Waterproof and pressure-resistant circuit board

Abstract

The utility model relates to the technical field of circuit boards, in particular to a waterproof and pressure-resistant circuit board, which comprises a protective bottom plate, a circuit board body and a heat dissipation frame, a spring telescopic rod is mounted at the top of the protective bottom plate, a heat dissipation mesh is mounted at the top of the spring telescopic rod, the circuit board body is fixedly mounted at the top of the heat dissipation mesh, and the circuit board body is fixedly mounted at the bottom of the protective bottom plate. A waterproof coating is arranged on the top of the circuit board body, a heat dissipation frame is installed on the top of the protective bottom plate and located on the periphery of the circuit board body in a sleeved mode, and heat dissipation fins are installed on the periphery of the heat dissipation frame. Therefore, waterproof and buffer pressure-resistant effects are provided for the circuit board, rapid heat dissipation of the circuit board is realized, the pressure-resistant performance and waterproof performance of the circuit board are improved, overheating damage of the circuit board is avoided, the service life is prolonged, and the circuit board is very practical.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a waterproof and pressure-resistant circuit board. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts.

[0003] In the prior art, the circuit board does not have a waterproof, pressure-resistant and heat-dissipating structure, which makes it difficult to provide the circuit board with waterproof and buffer pressure-resistant effects and to achieve rapid heat dissipation of the circuit board, thereby affecting the pressure-resistant and waterproof performance of the circuit board and being unable to avoid the problem of overheating and damage to the circuit board that affects its service life.

[0004] Therefore, it is necessary to design a waterproof and pressure-resistant circuit board to solve the above-mentioned problems. Utility Model Content

[0005] The purpose of the utility model is to provide a waterproof and pressure-resistant circuit board, to increase the design of the circuit board with waterproof, pressure-resistant and heat-dissipating structures, to provide the circuit board with waterproof and buffering pressure-resistant effects and to achieve rapid heat dissipation of the circuit board, to improve the pressure-resistant and waterproof performance of the circuit board and to avoid overheating and damage of the circuit board and to extend its service life, thereby solving the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A waterproof and pressure-resistant circuit board comprises a protective bottom plate, a circuit board body and a heat dissipation frame, a spring telescopic rod is installed on the top of the protective bottom plate, a heat dissipation mesh is installed on the top of the spring telescopic rod, a circuit board body is fixedly installed on the top of the heat dissipation mesh, a waterproof coating is provided on the top of the circuit board body, a heat dissipation frame is installed on the top of the protective bottom plate and located on the periphery of the circuit board body, and heat dissipation fins are installed on the periphery of the heat dissipation frame.

[0008] As a preferred solution of the utility model, mounting holes are provided at the four corners of the top of the protective bottom plate.

[0009] As a preferred solution of the utility model, a plurality of spring telescopic rods are arranged in a rectangular distribution, and the plurality of spring telescopic rods have an upper connecting seat fixedly connected to the bottom of the heat dissipation mesh, a telescopic sleeve is installed at the bottom end of the upper connecting seat, a fixing rod is inserted inside the telescopic sleeve, a lower connecting seat is fixedly connected between the bottom end of the fixing rod and the top of the protective bottom plate, and a spring is installed on the periphery of the telescopic sleeve and the fixing rod and is located between the lower connecting seat and the upper connecting seat.

[0010] As a preferred solution of the present utility model, the waterproof coating specifically adopts PCB nano waterproof coating.

[0011] As a preferred solution of the utility model, an O-shaped heat dissipation channel is provided inside the heat dissipation frame, and heat dissipation through holes are provided on all four sides of the inner wall of the heat dissipation frame, penetrating through the heat dissipation channel.

[0012] As a preferred solution of the utility model, a plurality of heat dissipation fins are arranged at equal intervals around the periphery of the heat dissipation frame, and heat dissipation grooves are arranged inside the plurality of heat dissipation fins that penetrate the heat dissipation channel.

