Cover plate bonding jig for lead-type electronic component

Abstract

A cover plate bonding jig for a lead type electronic component comprises a bottom plate used for installing a substrate, an alignment plate supported on the bottom plate and used for placing a cover plate, a flattening plate located above the alignment plate and capable of abutting against the top face of the cover plate, a positioning mechanism arranged between the bottom plate and the alignment plate, and an adjusting and fixing mechanism arranged between the bottom plate and the flattening plate. The bottom plate is provided with a plurality of mounting grooves for mounting the base plate, the alignment plate is provided with a plurality of placing holes for placing the cover plate, the plurality of mounting grooves are in one-to-one correspondence with the plurality of placing holes, and when the cover plate is placed in the placing holes, the upper end of the cover plate is higher than the top surface of the alignment plate; the adjusting and fixing mechanism is used for adjusting the distance between the flattening plate and the bottom plate so as to fix the bonding pressure between the cover plate and the lead; the bonding jig is simple in overall structure, low in price, capable of being used for bonding of the cover plate and a silk-screen printing platform and also capable of being used for lead welding, multipurpose, high in flexibility, convenient and fast to use.

Description

Technical Field

[0001] The utility model belongs to the field of electronic component preparation, and in particular relates to a cover bonding fixture for lead-type electronic components. Background Art

[0002] Leaded RF power resistors, as the name implies, must take into account both the RF electrical performance of the product and its high power characteristics, so the bonding requirements for its cover are relatively stringent. Not only must the glue have a certain sealing property after curing to prevent the product's electrical performance from changing in a high-humidity, high-pressure, and high-temperature environment, but it must also have a certain thermal conductivity and heat dissipation effect so that the product can reach the rated power.

[0003] Leaded products are mainly composed of three parts: chip RF power resistor, lead, and ceramic cover. First, the lead needs to be welded to the chip RF power resistor substrate by hot pressing. Since the lead is exposed after welding, the product is easily affected by external forces during transportation and use, causing the lead to fall off and deform, affecting the use of the product. At this time, it is necessary to bond the cover to the lead and substrate for protection and identification. At present, the domestic market mainly relies on fully automatic dispensing and placement machines. Due to the small size and high precision of the product, the equipment is expensive, basically starting at one million. In addition, in order to meet the high-precision requirements, the dispensing machine adopts a screw valve type. The price of a set of valves is about 60,000. During use, it is easy to cause blockage and cracking and scrapping due to the small outlet pressure, and the subsequent cost burden is large. Since the lead has a certain thickness and the glue has a certain fluidity, it is easy to cause thick glue at the lead when manually bonding the cover, the substrate cover is high at one end and low at the other, and the lead position is not bonded in place; further improvement is needed. Utility Model Content

[0004] The utility model aims to overcome the shortcomings of the prior art and provide a cover bonding fixture for lead-type electronic components.

[0005] The utility model adopts the following technical solutions:

[0006] A cover bonding jig for lead-type electronic components comprises a bottom plate for mounting a substrate, an alignment plate supported on the bottom plate for placing a cover plate, a pressing plate located above the alignment plate and capable of abutting against a top surface of the cover plate, a positioning mechanism arranged between the bottom plate and the alignment plate, and an adjusting and fixing mechanism arranged between the bottom plate and the pressing plate, wherein the bottom plate is provided with a plurality of mounting grooves for mounting the substrate, the alignment plate is provided with a plurality of placement holes for placing the cover plate, the plurality of mounting grooves correspond to the plurality of placement holes one by one, and when the cover plate is placed in the placement holes, its upper end is higher than the top surface of the alignment plate; the adjusting and fixing mechanism adjusts the distance between the pressing plate and the bottom plate to fix the bonding pressure between the cover plate and the lead.

[0007] Furthermore, the adjusting and fixing mechanism includes a fixing hole arranged on the bottom plate and a screw micrometer arranged on the pressing plate and opposite to the fixing hole and capable of moving up and down.

[0008] Furthermore, a mounting block for mounting a micrometer screw is provided on the pressure plate, and the micrometer screw includes a fixed sleeve arranged on the mounting block, a micrometer screw which can be moved up and down and is arranged in the fixed sleeve and cooperates with a relative fixed hole, and a knob which can be rotatably arranged in the fixed sleeve and connected to the micrometer screw, and a movable hole for the micrometer screw to move up and down is provided on the pressure plate.

[0009] Furthermore, the adjusting and fixing mechanism also includes a spring sleeved on the outer periphery of the micrometer screw, and one end of the spring is fixedly connected to the inner wall of the movable hole.

