Radiating device and electronic equipment
By using a combination of the first thermal conductor and an acoustic transducer in the electronic device, the problem of poor heat dissipation effect of the electronic device is solved, and more efficient heat dissipation is achieved, equipment performance is improved and heat dissipation costs are reduced.
Patent Information
- Application Number
- CN202421049692.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-13
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-05-13
AI Technical Summary
The poor heat dissipation effect of existing electronic devices leads to heat accumulation inside, limiting the performance of the device.
A heat dissipation device is used, the device comprising a first thermal conductor and an acoustic and electrical transducer. The projection area of the first thermal conductor covers the heat source device and the acoustic and electrical transducer, and heat is transferred to the acoustic and electrical transducer through thermal conduction. The acoustic and electrical transducer realizes a one-way flow of air through the vibration of the diaphragm, absorbing and bringing out heat.
It significantly improves the heat dissipation effect of electronic devices, reduces the temperature of the heat source device, improves the performance of the equipment, and avoids the need for additional heat dissipation drive devices, and reduces the heat dissipation cost.
Smart Images
Figure CN222532048U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of terminals, and in particular to a heat dissipation device and an electronic device. Background Art
[0002] Electronic devices such as mobile phones and tablets have gained great popularity among users due to their diverse functions and services, as well as their portability. At the same time, they also place higher demands on their heat dissipation capabilities.
[0003] At present, electronic devices such as mobile phones and tablets usually use passive heat dissipation solutions, that is, the heat generated by heat source devices such as chips is transferred to the structural shell of the electronic device through thermal conductive materials, and the shell is used for heat distribution. However, this heat dissipation method easily causes heat to accumulate inside the electronic device, and it is impossible to effectively dissipate the heat to the outside world. The heat dissipation effect is very poor, which limits the performance of the electronic device. Utility Model Content
[0004] In view of this, the present application provides a heat dissipation device and an electronic device, which can significantly improve the heat dissipation effect of the electronic device and improve the performance of the electronic device.
[0005] In order to achieve the above-mentioned objectives, in a first aspect, an embodiment of the present application provides a heat dissipation device, comprising a first heat conductor and an acoustic-electric transducer; the projection area of the first end of the first heat conductor covers at least a partial area of the heat source device, and the projection area of the second end of the first heat conductor covers at least a partial area of the acoustic-electric transducer; the acoustic-electric transducer comprises a diaphragm and a through first cavity, the first cavity comprises an air inlet and an air outlet, the air inlet is provided with an air inlet valve membrane, the air outlet is provided with an air outlet valve membrane, the air inlet valve membrane is used to open or close the air inlet, and the air outlet valve membrane is used to open or close the air outlet; when the diaphragm vibrates along a first direction, the volume in the first cavity increases, the air inlet valve membrane opens and the air outlet valve membrane closes; when the diaphragm vibrates along a second direction, the volume in the first cavity decreases, the air inlet valve membrane is closed and the air outlet valve membrane opens.
[0006] In the embodiment of the present application, the projection area of the first end of the first heat conductor covers at least part of the area of the heat source device, and the projection area of the second end of the first heat conductor covers at least part of the area of the acoustic-electric transducer, so that the heat generated by the heat source device can be conducted to the acoustic-electric transducer. When the acoustic-electric transducer is working, the conversion of the sound signal and the electric energy signal is realized by the vibration of the diaphragm. In the process of piston movement when the diaphragm receives the electric signal, when the diaphragm vibrates along the first direction, the volume in the first cavity increases, the pressure inside the first cavity is less than the pressure outside the first cavity, the air inlet valve membrane opens and the air outlet valve membrane closes, so that air enters the first cavity; when the diaphragm vibrates along the second direction, the volume in the first cavity decreases, the pressure inside the first cavity is greater than the pressure outside the first cavity, the air inlet valve membrane closes and the air outlet valve membrane opens, so that air is discharged from the first cavity. Therefore, when the diaphragm vibrates continuously, the air will enter the first cavity along the air inlet and then flow out along the air outlet, that is, it will flow unidirectionally along the first cavity. When the air enters the first cavity, it absorbs the heat conducted to the acoustic-electric transducer by the first heat-conducting member. When the air after absorbing heat is discharged from the air outlet, it can realize active exchange with external heat, take the heat out and away from the heat source device, so that the heat source device is cooled down. And because the air inlet and outlet paths of the first cavity are isolated, the air flows in one direction. Therefore, when the air after absorbing heat is discharged from the air outlet, it will not enter the first cavity from the air outlet, thereby improving the heat dissipation efficiency. In addition, since the heat dissipation is realized by using the acoustic-electric transducer, the heat dissipation can be realized without adding other active heat dissipation drive devices to the electronic device, which significantly improves the heat dissipation performance and reduces the heat dissipation cost, and does not affect the portability of the electronic device.
