Efficient cold carrying equipment

Abstract

The utility model relates to the technical field of refrigerating equipment, in particular to efficient refrigerating equipment which comprises a plate-type box body, a lower refrigerating cavity and an upper radiating cavity are arranged in the plate-type box body, a plurality of water tanks are connected to a top plate in the refrigerating cavity, semiconductor refrigerating plates located in the water tanks are connected to the top in the refrigerating cavity, and the semiconductor refrigerating plates are connected to the top in the refrigerating cavity. The refrigerating face of the semiconductor refrigerating plate is arranged in the water tank, and the two sides of the bottom of the plate type box body are each connected with a plurality of circulating draft fans communicated with the interior of the refrigerating cavity. Compared with the prior art, the plate-type refrigeration and heat dissipation device has the advantages that through plate-type bottom refrigeration and top heat dissipation, efficient and rapid refrigeration and heat dissipation operation can be carried out, meanwhile, it can be guaranteed that the occupied area is small, the relative energy consumption is low, and the plate-type refrigeration and heat dissipation device is suitable for being used as cold carrying equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling equipment, in particular to a high-efficiency cooling equipment. Background Art

[0002] Refrigeration equipment is a type of refrigeration equipment. Refrigeration equipment refers to equipment mainly used for food refrigeration, refrigeration of various types of goods and cabin air conditioning in summer. Refrigeration equipment generally refers to refrigeration equipment installed on vehicles.

[0003] Most of the cooling equipment in the existing technology is mainly composed of a compressor, an expansion valve, an evaporator, a condenser and accessories, and pipelines. According to the working principle, they can be divided into compression refrigeration equipment, absorption refrigeration equipment, steam jet refrigeration equipment, heat pump refrigeration equipment and electric refrigeration equipment, etc. However, this type of equipment is installed on a vehicle, which generally has the problems of being relatively inconvenient to install, occupying a large space, low efficiency and high energy consumption, and the compressor is noisy. Utility Model Content

[0004] The technical problem to be solved by the present invention is to provide an efficient cooling device in view of the deficiencies of the cooling device proposed in the above background technology.

[0005] In order to solve the above technical problems, the present invention provides a technical solution as follows: an efficient cooling device, comprising a plate-type box, wherein the plate-type box comprises a lower refrigeration chamber and an upper heat dissipation chamber, wherein a top plate of the refrigeration chamber is connected to a plurality of water tanks, wherein the top of the refrigeration chamber is connected to a semiconductor refrigeration plate located inside the water tank, wherein the cooling surface of the semiconductor refrigeration plate is arranged inside the water tank, and wherein both sides of the bottom of the plate-type box are connected to a plurality of circulating exhaust fans in communication with the interior of the refrigeration chamber;

[0006] The heat dissipation surface of the semiconductor refrigeration plate extends into the heat dissipation cavity and is connected with a metal heat dissipation plate. The top of the plate-type box is connected with multiple heat dissipation fans, and both sides of the plate-type box are connected with multiple air inlet pipes.

[0007] Furthermore, a fixed connection plate is provided on the outer side of the middle portion of the plate-type box body to facilitate the fixed connection operation of the plate frame.

[0008] Furthermore, a first temperature sensor is connected to the top plate of the refrigeration cavity, and a second temperature sensor is connected to the bottom of the heat dissipation cavity, so as to facilitate sensing the temperature in the cavity.

[0009] Furthermore, the bottom of the plate-type box is connected to a first air collecting hood that cooperates with the circulating exhaust fan, the bottom of the first air collecting hood is connected to a first air duct, and the first air duct is connected to a first electric control valve to facilitate internal sealing operations when not in use.

[0010] Furthermore, the top plate of the plate-type box is connected to a second air collecting hood that cooperates with the cooling fan, the top of the second air collecting hood is connected to a second air duct, the second air duct is connected to a second electric control valve, and multiple second air ducts are commonly connected to an exhaust pipe to facilitate internal sealing operations when not in use.

[0011] Furthermore, a third electrically controlled valve is connected to the air inlet pipe, and filter plates are connected on both sides of the heat dissipation cavity between the air inlet pipe and the heat dissipation fan. The top plate of the plate-type box is connected to a cleaning sealing door that cooperates with the filter plate, so as to facilitate internal sealing operations when not in use and filter the incoming air at the same time.

