MEMS piezoresistive barometric altimeter
By using MEMS piezoresistive pressure sensing chip and high-precision signal conditioning chip in the barometer, combined with calibration compensation algorithm and multiple chip packaging methods, the existing barometer has been solved with low accuracy, poor reliability and complex installation problems, and a high-precision, convenient maintenance and a variety of applications have been achieved.
Patent Information
- Application Number
- CN202421209744.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-05-30
AI Technical Summary
The existing barometers do not use MEMS piezoresistive pressure sensing chips, resulting in low accuracy and reliability, inability to perform temperature compensation and zero-drift calibration, and complex installation, which cannot meet the needs of different volume application scenarios and maintenance and repair requirements.
The MEMS piezoresistive pressure sensing chip is adopted, and a high-precision signal conditioning chip is installed in the chip. The temperature compensation and zero-point drift calibration are performed through the calibration compensation algorithm. The separate and combined chip packaging method is adopted to design a convenient disassembly and assembled shell structure for rapid maintenance.
It improves the accuracy, reliability and expansion of the barometer, reduces the drift temperature, meets the needs of different volume application scenarios, and realizes the convenient disassembly, assembly and rapid maintenance of the barometer.
Smart Images

Figure CN222544692U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of air pressure altimeters, in particular to a MEMS piezoresistive air pressure altimeter. Background Art
[0002] The MEMS piezoresistive barometric altimeter is based on the piezoresistive principle. It measures the air pressure at the current altitude through a MEMS piezoresistive pressure sensor chip, and then uses the distribution law of air pressure changing with altitude in the vertical direction to calculate the current altitude based on the gas state equation and a known reference altitude (usually sea level altitude).
[0003] Existing barometric altimeters do not use MEMS piezoresistive pressure sensor chips, have low accuracy and reliability, are not installed with high-precision signal conditioning chips, have low scalability, and cannot perform temperature compensation and zero drift calibration through calibration compensation algorithms, resulting in low accuracy, low consistency, low reliability and high drift temperature. The packaging form of the sensor has not been expanded, and the height measurement requirements of application scenarios of different volumes cannot be met. In addition, existing barometric altimeters are complex to install and cannot respond to maintenance and repairs in a timely manner. Utility Model Content
[0004] The purpose of the utility model is to provide a MEMS piezoresistive barometric altimeter to solve the problems mentioned in the above background technology that the existing barometric altimeters do not use MEMS piezoresistive pressure sensor chips, have low accuracy and reliability, are not installed with high-precision signal conditioning chips, and cannot perform temperature compensation and zero drift calibration through calibration compensation algorithms, resulting in low accuracy, low consistency, low reliability and high drift temperature, and the packaging form of the sensor is not expanded, which cannot meet the height measurement requirements of different volume application scenarios, and the existing barometric altimeters are complex to install and cannot respond to maintenance and repairs in a timely manner.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a MEMS piezoresistive pressure altimeter, comprising a shell one, a screen is installed on the surface of the shell one, a groove is opened on the surface of the shell one, the inner wall of the shell one is movably connected to the shell two, the surface of the shell two is movably connected to a button, the surface of the shell two is fixedly connected to a bump, the surface of the shell two is fixedly connected to a mainboard, and the surface of the mainboard is welded with a pressure sensor chip.
[0006] Preferably, the screen is connected to the mainboard via a wire.
[0007] Preferably, the cross-section of the second shell is L-shaped.
[0008] Preferably, two groups of the grooves are arranged on the surface of the screen, and the two groups of the grooves are symmetrical about a center of the housing.
[0009] Preferably, two groups of protrusions are arranged on the surface of the second shell, and the two groups of protrusions are symmetrical about the center of the second shell.
[0010] Preferably, the protrusion is engaged with the groove.
[0011] Preferably, the pressure sensor chip includes a separate chip and a sealed chip, and the separate chip and the sealed chip are two different packaging methods.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] 1. By using MEMS piezoresistive pressure sensor chip in the barometric altimeter, the accuracy and reliability are improved. A high-precision signal conditioning chip is installed in the chip, which can be connected to external sensors, signal sources or other devices. It can receive different types of signals, such as analog signals, digital signals or mixed signals, and perform corresponding processing and adjustment according to design requirements, further improving the scalability of the pressure altimeter.
[0014] 2. Temperature compensation and zero drift calibration are performed through the calibration compensation algorithm, which improves the accuracy, consistency and reliability of the barometric altimeter and reduces the drift temperature. The sensor is packaged in two different ways: separate packaging and closed packaging, which meets the height measurement requirements of different volume application scenarios. The movable connection between the second shell and the first shell, and the clamping of the groove and the bump enable the convenient disassembly and assembly of the barometric altimeter, which enables timely response to maintenance and repair. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a top-down perspective schematic diagram of the structure of the utility model;
[0016] Figure 2 It is a side perspective schematic diagram of the housing 1 and the housing 2 of the utility model;
[0017] Figure 3 It is a partial three-dimensional exploded schematic diagram of the housing 1 and the housing 2 of the utility model;
[0018] Figure 4 It is a three-dimensional schematic diagram of the structure of the separate chip of the utility model;
[0019] Figure 5 It is a schematic structural stereogram of the sealed chip of the utility model.
[0020] In the figure: 1. Shell 1; 2. Screen; 3. Shell 2; 4. Button; 5. Groove; 6. Bump; 7. Mainboard; 8. Pressure sensor chip; 81. Separate chip; 82. Sealed chip. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0022] See also Figure 1-5 , an embodiment provided by the utility model:
[0023] A MEMS piezoresistive barometric altimeter comprises a shell 1, a screen 2 is mounted on the surface of the shell 1, a groove 5 is provided on the surface of the shell 1, a shell 2 3 is movably connected to the inner wall of the shell 1, a button 4 is movably connected to the surface of the shell 2 3, a bump 6 is fixedly connected to the surface of the shell 2 3, a mainboard 7 is fixedly connected to the surface of the mainboard 7, a pressure sensor chip 8 is welded to the surface of the mainboard 7, and through the movable connection between the shell 2 3 and the shell 1 and the clamping connection between the groove 5 and the bump 6, the barometric altimeter can be conveniently disassembled and assembled, and timely response to maintenance and repair is achieved.