[0013] Beneficial effect: In view of the fact that the circuit board in the prior art does not have a waterproof, pressure-resistant and heat-dissipating structure, it is not convenient to provide the circuit board with a waterproof and buffering pressure-resistant effect and realize rapid heat dissipation of the circuit board, which in turn affects the pressure-resistant and waterproof performance of the circuit board and cannot avoid the problem of overheating and damage of the circuit board affecting its service life. In the utility model, a circuit board body with a waterproof coating is installed and supported by a spring telescopic rod in cooperation with a heat dissipation mesh, and a heat dissipation frame cover with heat dissipation fins is arranged on the periphery of the circuit board body, which can provide the circuit board with a waterproof and buffering pressure-resistant effect, thereby improving the pressure-resistant and waterproof performance of the circuit board, and a heat dissipation frame cover with heat dissipation fins is arranged inside the heat dissipation frame, which can provide the circuit board with a waterproof and buffering pressure-resistant effect, thereby improving the pressure-resistant and waterproof performance of the circuit board, and a heat dissipation channel is arranged inside the heat dissipation frame, heat dissipation through holes are opened around the circuit board body, and the heat dissipation channel passes through the heat dissipation grooves arranged inside the heat dissipation fins, which can realize rapid heat dissipation of the circuit board, thereby avoiding overheating and damage of the circuit board and extending the service life. The structure is simple and has a waterproof, pressure-resistant and heat-dissipating structure, which can facilitate providing the circuit board with a waterproof and buffering pressure-resistant effect and realizing rapid heat dissipation of the circuit board, thereby improving the pressure-resistant and waterproof performance of the circuit board and avoiding overheating and damage of the circuit board and extending the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is an overall three-dimensional diagram of a waterproof and pressure-resistant circuit board of the utility model;

[0015] Figure 2 This is a schematic diagram of the overall main view of the internal structure of a waterproof and pressure-resistant circuit board of the utility model;

[0016] Figure 3 This is a schematic diagram of the overall internal structure of a waterproof and pressure-resistant circuit board of the utility model from a top view;

[0017] Figure 4 For this utility model Figure 2 Schematic diagram of the enlarged structure of point A.

[0018] In the figure: 1. Protective bottom plate; 11. Mounting hole; 2. Spring telescopic rod; 3. Heat dissipation mesh; 4. Circuit board body; 5. Waterproof coating; 6. Heat dissipation frame; 61. Heat dissipation channel; 62. Heat dissipation fins; 63. Heat dissipation through hole; 64. Heat dissipation groove. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0020] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant literature, and several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0021] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this article includes any and all combinations of one or more related listed items.

[0023] See also Figure 1-4 , the utility model provides a technical solution:

[0024] A waterproof and pressure-resistant circuit board comprises a protective base plate 1, a circuit board body 4 and a heat dissipation frame 6, a spring telescopic rod 2 is installed on the top of the protective base plate 1, a heat dissipation mesh 3 is installed on the top of the spring telescopic rod 2, a circuit board body 4 is fixedly installed on the top of the heat dissipation mesh 3, a waterproof coating 5 is provided on the top of the circuit board body 4, a heat dissipation frame 6 is installed on the top of the protective base plate 1 and located on the periphery of the circuit board body 4, and heat dissipation fins 62 are installed on the periphery of the heat dissipation frame 6.

[0025] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, specifically, mounting holes 11 are provided at the four corners of the top of the protective base plate 1, and a plurality of spring telescopic rods 2 are arranged in a rectangular distribution, and the plurality of spring telescopic rods 2 have an upper connecting seat fixedly connected to the bottom of the heat dissipation mesh 3, and a telescopic sleeve is installed at the bottom end of the upper connecting seat, and a fixing rod is inserted inside the telescopic sleeve, and a lower connecting seat is fixedly connected between the bottom end of the fixing rod and the top of the protective base plate 1, and a spring is installed on the periphery of the telescopic sleeve and the fixing rod and is located between the lower connecting seat and the upper connecting seat. The waterproof coating 5 specifically adopts a PCB nano waterproof coating, and the circuit board body 4 with the waterproof coating 5 is supported and installed by the spring telescopic rod 2 in cooperation with the heat dissipation mesh 3, which can provide the circuit board with waterproof and buffer pressure resistance effects, thereby improving the pressure resistance and waterproof performance of the circuit board.