[0007] In some embodiments, the heat dissipation device further includes a second heat conductive member, the second heat conductive member is in contact with the second end of the first heat conductive member, the second heat conductive member includes a plurality of fins, and the plurality of fins are arranged on one side of the air outlet.
[0008] The second heat-conducting member includes a plurality of fins, which can convert the planar heat of the first heat-conducting member into three-dimensional heat, significantly increasing the surface area of the second heat-conducting member, thereby improving the heat exchange efficiency, so that the air can take away more heat when discharged from the air outlet, further improving the heat dissipation efficiency.
[0009] In some embodiments, the projection area of the second end of the first heat conductor covers at least a portion of the first cavity, which can further improve the efficiency of heat exchange when air passes through the first cavity, thereby further improving the heat dissipation efficiency.
[0010] In some embodiments, the acoustic-electric transducer further includes a first opening and a second cavity, the first opening is used to place the diaphragm, the first opening is connected to the second cavity, the second cavity includes a second opening, the second opening is a sound outlet or a sound receiving port of the acoustic-electric transducer, and the projection area of the second end of the first heat conductor covers at least a portion of the second cavity.
[0011] In some embodiments, a side surface of the acoustic-electric transducer includes a recessed area, and when the acoustic-electric transducer is disposed in an electronic device, the side surface is in contact with a housing of the electronic device, and the housing encloses a portion of the recessed area to form the second cavity and the second opening.
[0012] When the diaphragm vibrates, the volume of the second cavity can be increased or decreased. When the volume of the second cavity increases, air is sucked in from the second opening, and when the volume of the second cavity decreases, air is discharged from the second opening. When the air enters the second cavity, it can absorb the heat conducted to the second cavity by the first heat conductor, and take the heat away when it is discharged from the second cavity, thereby achieving the effect of heat dissipation. By dissipating heat together by the first cavity and the second cavity, the heat dissipation effect can be further improved.
[0013] In some embodiments, the first heat conducting member includes a heat conducting pipe.
[0014] In some embodiments, the acoustic-electric transducer comprises a speaker.
[0015] In a second aspect, an embodiment of the present application provides an electronic device, comprising a heat source device and a heat dissipation device as described in any one of the first aspects.
[0016] In some embodiments, the electronic device further includes a shell, the shell of the electronic device includes a sound outlet, and the air outlet and the air inlet are opposite to the sound outlet, so that the electronic device can achieve heat dissipation without the need for adding new appearance openings, thereby reducing the heat dissipation cost and improving the aesthetics and portability of the electronic device.
[0017] In some embodiments, the sound outlet hole is opposite to the second opening of the second cavity.
[0018] In some embodiments, the heat source device includes a chip.
[0019] It can be understood that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 A schematic diagram of the structure of a heat dissipation device provided in an embodiment of the present application;
[0021] Figure 2 A schematic diagram of the structure of another heat dissipation device provided in an embodiment of the present application;
[0022] Figure 3 A schematic diagram of the structure of another heat dissipation device provided in an embodiment of the present application;
[0023] Figure 4 An exploded diagram of a heat dissipation device provided in an embodiment of the present application;
[0024] Figure 5 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;
[0025] Figure 6 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application;
[0026] Figure 7 A partial schematic diagram of an electronic device provided in an embodiment of the present application;
[0027] Figure 8 A partial schematic diagram of an electronic device provided in an embodiment of the present application;
[0028] Fig. 9 A partial schematic diagram of an electronic device provided in an embodiment of the present application;
[0029] Fig.10 A schematic diagram of the structure of another electronic device provided in an embodiment of the present application.
