Laminated wafer capacitor lead frame transfer device
By designing a leadframe transfer device for stacked capacitor preparation, the problem of traditional equipment relying on low manual delivery efficiency and leadframe stacking is solved, and efficient automated delivery of leadframes and single-layer guarantees are achieved, improving construction efficiency and accuracy.
Patent Information
- Application Number
- CN202421096411.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-05-20
AI Technical Summary
During the preparation of stacked capacitors, traditional equipment relies on manual delivery of lead frames, which are inefficient and can easily lead to lead frame stacking, affecting the normal operation of the equipment.
A laminated wafer capacitor lead frame transfer device is designed, including a feeding table, a feeding mechanism, a first detection part and a transfer mechanism. The feeding mechanism automatically transports the lead frame to the feeding table. The first detection part detects the number of lead frames. If it is one, the transfer mechanism will work and transfer the lead frame to the downstream. If the number is greater than one, the transfer mechanism will not work to avoid stacking.
It realizes efficient and automated delivery of lead frames, ensuring that the lead frames are always single-layer, avoid stacking problems, and improves the construction efficiency and accuracy of stacked wafer capacitors.
Smart Images

Figure CN222555958U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of stacked capacitor preparation equipment, and in particular to a stacked chip capacitor lead frame transfer device. Background Art
[0002] The stacked capacitor is made of stacked wafers, and multiple sets of stacked wafers are welded on a lead frame, which is used as a capacitor electrode.
[0003] When preparing stacked capacitors, it is necessary to first supply the lead frame to the welding station, and then weld the chips layer by layer on the lead frame at the welding station. In traditional equipment, workers are usually required to deliver the lead frames one by one to ensure that the lead frames enter the welding station in a preset posture. This loading method relies on manual labor, is time-consuming, labor-intensive and inefficient. At the same time, because the lead frame is a thin sheet structure, when traditional equipment is working, multiple layers of lead frames often overlap and cannot be used. Summary of the invention
[0004] The purpose of the present application is to overcome the deficiencies in the prior art and to provide a stacked chip capacitor lead frame transfer device.
[0005] To achieve the above technical objectives, the present application provides a stacked chip capacitor lead frame transfer device, including: a feeding table, used to receive the lead frame to be transferred; a loading mechanism, used to deliver the lead frame to the feeding table; a first detection piece, used to detect the number of lead frames on the feeding table; a transfer mechanism, used to send the lead frame on the feeding table downstream; when working, the loading mechanism moves the lead frame to the feeding table, and the first detection piece confirms the number of lead frames on the feeding table; if the number of lead frames on the feeding table is one, the transfer mechanism works and transfers the lead frame downstream; if the number of lead frames on the feeding table is greater than one, the transfer mechanism does not work.
[0006] Furthermore, a linearly extending limiting groove is provided on the feeding platform, and the limiting groove is used to accommodate the lead frame and can limit the position and transfer direction of the lead frame.
[0007] Furthermore, the top opening of the limiting groove is arranged in a trumpet shape, and the top opening of the limiting groove gradually shrinks from the outside to the inside.
[0008] Furthermore, a straight-line-extending through-hole is provided on the feeding table, and the through-hole passes through the feeding table in the thickness direction; the transfer mechanism includes: a pushing block, which is passed through the through-hole and is used to contact the lead frame on the feeding table; and a transfer drive component, which is used to drive the pushing block to move along the through-hole so that the pushing block can push the lead frame to move downstream.
[0009] Furthermore, the stacked chip capacitor lead frame transfer device also includes a second detection component, which is arranged at the discharge end of the feeding platform and is used to confirm whether the lead frame leaves the feeding platform.
[0010] Furthermore, the loading mechanism includes: a suction cup for sucking the lead frame; a loading drive assembly for driving the suction cup to move back and forth between the picking station and the feeding table; when working, the loading drive assembly drives the suction cup to the picking station to obtain the lead frame, and after the suction cup sucks the lead frame, the loading drive assembly drives the suction cup to the feeding table, and the suction cup can place the lead frame on the feeding table.
[0011] Furthermore, the feeding mechanism also includes a mounting plate, which is arranged at the movable end of the feeding drive assembly, and the suction cup is arranged on the mounting plate; three suction cups are arranged on the mounting plate, and the three suction cups are arranged at intervals along the length direction of the lead frame and staggered along the width direction of the lead frame.
