Heat dissipation enhanced TVS diode
By adopting a fully enclosed substrate packaging design in TVS diodes, the conductive and thermal conductivity characteristics of copper materials are used to solve the problem of poor heat dissipation effect of TVS diodes in different installation environments, achieving performance improvement and cost reduction.
Patent Information
- Application Number
- CN202421186599.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-02-28
- Estimated Expiration
- 2034-05-28
AI Technical Summary
The high-power TVS diodes have different heat dissipation effects under different installation environments, which leads to a large margin of parameter to ensure normal use, thereby increasing costs.
It adopts a fully enclosed substrate packaging design, which utilizes the excellent electrical and thermal conductivity of copper materials to increase the heat dissipation area and shorten the heat dissipation path, thereby improving the performance of TVS diodes.
Through the fully enclosed substrate packaging design, the heat dissipation effect of TVS diodes is significantly improved, and no large parameter margin is required, which reduces costs.
Smart Images
Figure CN222546348U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of TVS diodes, in particular to a TVS diode with enhanced heat dissipation. Background Art
[0002] TVS diode is a new type of high-efficiency circuit protection component invented based on the Zener diode process. It is also called TVS tube, transient voltage suppression diode, transient voltage suppressor diode, and transient voltage suppressor. When the two ends of the TVS diode are subjected to a momentary high-energy impact, it changes the impedance value between the two ends from high impedance to low impedance at a speed of PS seconds to absorb a momentary large current and clamp the voltage between its two ends to a predetermined value, thereby protecting the subsequent precision components from the impact of transient high-voltage spike pulses. High-power TVS diodes have different effects in different installation environments due to differences in heat dissipation effects. Therefore, in order to ensure normal use, a large parameter margin is usually left, which will increase costs. Utility Model Content
[0003] 1. Technical issues to be solved
[0004] The technical problem to be solved by the utility model is that the heat dissipation effect of the current high-power TVS diode is different in different installation environments. In order to ensure that the TVS diode can be used normally in different installation environments, a large parameter margin needs to be left. Such usage will lead to increased costs.
[0005] (II) Technical solution
[0006] In order to solve the above technical problems, the technical solution provided by the utility model is: a TVS diode with enhanced heat dissipation, including a chip, solders are provided on both sides of the chip, a jumper is provided at the upper end of the solder located at the top, and a fully surrounding substrate is provided at the lower end of the solder located at the bottom, a colloid is provided on the fully surrounding substrate, a pin electrically connected to the jumper is provided in the colloid, and the pin passes through one side of the colloid.
[0007] As an improvement, the fully enclosed substrate is made of copper.
[0008] As an improvement, the fully enclosed substrate is a fully enclosed packaging design.
[0009] (III) Beneficial effects
[0010] The advantages of the present invention compared with the prior art are: the full-surround substrate packaging design is adopted, and the excellent electrical conductivity and thermal conductivity of copper can be used to greatly improve the performance of the TVS diode. The full-surround design increases the heat dissipation area and shortens the heat dissipation path. Copper has a higher heat capacity and thermal conductivity, and can take away the heat of the chip more quickly, thereby eliminating the need to leave a large parameter margin and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 The utility model is a structural schematic diagram of a TVS diode with enhanced heat dissipation.
[0012] Figure 2 This is an enlarged view of point A of a TVS diode with enhanced heat dissipation according to the utility model.
[0013] As shown in the figure: 1. Chip; 2. Solder; 3. Jumper; 4. Pin; 5. Colloid; 6. Fully surrounded substrate. DETAILED DESCRIPTION
[0014] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments; based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.
[0015] like Figure 1 and Figure 2 As shown, a TVS diode with enhanced heat dissipation includes a chip 1, solders 2 are provided on both sides of the chip 1, a jumper 3 is provided at the upper end of the solder 2 located at the top, and a fully surrounding substrate 6 is provided at the lower end of the solder 2 located at the bottom, a colloid 5 is provided on the fully surrounding substrate 6, a pin 4 electrically connected to the jumper 3 is provided in the colloid 5, the pin 4 passes through one side of the colloid 5, the fully surrounding substrate 6 is made of copper, and the fully surrounding substrate 6 is a fully surrounding package design.
[0016] During the specific implementation of the utility model, the chip can be electrically connected to the outside through jumpers and pins. The packaging design of the fully surrounded substrate can increase the heat dissipation area and shorten the heat dissipation path. The fully surrounded substrate is made of copper, which has high heat capacity and thermal conductivity and can take away the heat of the chip more quickly. The excellent electrical and thermal conductivity of copper can be used to greatly improve the performance of the TVS diode without leaving a large parameter margin, which can reduce costs.
[0017] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0018] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
[0019] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.
Claims
1. A TVS diode with enhanced heat dissipation, characterized in that: The invention comprises a chip (1), wherein solder (2) is provided on both sides of the chip (1), a jumper (3) is provided at the upper end of the solder (2) located at the upper end, and a fully surrounding substrate (6) is provided at the lower end of the solder (2) located at the lower end, a colloid (5) is provided on the fully surrounding substrate (6), a pin (4) electrically connected to the jumper (3) is provided in the colloid (5), and the pin (4) passes through one side of the colloid (5).
2. A TVS diode with enhanced heat dissipation according to claim 1, characterized in that: The fully enclosed substrate (6) is made of copper.
3. A TVS diode with enhanced heat dissipation according to claim 1, characterized in that: The fully enclosed substrate (6) is designed as a fully enclosed package.