Grinding equipment for semiconductor production

Abstract

The utility model relates to the technical field of semiconductor polishing, and discloses a polishing device for semiconductor production, which comprises a bottom plate, the left side of the upper part of the bottom plate is fixedly connected with a water storage tank, the right side of the upper part of the bottom plate is fixedly connected with an inclined supporting plate, the upper part of the inclined supporting plate is fixedly connected with a mounting box, and the outer side of the upper part of the mounting box is fixedly connected with a water baffle. Air holes are evenly formed in the upper portion of the mounting box, a mounting assembly is arranged on the left side of the bottom in the mounting box, a dust falling assembly is arranged on the right side of the bottom in the mounting box, and a plurality of drainage assemblies are evenly and fixedly connected to the left side of a water baffle; and a polishing equipment body is fixedly connected into the portal frame. According to the device, through cooperation of the water pump, the water pumping pipe, the water conveying pipe, the water baffle, the spray head and other structures, the polishing device can recycle water for dust fall treatment, and the utilization rate of water resources is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor polishing, in particular to a polishing device for semiconductor production. Background Art

[0002] Semiconductor components are electronic devices with conductivity between good conductors and insulators. They use the special electrical properties of semiconductor materials to perform specific functions. They can be used to generate, control, receive, transform, amplify signals and perform energy conversion. When semiconductor components are processed, their surfaces need to be polished. Therefore, a semiconductor production polishing equipment is needed. The semiconductor production polishing equipment is one of the key equipment in the semiconductor manufacturing process. It is used to process and finish the surface of semiconductor wafers to ensure their flatness, accuracy and surface quality.

[0003] In the prior art, polishing equipment used in semiconductor production mostly uses a spraying method to reduce dust, which consumes a lot of water resources and has a low utilization rate. Utility Model Content

[0004] In order to make up for the above shortcomings, the utility model provides a semiconductor production polishing equipment, aiming to improve the problem that the semiconductor production polishing equipment in the prior art mostly uses a spraying method to reduce dust, consumes a lot of water resources and has a low utilization rate.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a polishing equipment for semiconductor production, including a base plate, a water storage tank is fixedly connected to the left side of the upper part of the base plate, a diagonal support plate is fixedly connected to the right side of the upper part of the base plate, an installation box is fixedly connected to the upper part of the diagonal support plate, a water baffle is fixedly connected to the outer side of the upper part of the installation box, air holes are evenly opened on the upper part of the installation box, an installation component is arranged on the left side of the bottom of the installation box, a dust reduction component is arranged on the right side of the bottom of the installation box, a plurality of drainage components are evenly fixedly connected to the left side of the water baffle, a gantry is fixedly connected to the upper part of the installation box, and a polishing equipment body is fixedly connected inside the gantry.

[0006] As a further description of the above technical solution:

[0007] The installation assembly includes a fan, an air intake pipe and an air supply pipe. The fan is fixedly connected to the left side of the bottom of the installation box, the air intake pipe is fixedly connected to the fan input end, and the air supply pipe is fixedly connected to the fan output end.

[0008] As a further description of the above technical solution:

[0009] The dust reduction assembly includes a water pump, a water suction pipe, a water delivery pipe and a nozzle. The water pump is fixedly connected to the right side of the bottom of the installation box, the water suction pipe is fixedly connected to the input end of the water pump, the water delivery pipe is fixedly connected to the output end of the water pump, and the nozzle is fixedly connected to the end of the water delivery pipe away from the water pump.

[0010] As a further description of the above technical solution:

[0011] The drainage assembly includes a drainage pipe and a filter screen. The drainage pipe is fixedly connected to the upper right side of the water tank, and the filter screen is fixedly connected to an end of the drainage pipe away from the water tank.

[0012] As a further description of the above technical solution:

[0013] The gas delivery pipe passes through the installation box.

[0014] As a further description of the above technical solution:

[0015] The water pumping pipe passes through the installation box and is fixedly connected with the water storage tank, and the water delivery pipe passes through the installation box and the gantry.