[0030] Figure numerals: first heat-conducting member -100, acoustic-electric transducer -200, heat source device -300, second heat-conducting member -400, shell -500, sealing member -600, display screen -700, main board -800, diaphragm 210, first cavity -220, air inlet -221, air outlet -222, air inlet valve membrane -230, air outlet valve membrane -240, second cavity -250, first opening -260. DETAILED DESCRIPTION
[0031] The heat dissipation device provided in the embodiment of the present application can be applied to electronic devices such as mobile phones, tablet computers, wearable devices, augmented reality (AR) / virtual reality (VR) devices, laptop computers, ultra-mobile personal computers (UMPC), netbooks, personal digital assistants (PDA), etc. The embodiment of the present application does not impose any restrictions on the specific types of electronic devices.
[0032] The electronic device may include a heat dissipation device and an acoustic-electric transducer. In some embodiments, the acoustic-electric transducer may be used to convert an electrical energy signal into an acoustic signal, such as a speaker or a horn; or, the acoustic-electric transducer may be used to convert an acoustic signal into an electrical energy signal, such as a microphone. The acoustic-electric transducer includes a diaphragm, which may vibrate when the acoustic-electric transducer is in operation.
[0033] In the embodiment of the present application, the vibration of the diaphragm in the acoustic-electric transducer can drive the airflow inside the electronic device to flow unidirectionally, thereby taking away the heat in the electronic device and significantly improving the heat dissipation performance of the electronic device.
[0034] The heat dissipation device of the present application is described in detail below with reference to specific embodiments.
[0035] Please refer to Figure 1 , is a schematic diagram of the structure of a heat dissipation device provided in an embodiment of the present application, including a first heat conductor 100 and an acoustic-electric transducer 200. The projection area of the first end of the first heat conductor 100 covers at least a portion of the heat source device 300, and the projection area of the second end of the first heat conductor 100 covers at least a portion of the acoustic-electric transducer 200. The acoustic-electric transducer 200 includes a diaphragm 210 and a first through cavity 220, the first cavity 220 includes an air inlet 221 and an air outlet 222, the air inlet 221 is provided with an air inlet valve membrane 230, the air outlet 222 is provided with an air outlet valve membrane 240, the air inlet valve membrane 230 is used to open or close the air inlet 221, and the air outlet valve membrane 240 is used to open or close the air outlet 222. When the diaphragm 210 vibrates along the first direction, the volume in the first cavity 220 increases, the air inlet valve membrane 230 opens, and the air outlet valve membrane 240 closes. When the diaphragm 210 vibrates along the second direction, the volume in the first cavity 220 decreases, the air inlet valve membrane 230 is closed, and the air outlet valve membrane 240 is opened.
[0036] The heat source device 300 may generate heat through physical friction or chemical reaction. In some embodiments, the heat source device 300 may include a chip, a system on chips (SOC), a processor, or a battery.
[0037] The first heat conductor 100 may be made of a heat conductive material. The projection area of the first end of the first heat conductor 100 covers at least a portion of the heat source device 300, and the projection area of the second end of the first heat conductor 100 covers at least a portion of the acoustic-electric transducer 200, so that the heat generated by the heat source device 300 can be transferred to the acoustic-electric transducer 200. The better the thermal conductivity of the first heat conductor 100 and the larger the surface area, the higher the efficiency of transferring the heat generated by the heat source device 300 to the acoustic-electric transducer 200, and the higher the heat dissipation performance.
[0038] In some embodiments, the first heat conducting member 100 may include a heat conducting pipe.