[0010] Furthermore, the adjusting and fixing mechanism also includes a level meter arranged on the pressure plate and opposite to the micrometer screw.

[0011] Furthermore, four adjusting and fixing mechanisms are provided, and the four adjusting and fixing mechanisms are respectively provided at four corners of the pressing plate, and the four levels are respectively provided between two adjacent screw micrometers.

[0012] Furthermore, the base plate also includes one or more adsorption fixing holes arranged in the mounting groove and extending downward.

[0013] Furthermore, a lead wire is welded on the substrate, the mounting groove includes a mounting groove body for mounting the substrate and a lead groove connected to the mounting groove body for mounting the lead wire, and the adsorption fixing hole is arranged in the mounting groove body.

[0014] Furthermore, a connection hole extending upward and communicating with the adsorption fixing hole is provided on the bottom surface of the bottom plate, and the connection hole is connected to the air suction device.

[0015] Furthermore, the positioning mechanism includes a plurality of positioning posts arranged at the bottom of the alignment plate and a plurality of positioning holes arranged on the bottom plate for the plurality of positioning posts to be respectively embedded in.

[0016] It can be seen from the above description of the utility model that, compared with the prior art, the utility model has the following beneficial effects: first, the bonding fixture defined in the present application has a simple overall structure and low price, and can be used not only for bonding the cover plate, but also as a fixture for lead welding on the screen printing platform, with one plate having multiple uses, high flexibility, and convenience;

[0017] Second, the structure of the bottom plate is specifically defined, and adsorption fixing holes and connection holes are added, so that the bottom plate can also be used on the platform of the screen printing equipment. After screen printing, the product can be directly nested with the cover plate and other devices on the platform. After the nesting is completed, the next step can be carried out directly without the need to disassemble and reinstall the substrate, which greatly improves the work efficiency. The adsorption fixing holes can be used with the suction device to fix the substrate in the installation groove, which effectively improves the installation accuracy of the product and ensures the product yield.

[0018] Thirdly, the structure of the adjusting and fixing mechanism is specifically defined, and the distance between the pressing plate and the base plate is adjusted through the cooperation between the screw micrometer and the spirit level so as to keep the pressing plate in a horizontal state, so as to overcome the problem of one high and one low bonding of the cover plate caused by a certain thickness of the lead and a certain fluidity of the glue, thereby ensuring the bonding effect between the lead and the cover plate and effectively improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 The structure of the utility model is shown in FIG. Figure 1 ;

[0020] Figure 2 The structure of the utility model is shown in FIG. Figure 2 ;

[0021] In the figure, 1-base plate, 2-alignment plate, 3-pressing plate, 4-positioning mechanism, 5-adjusting and fixing mechanism, 11-mounting slot, 12-adsorption and fixing hole, 13-connecting hole, 14-mounting slot body, 15-lead slot, 21-placing hole, 31-mounting block, 41-positioning column, 42-positioning hole, 51-fixing hole, 52-micrometer, 521-fixing sleeve, 522 micrometer screw, 523-knob, 53-spring, 54-level. DETAILED DESCRIPTION

[0022] The present invention is further described below through specific implementation methods.

[0023] Reference Figure 1 to Figure 2 As shown, a cover bonding fixture for lead-type electronic components includes a base plate 1, an alignment plate 2, a pressing plate 3, a positioning mechanism 4 and an adjusting and fixing mechanism 5.

[0024] The electronic component comprises a substrate, a lead wire with one end welded to the upper end of the substrate and the other end extending outward, and a cover plate arranged on the lead wire and located at the upper end of the substrate.

[0025] The base plate 1 includes a plurality of mounting grooves 11 for mounting substrates with leads welded thereon, a plurality of adsorption and fixing holes 12 extending downwardly from the mounting grooves 11, and connection holes 13 extending upward and downwardly from the bottom surface thereof and communicating with the plurality of adsorption and fixing holes 12. The connection holes 13 can be connected to an air suction device to adsorb and fix the substrates with leads welded thereon so as to screen-print glue on the surface of the substrate. Specifically, the mounting groove 11 includes a mounting groove body 14 for mounting the substrate and an extension groove 15 connected to the mounting groove body 14 for mounting the leads. The plurality of adsorption and fixing holes 12 are arranged at the bottom of the mounting groove body 14 and extend downwardly. When welding the substrates and the leads, the plurality of substrates are first placed one by one in the corresponding mounting groove bodies 14, and then the plurality of leads are placed one by one in the corresponding lead grooves 15. Then the base plate 1 is placed under a hot pressing welding device for hot pressing welding, so that the leads are welded to the relative substrates.