[0012] Furthermore, the first detection member adopts a distance sensor; after the loading mechanism carries the lead frame to the feeding table, the first detection member presses the lead frame, and the thickness of the lead frame is obtained by detecting the distance between the detection end of the first detection member and the table surface of the feeding table.
[0013] Furthermore, the stacked chip capacitor lead frame transfer device also includes an elastic member, which is connected to the first detection member, and the first detection member can elastically contact the lead frame through the elastic member.
[0014] Furthermore, the feeding mechanism includes a suction cup and a feeding drive assembly, and the first detection member is arranged on the feeding drive assembly; a buffer is also arranged on the feeding drive assembly, and the buffer contacts the feeding table before the first detection member contacts the lead frame.
[0015] The present application provides a stacked chip capacitor lead frame transfer device, including a feeding table, a loading mechanism, a first detection component and a transfer mechanism, wherein the loading mechanism is used to deliver lead frames to the feeding table, and the first detection component is used to detect the number of lead frames on the feeding table. If the number of lead frames on the feeding table is one, the transfer mechanism works and transfers the lead frames downstream; by setting up the loading mechanism, the lead frames can be quickly transferred from the material picking station to the feeding table, and in conjunction with the first detection component, the problem of lead frame stacking can be avoided, and the transfer mechanism will work only after confirming that only one lead frame is loaded on the feeding table; therefore, the stacked chip capacitor lead frame transfer device provided by the present application can not only efficiently deliver lead frames to downstream equipment, but also ensure that the lead frames delivered to the downstream equipment are always single-layered and will not have stacking problems, which is conducive to the downstream equipment to accurately and quickly build stacked chip capacitors. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 A schematic structural diagram of a stacked chip capacitor lead frame transfer device provided in the present application;
[0017] Figure 2 for Figure 1 A schematic diagram of the structure of a feeding table of a medium-layer wafer capacitor lead frame transfer device;
[0018] Figure 3 A schematic diagram of the structure of a feeding platform and a transfer mechanism provided in this application;
[0019] Figure 4 A schematic diagram of the structure of a feeding mechanism, a first detection member and a buffer provided in the present application;
[0020] Figure 5 for Figure 4 Schematic diagram of the structure of the feeding mechanism, the first detection member and the buffer in another direction. DETAILED DESCRIPTION
[0021] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0022] The present application provides a stacked chip capacitor lead frame transfer device, comprising: a feeding table 10, used to receive the lead frame 1 to be transferred; a loading mechanism 20, used to deliver the lead frame 1 to the feeding table 10; a first detection member 31, used to detect the number of lead frames 1 on the feeding table 10; a transfer mechanism, used to send the lead frame 1 on the feeding table 10 downstream; when working, the loading mechanism 20 moves the lead frame 1 to the feeding table 10, and the first detection member 31 confirms the number of lead frames 1 on the feeding table 10; if the number of lead frames 1 on the feeding table 10 is one, the transfer mechanism works and transfers the lead frame 1 downstream; if the number of lead frames 1 on the feeding table 10 is greater than one, the transfer mechanism does not work.
[0023] The feeding platform 10 may be any structure that is convenient for receiving the lead frame 1 .
[0024] The loading mechanism 20 can be a structure that facilitates automatic conveying of the lead frame 1 by a manipulator, a conveyor belt, an overhead crane, etc. The loading mechanism 20 is connected in series with the material taking station and the feeding table 10. The lead frame 1 to be transferred is placed at the material taking station. The loading mechanism 20 can obtain the lead frame 1 at the material taking station and can feed the lead frame 1 to the feeding table 10.
[0025] The first detection member 31 can be a detection mechanism that is convenient for detecting whether the lead frames 1 are stacked, such as a distance sensor, a weight sensor, a reflective photoelectric sensor, a CCD camera, etc. After the feed table 10 receives the lead frame 1, the detection end of the first detection member 31 faces the lead frame 1. The first detection member 31 can confirm whether there is more than one lead frame 1 on the feed table 10 by detecting the thickness, weight, etc. of the lead frame 1. If the number of lead frames 1 on the feed table 10 is greater than one, it is said that the lead frames 1 are stacked together. At this time, the lead frame 1 cannot be delivered to the downstream; after confirming that the number of lead frames 1 on the feed table 10 is one, the transfer mechanism can work.