[0039] When the acoustic-electric transducer 200 is working, the conversion of the sound signal and the electric energy signal is realized by the vibration of the diaphragm 210. In the process of the diaphragm 210 receiving the electric signal and performing piston movement, when the diaphragm 210 vibrates along the first direction, the volume in the first cavity 220 increases, the pressure inside the first cavity 220 is less than the pressure outside the first cavity 220, the air inlet valve membrane 230 opens and the air outlet valve membrane 240 closes, so that air enters the first cavity 220; when the diaphragm 210 vibrates along the second direction, the volume in the first cavity 220 decreases, the pressure inside the first cavity 220 is greater than the pressure outside the first cavity 220, the air inlet valve membrane 230 closes and the air outlet valve membrane 240 opens, so that air is discharged from the first cavity 220. Therefore, when the diaphragm 210 vibrates continuously, the air will enter the first cavity 220 along the air inlet 221 and then flow out along the air outlet 222, that is, it will flow unidirectionally along the first cavity 220. When the air enters the first cavity 220, it absorbs the heat conducted from the first heat conductor 100 to the acoustic-electric transducer 200. When the air after absorbing heat is discharged from the air outlet 222, it can realize active exchange with external heat, take the heat out and away from the heat source device 300, so that the heat source device 300 is cooled down. And because the air inlet path and the air outlet path of the first cavity 220 are isolated, the air flows in one direction. Therefore, when the air after absorbing heat is discharged from the air outlet 222, it will not enter the first cavity from the air outlet 222, thereby improving the heat dissipation efficiency. In addition, since the heat dissipation is realized by using the acoustic-electric transducer 200, the heat dissipation is realized without adding other active heat dissipation drive devices in the electronic device, which significantly improves the heat dissipation performance and reduces the heat dissipation cost, and does not affect the portability of the electronic device.
[0040] In some embodiments, the inlet valve membrane 230 and the outlet valve membrane 240 are one-way valves.
[0041] In some embodiments, the first vibration direction and the second vibration direction are opposite.
[0042] In some embodiments, the acoustic-electric transducer 200 may include a speaker or a microphone.
[0043] In some embodiments, the projection area of the second end of the first heat conductor 100 covers at least a portion of the first cavity 220 , so that the air can take away more heat when passing through the first cavity 220 , further improving the heat dissipation performance.
[0044] In some embodiments, the diaphragm 210 may or may not make a sound. In the silent state, the diaphragm 210 may vibrate at a relatively low frequency (e.g., lower than the lowest frequency that human hearing can sense). Combined with the inverted tube design, the diaphragm 210 can achieve a relatively large vibration displacement at a relatively low power at this frequency, thereby driving air flow for heat dissipation. In the normal external sound condition, low-frequency and large-displacement vibrations are used to drive air to exchange heat.
[0045] Please refer to Figure 2 , is a schematic diagram of the structure of another heat dissipation device provided in an embodiment of the present application. The heat dissipation device further includes a second heat conducting member 400, the second heat conducting member 400 contacts the second end of the first heat conducting member 100, and the second heat conducting member 400 includes a plurality of fins, and the plurality of fins are arranged on one side of the air outlet 222.
[0046] The second heat-conducting member 400 may be made of a heat-conducting material. The second heat-conducting member 400 includes a plurality of fins, which can convert the planar heat of the first heat-conducting member 100 into three-dimensional heat, significantly increase the surface area of the second heat-conducting member 400, thereby improving the heat exchange efficiency, so that the air can take away more heat when discharged from the air outlet 222, and further improve the heat dissipation efficiency.
[0047] Please refer to Figure 3 , which is a schematic diagram of the structure of another heat dissipation device provided in an embodiment of the present application. The acoustic-electric transducer 200 further includes a second cavity 250 and a first opening 260 ( Figure 3 The first opening 260 is used to place the diaphragm 210, and the first opening 260 is connected to the second cavity 250. The second cavity 250 includes a second opening, which is a sound outlet or a sound receiving port of the acoustic-electric transducer. The projection area of the second end of the first heat conductor 100 covers at least a part of the second cavity 250.
[0048] When the diaphragm 210 continuously vibrates, the volume of the second cavity 250 can be increased or decreased. When the volume of the second cavity 250 increases, air is sucked in from the second opening, and when the volume of the second cavity 250 decreases, air is discharged from the second opening. When the air enters the second cavity 250, it can absorb the heat conducted to the second cavity 250 by the first heat conductor 100, and take the heat away when being discharged from the second cavity 250, thereby achieving a heat dissipation effect. By dissipating heat together by the first cavity 220 and the second cavity 250, the heat dissipation effect can be further improved.
[0049] In some embodiments, the projection area of the second end of the first heat conducting member 100 covers directly above or directly below the second cavity 250 .
