Lamp bead and display module

Abstract

The utility model provides a lamp bead and a display module, the lamp bead comprises a substrate, a driving IC arranged on the substrate and a plurality of light-emitting chip sets electrically connected with the driving IC, the middle part of the substrate is provided with a first bonding pad arranged corresponding to the driving IC, the driving IC is arranged on the first bonding pad in a forward mounting manner, and the light-emitting chip sets are electrically connected with the driving IC. A plurality of second bonding pads corresponding to the light-emitting chip sets are arranged on the outer edge of the first bonding pad, the light-emitting chip sets comprise red light chips, green light chips and blue light chips which are arranged on the second bonding pads in an inverted mode, and bonding wires are arranged between the first bonding pad and the second bonding pads. The first bonding pad used for installing the driving IC and the second bonding pads used for installing the multiple light-emitting chip sets are arranged on the substrate, the driving IC can be communicated with the red light chip, the green light chip and the blue light chip only by being connected with the first bonding pad through the bonding wires, the number of pins needed for electrode direct connection of the driving IC and the chips is reduced, and the cost is reduced. And the complexity of the process is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of display modules, in particular to a lamp bead and a display module. Background Art

[0002] LED display is a flat panel display, which is composed of small LED module panels and is used to display various information such as text, images, videos, etc. This product integrates microelectronics technology, computer technology, and information processing, and has the advantages of bright colors, wide dynamic range, high brightness, long life, stable and reliable operation, etc.

[0003] In the prior art, a common single lamp bead includes a light-emitting chip group consisting of red, blue and green chips, and a driver IC for connecting the light-emitting chip group. The driver IC achieves conduction by connecting the electrodes of each chip. A single driver IC needs to set pin connections based on each chip, and the process is highly complex. Utility Model Content

[0004] In view of the deficiencies of the prior art, the purpose of the present invention is to provide a lamp bead and a display module, aiming to solve the technical problem of high process complexity in the prior art.

[0005] In order to achieve the above-mentioned purpose, the utility model is implemented through the following technical scheme: a lamp bead, including a substrate, a driver IC arranged on the substrate, and a plurality of light-emitting chip groups electrically connected to the driver IC, a first soldering pad corresponding to the driver IC is provided in the middle of the substrate, the driver IC is arranged on the first soldering pad in a positive manner, a plurality of second soldering pads corresponding to each of the light-emitting chip groups are provided on the outer edge of the first soldering pad, the light-emitting chip group includes a red light chip, a green light chip and a blue light chip arranged on the second soldering pad in a flip-chip manner, and a bonding wire is provided between the first soldering pad and the second soldering pad.

[0006] According to one aspect of the above technical solution, the lamp bead further includes a packaging layer disposed on a side of the substrate close to the light-emitting chip group.

[0007] According to one aspect of the above technical solution, the thickness of the encapsulation layer is 0.25 mm, and the material of the encapsulation layer is epoxy resin.

[0008] According to one aspect of the above technical solution, the number of the light-emitting chip groups and the second solder pads is four, and the four second solder pads and the light-emitting chip groups are respectively arranged on the four corners of the first solder pad.

[0009] According to one aspect of the above technical solution, the first pad includes a pad body and a power input pin and a current output pin respectively arranged on the pad body, and the current output pin includes a first output pin, a second output pin and a third output pin respectively arranged corresponding to the red light chip, the green light chip and the blue light chip.

[0010] According to one aspect of the above technical solution, the second pad includes a first input pin, a second input pin and a third input pin respectively arranged corresponding to the first output pin, the second output pin and the third output pin, and the bonding wire includes a first bonding wire connecting the first input pin and the first output pin, a second bonding wire connecting the second input pin and the second output pin, and a third bonding wire connecting the third input pin and the third output pin.

[0011] According to one aspect of the above technical solution, the lamp bead further includes a signal output terminal, a signal input terminal, a power output terminal and a ground terminal which are arranged on the substrate.

[0012] According to one aspect of the above technical solution, the first pad also includes a signal output pin, a signal input pin and a ground pin arranged on the pad body, and the bonding wire includes a fourth bonding wire connecting the signal output terminal and the signal input pin, a fifth bonding wire connecting the signal input terminal and the signal output pin, a sixth bonding wire connecting the ground terminal and the ground pin, and a seventh bonding wire connecting the power output terminal and the power input pin.

[0013] According to one aspect of the above technical solution, the substrate is made of BT resin substrate material.

[0014] On the other hand, the present application also provides a display module, comprising the lamp beads described in the above technical solution.