[0012] The advantages of the high-efficiency cooling device of the present invention compared with the existing technology are: the present invention can perform efficient and rapid cooling and heat dissipation operations through plate-type bottom cooling and top heat dissipation, while ensuring a small footprint and relatively low energy consumption, making it suitable for use as a cooling device. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a first structural schematic diagram of an efficient cooling device of the present invention.

[0014] Figure 2 This is a second structural schematic diagram of an efficient cooling device of the present invention.

[0015] Figure 3 This is a first top-sectional structural schematic diagram of a high-efficiency cooling device of the present invention.

[0016] Figure 4 This is a second top-sectional structural schematic diagram of an efficient cooling device of the present invention.

[0017] Figure 5 This is a third schematic diagram of a top-down cross-sectional structure of a high-efficiency cooling device of the present invention.

[0018] Figure 6 This is a first top-sectional structural schematic diagram of an efficient cooling device of the present invention.

[0019] Figure 7 This is a second top sectional structural schematic diagram of an efficient cooling device of the present invention.

[0020] As shown in the figure: 1. Plate-type cabinet; 2. Fixed connecting plate; 3. Refrigeration chamber; 4. Heat dissipation chamber; 5. Water tank; 6. Semiconductor refrigeration plate; 7. First temperature sensor; 8. Metal heat dissipation plate; 9. Second temperature sensor; 10. Circulation fan; 11. First air hood; 12. First air duct; 13. First electric-controlled valve; 14. Cooling fan; 15. Second air hood; 16. Second air duct; 17. Second electric-controlled valve; 18. Exhaust pipe; 19. Air inlet pipe; 20. Third electric-controlled valve; 21. Filter plate; 22. Cleaning sealing door. DETAILED DESCRIPTION

[0021] The present invention will be described in further detail below with reference to the accompanying drawings.

[0022] Combined with attachment Figure 1 、 3 , 4, 5, a high-efficiency cold-carrying equipment, including a plate-type box body 1, a fixed connecting plate 2 is connected to the outer side of the middle of the plate-type box body 1, and the plate-type box body 1 includes a lower refrigeration chamber 3 and an upper heat dissipation chamber 4. During the specific installation, it is generally installed on the top of the transport equipment through the fixed connecting plate 2, and then the refrigeration chamber 3 is installed inside the space to be refrigerated, and the heat dissipation chamber 4 is arranged outside for heat dissipation operation, and the connection needs to be sealed. A plurality of water tanks 5 are connected to the top plate of the refrigeration chamber 3, and a semiconductor refrigeration plate 6 located inside the water tank 5 is connected to the top of the refrigeration chamber 3. The cooling surface of the semiconductor refrigeration plate 6 is arranged in the water tank 5. A plurality of circulating exhaust fans 10 in communication with the inside of the refrigeration chamber 3 are connected on both sides of the bottom of the plate-type box body 1. The water tank 5 is quickly cooled by the semiconductor refrigeration plate 6, so that the inside of the refrigeration chamber 3 is cooled quickly. The temperature drops rapidly, and then the circulating exhaust fans 10 at both ends are started, with exhaust at one end and exhaust at the other end, so that the refrigeration space can be cooled quickly and efficiently. In the cooling stage, the semiconductor refrigeration plates 6 in multiple water tanks 5 are started. When the temperature reaches the appropriate temperature, several semiconductor refrigeration plates 6 can be closed, so that both efficient cooling and energy saving can be achieved. The bottom of the plate-type box 1 is connected to a first air collecting hood 11 that cooperates with the circulating exhaust fan 10. The bottom of the first air collecting hood 11 is connected to a first air duct 12, and the first air duct 12 is connected to a first electrically controlled valve 13. Through the air collecting hood and the electrically controlled valve, the internal sealing operation can be ensured when not in use, thereby preventing high humidity from affecting the internal electrical components. The top plate in the refrigeration cavity 3 is connected to a first temperature sensor 7.

[0023] In specific implementation: when cooling is performed, the water tank 5 is quickly cooled by the semiconductor refrigeration plate 6, so that the temperature in the refrigeration cavity 3 is quickly reduced, and then the circulating exhaust fans 10 at both ends are started, one end is used to extract air and the other end is used to discharge air, so that the refrigeration space can be cooled quickly and efficiently.

