Air-cooled radiator for CPU (Central Processing Unit)

Abstract

The utility model discloses a CPU air cooling radiator which comprises a base, a radiating pipe set, a radiating fin set and a fan. The base is used for making contact with and being fixed to the upper portion of a CPU, and a heat pipe hole is formed in the base. One end of the radiating pipe group is embedded in the heat pipe hole, is fixedly connected with the base and can be in contact with a CPU (Central Processing Unit); a slotted hole is formed in the heat dissipation fin group, and the other end of the heat dissipation pipe group is embedded into the slotted hole and fixedly connected with the heat dissipation fin group; the fan is fixedly connected to the side face of the heat dissipation fin set and used for cooling the heat dissipation fin set. According to the utility model, by arranging the radiating pipe group consisting of the uniformly arranged heat conduction pipes, the heat of the heat conduction pipes can be better transferred to the radiating fin group, so that the radiating performance of the radiator is stronger.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a CPU air-cooling radiator. Background Art

[0002] Computers are very popular office equipment in today's society. They are generally composed of a chassis and a display. There are many electronic components in the chassis. With the high speed and complexity of data processing, the requirements for CPU processors are getting higher and higher. The problem is that the heat generation increases, which will cause the CPU, graphics card or other devices to be too high. In mild cases, the CPU and graphics card will automatically reduce the frequency and reduce the performance. In severe cases, the system will freeze, restart automatically, or even burn out. Therefore, good heat dissipation of the CPU is particularly important.

[0003] Radiators are widely used in the heat dissipation of chips (CPUs) and are an indispensable part of the stable operation of chips. The heat dissipation effect and volume of the radiator determine the performance and size of the device. From the release of Intel and AMD's successive CPUs to commercial use, the thermal design power consumption of civilian CPUs has increased from 95w to 320w. It can be seen that the thermal design power consumption of CPUs is getting higher and higher. The thermal design heat dissipation power of successive air-cooled CPU radiators has increased very little. The demand for CPU heat dissipation is getting higher and higher, and more efficient CPU radiators are needed.

[0004] In the existing radiators, generally, the two ends of the heat pipes and the heat sinks are inserted in the same heat sink group, or the two ends of the heat pipes are inserted in different heat sink groups respectively; the former has a simple arrangement and cannot fully utilize the heat dissipation capacity of the heat sink; the latter occupies a large space and has a large volume requirement for the chassis. At the same time, the current arrangement method between the heat pipes and the heat sinks is only a simple interval distribution. When the heat pipes transfer heat to the heat sinks, the heat sink area in contact with the heat pipes may be in a state of waiting for heat dissipation (with a temperature state higher than the surface temperature in standby mode). This is partly due to the arrangement problem between the heat pipes and the heat dissipation holes on the heat sinks, which will affect the heat dissipation effect of the radiator. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a CPU air-cooled radiator, which greatly improves the heat dissipation effect by reasonably arranging the heat pipes and the heat sinks.

[0006] The utility model is realized by the following technical solutions:

[0007] A CPU air-cooling radiator, comprising:

[0008] A base, wherein a plurality of evenly arranged heat pipe holes are formed on the base;

[0009] A heat dissipation pipe group, one end of which is embedded in the heat pipe hole to transfer heat generated by the CPU;

[0010] A heat dissipation fin group, wherein the heat dissipation fin group is provided with a plurality of evenly arranged slots, and the other end of the heat dissipation tube group is embedded in the slots;

[0011] At least one fan is disposed on a side of the heat sink fin group and is used to cool the heat sink fin group.

[0012] Furthermore, the heat dissipation pipe group includes a plurality of heat-conducting pipes, and the heat-conducting pipes include a first portion. The first portions of the plurality of heat-conducting pipes are evenly distributed at intervals and are embedded in the plurality of heat pipe holes one by one.

[0013] Furthermore, the heat sink fin group includes a plurality of evenly arranged heat sink fins, and a through heat sink gap is formed between adjacent heat sink fins.