[0050] In some embodiments, a side surface of the acoustic-electric transducer 200 includes a recessed area, and when the acoustic-electric transducer is disposed in an electronic device, the side surface is adjacent to a housing 500 ( Figure 3 The housing 500 is fitted with the housing 500 to partially enclose the recessed area, thereby forming a second cavity 250 and a second opening.
[0051] In some embodiments, the first cavity 220 may be referred to as a rear cavity, and the second cavity 250 may be referred to as a front cavity.
[0052] Please refer to Figure 4 , is an exploded view of a heat dissipation device provided in an embodiment of the present application. The heat dissipation device includes a first heat conducting member 100, an acoustic-electric transducer 200, and a second heat conducting member 400. The acoustic-electric transducer 200 includes a diaphragm 210, a first cavity 220, and a recessed area. The first cavity 220 includes an air inlet 221 and an air outlet 222.
[0053] When the acoustic-electric transducer 200 is fixedly connected to the housing 500 of the electronic device through the sealing member 600 , the housing 500 of the electronic device may seal a portion of the recessed area to form the second cavity 250 and the second opening.
[0054] In some embodiments, seal 600 may include foam.
[0055] In combination with the above heat dissipation device, the embodiment of the present application further provides an electronic device, which may include a heat source device and any of the above heat dissipation devices. In some embodiments, the electronic device further includes more devices, such as a housing 500, a middle frame or a display screen 700.
[0056] Please refer to Figure 5 and Figure 6 , is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. The electronic device includes Figure 2 The heat sink shown.
[0057] The electronic device includes a housing 500, a display screen 700 and a mainboard 800. The mainboard 800 is arranged on a side of the electronic device close to the longer frame, the heat source device 300 is arranged on the mainboard 800, and the heat dissipation device is arranged on a side of the electronic device close to the shorter frame. The first heat conducting member 100 conducts the heat generated by the heat source device 300 to the second heat conducting member 400, and the second heat conducting member 400 is in the first cavity 220 ( Figure 5 and Figure 6 The air outlet 222 (not shown) Figure 5 and Figure 6 The housing 500 of the electronic device includes a sound outlet 510, an air outlet 222 and an air inlet 221 ( Figure 5and Figure 6 The outer cover 510 (not shown) is opposite to the sound outlet hole 510, so that the electronic device can achieve heat dissipation without adding a new appearance opening, thereby reducing the heat dissipation cost and improving the aesthetics and portability of the electronic device.
[0058] The diaphragm 210 vibrates to drive the air outside the electronic device to flow out from the sound outlet 510 and the air inlet 221 ( Figure 5 and Figure 6 The heat source device 300 (not shown) enters the first cavity, is discharged from the air outlet 222 of the first cavity 220 and passes through the second heat-conducting member 400, and is discharged from the sound outlet 510 after absorbing the heat in the second heat-conducting member 400, thereby bringing the heat of the heat source device 300 out of the electronic device, significantly improving the heat dissipation performance of the electronic device.
[0059] Please refer to Figure 7-Figure 9 , is a partial schematic diagram of an electronic device provided in an embodiment of the present application. The electronic device may be Figure 5 and Figure 6 The electronic device shown. Figure 8 For along Figure 7 The cross-sectional view along the AA line. Fig. 9 For along Figure 7 Cross-sectional view along line BB.
[0060] Depend on Figure 8 It can be seen that at the air inlet 221 of the first cavity 220, the air inlet valve membrane 230 is arranged on one side of the air inlet 221, and the air inlet 221 is opposite to the sound outlet 510 of the electronic device. The air outside the electronic device can enter the first cavity 220 along the sound outlet 510, the air inlet 221 and the air inlet valve membrane 230; the air outlet valve membrane 240 and the second heat conductive member 400 are arranged at the air outlet 222 of the first cavity 220. The air in the first cavity 220 can be discharged from the air outlet 222 through the air outlet valve membrane 240 and pass through the second heat conductive member 400, thereby absorbing the heat at the second heat conductive member 400 and discharging it to the outside of the electronic device.
[0061] Depend on Fig. 9 It can be seen that the shell 500 of the electronic device is connected to the acoustic-electric transducer 200 through the seal 600 , and the shell 500 includes a sound outlet 510 , which is opposite to the second opening of the second cavity 250 , and the diaphragm 210 separates the acoustic-electric transducer 200 into the second cavity 250 and the first cavity 220 .
