Heat dissipation device of motor driver

Abstract

The utility model relates to a heat dissipation device of a motor driver, and aims to solve the problems that in the working process of the existing motor driver, a large amount of heat is generated in the driver, and when the heat generated by the driver cannot be discharged out of the driver at the first time, the temperature in the driver rises continuously, so that the heat dissipation effect is poor. The utility model relates to a direct-current motor driver, in particular to a direct-current motor driver, and aims to solve the technical problems that components in the driver work abnormally due to continuously increased temperature, so that a circuit in the driver is influenced, the driver cannot work normally, and finally the operation of the direct-current motor is influenced, and the direct-current motor driver comprises a motor driver body. The semiconductor chilling plate is arranged on the radiating fin, so that airflow passing through the semiconductor chilling plate is effectively cooled, when the cooled airflow is in contact with the radiating fin, heat exchange can be better carried out, the wavy radiating fin increases the contact area with heat and improves the radiating efficiency, meanwhile, the wavy radiating fin can slow down the airflow rate, and the low-temperature airflow and the radiating fin are subjected to sufficient heat exchange.

Description

Technical Field

[0001] The utility model relates to the technical field of motor drivers, in particular to a heat dissipation device of a motor driver. Background Art

[0002] A motor driver is a power electronic device used to control the operation of a motor. It receives signals from the control system and converts these signals into instructions that the motor can understand and execute, thereby driving the motor to operate in a predetermined manner. The main functions of the driver include speed control, position control, and torque control.

[0003] During the operation of the existing motor driver, a large amount of heat is generated inside the driver. When the heat generated by the driver cannot be discharged outside the driver in the first time, the temperature inside the driver will continue to rise. The continuously rising temperature will cause the components in the driver to work abnormally, thereby affecting the internal circuit of the driver, causing the driver to fail to work normally, and ultimately affecting the operation of the DC motor. In view of this, we propose a heat dissipation device for a motor driver. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies of the prior art, meet actual needs, and provide a heat dissipation device for a motor driver to solve the technical problem that a large amount of heat is generated inside the driver during the operation of the current existing motor driver. When the heat generated by the driver cannot be discharged outside the driver in the first time, the temperature inside the driver will continue to rise. The continuously rising temperature will cause the components in the driver to work abnormally, thereby affecting the circuit inside the driver, causing the driver to fail to work normally, and ultimately affecting the operation of the DC motor.

[0005] In order to achieve the purpose of the utility model, the technical solution adopted by the utility model is: designing a heat dissipation device for a motor driver, including a motor driver body, a protective component is provided on the top of the motor driver body, and a heat dissipation mechanism is provided in the middle of the protective component;

[0006] The heat dissipation mechanism comprises a heat dissipation fan, a semiconductor cooling sheet is arranged below the heat dissipation fan, and a plurality of heat dissipation sheets are evenly distributed below the semiconductor cooling sheet.

[0007] Preferably, the semiconductor refrigeration sheet is embedded in the top of the protective component, and the heat dissipation fan and the protective component are threadedly connected.

[0008] Preferably, the heat sink is wavy in shape, and is fixedly connected to the motor driver body.

[0009] Preferably, the protective component includes a protective cover, a group of guide plates are arranged at the front and rear ends of the bottom of the protective cover, the outside of the guide plates are matched with guide grooves, bolts pass through the inside of the guide plates, a group of filter plates are arranged on the left and right sides of the bottom of the protective cover, and the outer side of the bottom end of the filter plate is matched with a slot.

[0010] Preferably, the protective cover forms a snap-fit ​​structure with the guide plate and the guide groove, and the guide plate forms a detachable structure with the motor driver body with bolts.

[0011] Preferably, the filter plate forms a snap-fit ​​structure with the motor driver body via a snap slot, and the protective cover and the filter plate are fixedly connected.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. The utility model performs cooling through semiconductor refrigeration sheets, and at the same time, the heat dissipation fan blows air downward, thereby effectively cooling the airflow passing through the semiconductor refrigeration sheets. When the cooled airflow contacts the heat sink, heat exchange can be better performed, thereby efficiently taking away the heat on the surface of the heat sink and the surrounding heat. The wavy heat sink increases the contact surface with the heat and improves the heat dissipation efficiency. At the same time, the wavy heat sink can slow down the airflow rate, so that the low-temperature airflow can fully exchange heat with the heat sink.

[0014] 2. The setting of the guide plate in the utility model can quickly assemble the protective cover and the motor driver body, thereby improving the assembly efficiency. The setting of the filter plate can effectively block external dust and prevent dust accumulation on the surface of the heat sink from affecting subsequent heat dissipation. The guide plate and the filter plate can be removed from the motor driver body by removing the bolts, thereby facilitating the cleaning of the filter plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the partial disassembled structure of the utility model;

[0017] Figure 3 It is a partial three-dimensional structural schematic diagram of the heat dissipation mechanism of the utility model;

[0018] In the figure: 1. Motor driver body; 2. Protection component; 3. Heat dissipation mechanism;

[0019] 201, protective cover; 202, guide plate; 203, guide groove; 204, bolt; 205, filter plate; 206, slot;

[0020] 301. Cooling fan; 302. Semiconductor cooling sheet; 303. Heat sink. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0022] A heat dissipation device for a motor driver, see Figures 1 to 3 , comprising a motor driver body 1, a protective component 2 is provided on the top of the motor driver body 1, and a heat dissipation mechanism 3 is provided in the middle of the protective component 2;