[0015] Compared with the prior art, the beneficial effect of the utility model lies in that: by arranging a first solder pad for installing a driver IC and multiple second solder pads for installing multiple groups of light-emitting chip groups on the substrate, the driver IC only needs to be connected to the first solder pad through bonding wires to achieve connectivity with the red light chip, the green light chip and the blue light chip, thereby reducing the number of pins required for direct connection between the driver IC and the chip electrodes and reducing the complexity of the process. At the same time, a single driver IC can connect multiple light-emitting chip groups, which is conducive to achieving the development goals of a light, thin, integrated and highly reliable display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic structural diagram of the light-emitting surface of a lamp bead in one embodiment of the utility model;

[0017] Figure 2This is a schematic structural diagram of the backlight surface of a lamp bead in one embodiment of the utility model;

[0018] Description of main component symbols:

[0019] Substrate 10, light emitting chip group 11, red light chip 12, green light chip 13, blue light chip 14, driver IC 20, first output pin 31, second output pin 32, third output pin 33, first signal input pin 34a, second signal input pin 34b, signal output pin 35, ground pin 36, red light power input pin 37a, blue-green light power input pin 37b, first signal output terminal 41, second signal output terminal 42, blue-green light power input terminal 43, signal input terminal 44, ground terminal 45, red light power input terminal 46;

[0020] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0022] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0024] See also Figure 1 to Figure 2, shown is a lamp bead in the first embodiment of the utility model, including a substrate 10, a driver IC 20 arranged on the substrate 10, and a plurality of light-emitting chip groups 11 electrically connected to the driver IC 20, a first pad corresponding to the driver IC 20 is provided in the middle of the substrate 10, the driver IC 20 is arranged on the first pad in a positive manner, a plurality of second pads corresponding to each of the light-emitting chip groups 11 are provided on the outer edge of the first pad, the light-emitting chip group 11 includes a red chip 12, a green chip 13 and a blue chip 14 which are arranged on the second pad in a flip-chip manner, and a bonding wire is provided between the first pad and the second pad. Preferably, in this embodiment, the substrate 10 is made of BT resin substrate 10 material, the main component of which is a polymer of Bismaleimide (B) and Triazine (T).

[0025] Specifically, in this embodiment, the lamp bead further includes a packaging layer disposed on a side of the substrate 10 close to the light-emitting chip group 11. The packaging layer has a thickness of 0.25 mm and is made of epoxy resin.

[0026] Preferably, in this embodiment, the number of the light emitting chip group 11 and the second solder pad is four, and the four second solder pads and the light emitting chip group 11 are respectively arranged at the four corners of the first solder pad. It can be understood that in other embodiments, the number of the light emitting chip group 11 and the second solder pad can be adjusted according to the product model, and correspondingly, the pin position on the first solder pad can be adaptively adjusted.

[0027] For ease of understanding, in some application scenarios of this embodiment, the main preparation process of the above-mentioned lamp beads is as follows:

[0028] First, a printer is used to print solder paste on the substrate 10, and then a flip chip bonding machine is used to complete the bonding of the Mini RGB flip chip, i.e., the red chip 12, the green chip 13, and the blue chip 14, on the four corresponding second pads on the substrate 10;

[0029] Then, a positive die bonding machine is used to apply silver glue to the die bonding position of the driver IC 20 in the center of the substrate 10 to complete the die bonding of the driver IC 20 chip;

[0030] Further, a wire bonding machine is used to bond the first pad and the second pad at corresponding positions with bonding wires to achieve conduction between the driver IC 20 and the light emitting chip group 11;

[0031] Then, a molding machine is used to mold a layer of epoxy resin as a packaging layer on the finished semi-finished material. The thickness of the epoxy resin is 0.25 mm. The size of the entire substrate 10 is: 55.6 mm*120 mm;

[0032] Finally, a cutting machine is used to cut the entire substrate 10 into a single lamp bead in this embodiment, and the size of the lamp bead is 2.8 mm*2.8 mm.

[0033] Compared with the single-lamp SMD package, the lamp beads in this application have 4 groups of RGB chip constant current drive control functions, can achieve up to 18-bit PWM grayscale control, and have high-precision point-by-point correction, which can keep the low grayscale and high grayscale correction effects consistent; the BGA (Ball Grid Array Package) flat package and square pins make the patch flatter and without warping and tilting; at the same time, the heat is directly dissipated through the BT substrate 10, the thermal resistance value is small, the heat does not accumulate, and the product service life is more guaranteed; a driver IC controls 4 groups of RGB light-emitting chip groups. When the operating voltage is 4V, the IC output current: R red chip = 2.7mA, G / B blue-green chip = 1.35mA.

[0034] Specifically, in the present embodiment, the first pad includes a pad body and a power input pin and a current output pin respectively arranged on the pad body, and the current output pin includes a first output pin 31, a second output pin 32 and a third output pin 33 respectively arranged corresponding to the red light chip 12, the green light chip 13 and the blue light chip 14. Correspondingly, the second pad includes a first input pin, a second input pin and a third input pin respectively arranged corresponding to the first output pin 31, the second output pin 32 and the third output pin 33, and the bonding wire includes a first bonding wire connecting the first input pin and the first output pin 31, a second bonding wire connecting the second input pin and the second output pin 32, and a third bonding wire connecting the third input pin and the third output pin 33.