[0026] The transfer mechanism can adopt a structure such as a conveyor belt, a pull claw, a push block, etc. to facilitate the transfer of the lead frame 1 to the downstream. After the first detection member 31 confirms that the number of lead frames 1 on the feeding table 10 is one, the transfer mechanism works to send the lead frame 1 to the downstream equipment. After the lead frame 1 enters the downstream equipment, it can be welded with the wafer.
[0027] The stacked chip capacitor lead frame transfer device provided in the present application can quickly transfer the lead frame 1 from the material picking station to the feeding table 10 by setting up a loading mechanism 20. In conjunction with the first detection component 31, the problem of lead frame 1 stacking can be avoided. The transfer mechanism will not work until it is confirmed that only one lead frame 1 is loaded on the feeding table 10. Therefore, the stacked chip capacitor lead frame transfer device provided in the present application can not only efficiently deliver the lead frame 1 to the downstream equipment, but also ensure that the lead frame 1 sent to the downstream equipment is always single-layer and there will be no stacking problem, which is conducive to the downstream equipment to accurately and quickly build a stacked chip capacitor.
[0028] Optionally, the stacked chip capacitor lead frame transfer device provided in the present application also includes a warning mechanism. When the first detection member 31 detects that the number of lead frames 1 on the feeding table 10 is greater than one, the warning mechanism can remind workers or related equipment to record or process.
[0029] Among them, the warning agency can use equipment such as sirens, display screens, and prompt lights to conveniently send out warning signals.
[0030] In one embodiment, when the first detection member 31 detects that the feeding table 10 carries more than one lead frame 1, the warning mechanism sends a reminder signal, and the worker goes to the feeding table 10 to confirm the number of lead frames 1 and then takes away the excess lead frames 1 to ensure that only one lead frame 1 is left on the feeding table 10. Then, the transfer mechanism works and delivers the lead frame 1. After the lead frame 1 is sent away, the feeding table 10 is empty, and the loading mechanism 20 can input a new lead frame 1 into the feeding table 10.
[0031] In another embodiment, when the first detection member 31 detects that the feed table 10 carries more than one lead frame 1, the warning mechanism sends a warning signal, and the loading mechanism 20 takes away the lead frame 1 on the feed table 10 until only one lead frame 1 is left on the feed table 10, and then the transfer mechanism works to convey the lead frame 1 downstream. Alternatively, the loading mechanism 20 takes away all the lead frames 1 on the feed table 10, and after the feed table 10 is empty, the loading mechanism 20 re-obtains the lead frame 1 at the material taking station until the first detection member 31 confirms that the number of lead frames 1 on the feed table 10 is one, and then the transfer mechanism works to deliver the lead frame 1.
[0032] In another embodiment, the stacked chip capacitor lead frame transfer device provided by the present application further includes an auxiliary film taking mechanism, which can use a structure such as a manipulator, a suction cup, etc. to conveniently take away the lead frame 1. When the first detection member 31 detects that the number of lead frames 1 on the feeding table 10 is greater than one, the auxiliary film taking mechanism works and takes away the lead frame 1 on the feeding table 10. The auxiliary film taking mechanism can take away the lead frame 1 layer by layer until only one lead frame 1 is left on the feeding table 10; the auxiliary film taking mechanism can also take away all the lead frames 1 on the feeding table 10; after confirming that the number of lead frames 1 on the feeding table 10 is one, the transfer mechanism works and delivers the lead frame 1.
[0033] Optionally, a linearly extending limiting groove is provided on the feeding platform 10 , and the limiting groove is used to accommodate the lead frame 1 and can limit the position and transfer direction of the lead frame 1 .
[0034] For example, Figures 1 to 3 In the illustrated embodiment, the lead frame 1 is a roughly rectangular sheet structure, and a linearly extending limiting groove is provided on the feeding table 10, and the groove width of the limiting groove is adapted to the width of the lead frame 1; after the lead frame 1 is placed in the limiting groove, it can only be laid flat in the limiting groove along a linear direction, and the limiting groove can limit the position of the lead frame 1, ensuring that the lead frame 1 is both within the detection range of the first detection member 31 and within the transfer range of the transfer mechanism, and the limiting groove can also limit the extension direction and the flattening state of the lead frame 1, ensuring that the lead frame 1 can move downstream in a uniform posture, which is convenient for downstream equipment to receive and process. When the transfer mechanism delivers the lead frame 1, the lead frame 1 can only move in a straight line along the limiting groove, and the limiting groove also plays a guiding role, so that the lead frame 1 can move downstream in a uniform posture and along a uniform path.