[0026] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, preferably, an O-shaped heat dissipation channel 61 is provided inside the heat dissipation frame 6, and heat dissipation holes 63 are opened inside the inner wall of the heat dissipation frame 6 on all sides, and a plurality of heat dissipation fins 62 are arranged around the periphery of the heat dissipation frame 6 at equal intervals, and a plurality of heat dissipation fins 62 are all provided with heat dissipation grooves 64 inside the heat dissipation channel 61, and the heat dissipation frame 6 with heat dissipation fins 62 is covered on the periphery of the circuit board body 4, and the heat dissipation channel 61 is provided inside the heat dissipation frame 6, and the heat dissipation holes 63 are opened around the circuit board body 4, and the heat dissipation channel 61 is provided inside the heat dissipation frame 6, and the heat dissipation grooves 64 are provided inside the heat dissipation fins 62, so that the circuit board can be quickly cooled, thereby avoiding overheating and damage of the circuit board and extending the service life.

[0027] To summarize, firstly, the circuit board body 4 with the waterproof coating 5 is supported and installed by the spring telescopic rod 2 and the heat dissipation mesh 3, and the heat dissipation frame 6 with the heat dissipation fins 62 is covered on the periphery of the circuit board body 4, which can provide waterproof and buffer pressure resistance effects for the circuit board, thereby improving the pressure resistance and waterproof performance of the circuit board, and by arranging a heat dissipation channel 61 inside the heat dissipation frame 6, heat dissipation through holes 63 are opened around the circuit board body 4, and the heat dissipation channel 61 passes through the heat dissipation grooves 64 arranged inside the heat dissipation fins 62, the circuit board can be quickly dissipated, thereby avoiding overheating damage to the circuit board and extending the service life. The utility model is not only simple in structure but also has waterproof, pressure-resistant and heat-dissipating structures, thereby facilitating providing waterproof and buffer pressure resistance effects for the circuit board and realizing rapid heat dissipation of the circuit board, thereby improving the pressure resistance and waterproof performance of the circuit board and avoiding overheating damage to the circuit board and extending the service life, which is very practical.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A waterproof and pressure-resistant circuit board, comprising a protective bottom plate (1), a circuit board body (4) and a heat dissipation frame (6), characterized in that A spring telescopic rod (2) is installed on the top of the protective bottom plate (1), a heat dissipation mesh (3) is installed on the top of the spring telescopic rod (2), a circuit board body (4) is fixedly installed on the top of the heat dissipation mesh (3), a waterproof coating (5) is provided on the top of the circuit board body (4), a heat dissipation frame (6) is installed on the top of the protective bottom plate (1) and located on the periphery of the circuit board body (4), and heat dissipation fins (62) are installed on the periphery of the heat dissipation frame (6).

2. A waterproof and pressure-resistant circuit board according to claim 1, characterized in that: The four corners on the top of the protective bottom plate (1) are provided with mounting holes (11).

3. The waterproof and pressure-resistant circuit board according to claim 1, characterized in that: The spring telescopic rods (2) are arranged in a rectangular distribution and are provided in plurality, and the plurality of spring telescopic rods (2) have an upper connecting seat fixedly connected to the bottom of the heat dissipation mesh (3), a telescopic sleeve is installed at the bottom end of the upper connecting seat, a fixing rod is inserted inside the telescopic sleeve, a lower connecting seat is fixedly connected between the bottom end of the fixing rod and the top of the protective bottom plate (1), and a spring is sleeved and installed around the telescopic sleeve and the fixing rod and between the lower connecting seat and the upper connecting seat.

4. The waterproof and pressure-resistant circuit board according to claim 1, characterized in that: The waterproof coating (5) is specifically a PCB nano waterproof coating.

5. The waterproof and pressure-resistant circuit board according to claim 1, characterized in that: An O-shaped heat dissipation channel (61) is provided inside the heat dissipation frame (6), and heat dissipation through holes (63) are provided inside the heat dissipation channel (61) on all sides of the inner wall of the heat dissipation frame (6).

6. The waterproof and pressure-resistant circuit board according to claim 1, characterized in that: A plurality of the heat dissipation fins (62) are arranged at equal intervals around the periphery of the heat dissipation frame (6), and a heat dissipation groove (64) is arranged inside the plurality of heat dissipation fins (62) that penetrate the heat dissipation channel (61).

Images