Cooling and lubricating device for silicon wafer cutting

Abstract

The utility model discloses a cooling and lubricating device for silicon wafer cutting, which comprises two fixing plates, a plurality of guide rollers are rotatably connected between the two fixing plates, a cutting wire is wound among the plurality of guide rollers, one side of each fixing plate is fixedly connected with a mounting plate, a liquid storage hopper is fixedly connected between the two mounting plates, and the liquid storage hopper is fixedly connected with the liquid storage hopper. A baffle is slidably connected into a discharge port of the liquid storage hopper, an adjusting screw is rotatably inserted into the top of the liquid storage hopper and is in threaded connection with the baffle, two guide rods are welded to the top of the baffle and slidably inserted into the liquid storage hopper, and an inclined plate is integrally formed at the bottom of the liquid storage hopper. Lubricating liquid is discharged from the discharging port of the liquid storage hopper and then adheres to the cutting wire under the flow guiding effect of the inclined plate, so that the cutting wire is lubricated, then the cutting wire penetrates through the wire groove, the lubricating liquid adheres to the cutting wire again, and the lubricating effect of the cutting wire is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon slice cutting, in particular to a cooling and lubricating device for silicon slice cutting. Background Art

[0002] Silicon wafers used in large quantities in the photovoltaic industry are mainly obtained by cutting silicon ingots. In the field of crystalline silicon cutting, major manufacturers all use multi-wire cutting technology. The mechanism is that the machine guide wheel drives the steel wire during high-speed operation, so that the steel wire delivers the mortar mixed with cutting fluid and silicon carbide micropowder to the cutting area. During the high-speed operation of the steel wire, the cutting process is completed through continuous friction with the workpiece pressed on the wire mesh.

[0003] At present, in the existing silicon wafer cutting process, the cutting line cannot fully contact with the cutting liquid, resulting in less cutting liquid adhering to the cutting line, thereby affecting the lubrication effect of the cutting process and affecting the quality of silicon wafer cutting. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a cooling and lubricating device for silicon wafer cutting.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A cooling and lubrication device for silicon wafer cutting comprises two fixed plates, a plurality of guide rollers are rotatably connected between the two fixed plates, cutting wires are wound between the plurality of guide rollers, a mounting plate is fixedly connected to one side of the fixed plate, a liquid storage bucket is fixedly connected between the two mounting plates, a baffle is slidably connected in the discharge port of the liquid storage bucket, an adjusting screw is rotatably plugged into the top of the liquid storage bucket, the adjusting screw is threadedly connected to the baffle, two guide rods are welded to the top of the baffle, the guide rods are slidably plugged into the liquid storage bucket, an inclined plate is integrally formed with the bottom of the liquid storage bucket, a support plate is fixedly connected between the two fixed plates, a sponge plate is bonded to the top of the support plate, a plurality of wire grooves are arranged on the top of the sponge plate, and the cutting wires pass through the wire grooves.

[0007] Furthermore, the cutting wire is diamond wire.

[0008] Furthermore, a butt joint is plugged into the top of the liquid storage hopper, and a liquid inlet pipe is plugged into the top of the butt joint.

[0009] Furthermore, the top of the support plate is provided with a plurality of through holes.

[0010] Furthermore, a waste liquid box is fixedly connected between the two fixing plates.

[0011] Furthermore, the waste liquid box is arranged below the cutting wire.

[0012] Furthermore, a liquid outlet is provided on one side of the waste liquid box.

[0013] The beneficial effects of the utility model are:

[0014] 1. The lubricating liquid is discharged from the discharge port of the liquid storage hopper, and then the lubricating liquid adheres to the cutting wire under the diversion effect of the inclined plate, thereby lubricating the cutting wire, and then the cutting wire passes through the wire groove so that the lubricating liquid adheres to the cutting wire again, thereby improving the lubrication effect of the cutting wire.

[0015] 2. By turning the adjusting screw, the guide rod slides on the liquid storage bucket, thereby driving the baffle to move up and down, and then adjusting the size of the discharge port of the liquid storage bucket to better lubricate the cutting wire.

[0016] 3. By providing a waste liquid box below the cutting wire, the generated waste liquid can be collected centrally for subsequent cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional structural schematic diagram of a cooling and lubricating device for silicon wafer cutting proposed by the utility model;

[0018] Figure 2 This is a side structural schematic diagram of a cooling and lubricating device for silicon wafer cutting proposed by the utility model;

[0019] Figure 3 The present invention is a partial three-dimensional structural schematic diagram of a cooling and lubricating device for silicon wafer cutting proposed by the present invention.