[0035] Optionally, the feeding table 10 is an integrated structure, and a recessed limiting groove is provided on the table surface of the feeding table 10.
[0036] Optionally, the feeding platform 10 includes: a receiving portion 11 for receiving the lead frame 1; a first limiting portion 12 and a second limiting portion 13, and the receiving portion 11 is arranged between the first limiting portion 12 and the second limiting portion 13; the thickness of the receiving portion 11 is smaller than the thickness of the first limiting portion 12 and the second limiting portion 13, and a limiting groove is formed between the first limiting portion 12 and the second limiting portion 13.
[0037] For example, Figures 1 to 3 In the illustrated embodiment, the feeding platform 10 includes a receiving portion 11, a first limiting portion 12 and a second limiting portion 13 which are spaced apart. Since the thickness of the receiving portion 11 is smaller than the thickness of the first limiting portion 12 and the second limiting portion 13, after the lead frame 1 is placed on the receiving portion 11, both sides of the lead frame 1 in the width direction will be restricted by the first limiting portion 12 and the second limiting portion 13.
[0038] Optionally, the distance between the first limiting portion 12 and the second limiting portion 13 is adjustable.
[0039] By making at least one of the first limiting portion 12 and the second limiting portion 13 away from the material receiving portion 11, the spacing between the first limiting portion 12 and the second limiting portion 13 increases, and the width of the limiting groove increases, the feeding platform 10 can receive a large-sized lead frame 1. Similarly, by making at least one of the first limiting portion 12 and the second limiting portion 13 close to the material receiving portion 11, the spacing between the first limiting portion 12 and the second limiting portion 13 decreases, and the width of the limiting groove decreases, the feeding platform 10 can receive a small-sized lead frame 1.
[0040] The spacing between the first limit portion 12 and the second limit portion 13 can be manually changed by a micrometer, a screw, an assembly method of a waist-shaped hole and a screw hole, or can be automatically changed by a driving mechanism such as a cylinder or an electric cylinder.
[0041] Optionally, the top opening of the limiting groove is configured to be trumpet-shaped, and the top opening of the limiting groove gradually shrinks from the outside to the inside.
[0042] For details, please refer to Figure 2 and Figure 3 In the illustrated embodiment, the feeding platform 10 includes a material receiving portion 11, a first limiting portion 12 and a second limiting portion 13 arranged at intervals. The upper surface of the first limiting portion 12 facing the second limiting portion 13 is set as an inclined surface inclined from bottom to top and away from the second limiting portion 13, and the upper surface of the second limiting portion 13 facing the first limiting portion 12 is set as an inclined surface inclined from bottom to top and away from the first limiting portion 12. The two inclined surfaces are inclined toward each other from top to bottom, so that the top opening of the limiting groove gradually shrinks.
[0043] The top of the opening has a large diameter, so that the feeding platform 10 can receive the lead frame 1. After the lead frame 1 enters the opening, the tapered opening can guide the lead frame 1 to fall into the bottom of the groove.
[0044] Optionally, a straight-line-extending through-hole is provided on the feeding table 10, and the through-hole passes through the feeding table 10 in the thickness direction; the transfer mechanism includes: a pushing block 41, which is passed through the through-hole and is used to contact the lead frame 1 on the feeding table 10; and a transfer drive 42, which is used to drive the pushing block 41 to move along the through-hole, so that the pushing block 41 pushes the lead frame 1 to move downstream.
[0045] The pusher block 41 may be any structure such as a plate, a rod, or a block that can contact the lead frame 1. The transfer drive member 42 may be any drive structure such as a cylinder or an electric cylinder that can drive the pusher block 41 to move linearly.