[0016] As a further description of the above technical solution:

[0017] The drainage pipe passes through the gantry.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the utility model, through the cooperation among structures such as a water pump, a water pumping pipe, a water delivery pipe, a water baffle and a nozzle, the grinding equipment can recycle the water used for dust reduction treatment, thereby improving the utilization rate of water resources.

[0020] 2. In the utility model, through the coordination between the blower, the air suction pipe and the air delivery pipe, the semiconductor production polishing equipment can vacuum adsorb the semiconductor to avoid the semiconductor from shifting during the polishing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional diagram of a grinding device for semiconductor production proposed by the utility model;

[0022] Figure 2 This is a bottom view of a grinding device for semiconductor production proposed by the utility model;

[0023] Figure 3 This is a cross-sectional view of an installation box of a semiconductor production grinding device proposed by the utility model;

[0024] Figure 4 for Figure 1 Enlarged view of point A in .

[0025] Legend:

[0026] 1. Bottom plate; 2. Water storage tank; 3. Diagonal support plate; 4. Installation box; 5. Water retaining plate; 6. Gantry; 7. Grinding equipment body; 8. Air hole; 9. Fan; 10. Intake pipe; 11. Air supply pipe; 12. Water pump; 13. Suction pipe; 14. Water supply pipe; 15. Nozzle; 16. Drain pipe; 17. Filter. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Reference Figure 2-4 , an embodiment provided by the utility model: a polishing device for semiconductor production, comprising a bottom plate 1, a water storage tank 2 is fixedly connected to the left side of the upper part of the bottom plate 1, a diagonal support plate 3 is fixedly connected to the right side of the upper part of the bottom plate 1, a mounting box 4 is fixedly connected to the upper part of the diagonal support plate 3, a water retaining plate 5 is fixedly connected to the outer side of the upper part of the mounting box 4, air holes 8 are evenly opened on the upper part of the mounting box 4, a mounting component is arranged on the left side of the bottom of the mounting box 4, a dust reduction component is arranged on the right side of the bottom of the mounting box 4, a plurality of drainage components are evenly fixedly connected to the left side of the water retaining plate 5, a gantry 6 is fixedly connected to the upper part of the mounting box 4, a polishing equipment body 7 is fixedly connected to the inside of the gantry 6, and the dust reduction component package It includes a water pump 12, a suction pipe 13, a water delivery pipe 14 and a nozzle 15. The water pump 12 is fixedly connected to the right side of the bottom of the installation box 4, the suction pipe 13 is fixedly connected to the input end of the water pump 12, the water delivery pipe 14 is fixedly connected to the output end of the water pump 12, the nozzle 15 is fixedly connected to the end of the water delivery pipe 14 away from the water pump 12, the suction pipe 13 passes through the installation box 4 and is fixedly connected to the water storage tank 2, the water delivery pipe 14 passes through the installation box 4 and the gantry 6, the drainage assembly includes a drain pipe 16 and a filter 17, the drain pipe 16 is fixedly connected to the upper right side of the water storage tank 2, the filter 17 is fixedly connected to the end of the drain pipe 16 away from the water storage tank 2, and the drain pipe 16 passes through the gantry 6.

[0029] The mounting box 4 is supported by the diagonal support plate 3 so that the water for dust reduction treatment can flow into the water storage tank 2 through the drain pipe 16. The water pump 12 is started by controlling the water pump pipe 13 to operate and the water in the water storage tank 2 is pumped into the water pump 12. The water is input into the nozzle 15 through the water pipe 14. The water is sprayed out through the nozzle 15 to reduce the dust generated by the semiconductor grinding. After the dust reduction, the dust is filtered through the filter 17 and the water is discharged into the water storage tank 2 through the drain pipe 16. In this way, the grinding equipment can recycle the water used for dust reduction treatment and improve the utilization rate of water resources.

[0030] Reference Figure 1-3 The installation assembly includes a fan 9, an air intake pipe 10 and an air supply pipe 11. The fan 9 is fixedly connected to the left side of the bottom of the installation box 4, the air intake pipe 10 is fixedly connected to the input end of the fan 9, and the air supply pipe 11 is fixedly connected to the output end of the fan 9. The air supply pipe 11 runs through the installation box 4.

