Constant liquid level detinning device for waste circuit board
By designing a waste circuit board constant liquid level detinning device including working tin pot, small tin pot and pumping components, the problems of complex structure and time-consuming maintenance of transportation components in the prior art are solved, and the effect of simplifying the structure and reducing costs is achieved.
Patent Information
- Application Number
- CN202420543667.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-20
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-03-20
AI Technical Summary
In the prior art, the transportation components of waste circuit boards have complex structures, and subsequent maintenance is time-consuming and laborious.
A constant liquid level detinning device for waste circuit boards is designed, including a working tin pot, a small tin pot and a pumping component. The recycling of tin liquid is achieved through the overflow nozzle and the return tin pipe, ensuring the balance of the liquid level in the working tin pot, and forming a surge flow through the shunt valve block and the overflow valve block, simplifying the movement process of the waste circuit board.
There is no need to add complex transportation components, which simplifies the device structure, saves costs, and saves maintenance costs for transportation components.
Smart Images
Figure CN222557012U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of recycling and detinning, in particular to a constant liquid level detinning device for waste circuit boards. Background Art
[0002] At present, for the recycling of tin from waste circuit boards, the traditional manual detinning method has been gradually eliminated due to the defects of high labor intensity, low efficiency, and high working environment temperature. In the prior art, tin recycling is mostly achieved through automatic heating detinning equipment. For example, the patent technology with the publication number "CN217775122U" discloses a constant liquid level tin tank heating conveyor, which melts the solder by heating the motherboard to a set temperature, making it convenient for subsequent equipment to carry out detinning and component removal. However, in the prior art, the transportation of waste circuit boards needs to be achieved through a complex transportation component, which is costly and time-consuming and labor-intensive to repair and maintain. Utility Model Content
[0003] The utility model aims to provide a constant liquid level detinning device for waste circuit boards, so as to solve the defects of the prior art that the transportation components of waste circuit boards are complex in structure and the subsequent repair and maintenance are time-consuming and labor-intensive.
[0004] The embodiments of the present invention are implemented by the following technical solutions:
[0005] A constant liquid level detinning device for waste circuit boards comprises a working tin pot, a small tin pot and a pumping assembly, wherein a first heating element is arranged in the working tin pot, a second heating element is arranged in the small tin pot, the working tin pot is provided with an overflow nozzle for introducing overflow tin liquid into the small tin pot, a tin return pipe is connected between the small tin pot and the working tin pot, the pumping assembly is configured to return the tin liquid in the small tin pot to the working tin pot through the tin return pipe, a diverter valve block connected to the tin return pipe is arranged at one end of the working tin pot, and an overflow valve block connected to the overflow nozzle is arranged at the other end, a plurality of overflow holes are arranged on the overflow valve block along the width direction of the working tin pot, and a plurality of diverter holes are arranged on the diverter valve block along the width direction of the working tin pot, and the diverter holes face the overflow valve block.
[0006] Optionally, a flow regulating valve is provided between the diverter valve block and the tin return pipeline.
[0007] Optionally, the outer wall of the tin return pipe is wrapped with a thermal insulation belt.
[0008] Optionally, a heat insulation layer is provided on the outside of the thermal insulation belt.
[0009] Optionally, the pumping assembly includes a high-temperature tin pump, a machine base and a driving element. The machine base is fixedly connected to the small tin pot. The high-temperature tin pump and the driving element are transmission-connected and both are installed on the machine base. The pump head of the high-temperature tin pump extends into the tin liquid in the small tin pot and is connected to the tin return pipe.
[0010] Optionally, the driving element is a servo motor.
[0011] Optionally, the detinning device also includes a controller, a first sensor for detecting the temperature of the tin liquid inside the working tin pot, a second sensor for detecting the temperature of the tin liquid inside the small tin pot, and a third sensor for detecting the temperature of the tin liquid inside the tin return pipe. The first sensor, the second sensor, the third sensor, the first heating element, the second heating element and the driving element are all electrically connected to the controller.
[0012] The technical solution of the present utility model has at least the following advantages and beneficial effects: in the present utility model, excess tin liquid in the working tin pot flows into the small tin pot from the overflow nozzle, and the pumping component can make the tin liquid in the small tin pot return to the working tin pot through the tin return pipe, effectively ensuring the balance of the liquid level in the working tin pot, so that the soldering surface of the waste circuit board can always be in contact with the high-temperature tin liquid. At the same time, on this basis, a diverter valve block is arranged at one end of the working tin pot, and an overflow valve block is arranged at the other end. After the tin liquid in the small tin pot is pressurized by the pumping component, it is sprayed out from the several diverter holes of the diverter valve block and gradually flows to the overflow valve block to form a surge, so that the waste circuit board entering the working tin pot is moved. Compared with the prior art, there is no need to add a complex transportation component, which simplifies the structure, saves costs, and also saves the cost of repairing and maintaining the transportation component. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0014] Figure 1 A structural schematic diagram of a constant liquid level detinning device for waste circuit boards provided by the utility model;
[0015] Figure 2 It is an enlarged structural schematic diagram of the diverter valve block;
[0016] Figure 3 It is an enlarged structural schematic diagram of the overflow valve block;
[0017] Figure 4 It is a cross-sectional view of the tin return pipeline;
[0018] Icons: 1-working tin pot, 2-small tin pot, 3-overflow nozzle, 4-tin return pipe, 5-diverter valve block, 501-diverter hole, 6-overflow valve block, 601-overflow hole, 602-tin discharge hole, 7-flow regulating valve, 8-insulation belt, 9-insulation layer, 10-high temperature tin pump, 11-machine base, 12-driving element, 13-controller. DETAILED DESCRIPTION
[0019] refer to Figure 1 A constant liquid level detinning device for waste circuit boards comprises a working tin pot 1, a small tin pot 2 and a pumping assembly. The working tin pot 1 is provided with a first heating element, and the small tin pot 2 is provided with a second heating element. It is easy to understand that the first heating element and the second heating element are used for heating, and their specific forms are not limited, such as an electric heating plate, a plurality of electric heating rods, etc.