[0023] The heat dissipation mechanism 3 includes a heat dissipation fan 301, and a semiconductor cooling sheet 302 is arranged below the heat dissipation fan 301, wherein the semiconductor cooling sheet 302 is embedded in the top of the protective component 2, and the heat dissipation fan 301 and the protective component 2 are threadedly connected, and a plurality of heat sinks 303 are evenly distributed below the semiconductor cooling sheet 302. Furthermore, the heat sink 303 is wavy, and the heat sink 303 is fixedly connected to the motor driver body 1. The utility model performs cooling through the semiconductor cooling sheet 302, and the heat dissipation fan 301 blows air downward, thereby effectively cooling the airflow passing through the semiconductor cooling sheet 302. When the cooled airflow contacts the heat sink 303, heat exchange can be better performed, thereby efficiently taking away the heat on the surface and surrounding of the heat sink 303. The wavy heat sink 303 increases the contact surface with the heat, improves the heat dissipation efficiency, and the wavy heat sink 303 can slow down the airflow rate, so that the low-temperature airflow and the heat sink 303 can fully exchange heat.

[0024] It is worth noting that the protective component 2 includes a protective cover 201, and a group of guide plates 202 are arranged at the front and rear ends of the bottom of the protective cover 201. The outer side of the guide plate 202 is matched and fitted with a guide groove 203, and the inside of the guide plate 202 is penetrated by a bolt 204, wherein the protective cover 201 forms a clamping structure with the guide groove 203 through the guide plate 202, and the guide plate 202 forms a detachable structure with the motor driver body 1 through the bolt 204, and a group of filter plates 205 are arranged on the left and right sides of the bottom of the protective cover 201, and the outer side of the bottom end of the filter plate 205 is matched and fitted with a clamping groove 206. It is worth noting that the filter plate 205 forms a clamping structure with the motor driver body 1 through the clamping groove 206, and the protective cover 201 and the filter plate 205 are fixedly connected. The setting of the guide plate 202 in the utility model can quickly assemble the protective cover 201 and the motor driver body 1, thereby improving the assembly efficiency. The setting of the filter plate 205 can effectively block external dust and prevent dust from accumulating on the surface of the heat sink 303 and affecting subsequent heat dissipation. The guide plate 202 and the filter plate 205 can be removed from the motor driver body 1 by removing the bolts 204, thereby facilitating the cleaning of the filter plate 205.

[0025] Working principle: The protective cover 201 and the motor driver body 1 can be quickly assembled through the guide plate 202. The setting of the filter plate 205 can block external dust and prevent dust accumulation on the surface of the heat sink 303 from affecting subsequent heat dissipation. Then, the semiconductor refrigeration plate 302 is used for cooling. At the same time, the cooling fan 301 blows air downward, so that the airflow passing through the semiconductor refrigeration plate 302 is cooled. When the cooled airflow contacts the heat sink 303, heat exchange can be better performed, thereby efficiently taking away the heat on the surface of the heat sink 303 and the surrounding heat. The wavy heat sink 303 increases the contact area with the heat and improves the heat dissipation efficiency. At the same time, the wavy heat sink 303 can slow down the airflow rate, so that the low-temperature airflow and the heat sink 303 can be fully exchanged with heat. Subsequently, the guide plate 202 and the filter plate 205 can be removed from the motor driver body 1 by removing the bolts 204, thereby facilitating the cleaning of the filter plate 205.

[0026] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A heat dissipation device for a motor driver, comprising a motor driver body (1), characterized in that: A protective component (2) is provided on the top of the motor driver body (1), and a heat dissipation mechanism (3) is provided in the middle of the protective component (2); The heat dissipation mechanism (3) comprises a heat dissipation fan (301), a semiconductor cooling sheet (302) is arranged below the heat dissipation fan (301), and a plurality of heat dissipation sheets (303) are evenly distributed below the semiconductor cooling sheet (302).

2. The heat dissipation device for a motor driver according to claim 1, characterized in that: The semiconductor cooling sheet (302) is embedded in the top of the protection component (2), and the heat dissipation fan (301) and the protection component (2) are threadedly connected.

3. The heat dissipation device for a motor driver according to claim 1, characterized in that: The heat sink (303) is wavy in shape, and the heat sink (303) is fixedly connected to the motor driver body (1).

4. The heat dissipation device for a motor driver according to claim 1, characterized in that: The protection component (2) comprises a protection cover (201), a group of guide plates (202) are arranged at the front and rear ends of the bottom of the protection cover (201), the guide plates (202) are matched and fitted with guide grooves (203) on the outside, bolts (204) penetrate the inside of the guide plates (202), and a group of filter plates (205) are arranged on the left and right sides of the bottom of the protection cover (201), and the bottom ends of the filter plates (205) are matched and fitted with card slots (206) on the outside.

5. The heat dissipation device for a motor driver according to claim 4, characterized in that: The protective cover (201) forms a snap-fit ​​structure with the guide plate (202) and the guide groove (203), and the guide plate (202) forms a detachable structure with the motor driver body (1) through bolts (204).

6. The heat dissipation device for a motor driver according to claim 4, characterized in that: The filter plate (205) forms a snap-fit ​​structure with the motor driver body (1) via a snap-fit ​​groove (206), and the protective cover (201) and the filter plate (205) are fixedly connected.

Images