[0024] Furthermore, the screen 2 is connected to the main board 7 via a wire, and the length of the wire is twice the length of the outer shell 1. When the outer shell 3 is pulled out and the pressure sensor chip 8 is repaired or replaced, the wire length is ensured to be sufficient. When the pressure sensor chip 8 is repaired or replaced, the connection between the screen 2 and the main board 7 will not be affected.
[0025] Furthermore, the cross section of the outer shell 2 3 is L-shaped, and when the outer shell 1 1 and the outer shell 2 3 are closed, there is no gap between the outer shell 1 1 and the outer shell 2 3 .
[0026] Furthermore, two groups of grooves 5 are provided on the surface of the screen 2, and the two groups of grooves 5 are symmetrical about the center of the housing 1. The grooves 5 are engaged with the protrusions 6 to play the role of fixing and releasing.
[0027] Furthermore, two groups of protrusions 6 are arranged on the surface of the second shell 3 , and the two groups of protrusions 6 are symmetrical about the center of the second shell 3 . The protrusions 6 are engaged with the grooves 5 arranged on the first shell 1 to play a fixing role.
[0028] Furthermore, the protrusion 6 is engaged with the groove 5 so that the housing 1 and the housing 2 3 can be fixed together when they are closed.
[0029] Furthermore, the pressure sensor chip 8 includes a separate chip 81 and a sealed chip 82. The separate chip 81 and the sealed chip 82 are two different packaging methods. The separate chip 81 is packaged using a separate packaging process, and the sealed chip 82 is packaged using a sealed packaging process, thereby meeting the height measurement requirements of different volume application scenarios.
[0030] Working principle: a square groove is provided on the surface of the shell 1, and the screen 2 is installed in the square groove on the surface of the shell 1. The screen 2 is connected to the main board 7 through a wire. The length of the wire is twice the length of the shell 1. When the shell 2 3 is pulled out, the wire length is guaranteed to be sufficient. When the pressure sensor chip 8 is repaired or replaced, the connection between the screen 2 and the main board 7 will not be affected. The inner wall of the shell 1 is movably connected to the shell 2 3, so that the shell 2 3 can be pulled out, which is convenient for disassembly and assembly of the barometric altimeter and maintenance and repair of the pressure sensor chip 8. The button 4 installed on the surface of the shell 2 3 is used to control the switch of the barometric altimeter and the display content of the screen 2. Two groups of grooves 5 are symmetrically arranged on the surface of the shell 1, and two groups of bumps 6 are symmetrically arranged on the surface of the shell 2 3 to fix and release the shell 2 3 when the shell 1 and the shell 2 3 are closed. The main board 7 is arranged on the surface of the shell 2 3, and the pressure sensor chip 8 is welded on the main board 7. Chip 8 includes a separate chip 81 and a sealed chip 82. The separate chip 81 and the sealed chip 82 are two different packaging processes. The separate chip 81 is packaged using a separate packaging process, and the sealed chip 82 is packaged using a sealed packaging process, which meets the height measurement requirements of different volume application scenarios. By using a MEMS piezoresistive pressure sensor chip in the barometric altimeter, the accuracy and reliability are improved. A high-precision signal conditioning chip is installed in the chip, which can be connected to an external sensor, signal source or other device. It can receive different types of signals, such as analog signals, digital signals or mixed signals, and perform corresponding processing and adjustment according to design requirements, further improving the scalability of the pressure altimeter. The MEMS piezoresistive pressure sensor used can perform temperature compensation and zero drift calibration through a calibration compensation algorithm, which improves the accuracy, consistency and reliability of the barometric altimeter and reduces the drift temperature.
[0031] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.
Claims
1. A MEMS piezoresistive barometric altimeter, comprising a housing (1), characterized in that: A screen (2) is mounted on the surface of the first shell (1), a groove (5) is provided on the surface of the first shell (1), the inner wall of the first shell (1) is movably connected to the second shell (3), the surface of the second shell (3) is movably connected to a button (4), the surface of the second shell (3) is fixedly connected to a bump (6), the surface of the second shell (3) is fixedly connected to a mainboard (7), and the surface of the mainboard (7) is welded with a pressure sensor chip (8).
2. A MEMS piezoresistive pressure altimeter according to claim 1, characterized in that: The screen (2) is connected to the main board (7) via a wire.
3. A MEMS piezoresistive pressure altimeter according to claim 1, characterized in that: The cross section of the second shell (3) is L-shaped.
4. A MEMS piezoresistive pressure altimeter according to claim 1, characterized in that: Two groups of the grooves (5) are arranged on the surface of the screen (2), and the two groups of the grooves (5) are symmetrical about the center of the housing (1).
5. A MEMS piezoresistive pressure altimeter according to claim 1, characterized in that: Two groups of the protrusions (6) are arranged on the surface of the second shell (3), and the two groups of the protrusions (6) are symmetrical about the center of the second shell (3).
6. A MEMS piezoresistive barometric altimeter according to claim 1, characterized in that: The protrusion (6) is engaged with the groove (5).
7. A MEMS piezoresistive barometric altimeter according to claim 1, characterized in that: The pressure sensor chip (8) comprises a separate chip (81) and a sealed chip (82), wherein the separate chip (81) and the sealed chip (82) are two different packaging methods.