[0020] In the figure: 1. fixing plate; 2. guide roller; 3. cutting wire; 4. mounting plate; 5. liquid storage bucket; 6. baffle; 7. adjusting screw; 8. guide rod; 9. butt joint tube; 10. liquid inlet pipe; 11. inclined plate; 12. support plate; 13. sponge board; 14. perforation; 15. wire trough; 16. waste liquid box; 17. liquid outlet. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] Reference Figure 1-Figure 3A cooling and lubricating device for silicon wafer cutting comprises two fixed plates 1, a plurality of guide rollers 2 are rotatably connected between the two fixed plates 1, a cutting wire 3 is wound between the plurality of guide rollers 2, a mounting plate 4 is fixed to one side of the fixed plate 1 by bolts, a liquid storage hopper 5 is fixed between the two mounting plates 4 by bolts, a baffle 6 is slidably connected in the discharge port of the liquid storage hopper 5, an adjusting screw 7 is rotatably plugged into the top of the liquid storage hopper 5, the adjusting screw 7 is threadedly connected to the baffle 6, two guide rods 8 are welded to the top of the baffle 6, and the guide rods 8 are slidably plugged into the liquid storage hopper 5, Turning the adjusting screw 7 makes the guide rod 8 slide on the liquid storage bucket 5, thereby driving the baffle 6 to move up and down, and then adjusting the size of the discharge port of the liquid storage bucket 5. The bottom of the liquid storage bucket 5 is integrally formed with an inclined plate 11, and the flow of the lubricating liquid is guided by the inclined plate 11. A support plate 12 is fixed between the two fixed plates 1 by bolts, and a sponge plate 13 is bonded to the top of the support plate 12. A plurality of wire grooves 15 are provided on the top of the sponge plate 13. The cutting wire 3 passes through the wire grooves 15 to make the lubricating liquid adhere to the cutting wire 3 again, and the cutting wire 3 passes through the wire grooves 15.

[0023] The cutting wire 3 is a diamond wire, a docking tube 9 is inserted at the top of the liquid storage bucket 5, a liquid inlet pipe 10 is inserted at the top of the docking tube 9, the lubricating liquid is input into the liquid storage bucket 5 through the docking tube 9 and the liquid inlet pipe 10, a plurality of through holes 14 are provided at the top of the support plate 12, a waste liquid box 16 is fixed between the two fixed plates 1 by bolts, the generated waste liquid falls into the waste liquid box 16 for centralized collection, the waste liquid box 16 is arranged below the cutting wire 3, a liquid outlet 17 is provided on one side of the waste liquid box 16, so as to facilitate the discharge of the waste liquid.

[0024] Working principle: When in use, first, turn the adjusting screw 7 to make the guide rod 8 slide on the liquid storage bucket 5, thereby driving the baffle 6 to move up and down, and then adjust the size of the discharge port of the liquid storage bucket 5, and then, input the lubricating liquid into the liquid storage bucket 5 through the docking tube 9 and the liquid inlet pipe 10, and then, the lubricating liquid is discharged from the discharge port of the liquid storage bucket 5, and then, under the guiding effect of the inclined plate 11, the lubricating liquid adheres to the cutting wire 3, thereby lubricating the cutting wire 3, at the same time, the sponge board 13 is soaked with the lubricating liquid, and then the cutting wire 3 passes through the wire groove 15 to make the lubricating liquid adhere to the cutting wire 3 again, and the waste liquid generated falls into the waste liquid box 16 for centralized collection.

[0025] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A cooling and lubricating device for silicon wafer cutting, comprising two fixing plates (1), characterized in that: A plurality of guide rollers (2) are rotatably connected between the two fixed plates (1), and a cutting wire (3) is wound between the plurality of guide rollers (2). A mounting plate (4) is fixedly connected to one side of the fixed plate (1), and a liquid storage bucket (5) is fixedly connected between the two mounting plates (4). A baffle (6) is slidably connected in the discharge port of the liquid storage bucket (5). An adjusting screw (7) is rotatably plugged into the top of the liquid storage bucket (5), and the adjusting screw (7) is threadedly connected to the baffle (6). Two guide rods (8) are welded to the top of the baffle (6), and the guide rods (8) are slidably plugged into the liquid storage bucket (5). An inclined plate (11) is integrally formed at the bottom of the liquid storage bucket (5). A support plate (12) is fixedly connected between the two fixed plates (1), and a sponge plate (13) is bonded to the top of the support plate (12). A plurality of wire grooves (15) are provided on the top of the sponge plate (13), and the cutting wire (3) passes through the wire grooves (15).

2. A cooling and lubricating device for silicon wafer cutting according to claim 1, characterized in that: The cutting wire (3) is a diamond wire.

3. The cooling and lubricating device for silicon wafer cutting according to claim 1, characterized in that: The top of the liquid storage hopper (5) is plugged with a butt joint pipe (9), and the top end of the butt joint pipe (9) is plugged with a liquid inlet pipe (10).

4. The cooling and lubricating device for silicon wafer cutting according to claim 1, characterized in that: The top of the support plate (12) is provided with a plurality of through holes (14).

5. The cooling and lubricating device for silicon wafer cutting according to claim 1, characterized in that: A waste liquid box (16) is fixedly connected between the two fixing plates (1).

6. A cooling and lubricating device for silicon wafer cutting according to claim 5, characterized in that: The waste liquid box (16) is arranged below the cutting wire (3).

7. A cooling and lubricating device for silicon wafer cutting according to claim 6, characterized in that: A liquid outlet (17) is provided on one side of the waste liquid box (16).

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