[0046] For details, please refer to Figure 3 In the illustrated embodiment, the feeding platform 10 includes a receiving portion 11, a first limiting portion 12, and a second limiting portion 13, which are arranged at intervals. The interval between the receiving portion 11 and the first limiting portion 12 forms a through hole, and the interval between the receiving portion 11 and the second limiting portion 13 forms another through hole. The pusher block 41 is used to contact the end of the lead frame 1 and is provided with two push pieces, the first push piece is located in the through hole between the receiving portion 11 and the first limiting portion 12, and the second push piece is located in the through hole between the receiving portion 11 and the second limiting portion 13; the transfer drive 42 adopts a cylinder, the cylinder body of the cylinder is arranged on one side of the feeding platform 10, the pusher block 41 is arranged on the piston rod of the transfer drive 42, and the push piece is inserted into the through hole from bottom to top. When the receiving portion 11 receives the lead frame 1, the pushing block 41 is away from the discharge end of the feeding table 10 and is located outside the end of the lead frame 1; after the first detection component 31 confirms that the number of lead frames 1 on the feeding table 10 is one, the transfer drive component 42 drives the pushing block 41 to move linearly toward the discharge end of the feeding table 10, and the pushing block 41 can push the lead frame 1 so that the lead frame 1 moves downstream along the limiting groove.
[0047] Optionally, the stacked chip capacitor lead frame transfer device provided in the present application further includes a second detection member 32 , which is disposed at the discharge end of the feeding table 10 and is used to confirm whether the lead frame 1 leaves the feeding table 10 .
[0048] The second detection member 32 may be a photoelectric sensor, and the detection end of the second detection member 32 is facing the discharge end of the feeder 10; when the lead frame 1 passes through the discharge end of the feeder 10, the light signal emitted by the second detection member 32 will be blocked, and when the lead frame 1 completely leaves the discharge end of the feeder 10, the light signal emitted by the second detection member 32 will no longer be blocked. When the signal is blocked, it is confirmed that the lead frame 1 is passing; when the signal is no longer blocked, it is confirmed that the lead frame 1 has completely left the feeder 10; according to the blocking time of the signal and the moving speed of the lead frame 1, the length of the lead frame 1 can be known, and it can be further confirmed whether the currently transported lead frame 1 is normal.
[0049] In other embodiments, the second detection member 32 may also be a detection structure such as a weight sensor, an acoustic wave sensor, or a CCD camera.
[0050] After confirming that the lead frame 1 has left the feeding table 10 normally, the feeding table 10 is empty, and the loading mechanism 20 can input a new lead frame 1 into the feeding table 10 .
[0051] In one embodiment, the loading mechanism 20 includes: a suction cup 21 for sucking the lead frame 1; a loading drive assembly for driving the suction cup 21 to move back and forth between the picking station and the feeding table 10; when working, the loading drive assembly drives the suction cup 21 to the picking station to obtain the lead frame 1, and after the suction cup 21 sucks the lead frame 1, the loading drive assembly drives the suction cup 21 to the feeding table 10, and the suction cup 21 can place the lead frame 1 on the feeding table 10.
[0052] The feeding drive assembly can realize the transfer of the lead frame 1 by the suction cup 21 by means of translation and lifting, or can realize the transfer of the lead frame 1 by the suction cup 21 by means of reciprocating swing.
[0053] Figure 1 In the illustrated embodiment, the loading drive assembly includes: a translation drive 23, which is used to drive the suction cup 21 to move horizontally; and a lifting drive 24, which is used to drive the suction cup 21 to move vertically. When obtaining the lead frame 1, the translation drive 23 drives the suction cup 21 to move to the top of the material taking station, and the lifting drive 24 drives the suction cup 21 to descend to suck the lead frame 1; after obtaining the lead frame 1, the lifting drive 24 drives the suction cup 21 to carry the lead frame 1 upward to avoid the position, and the translation drive 23 drives the suction cup 21 to move to the top of the feeding table 10, and the lifting drive 24 drives the suction cup 21 to descend and put the lead frame 1 on the feeding table 10.
[0054] Optionally, the feeding mechanism 20 also includes a mounting plate 22, which is arranged at the movable end of the feeding drive assembly, and the suction cup 21 is arranged on the mounting plate 22; three suction cups 21 are arranged on the mounting plate 22, and the three suction cups 21 are arranged at intervals along the length direction of the lead frame 1 and are arranged staggered along the width direction of the lead frame 1.