[0035] In addition, in this embodiment, the lamp bead further includes a signal output terminal, a signal input terminal 44, a power output terminal and a ground terminal 45 provided on the substrate 10. The first pad further includes a signal output pin 35, a signal input pin and a ground pin 36 provided on the pad body, and the bonding wire includes a fourth bonding wire connecting the signal output terminal and the signal input pin 34, a fifth bonding wire connecting the signal input terminal 44 and the signal output pin 35, a sixth bonding wire connecting the ground terminal 45 and the ground pin 36, and a seventh bonding wire connecting the power output terminal and the power input pin.

[0036] The number of the signal input pins 34 is two, including a first signal input pin 34a and a second signal input pin 34b corresponding to two signal output terminals, namely, a first signal output terminal 41 and a second signal output terminal 42. Preferably, in this embodiment, the power input pins include a red light power input pin 37a corresponding to the red light chip 12, and a blue-green light power input pin 37b corresponding to the blue light chip 14 and the green light chip 13, and the power input terminals include a red light power input terminal 46 corresponding to the red light chip 12, and a blue-green light power input terminal 43 corresponding to the blue light chip 14 and the green light chip 13.

[0037] In summary, the lamp beads in the above-mentioned embodiments of the utility model are provided with a first solder pad for installing a driver IC20 and multiple second solder pads for installing multiple groups of light-emitting chip groups 11 on the substrate 10. The driver IC20 only needs to be connected to the first solder pad through a bonding wire to achieve connectivity with the red light chip 12, the green light chip 13 and the blue light chip 14, thereby reducing the number of pins required for direct connection between the driver IC20 and the electrodes of the chip, and reducing the complexity of the process. At the same time, a single driver IC20 can connect multiple light-emitting chip groups 11, which is conducive to achieving the development goals of a thin, integrated and highly reliable display screen.

[0038] A second embodiment of the present application provides a display module, comprising the lamp beads in the above embodiment.

[0039] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0040] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model shall be subject to the attached claims.

Claims

1. A lamp bead, characterized in that: The invention comprises a substrate, a driver IC arranged on the substrate, and a plurality of light-emitting chip groups electrically connected to the driver IC, wherein a first pad corresponding to the driver IC is arranged in the middle of the substrate, the driver IC is arranged on the first pad in a face-up manner, a plurality of second pads corresponding to the light-emitting chip groups are arranged on the outer edge of the first pad, the light-emitting chip group comprises a red light chip, a green light chip and a blue light chip which are arranged on the second pad in a flip-chip manner, and a bonding wire is arranged between the first pad and the second pad.

2. The lamp bead according to claim 1, characterized in that: The lamp bead further comprises a packaging layer arranged on a side of the substrate close to the light emitting chip group.

3. The lamp bead according to claim 2, characterized in that: The thickness of the packaging layer is 0.25 mm, and the material of the packaging layer is epoxy resin.

4. The lamp bead according to claim 1, characterized in that: The number of the light emitting chip groups and the second soldering pads is four, and the four second soldering pads and the light emitting chip groups are respectively arranged on the four corners of the first soldering pad.

5. The lamp bead according to claim 1, characterized in that: The first pad includes a pad body and a power input pin and a current output pin respectively arranged on the pad body, and the current output pin includes a first output pin, a second output pin and a third output pin respectively arranged corresponding to the red light chip, the green light chip and the blue light chip.

6. The lamp bead according to claim 5, characterized in that: The second pad includes a first input pin, a second input pin, and a third input pin respectively arranged corresponding to the first output pin, the second output pin, and the third output pin, and the bonding wire includes a first bonding wire connecting the first input pin and the first output pin, a second bonding wire connecting the second input pin and the second output pin, and a third bonding wire connecting the third input pin and the third output pin.

7. The lamp bead according to claim 5, characterized in that: The lamp bead further comprises a signal output terminal, a signal input terminal, a power output terminal and a ground terminal which are arranged on the substrate.

8. The lamp bead according to claim 7, characterized in that: The first pad also includes a signal output pin, a signal input pin and a ground pin arranged on the pad body, and the bonding wire includes a fourth bonding wire connecting the signal output terminal and the signal input pin, a fifth bonding wire connecting the signal input terminal and the signal output pin, a sixth bonding wire connecting the ground terminal and the ground pin, and a seventh bonding wire connecting the power output terminal and the power input pin.

9. The lamp bead according to claim 1, characterized in that: The substrate is made of BT resin substrate material.

10. A display module, characterized in that: The invention comprises the lamp bead described in any one of claims 1 to 9.

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