[0062] Please refer to Fig.10 , is a schematic diagram of the structure of another electronic device provided in an embodiment of the present application. The electronic device includes Figure 3 The heat sink shown.
[0063] The mainboard 800 is arranged on one side of the electronic device close to the longer frame, the heat source device 300 is arranged on the mainboard 800, and the heat dissipation device is arranged on the side of the electronic device close to the shorter frame. The projection area of the second end of the first heat-conducting member 100 covers most of the area of the acoustic-electric transducer 200, including at least part of the area of the second cavity 250. Therefore, the first heat-conducting member 100 can not only conduct heat to the second heat-conducting member 400, but also transfer heat to the second cavity 250, thereby simultaneously passing through the first cavity 220 ( Fig.10 ) and the second cavity 250 for heat dissipation.
[0064] In some embodiments, the sound outlet 510 ( Fig.10 ) is opposite to the second opening of the second cavity 250.
[0065] In the above embodiments, the description of each embodiment has its own emphasis. For the part that is not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of some embodiments.
[0066] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, elements, components and / or groups thereof.
[0067] It should also be understood that the term “and / or” used in the specification and appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes these combinations.
[0068] As used in the specification and appended claims of this application, the term "if" can be interpreted as "when" or "uponce" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "uponce it is determined" or "in response to determining" or "uponce [described condition or event] is detected" or "in response to detecting [described condition or event]", depending on the context.
[0069] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.
[0070] References to "one embodiment" or "some embodiments" etc. described in the specification of this application mean that one or more embodiments of the present application include specific features, structures or characteristics described in conjunction with the embodiment. Therefore, the statements "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.
[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A heat dissipation device, characterized in that: It includes a first heat conducting member and an acoustic-electric transducer; The projection area of the first end of the first heat conductor covers at least a part of the heat source device, and the projection area of the second end of the first heat conductor covers at least a part of the acoustic-electric transducer; The acoustic-electric transducer comprises a diaphragm and a first through cavity, the first cavity comprises an air inlet and an air outlet, the air inlet is provided with an air inlet valve membrane, the air outlet is provided with an air outlet valve membrane, the air inlet valve membrane is used to open or close the air inlet, and the air outlet valve membrane is used to open or close the air outlet; When the diaphragm vibrates along a first direction, the volume in the first cavity increases, the air inlet valve membrane opens, and the air outlet valve membrane closes; When the diaphragm vibrates along the second direction, the volume in the first cavity decreases, the air inlet valve membrane is closed, and the air outlet valve membrane is opened.
2. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device further includes a second heat conducting member, the second heat conducting member is in contact with the second end of the first heat conducting member, the second heat conducting member includes a plurality of fins, and the plurality of fins are arranged on one side of the air outlet.
3. The heat dissipation device according to claim 1 or 2, characterized in that: The projection area of the second end of the first heat conducting member covers at least a portion of the first cavity.
4. The heat dissipation device according to any one of claims 1 to 3, characterized in that: The acoustic-electric transducer also includes a first opening and a second cavity, the first opening is used to place the diaphragm, the first opening is connected to the second cavity, the second cavity includes a second opening, the second opening is the sound outlet or sound receiving port of the acoustic-electric transducer, and the projection area of the second end of the first heat conductor covers at least a portion of the second cavity.
5. The heat dissipation device according to claim 4, characterized in that: One side of the acoustic-electric transducer includes a recessed area, and when the acoustic-electric transducer is disposed in an electronic device, the side is in contact with a housing of the electronic device, and the housing closes a portion of the recessed area to form the second cavity and the second opening.
6. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The first heat conducting member comprises a heat conducting pipe.
7. The heat dissipation device according to any one of claims 1 to 5, characterized in that: The acoustic-electric transducer comprises a speaker.
8. An electronic device, characterized in that: The electronic device comprises a heat source device and a heat dissipation device as claimed in any one of claims 1 to 7.
9. The electronic device according to claim 8, characterized in that: The electronic device further comprises a housing, the housing of the electronic device comprises a sound outlet, and the air outlet and the air inlet are opposite to the sound outlet.
10. The electronic device according to claim 8 or 9, characterized in that: The heat source device includes a chip.