[0014] Furthermore, the heat dissipation fins are welded to the heat pipes.

[0015] Furthermore, the heat pipe also includes a second portion and a connecting portion, the connecting portion is fixedly connected between the first portion and the second portion, and the second portion is embedded in the slot.

[0016] Furthermore, the heat pipe has a first surface in contact with the CPU, the base has a second surface, and the first surface of the heat pipe is coplanar with the second surface of the base. In this case, the heat pipe is in direct contact with the CPU.

[0017] Furthermore, the CPU air-cooling radiator also includes a heat spreader, one end of the heat spreader is attached to the heat pipe, and the other end of the heat spreader is attached to the CPU.

[0018] Furthermore, the heat pipe is flat, so as to increase the contact area between the heat pipe and the CPU.

[0019] Furthermore, the fans are arranged on both sides of the heat dissipation fin group.

[0020] Furthermore, notches are respectively provided at both ends of the heat dissipation fins, and the notches of several heat dissipation fins together form a fixing groove. The CPU air-cooled radiator also includes a clip, one end of the clip is clipped to the fan, and the other end is clipped into the fixing groove.

[0021] Compared with the prior art, the advantages of the present invention are:

[0022] 1. By providing a heat pipe group consisting of evenly arranged heat pipes, the heat of the heat pipes can be better transferred to the heat dissipation fin group, making the heat dissipation performance of the radiator stronger.

[0023] 2. By providing a flat heat pipe, the actual contact area between the heat pipe and the CPU is increased, so that the heat of the CPU can be better transferred to the heat pipe.

[0024] 3. By setting fans with the same wind direction at both ends of the heat dissipation fin group, the heat of the heat dissipation fin group can be better dissipated. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a structural schematic diagram of a CPU air-cooling radiator embodiment 1 of the utility model;

[0026] Figure 2 It is the exploded view of Figure 1;

[0027] Figure 3 for Figure 1 Schematic diagram from another perspective;

[0028] Figure 4 This is a schematic diagram of the structure of the second embodiment of the present utility model;

[0029] Figure 5 for Figure 4 Exploded diagram of

[0030] Figure 6 This is a schematic diagram of the structure of the third embodiment of the present utility model;

[0031] Figure 7 for Figure 6 Exploded diagram of

[0032] Figure 8 This is a structural diagram of a base of another optional implementation mode of a CPU air-cooling radiator of the present utility model.

[0033] Explanation of reference numerals: 1. base; 11. fixing plate; 12. fixing seat; 10. heat pipe hole; 13. second side; 2. heat dissipation pipe group; 20. heat conducting pipe; 21. first side; 200. first part; 201. second part; 202. connecting part; 3. heat dissipation fin group; 30. heat dissipation fin; 301. heat dissipation gap; 300. slot; 302. notch; 303. fixing slot; 30a. small hole; 4. fan; 40. buckle; 5. heat dissipation top cover; 50. second slot; 101. first screw hole; 102. second screw hole; 1a. heat spreader. DETAILED DESCRIPTION

[0034] The following is a further non-restrictive detailed description of the utility model technical solution in conjunction with the preferred embodiment and its accompanying drawings. In the description of the utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings. In addition, the terms "first" and "second" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the utility model, and cannot be understood as limitations on the utility model.

[0035] like Figure 1 and Figure 2 As shown, a CPU air-cooling radiator of Example 1 of the utility model includes a base 1, a heat pipe group 2, a heat fin group 3 and at least one fan 4. The base 1 is used to contact and be fixed above the CPU. A plurality of evenly arranged heat pipe holes 10 are formed on the base 1. A plurality of evenly arranged slots 300 are provided on the heat fin group 3. One end of the heat pipe group 2 is fixedly connected to the base 1, and the other end is embedded in the slot 300. At least one fan 4 is arranged on the side of the heat fin group 3 for cooling the heat fin group 3.