[0031] By placing the semiconductor on the upper part of the air hole 8, multiple air holes 8 are used to facilitate the adsorption of multiple semiconductors, thereby improving the efficiency of semiconductor grinding processing, and controlling the fan 9 to start so that the suction pipe 10 at the input end of the fan 9 runs to draw air into the fan 9, and the air is discharged from the installation box 4 through the air supply pipe 11, so that negative pressure is formed inside the installation box 4 to adsorb the semiconductor on the upper part of the air hole 8.

[0032] Working principle: when it is necessary to polish the semiconductor, the semiconductor is placed on the upper part of the pore 8, the fan 9 is controlled to be turned on so that the suction pipe 10 at the input end of the fan 9 runs to draw air into the fan 9, and the air is discharged from the installation box 4 through the air supply pipe 11, so that a negative pressure is formed inside the installation box 4 to adsorb the semiconductor on the upper part of the pore 8, thereby realizing that the polishing equipment can vacuum adsorb the semiconductor to avoid the semiconductor from shifting during the polishing process. When it is necessary to perform dust reduction treatment on the dust generated by the semiconductor polishing, the water pump 12 is controlled to be started so that the water suction pipe 13 runs to draw water in the water tank 2 into the water pump 12, and the water is input into the nozzle 15 through the water supply pipe 14, and the water is sprayed out through the nozzle 15 to perform dust reduction treatment on the dust generated by the semiconductor polishing. After dust reduction, the dust is filtered through the filter 17, and the water is discharged into the water tank 2 through the drain pipe 16, thereby realizing that the polishing equipment can recycle the water used for dust reduction treatment, thereby improving the utilization rate of water resources.

[0033] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A grinding device for semiconductor production, comprising a base plate (1), characterized in that: The upper left side of the base plate (1) is fixedly connected to a water storage tank (2), the upper right side of the base plate (1) is fixedly connected to an inclined support plate (3), the upper part of the inclined support plate (3) is fixedly connected to an installation box (4), the upper outer side of the installation box (4) is fixedly connected to a water retaining plate (5), the upper part of the installation box (4) is evenly provided with air holes (8), the lower left side of the inner bottom of the installation box (4) is provided with an installation component, the lower right side of the inner bottom of the installation box (4) is provided with a dust reduction component, the left side of the water retaining plate (5) is evenly fixedly connected to a plurality of drainage components, the upper part of the installation box (4) is fixedly connected to a gantry (6), and the interior of the gantry (6) is fixedly connected to a grinding equipment body (7).

2. A semiconductor production polishing device according to claim 1, characterized in that: The installation assembly comprises a fan (9), an air intake pipe (10) and an air supply pipe (11); the fan (9) is fixedly connected to the left side of the bottom of the installation box (4); the air intake pipe (10) is fixedly connected to the input end of the fan (9); and the air supply pipe (11) is fixedly connected to the output end of the fan (9).

3. The semiconductor production polishing equipment according to claim 1, characterized in that: The dust reduction component comprises a water pump (12), a water suction pipe (13), a water delivery pipe (14) and a nozzle (15); the water pump (12) is fixedly connected to the right side of the bottom of the installation box (4); the water suction pipe (13) is fixedly connected to the input end of the water pump (12); the water delivery pipe (14) is fixedly connected to the output end of the water pump (12); and the nozzle (15) is fixedly connected to an end of the water delivery pipe (14) away from the water pump (12).

4. The semiconductor production polishing equipment according to claim 1, characterized in that: The drainage assembly comprises a drainage pipe (16) and a filter screen (17); the drainage pipe (16) is fixedly connected to the upper right side of the water tank (2); and the filter screen (17) is fixedly connected to an end of the drainage pipe (16) away from the water tank (2).

5. The semiconductor production polishing equipment according to claim 2, characterized in that: The gas delivery pipe (11) passes through the installation box (4).

6. The semiconductor production polishing equipment according to claim 3, characterized in that: The water extraction pipe (13) passes through the installation box (4) and is fixedly connected to the water storage tank (2), and the water delivery pipe (14) passes through the installation box (4) and the gantry (6).

7. The semiconductor production polishing equipment according to claim 4, characterized in that: The drainage pipe (16) passes through the gantry (6).

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