[0026] The alignment plate 2 is supported on the base plate 1 and is used to place the cover plate. It is provided with a plurality of placement holes 21 for placing the cover plate. The plurality of placement holes 21 are arranged in one-to-one correspondence with the plurality of mounting slot bodies 14. When the cover plate is placed in the placement hole 21, its upper end is higher than the top surface of the alignment plate 2.

[0027] The pressing plate 3 is located above the alignment plate 2 and can be pressed against the top surfaces of multiple cover plates to apply pressure to the cover plates to ensure the bonding effect between the cover plates and the leads.

[0028] The positioning mechanism 4 is arranged between the base plate 1 and the alignment plate 2, so that the multiple placement holes 21 can be quickly correspondingly arranged with the multiple installation slot bodies 14, including multiple positioning columns 41 arranged at the bottom of the alignment plate 2 and multiple positioning holes 42 arranged on the base plate 1 for the multiple positioning columns 41 to be respectively embedded in. When working, it is only necessary to align the multiple positioning columns 41 with the multiple positioning holes 42 respectively, and then move the alignment plate 2 downward to make the multiple positioning columns 41 respectively embed into the relative positioning holes 42, so that the multiple placement holes 21 can be achieved. One-to-one correspondence with the multiple installation slot bodies 14 can be achieved, effectively improving production efficiency.

[0029] The adjusting and fixing mechanism 5 is arranged between the bottom plate 1 and the pressing plate 3, and the distance between the pressing plate 3 and the bottom plate 1 is adjusted to fix the bonding pressure between the cover plate and the lead wire, including a fixing hole 51 arranged on the bottom plate 1, a screw micrometer 52 arranged on the pressing plate 3 and relative to the fixing hole 51 and movable up and down, a spring 53 sleeved on the outer periphery of the screw micrometer 52, and a level 54 arranged on the pressing plate 3 and relative to the screw micrometer 52. Specifically, a mounting block 31 for mounting the screw micrometer 52 is arranged on the pressing plate 3, and the screw micrometer 52 includes a fixed sleeve 521 arranged on the mounting block 31, a micrometer screw 522 arranged in the fixed sleeve 521 and movable up and down and matched with the relative fixing hole 51, and a knob 523 rotatably arranged in the fixed sleeve 521 and connected to the micrometer screw 522, and the knob 523 is rotated to drive the micrometer screw 522 to move up and down, thereby accurately adjusting the screw 522. Control the distance between the pressing plate 3 and the base plate 1; accordingly, the pressing plate 3 is also provided with a moving hole for the micrometer screw 522 to move up and down; the spring 53 is sleeved on the outer periphery of the micrometer screw 522, and its upper end extends upward into the moving hole and is fixedly connected to the inner wall of the moving hole. When the cover plate and the lead are welded, the lower end of the spring 53 is against the surface of the base plate 1, and the bottom of the micrometer screw 522 is threadedly connected to the relative fixing hole 51 to fix the bonding pressure between the cover plate and the lead; further, four adjusting and fixing mechanisms 5 are provided, and the four adjusting and fixing mechanisms 5 are respectively arranged at the four corners of the pressing plate 3, and the four levels 54 are respectively arranged between two adjacent spiral micrometers 52. Through the cooperation of the four spiral micrometers 52 and the four levels 54, it is ensured that the adjusted pressing plate 3 is in a horizontal position to ensure the bonding effect between the cover plate and the lead, realize batch operation, and effectively improve production efficiency.

[0030] The method for preparing lead-type electronic components based on the above-mentioned bonding fixture specifically includes the following steps:

[0031] Step 1: first, place multiple substrates one by one in multiple installation slot bodies 14, then place multiple leads one by one in corresponding lead slots 15, and then place the bottom plate 1 in a hot pressing welding device to perform hot pressing welding of the leads;

[0032] Step 2: After welding is completed, the base plate 1 is placed on the screen printing platform, and the suction device is connected through the connection hole 13 to fix the multiple substrates. After the fixation is completed, glue is screen-printed on the surface of the substrate and the surface of the lead;

[0033] Step 3, after the glue printing is completed, the alignment plate 2 is moved to the top of the bottom plate 1 so that the plurality of positioning posts 41 are aligned with the plurality of positioning holes 42, and then the alignment plate 2 is moved downward so that the positioning posts 41 are embedded in the corresponding positioning holes 42, so that the plurality of placement holes 21 correspond to the plurality of placement slot bodies 14 one by one;

[0034] Step 4: Use a suction pen machine to suck up multiple cover plates one by one and place them in the corresponding placement holes 21 for alignment. After all the cover plates are installed, move the pressing plate 3 so that the lower end of the micro-screw 522 is placed in the relative fixing hole 51. At this time, under the action of the spring 53, the pressing plate 3 and the cover plate are in a non-contact state. Then turn the knob 523 to drive the micro-screw 522 to move downward and then drive the pressing plate 3 to move downward to press against the cover plate. At the same time, observe the level bubble of the level 54. When the level bubble of the level 54 is in the middle position, stop adjusting the pressing plate 3.

