Small-size high-power photoelectric device shell

Abstract

The utility model discloses a small-size high-power photoelectric device shell which comprises a frame, a bottom plate and a cover plate. A local hollowed-out structure is arranged in the frame, so that the cross section of the frame is L-shaped, the top of the local hollowed-out structure is lower than the top of the frame, the frame is provided with a fiber outlet pipe and low-frequency integral glass, the low-frequency integral glass is provided with a plurality of low-frequency leads, and the low-frequency leads are connected with the fiber outlet pipe. The plurality of low-frequency leads are vertically arranged in the low-frequency integral glass in a stepped manner, the bottom plate is connected with the bottom of the frame, and the cover plate is connected with the top of the frame. According to the utility model, the design requirements of small size and high power of the photoelectric device are met, the process of the lower sealing cover with the special-shaped structure can be realized, and good air tightness and reliability can be realized.

Description

Technical Field

[0001] The utility model relates to the technical field of optoelectronic device shells, in particular to a small-volume and high-power optoelectronic device shell. Background Art

[0002] With the trend of increasing module integration, the overall size of the optoelectronic device housing is getting smaller and smaller. In some scenarios with very strict space restrictions, it is necessary to find ways to improve the utilization of the inner cavity space while ensuring the operability of the cover. In conventional designs, in order to ensure that the device fits the heat sink at the bottom of the housing, the leads are arranged in the same plane, the lateral dimensions of the housing are generally wider, and the area occupied is larger; at the same time, in order to ensure the parallel sealing process, the side wall of the housing must be designed as a straight wall, and the space utilization rate is not high. If it is designed into a special-shaped structure to improve space utilization, the parallel seam welding process cannot be used, resulting in a contradictory situation. Utility Model Content

[0003] In view of this, the utility model hopes to provide a small-volume, high-power optoelectronic device housing, which improves space utilization by arranging leads in the vertical direction, and utilizes the split structure of the base plate and the frame to achieve partial expansion of the cavity space and ensure that the seal is a straight line structure, taking into account both space utilization and the feasibility of the sealing process, and solving the problems of low product integration and the inability to seal special-shaped products.

[0004] In order to achieve the above object, the technical solution of the utility model is implemented as follows:

[0005] The utility model provides a small-volume high-power optoelectronic device housing, comprising a frame, a bottom plate, and a cover plate; a local hollow structure is arranged in the frame, so that the cross section of the frame is L-shaped, the top of the local hollow structure is lower than the top of the frame, a fiber outlet tube and a low-frequency integral glass are arranged on the frame, a plurality of low-frequency leads are arranged on the low-frequency integral glass, the bottom plate is connected to the bottom of the frame, and the cover plate is connected to the top of the frame.

[0006] Furthermore, radio frequency glass and a grounding lead are also provided on the frame, and a radio frequency lead is provided on the radio frequency glass.

[0007] Furthermore, a protrusion is provided on the bottom plate, and the protrusion matches the hollowed-out contour of the bottom of the frame.

[0008] Furthermore, the bottom plate is made of copper-based alloy, and the copper-based alloy includes tungsten copper and molybdenum copper; and the frame is made of expansion alloy.

[0009] Furthermore, the frame and the fiber outlet tube are integrally formed.

[0010] Furthermore, the frame is fixedly connected to the base plate by high-temperature brazing, and the cover plate is fixedly connected to the frame by a parallel seam welding process.

[0011] The beneficial effects of the utility model are as follows:

[0012] The utility model changes the existing low-frequency lead wire for transmitting low-frequency models from a conventional horizontal arrangement structure to a stepped vertical arrangement structure, thereby achieving a significant reduction in the lateral size. The design uses low-frequency integral glass as the insulating medium, which further reduces the lead wire spacing compared to single-hole glass.