[0055] For details, please refer to Figure 1 In the illustrated embodiment, the fixed end of the translation driving member 23 is arranged on the mounting support, so that the translation driving member 23 is arranged above the feeding platform 10; the lifting driving member 24 is arranged at the movable end of the translation driving member 23 and is suspended above the feeding platform 10; the mounting plate 22 is arranged at the movable end of the lifting driving member 24 and is suspended above the feeding platform 10; the suction cup 21 is arranged on the mounting plate 22.
[0056] Combined with reference Figure 4 and Figure 5, there are three suction cups 21 on the mounting plate 22, and the three suction cups 21 are arranged at intervals along the length direction of the mounting plate 22. Along the width direction of the mounting plate 22, two suction cups 21 are on the same straight line and close to one side of the mounting plate 22, and another suction cup 21 is close to the other side of the mounting plate 22 and staggered with them. When the three suction cups 21 cooperate to absorb the long strip lead frame 1, the first suction cup 21 is close to one end of the lead frame 1, the third suction cup 21 is close to the other end of the lead frame 1, and the second suction cup 21 is combined to absorb the middle part of the lead frame 1. The three suction cups 21 can not only stably absorb the lead frame 1, but also prevent the two ends of the lead frame 1 from drooping, which is conducive to ensuring the posture balance of the lead frame 1 during transportation; at the same time, along the width direction of the lead frame, two suction cups 21 are close to one side of the lead frame, and one suction cup 21 is close to the other side of the lead frame 1. When the width of the lead frame 1 is large, the three suction cups 21 can further ensure the stability of the lead frame 1 during transfer.
[0057] In one embodiment, the first detection member 31 adopts a distance sensor; after the loading mechanism 20 moves the lead frame 1 to the feeding table 10, the first detection member 31 presses against the lead frame 1, and the thickness of the lead frame 1 is obtained by detecting the distance between the detection end of the first detection member 31 and the table surface of the feeding table 10.
[0058] Among them, the distance sensor can be an optical distance sensor, an infrared distance sensor, an ultrasonic distance sensor, etc.
[0059] Optionally, the first detection member 31 is disposed on one side of the feeding table 10. After the feeding table 10 is loaded with the lead frame 1, the first detection member 31 presses against the lead frame 1 from top to bottom. At this time, the vertical distance between the first detection member 31 and the surface of the feeding table 10 is the thickness of the lead frame 1 on the feeding table 10. Assuming that the thickness of a normal single lead frame 1 is 1 mm, it can be set that when the vertical distance detected by the first detection member 31 is greater than 1.5 mm, it is determined that the number of lead frames 1 on the feeding table 10 is greater than one.
[0060] Optionally, the feeding mechanism 20 includes a suction cup 21, a mounting plate 22 and a feeding drive assembly, and the first detection member 31 is disposed on the mounting plate 22, and the end of the first detection member 31 used to contact the lead frame 1 is slightly higher than the end of the suction cup 21 used to contact the lead frame 1. At this time, after the suction cup 21 lowers the lead frame 1 onto the feeding table 10, the feeding drive assembly drives the mounting plate 22 to continue to descend, and the first detection member 31 can resist the lead frame 1, so that the lead frame 1 is pressed between the first detection member 31 and the feeding table 10, and then the vertical distance between the first detection member 31 and the surface of the feeding table 10 is measured.
[0061] It should be added that, since the suction cup 21 itself has an air expansion property, when the mounting plate 22 continues to descend, as long as the limit distance of the suction cup 21 structure is not exceeded, the suction cup 21 can be actively compressed and deformed without being damaged. If necessary, the suction cup 21 can also be elastically set on the mounting plate 22 by an elastic structure such as a spring or a spring.
[0062] In another embodiment, the first detection member 31 is a motion sensor. The first detection member 31 is arranged directly above the feeding table 10. In the initial state, the distance between the first detection member 31 and the feeding table 10 is H. After the feeding table 10 is loaded with the lead frame 1, the first detection member 31 moves from top to bottom and against the lead frame 1. The movement distance of the first detection member 31 is H1. Assuming that the thickness of the single lead frame 1 is h, when H-H1>h, the number of lead frames 1 on the feeding table 10 is greater than one.
[0063] Optionally, the stacked chip capacitor lead frame transfer device provided in the present application further includes an elastic member, which is connected to the first detection member 31 , and the first detection member 31 can elastically contact the lead frame 1 through the elastic member.
