 43, wherein the connecting frame 41 is located directly above the cooling substrate 2 and is fixedly connected to the connecting frame 3, the mounting groove 42 is opened at the top of the connecting frame 41, and the cooling fan 43 is fixedly arranged at the inner bottom of the connecting frame 41.

[0035] Therefore, it is convenient to apply thermal conductive silicone grease on the motherboard CPU, and then fix the mounting base 1 on the computer motherboard by screws. At this time, the bottom of the heat dissipation substrate 2 is in contact with the thermal conductive silicone grease on the motherboard CPU, and then the power cord of the heat dissipation fan 43 is connected to the motherboard. During the subsequent operation of the motherboard, the heat dissipation fan 43 rotates and drives the airflow to blow to the heat dissipation substrate 2, so as to continuously dissipate the heat dissipation substrate 2, and the heat dissipation substrate 2 continuously exchanges heat with the motherboard, thereby cooling the motherboard.

[0036] Figure 3 It is a schematic structural diagram of a dustproof mechanism 5 of a computer motherboard radiator according to an embodiment of the present disclosure.

[0037] like Figure 3 As shown, in a preferred embodiment, the dustproof mechanism 5 includes a mounting frame 51 and a dustproof net 52 , wherein the mounting frame 51 is slidably arranged on the inner side of the mounting groove 42 along the vertical direction, and the dustproof net 52 is fixedly arranged on the inner side of the mounting frame 51 .

[0038] Therefore, when the heat dissipation fan 43 blows out airflow, the airflow continues to pass through the dustproof net 52 , and the dustproof net 52 filters the dust in the airflow to prevent the dust from directly adhering to the heat dissipation substrate 2 .

[0039] like Figure 2 and Figure 3 As shown, in the present disclosure, the quick disassembly and assembly mechanism 6 includes a push plate 61, a first spring 62, a locking groove 63, a T-shaped locking plate 64 and a second spring 65, wherein the push plate 61 is slidably arranged on the inner side of the mounting groove 42 along the vertical direction, the first spring 62 is fixedly connected between the mounting groove 42 and the push plate 61, four first springs 62 are provided, and the four first springs 62 are respectively fixedly arranged at the four corners of the bottom of the push plate 61, the locking groove 63 is opened on the side of the mounting frame 51, the T-shaped locking plate 64 slides through the outer wall of the connecting frame 41 and extends to the inner side of the connecting frame 41, the end of the T-shaped locking plate 64 is provided with an inclined surface, and the second spring 65 is fixedly connected between the connecting frame 41 and the T-shaped locking plate 64.

[0040] When the dustproof mechanism 5 needs to be disassembled, the two T-shaped locking plates 64 are pulled outward, the T-shaped locking plates 64 are forced to move outward and stretch the second spring 65. When the end of the T-shaped locking plate 64 is moved out of the inner side of the locking groove 63, the compressed first spring 62 drives the push plate 61 to move upward. When the push plate 61 moves up, it pushes the installation frame 51, thereby causing the installation frame 51 to drive the dustproof net 52 to move out of the inner side of the installation groove 42 to complete the disassembly. When the dustproof mechanism 5 needs to be installed, the installation frame 51 is placed in the inner side of the installation groove 42 and pushed downward. The installation frame 51 presses the push plate 61 downward and pushes the T-shaped locking plate 64 by the inclined surface. After being pushed, the T-shaped locking plate 64 moves outward and stretches the second spring 65, thereby releasing the obstruction of the installation frame 51. When the installation frame 51 is installed in place, the T-shaped locking plate 64 is inserted into the inner side of the locking groove 63 to achieve the locking of the installation frame 51.

[0041] In the description of this specification, the description with reference to the terms "one embodiment / method", "some embodiments / methods", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment / method or example are included in at least one embodiment / method or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment / method or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments / methods or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments / methods or examples described in this specification and the features of different embodiments / methods or examples, unless they are contradictory.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0043] Those skilled in the art should understand that the above embodiments are only for the purpose of clearly illustrating the present disclosure, and are not intended to limit the scope of the present disclosure. For those skilled in the art, other changes or modifications may be made based on the above disclosure, and these changes or modifications are still within the scope of the present disclosure.

Claims

1. A computer motherboard radiator, characterized in that: include: A heat dissipation substrate, wherein a connection frame is fixedly sleeved on the top of the outer side of the heat dissipation substrate; A fan assembly, wherein the fan assembly is used to cool the heat dissipation substrate; A dust-proof mechanism, the dust-proof mechanism is used to filter dust in the airflow; as well as A quick disassembly and assembly mechanism, the quick disassembly and assembly mechanism comprising a push plate, a first spring, a locking groove, a T-shaped locking plate and a second spring; The push plate is slidably arranged on the inner side of the mounting groove along the vertical direction, the first spring is fixedly connected between the mounting groove and the push plate, the locking groove is opened on the side of the mounting frame, the T-shaped locking plate slides through the outer wall of the connecting frame and extends to the inner side of the connecting frame, and the second spring is fixedly connected between the connecting frame and the T-shaped locking plate.

2. The computer motherboard radiator according to claim 1, characterized in that: There are four first springs, which are respectively fixed at the four corners of the bottom of the push plate, and an inclined surface is provided at the end of the T-shaped locking plate.

3. The computer motherboard radiator according to claim 2, characterized in that: The fan assembly includes a connecting frame, a mounting groove and a heat dissipation fan. The connecting frame is located directly above the heat dissipation substrate and is fixedly connected to the connecting frame. The mounting groove is opened at the top of the connecting frame, and the heat dissipation fan is fixedly arranged at the bottom inside the connecting frame.

4. The computer motherboard radiator according to claim 3, characterized in that: The dustproof mechanism comprises a mounting frame and a dustproof net. The mounting frame is slidably arranged inside the mounting groove along a vertical direction, and the dustproof net is fixedly arranged inside the mounting frame.

5. The computer motherboard radiator according to claim 4, characterized in that: It also includes a mounting seat, which is fixedly sleeved and arranged on the outer bottom of the heat dissipation substrate, and mounting holes are penetrated at the four corners of the top of the mounting seat.

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