[0013] The internal circuit of the optoelectronic device housing needs to be connected to the circuit and the lead by bonding. The low-frequency leads of the utility model are designed to have different lengths and can form a stepped structure after being arranged vertically, thereby ensuring that there is space in the vertical direction for bonding operations.

[0014] The frame and the bottom plate of the utility model are designed as a split structure. The frame adopts expansion alloy and the bottom plate adopts copper-based alloy, which can meet the requirements that the frame material can be glass sintered and the high thermal conductivity material of the bottom plate can achieve heat dissipation of high-power devices.

[0015] The frame of the utility model creatively proposes a design of partial hollowing out of the inner cavity. The top of the partial hollowing structure is lower than the top of the frame. The design of partial sinking of the hollowed part is adopted. The sealing position of the frame becomes a rectangle. The opposite sides of the seal are parallel to each other, and the parallel seam welding process can be realized, which not only improves the space utilization but also is compatible with the parallel seam welding process. The split structure of the frame and the bottom plate makes it possible to reverse the direction and process the partial hollowing structure from the bottom of the frame to achieve machinability.

[0016] The utility model provides a protrusion on the bottom plate which matches the hollowed-out contour of the bottom of the frame, and is used to reduce the flow of solder when the bottom plate and the frame are brazed, thereby ensuring the flatness of the circuit installation surface.

[0017] The utility model realizes the design requirements of small volume and high power of the photoelectric device, and can achieve good airtightness and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the utility model;

[0019] Figure 2 This is a partial cross-sectional view of the low-frequency lead wire of the embodiment of the utility model;

[0020] Figure 3 This is a schematic diagram of the bottom plate structure of an embodiment of the utility model;

[0021] Figure 4 This is a schematic diagram of the cover structure of an embodiment of the utility model;

[0022] Among them: 1 is the frame, 2 is the bottom plate, 3 is the low-frequency lead, 4 is the low-frequency integral glass, 5 is the radio frequency lead, 6 is the radio frequency glass, 7 is the ground lead, 8 is the cover plate, 11 is the local hollow structure, 12 is the sealing structure, 13 is the fiber outlet tube, 14 is the tin-plated port, and 21 is the protrusion. DETAILED DESCRIPTION

[0023] In order to more thoroughly understand the features and technical contents of the present invention, the implementation of the present invention is described in detail below in conjunction with the accompanying drawings. The attached drawings are for reference only and are not intended to limit the present invention.

[0024] like Figure 1-4 As shown, the housing of a small-volume, high-power optoelectronic device in an embodiment of the utility model comprises a frame 1, a base plate 2, and a cover plate 8; a local hollow structure 11 is arranged in the frame 1, so that the cross-section of the frame 1 is L-shaped, and the top of the local hollow structure 11 is lower than the top of the frame 1, so that when the frame 1 is a special-shaped structure, the sealing structure 12 above the frame 1 is rectangular, and the opposite sides of the seal are parallel to each other, which is used for parallel sealing between the cover plate 8 and the frame 1, and a fiber outlet tube 13 and a low-frequency integral glass 4 are arranged on the frame 1, and three low-frequency leads 3 of different lengths that have been flattened are arranged on the low-frequency integral glass 4, and the three low-frequency leads 3 are arranged vertically and in a step-like manner in the low-frequency integral glass 4 to ensure that a step with a short top and a long bottom is formed when viewed from above, and a radio frequency glass 6 and a grounding lead 7 are also arranged on the frame 1, and a radio frequency lead 5 is arranged on the radio frequency glass 6.

[0025] The base plate 2 is provided with a protrusion 21, which matches the hollow contour of the bottom of the frame 1. The base plate 2 is connected to the bottom of the frame 1 by high-temperature brazing. The protrusion 21 can reduce the flow of solder during brazing of the two, thereby ensuring the flatness of the circuit mounting surface; the cover plate 8 is fixedly connected to the frame 1 by a parallel seam welding process to achieve airtightness.