[0064] It is easy to understand that the first detection member 31 should press against the lead frame 1. If the two are in rigid contact, it is easy to damage each other's structure. Therefore, providing an elastic member so that the first detection member 31 elastically contacts the lead frame 1 is beneficial to protecting the first detection member 31 and the lead frame 1.
[0065] The elastic member may be an elastic structure such as a spring or a spring sheet, or may be made of elastic materials such as rubber or plastic. The first detection member 31 is connected to the elastic member. When the first detection member 31 presses against the lead frame 1, the elastic member is deformed.
[0066] In a specific embodiment, referring to Figure 4The feeding mechanism 20 includes a suction cup 21, a mounting plate 22 and a feeding drive assembly; the feeding drive assembly includes a lifting drive member 24, a vertical slide rail 25 and a slide 26, the vertical slide rail 25 is fixedly arranged on the mounting support, extends in the vertical direction, and is suspended above the feeding platform 10, the slide 26 is slidably arranged on the vertical slide rail 25, and the movable end of the lifting drive member 24 is connected to the slide 26 through a hinge bearing 27; the mounting plate 22 is arranged on the slide 26, and the suction cup 21 is arranged on the mounting plate 22; the slide 26 is also provided with a mounting seat 28, and the first detection member 31 is penetrated in the mounting seat 28; a vertically penetrating mounting hole is provided on the mounting seat 28, the outer diameter of the head of the first detection member 31 is larger than the inner diameter of the mounting hole, and the first detection member 31 The outer diameter of the rod is smaller than the inner diameter of the mounting hole; the rod of the first detection member 31 can pass through the mounting hole and the mounting plate 22 to press the lead frame 1; the head of the first detection member 31 is above the mounting hole, and an elastic member is provided between the head of the first detection member 31 and the mounting seat 28; after the first detection member 31 contacts the lead frame 1, when the lifting drive member 24 continues to drive the slide 26 to descend, the first detection member 31 moves upward relative to the mounting seat 28 and the elastic member is stretched, so that the first detection member 31 can be prevented from continuing to squeeze the lead frame 1 downward, and the elastic force of the elastic member can enable the first detection member 31 to press the lead frame 1 against the feeding table 10, so that it is conducive to ensuring that the first detection member 31 accurately measures the thickness of the lead frame 1.
[0067] Optionally, the feeding mechanism 20 includes a suction cup 21 and a feeding drive assembly, and the first detection member 31 is arranged on the feeding drive assembly; the feeding drive assembly is also provided with a buffer 2, and before the first detection member 31 contacts the lead frame 1, the buffer 2 contacts the feeding table 10 first.
[0068] The buffer 2 can be a hydraulic buffer, a pneumatic buffer, a spring buffer, etc. The buffer 2 is made to contact the feeding table 10 first, which can remind the control system and the feeding drive assembly that the first detection member 31 is about to press the lead frame 1 on the feeding table 10, and can also slow down the descending speed of the first detection member 31 toward the lead frame 1 and the feeding table 10, thereby preventing the first detection member 31 from moving too fast and damaging the lead frame 1.
[0069] Figure 1 , Figure 4 and Figure 5In the illustrated embodiment, the feeding platform 10 includes a receiving portion 11, a first limiting portion 12, and a second limiting portion 13 that are spaced apart. The thickness of the receiving portion 11 is less than that of the first limiting portion 12 and the second limiting portion 13. A limiting groove is formed between the first limiting portion 12 and the second limiting portion 13. The feeding mechanism 20 includes a suction cup 21, a mounting plate 22, and a feeding drive assembly. The first detection member 31 and the buffer 2 are disposed on the mounting plate 22. The suction cup 21 can place the lead frame 1 into the receiving portion 11. The first detection member 31 is disposed on one side of the suction cup 21 and is used to press the lead frame 1 against the receiving portion 11. The buffer 2 is disposed on one side of the first detection member 31 and is used to press the first limiting portion 12. After the lead frame 1 is placed in the receiving portion 11, the lifting drive member 24 drives the slide 26 to continue to descend, the suction cup 1 is compressed, and the first detection member 31 and the buffer 2 approach the feeding table 10; as the slide 26 continues to descend, the buffer 2 first abuts against the first limiting portion 12 with a higher position, thereby slowing down the descending speed and impact force of the first detection member 31, and then the first detection member 31 contacts the lead frame 1, the elastic member is deformed, and the first detection member 31 presses the lead frame 1 against the receiving portion 11.