[0036] Specifically, the base 1 includes a fixing seat 12 and a fixing plate 11, and the fixing plate 11 is fixedly connected to the fixing seat 12. First screw holes 101 are provided at both ends of the fixing seat 12, and the middle part of the fixing plate 11 is fixed to the fixing seat 12 by screws (not shown) passing through the first screw holes 101. Second screw holes 102 are provided at both ends of the fixing plate 11, and the fixing plate 11 can be fixed on the top of the CPU by screws passing through the second screw holes 102. A fixing plate 11 of appropriate specifications can be selected according to different installation requirements. A plurality of evenly arranged heat pipe holes 10 are formed on the fixing seat 12, and one end of the heat pipe group 2 is embedded in the heat pipe hole 10 to transfer the heat generated by the CPU.

[0037] The heat pipe group 2 includes a plurality of heat pipes 20 , each of which includes a first portion 200 . The first portions 200 of the plurality of heat pipes 20 are evenly distributed and embedded in the plurality of heat pipe holes 10 in a one-to-one correspondence.

[0038] The heat sink fin group 3 includes a plurality of evenly arranged heat sink fins 30, and small holes 30a are formed on the heat sink fins 30. The small holes 30a are coaxially arranged to form a slot 300. The heat pipe 20 also includes a second portion 201 and a connecting portion 202, the connecting portion 202 is fixedly connected between the first portion 200 and the second portion 201, and the second portion 201 is embedded in the slot 300. The heat sink fins 30 are welded to the heat pipe 20, and a through heat dissipation gap 301 is formed between adjacent heat sink fins 30.

[0039] In addition, the heat pipe 20 has a first surface 21 in contact with the CPU, and the base 1 has a second surface 13. The first surface 21 of the heat pipe 20 is coplanar with the second surface 13 of the base 1, which ensures that the heat pipe 20 can be in good contact with the CPU while improving the stability of the structure. In an operative manner, the heat pipe 20 passes through the heat pipe hole 10 and directly contacts the CPU. At this time, the heat of the CPU is directly transferred to the heat pipe 20; refer to Figure 8 In another practicable manner, the CPU air-cooled radiator further includes a vapor chamber 1a, one end of the vapor chamber 1a being attached to the heat pipe 20, and the other end being attached to the CPU. At this time, the heat of the CPU is transferred to the heat pipe 20 through the vapor chamber 1a. Compared with the former, by providing the vapor chamber 1a, the heat of the CPU can be transferred to the heat pipe 20 more efficiently.

[0040] The heat pipe 20 is flat, and its cross section is a rounded rectangular shape, so as to increase the contact area between the heat pipe 20 and the CPU.

[0041] This embodiment further includes a heat dissipation top cover 5 , on which a second groove 50 matching the heat pipe 20 is provided, and the top end of the second portion 201 of the heat pipe 20 is embedded in the corresponding second groove 50 and fixed by welding.

[0042] Fans 4 are provided on both sides of the heat dissipation fin group 3. Notches 302 are respectively provided at both ends of the heat dissipation fin 30, and the notches 302 of a plurality of heat dissipation fins 30 together form a fixing groove 303. The CPU air-cooling radiator further includes a buckle 40, one end of which is engaged with the fan 4, and the other end is engaged in the fixing groove 303. The fan 4 is fixedly connected to the side of the heat dissipation fin group 3, and is used to supply air to the heat dissipation fin group 3. The cooler air passes through the heat dissipation gap 301, so that the heat dissipation fin group 3 and the heat conducting pipe 20 are cooled. At the same time, in this embodiment, a fan 4 is fixed on both sides of the heat dissipation fin group 3, and the wind directions of the two fans 4 are the same.

[0043] like Figure 4 and Figure 5As shown, the second embodiment of the utility model comprises two groups of heat pipe groups 2, two groups of heat fin groups 3 and three fans 4 compared with the first embodiment. Two rows of evenly arranged heat pipe holes 10 are provided on the fixing seat 12, and the two groups of heat pipe groups 2 are respectively embedded in the corresponding heat pipe holes 10. Meanwhile, the three fans 4 are respectively arranged on both sides of the heat fin groups 3 and between adjacent heat fin groups 3. In addition, the wind directions of the three fans 4 are the same.