[0035] Step 5: Curing the glue according to the curing conditions. After the glue is cured, the fixture is removed to obtain the lead-type electronic component.

[0036] To sum up, the bonding jig defined in the present application has a simple overall structure and low price. It can not only be used for bonding the cover plate, but the silk screen printing platform can also be used as a jig for lead welding. It has multiple uses, high flexibility, and is convenient and fast. It effectively improves the installation accuracy of the product and the bonding effect between the cover plate and the lead, ensuring the product yield.

[0037] The above description is only a preferred embodiment of the present invention, and therefore cannot be used to limit the scope of implementation of the present invention. That is, equivalent changes and modifications made according to the scope of application of the present invention and the contents of the specification should still fall within the scope covered by the present invention.

Claims

1. A cover bonding jig for lead-type electronic components, characterized in that: It includes a bottom plate for mounting a substrate, an alignment plate supported on the bottom plate for placing a cover plate, a pressing plate located above the alignment plate and capable of pressing against the top surface of the cover plate, a positioning mechanism arranged between the bottom plate and the alignment plate, and an adjusting and fixing mechanism arranged between the bottom plate and the pressing plate. The bottom plate is provided with a plurality of mounting grooves for mounting the substrate, the alignment plate is provided with a plurality of placement holes for placing the cover plate, the plurality of mounting grooves correspond to the plurality of placement holes one by one, and when the cover plate is placed in the placement holes, its upper end is higher than the top surface of the alignment plate; the adjusting and fixing mechanism adjusts the distance between the pressing plate and the bottom plate to fix the bonding pressure between the cover plate and the lead.

2. The cover bonding jig for lead-type electronic components according to claim 1, characterized in that: The adjusting and fixing mechanism comprises a fixing hole arranged on the bottom plate and a screw micrometer arranged on the pressing plate and opposite to the fixing hole and capable of moving up and down.

3. The cover bonding jig for lead-type electronic components according to claim 2, characterized in that: The pressure plate is provided with a mounting block for mounting a micrometer screw, and the micrometer screw includes a fixed sleeve arranged on the mounting block, a micrometer screw that can be moved up and down and is arranged in the fixed sleeve and cooperates with a relative fixed hole, and a knob that can be rotatably arranged in the fixed sleeve and connected to the micrometer screw. The pressure plate is provided with a movable hole for the micrometer screw to move up and down.

4. The cover bonding jig for lead-type electronic components according to claim 3, characterized in that: The adjusting and fixing mechanism also includes a spring sleeved on the outer periphery of the micrometer screw, and one end of the spring is fixedly connected to the inner wall of the moving hole.

5. The cover bonding jig for lead-type electronic components according to claim 2, characterized in that: The adjusting and fixing mechanism also includes a level meter which is arranged on the pressing plate and is opposite to the micrometer screw.

6. The cover bonding jig for lead-type electronic components according to claim 5, characterized in that: There are four adjusting and fixing mechanisms, which are respectively arranged at four corners of the pressing plate, and four levels are respectively arranged between two adjacent screw micrometers.

7. The cover bonding jig for lead-type electronic components according to claim 1, characterized in that: The bottom plate further includes one or more adsorption fixing holes arranged in the mounting groove and extending downward.

8. The cover bonding jig for lead-type electronic components according to claim 7, characterized in that: Lead wires are welded on the substrate, the mounting groove comprises a mounting groove body for mounting the substrate and a lead wire groove connected to the mounting groove body for mounting the lead wires, and the adsorption fixing hole is arranged in the mounting groove body.

9. The cover bonding jig for lead-type electronic components according to claim 8, characterized in that: The bottom surface of the bottom plate is provided with a connecting hole extending upward and communicating with the adsorption fixing hole, and the connecting hole is connected to the air suction device.

10. The cover bonding jig for lead-type electronic components according to claim 1, characterized in that: The positioning mechanism comprises a plurality of positioning posts arranged at the bottom of the alignment plate and a plurality of positioning holes arranged on the bottom plate for the plurality of positioning posts to be respectively embedded in.

Images