[0070] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. A stacked chip capacitor lead frame transfer device, characterized in that: include: A feeding table (10) for receiving and transferring the lead frame (1); A feeding mechanism (20) for delivering a lead frame (1) to the feeding platform (10); A first detection member (31) for detecting the number of lead frames (1) on the feeding platform (10); A conveying mechanism, used for conveying the lead frame (1) on the feeding platform (10) downstream; When in operation, the loading mechanism (20) carries the lead frame (1) to the feeding platform (10), and the first detection component (31) confirms the number of lead frames (1) on the feeding platform (10); If the number of lead frames (1) on the feeding table (10) is one, the transfer mechanism operates to transfer the lead frame (1) downstream; If the number of lead frames (1) on the feeding platform (10) is greater than one, the transfer mechanism does not work.
2. The stacked chip capacitor lead frame transfer device according to claim 1, wherein: The feeding platform (10) is provided with a linearly extending limiting groove, the limiting groove being used to accommodate the lead frame (1) and capable of limiting the position and transfer direction of the lead frame (1).
3. The stacked chip capacitor lead frame transfer device according to claim 2, wherein: The top opening of the limiting groove is arranged in a trumpet shape, and the top opening of the limiting groove gradually shrinks from the outside to the inside.
4. The stacked chip capacitor lead frame transfer device according to claim 1, wherein: The feeding platform (10) is provided with a through hole extending in a straight line, and the through hole penetrates the feeding platform (10) in the thickness direction; The transfer mechanism comprises: A pusher block (41) is inserted into the through hole and is used to contact the lead frame (1) on the feeding platform (10); The transfer drive member (42) is used to drive the push block (41) to move along the perforation, so that the push block (41) pushes the lead frame (1) to move downstream.
5. The stacked chip capacitor lead frame transfer device according to claim 1, wherein: It also comprises a second detection member (32), which is arranged at the discharge end of the feeding platform (10) and is used to confirm whether the lead frame (1) leaves the feeding platform (10).
6. The stacked chip capacitor lead frame transfer device according to claim 1, wherein: The feeding mechanism (20) comprises: A suction cup (21) for sucking the lead frame (1); A feeding drive assembly, used for driving the suction cup (21) to move back and forth between the material taking station and the feeding platform (10); When in operation, the loading drive component drives the suction cup (21) to move to the material taking station to obtain the lead frame (1); after the suction cup (21) absorbs the lead frame (1), the loading drive component drives the suction cup (21) to move to the feeding table (10); the suction cup (21) can place the lead frame (1) on the feeding table (10).
7. The stacked chip capacitor lead frame transfer device according to claim 6, wherein: The feeding mechanism (20) further comprises a mounting plate (22), wherein the mounting plate (22) is arranged at the movable end of the feeding drive assembly, and the suction cup (21) is arranged on the mounting plate (22); The mounting plate (22) is provided with three suction cups (21), and the three suction cups (21) are arranged at intervals along the length direction of the lead frame (1) and are arranged staggered along the width direction of the lead frame (1).
8. The stacked chip capacitor lead frame transfer device according to claim 1, wherein: The first detection element (31) is a distance sensor; After the loading mechanism (20) carries the lead frame (1) onto the feeding table (10), the first detection member (31) presses against the lead frame (1) and detects the distance between the detection end of the first detection member (31) and the table surface of the feeding table (10) to obtain the thickness of the lead frame (1).
9. The stacked chip capacitor lead frame transfer device according to claim 8, characterized in that: It also comprises an elastic member, the elastic member being connected to the first detection member (31), and the first detection member (31) being able to elastically contact the lead frame (1) through the elastic member.
10. The stacked chip capacitor lead frame transfer device according to claim 8, wherein: The feeding mechanism (20) comprises a suction cup (21) and a feeding drive assembly, and the first detection member (31) is arranged on the feeding drive assembly; A buffer (2) is also provided on the feeding drive assembly, and before the first detection member (31) contacts the lead frame (1), the buffer (2) first contacts the feeding platform (10).