[0024] Combined with attachment Figure 2 、 6 , 7, the heat dissipation surface of the semiconductor refrigeration plate 6 extends into the heat dissipation cavity 4 and is connected with a metal heat dissipation plate 8. At the same time, a heat insulation plate needs to be set between the lower refrigeration cavity 3 and the upper heat dissipation cavity 4, and then a sealing connection process needs to be performed at the connection of the semiconductor refrigeration plate 6, so as to reduce the influence between the upper and lower cavities. The top of the plate-type box 1 is connected with a plurality of cooling fans 14, and the two sides of the plate-type box 1 are connected with a plurality of air inlet pipes 19. The top plate of the plate-type box 1 is connected with a second air collecting cover 15 that cooperates with the cooling fan 14. The top of the second air collecting cover 15 is connected with a second air guide pipe 16, and the second air guide pipe 17 is connected with the second air guide pipe 18. A second electrically controlled valve 17 is connected to the air pipe 16, and multiple second air guide pipes 16 are commonly connected to an exhaust pipe 18. A third electrically controlled valve 20 is connected to the air inlet pipe 19. Filter panels 21 are connected on both sides of the heat dissipation cavity 4 between the air inlet pipe 19 and the heat dissipation fan 14. A cleaning sealing door 22 is connected to the top plate of the plate-type box 1 to match the filter panel 21. When the air is taken in, there are often too many or too few garbage and dust particles, which will affect the electrical components. Therefore, by filtering, the impact on the internal electrical components can be reduced. A second temperature sensor 9 is connected to the bottom of the heat dissipation cavity 4.

[0025] In specific implementation: due to rapid cooling, the semiconductor refrigeration plate 6 will dissipate heat quickly, thereby cooperating with the metal heat dissipation plate 8 and multiple cooling fans 14 to ensure rapid heat dissipation. Through the electric control valve, the internal sealing can be ensured when not in use, thereby reducing the impact of the outside on the electrical components. At the same time, different numbers of cooling fans can be started according to the temperature, thereby achieving energy-saving effects.

[0026] This device requires an external controller and power supply equipment to power and control the electrical components inside the device. This is a common power supply and control circuit, so I will not elaborate on it.

[0027] The above description of the present invention and its embodiments is non-limiting. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if a person skilled in the art is inspired by the above, and does not deviate from the purpose of the present invention, without inventive design, a structure and embodiment similar to the technical solution should fall within the scope of protection of the present invention.

Claims

1. An efficient cooling device, comprising a plate-type box (1), characterized in that: The plate-type box (1) comprises a lower refrigeration chamber (3) and an upper heat dissipation chamber (4); a plurality of water tanks (5) are connected to the top plate of the refrigeration chamber (3); a semiconductor refrigeration plate (6) located inside the water tank (5) is connected to the top of the refrigeration chamber (3); a refrigeration surface of the semiconductor refrigeration plate (6) is arranged inside the water tank (5); and a plurality of circulating exhaust fans (10) in communication with the interior of the refrigeration chamber (3) are connected to both sides of the bottom of the plate-type box (1); The heat dissipation surface of the semiconductor refrigeration plate (6) extends into the heat dissipation cavity (4) and is connected to a metal heat dissipation plate (8); the top of the plate-type box (1) is connected to a plurality of heat dissipation fans (14); and both sides of the plate-type box (1) are connected to a plurality of air inlet pipes (19).

2. The efficient cooling device according to claim 1, characterized in that: A fixed connection plate (2) is connected to the outer side of the middle part of the plate-type box (1).

3. The efficient cooling device according to claim 1, characterized in that: A first temperature sensor (7) is connected to the top plate of the refrigeration cavity (3), and a second temperature sensor (9) is connected to the bottom plate of the heat dissipation cavity (4).

4. The efficient cooling device according to claim 1, characterized in that: The bottom of the plate-type box (1) is connected to a first air collecting hood (11) cooperating with the circulating exhaust fan (10), the bottom of the first air collecting hood (11) is connected to a first air duct (12), and the first air duct (12) is connected to a first electric control valve (13).

5. The efficient cooling device according to claim 1, characterized in that: The top plate of the plate-type box (1) is connected to a second air collecting hood (15) cooperating with a cooling fan (14); the top of the second air collecting hood (15) is connected to a second air guide pipe (16); the second air guide pipe (16) is connected to a second electric control valve (17); and a plurality of the second air guide pipes (16) are commonly connected to an exhaust pipe (18).

6. The efficient cooling device according to claim 1, characterized in that: The air inlet pipe (19) is connected to a third electrically controlled valve (20), the heat dissipation cavity (4) is provided with filter screens (21) on both sides between the air inlet pipe (19) and the heat dissipation fan (14), and the top plate of the plate-type box body (1) is connected to a cleaning sealing door (22) that cooperates with the filter screens (21).

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