[0044] like Figure 6 and Figure 7 As shown, the third embodiment of the utility model comprises three groups of heat pipe groups 2, three groups of heat fin groups 3 and four fans 4 compared with the first embodiment. Three rows of evenly arranged heat pipe holes 10 are provided on the fixing seat 12, and the three groups of heat pipe groups 2 are respectively embedded in the corresponding heat pipe holes 10. Meanwhile, the four fans 4 are respectively arranged on both sides of the heat fin groups 3 and between adjacent heat fin groups 3. In addition, the wind directions of the four fans 4 are the same.

[0045] When in use, select a fixing plate 11 of appropriate specifications according to actual installation needs and install it on the fixing seat 12 with screws. After applying thermal grease on the CPU, make the second surface 13 of the fixing seat 12 contact the CPU, and then fix the fixing plate 11 with screws.

[0046] The above embodiments only express several implementation methods of the utility model, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A CPU air-cooling radiator, characterized in that: include: A base (1), wherein a plurality of evenly arranged heat pipe holes (10) are formed on the base (1); A heat dissipation pipe group (2), one end of the heat dissipation pipe group (2) being embedded in the heat pipe hole (10) for transferring heat generated by the CPU; A heat dissipation fin group (3), wherein the heat dissipation fin group (3) is provided with a plurality of evenly arranged slots (300), and the other end of the heat dissipation tube group (2) is embedded in the slot (300); At least one fan (4), the fan (4) being arranged on a side of the heat dissipation fin group (3) and being used to cool the heat dissipation fin group (3).

2. The CPU air-cooling radiator according to claim 1, characterized in that: The heat dissipation pipe group (2) comprises a plurality of heat conduction pipes (20), wherein the heat conduction pipes (20) comprise a first portion (200), and the first portions (200) of the plurality of heat conduction pipes (20) are evenly spaced and embedded in a plurality of heat pipe holes (10) in a one-to-one correspondence.

3. The CPU air-cooling radiator according to claim 2, characterized in that: The heat dissipation fin group (3) comprises a plurality of evenly arranged heat dissipation fins (30), and a through heat dissipation gap (301) is formed between adjacent heat dissipation fins (30).

4. The CPU air-cooling radiator according to claim 3, characterized in that: The heat dissipation fins (30) are welded to the heat conducting pipe (20).

5. The CPU air-cooling radiator according to claim 2, characterized in that: The heat conducting pipe (20) further comprises a second portion (201) and a connecting portion (202), wherein the connecting portion (202) is fixedly connected between the first portion (200) and the second portion (201), and the second portion (201) is embedded in the slot (300).

6. The CPU air-cooling radiator according to claim 2, characterized in that: The heat pipe (20) has a first surface (21) in contact with the CPU, and the base (1) has a second surface (13). The first surface (21) of the heat pipe (20) and the second surface (13) of the base (1) are coplanar. At this time, the heat pipe (20) is in direct contact with the CPU.

7. The CPU air-cooling radiator according to claim 2, characterized in that: The CPU air-cooling radiator also includes a heat spreader (1a), one end of the heat spreader (1a) is bonded to the heat pipe (20), and the other end is bonded to the CPU.

8. The CPU air-cooling radiator according to claim 2, characterized in that: The heat conducting pipe (20) is flat and is used to increase the contact area between the heat conducting pipe (20) and the CPU.

9. The CPU air-cooling radiator according to claim 3, characterized in that: The fans (4) are arranged on both sides of the heat dissipation fin group (3).

10. The CPU air-cooling radiator according to claim 3, characterized in that: Notches (302) are respectively provided at both ends of the heat dissipation fin (30), and the notches (302) of a plurality of heat dissipation fins (30) together form a fixing groove (303). The CPU air-cooling radiator also includes a buckle (40), one end of the buckle (40) is buckled with the fan (4), and the other end is buckled in the fixing groove (303).

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