[0026] The bottom plate 2 is made of tungsten copper or molybdenum copper; the frame 1 is made of expansion alloy.

[0027] The frame 1 and the fiber outlet tube 13 are integrally formed, and the fiber outlet tube 13 is provided with a tinning port 14 for injecting solder during soldering.

[0028] The utility model changes the existing low-frequency lead 3 for transmitting low-frequency models from a conventional horizontal arrangement structure to a vertical arrangement structure, thereby achieving a significant reduction in the lateral size. The design uses a low-frequency integral glass 4 as an insulating medium, which further reduces the lead spacing compared to single-hole glass. The low-frequency lead 3 is designed to have different lengths and can form a stepped structure after being vertically arranged, thereby ensuring that there is space in the vertical direction for bonding operations.

[0029] The frame 1 and the bottom plate 2 of the utility model are designed as a split structure. The frame 1 adopts an expansion alloy and the bottom plate 2 adopts a copper-based alloy, which satisfies the requirements that the material of the frame 1 can be glass sintered and the high thermal conductivity material of the bottom plate 2 can achieve the heat dissipation of high-power devices.

[0030] The frame 1 of the utility model adopts a design of partial hollowing out 11 of the inner cavity, which improves the space utilization rate. The top of the partial hollowing structure 11 is lower than the top of the frame 1. In this way, the sealing structure 12 at the sealing position of the top of the frame 1 is still rectangular even when the frame 1 is an anisotropic structure. The opposite sides of the seal are parallel to each other, and the parallel seam welding process can be realized, which not only improves the space utilization rate but also is compatible with the parallel seam welding process. In addition, the separate structure of the frame 1 and the bottom plate 2 makes it possible to reverse the direction and process the partial hollowing structure 11 from the bottom of the frame 1 to achieve machinability.

[0031] When the user uses the utility model, the conversion module, the heat dissipation module and the optical fiber are installed inside the utility model, and the utility model is tinned and covered to achieve airtightness.

[0032] Here, the specific models of the above-mentioned devices are not limited or described in detail, and the in-depth connection methods of the above-mentioned devices are not described in detail. As common knowledge, technicians in this field can understand it.

[0033] The embodiments of the utility model are only to introduce its specific implementation methods and are not intended to limit its protection scope. The technicians in this industry can make some modifications inspired by the embodiments, so any equivalent changes or modifications made in accordance with the scope of the utility model patent are within the scope of the claims of the utility model patent.

Claims

1. A small-volume, high-power optoelectronic device housing, characterized in that: It includes a frame, a bottom plate, and a cover plate; a local hollow structure is arranged in the frame, so that the cross-section of the frame is L-shaped, and the top of the local hollow structure is lower than the top of the frame; a fiber outlet tube and a low-frequency integral glass are arranged on the frame; a plurality of low-frequency leads are arranged vertically and in a step-like manner in the low-frequency integral glass; the bottom plate is connected to the bottom of the frame, and the cover plate is connected to the top of the frame.

2. A small-volume, high-power optoelectronic device housing according to claim 1, characterized in that: The frame is also provided with radio frequency glass and a grounding lead, and the radio frequency lead is provided on the radio frequency glass.

3. A small-volume, high-power optoelectronic device housing according to claim 2, characterized in that: The bottom plate is provided with a protrusion, and the protrusion matches the hollowed-out contour of the bottom of the frame.

4. A small-volume high-power optoelectronic device housing according to claim 3, characterized in that: The bottom plate is made of copper-based alloy, which includes tungsten copper and molybdenum copper; the frame is made of expansion alloy.

5. A small-volume, high-power optoelectronic device housing according to claim 4, characterized in that: The frame and the fiber outlet tube are integrally formed.

6. A small-volume high-power optoelectronic device housing according to claim 5, characterized in that: The frame is fixedly connected to the bottom plate by high-temperature brazing, and the cover plate is fixedly connected to the frame by a parallel seam welding process.

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