[0020] The working tin pot 1 is provided with an overflow nozzle 3 for introducing overflow tin liquid into the small tin pot 2. A tin return pipe 4 is connected between the small tin pot 2 and the working tin pot 1. The pumping component is configured to return the tin liquid in the small tin pot 2 to the working tin pot 1 through the tin return pipe 4. When in use, the waste circuit board 14 enters the working tin pot 1, and the solder surface of the waste circuit board 14 contacts the tin liquid in the working tin pot 1. The movement of the waste circuit board 14 will cause the volume of the tin liquid in the working tin pot 1 to change, and the excess tin liquid enters the small tin pot 2 from the overflow nozzle 3. At the same time, the set pumping component can make the tin liquid in the small tin pot 2 return to the working tin pot 1 through the tin return pipe 4, effectively ensuring the balance of the liquid level in the working tin pot 1, so that the solder surface of the waste circuit board 14 can always be in contact with the high-temperature tin liquid.
[0021] One end of the working tin pot 1 having the overflow nozzle 3 is provided with an overflow valve block 6 connected to the overflow nozzle 3. Figure 3 The overflow valve block 6 is provided with a plurality of overflow holes 601 along the width direction of the working tin pot 1. Furthermore, the overflow valve block 6 is provided with a tin discharge hole 602, which connects the overflow hole 601 with the overflow nozzle 3, so that the tin liquid overflowing from the overflow hole 601 enters the overflow nozzle 3 through the tin discharge hole 602.
[0022] The working tin pot 1 is provided with a diverter valve block 5 connected to the tin return pipe 4 at one end opposite to the overflow valve block 6. Figure 2The diverter valve block 5 is connected with a connecting pipe, and the connecting pipe is connected to the tin return pipe 4 through a flange. Furthermore, a flow regulating valve 7 is provided between the diverter valve block 5 and the tin return pipe 4 to facilitate the flow adjustment. The diverter valve block 5 is provided with a plurality of diverter holes 501 along the width direction of the working tin pot 1, and the diverter holes 501 face the overflow valve block 6. It is worth noting that, with such a configuration, the tin liquid in the small tin pot 2 is pressurized by the pumping assembly, and then sprayed out from the plurality of diverter holes 501 of the diverter valve block 5, and gradually flows to the overflow valve block 6, forming a surge flow, so that the waste circuit board 14 entering the working tin pot 1 moves. Compared with the prior art, there is no need to add a complex transportation component, which simplifies the structure, saves costs, and also saves the repair and maintenance costs of the transportation component.
[0023] The pumping assembly of this embodiment includes a high-temperature tin pump 10, a machine base 11 and a driving element 12. The machine base 11 is fixedly connected to the small tin pot 2 (for example, welding, screw connection, etc.). The high-temperature tin pump 10 and the driving element 12 are transmission-connected and are both installed on the machine base 11. Specifically, in this example, the driving element 12 selects a servo motor. The driving element 12 and the high-temperature tin pump 10 are connected by a belt to achieve transmission. The pump head of the high-temperature tin pump 10 extends into the tin liquid in the small tin pot 2 and is connected to the tin return pipe 4.
[0024] In this embodiment, reference Figure 4 The outer wall of the tin return pipe 4 is wrapped with an insulation belt 8. Specifically, the insulation belt 8 is spirally wound on the outer wall of the tin return pipe 4 to keep the tin return pipe 4 warm and reduce heat loss. Furthermore, an insulation layer 9 is provided on the outer side of the insulation belt 8, and the insulation layer 9 wraps the insulation belt 8 inside to further reduce heat loss.
[0025] On the basis of the above, the detinning device of the utility model also includes a controller 13, a first sensor, a second sensor and a third sensor. The first sensor is installed on the working tin pot 1 to detect the temperature of the tin liquid inside the working tin pot 1, the second sensor is installed on the small tin pot 2 to detect the temperature of the tin liquid inside the small tin pot 2, and the third sensor is installed on the tin return pipe 4 to detect the temperature of the tin liquid inside the tin return pipe 4. On this basis, the first sensor, the second sensor, the third sensor, the first heating element, the second heating element and the driving element 12 are all electrically connected to the controller 13, so as to realize automatic control of heating and automatic tin return.
[0026] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A device for removing tin from waste circuit boards at a constant liquid level, comprising a working tin pot (1), a small tin pot (2) and a pumping assembly, wherein a first heating element is arranged in the working tin pot (1), a second heating element is arranged in the small tin pot (2), the working tin pot (1) is provided with an overflow nozzle (3) for introducing overflow tin liquid into the small tin pot (2), a tin return pipe (4) is connected between the small tin pot (2) and the working tin pot (1), and the pumping assembly is configured to return the tin liquid in the small tin pot (2) to the working tin pot (1) through the tin return pipe (4), characterized in that: A diverter valve block (5) connected to a tin return pipe (4) is provided at one end of the working tin pot (1), and an overflow valve block (6) connected to an overflow nozzle (3) is provided at the other end. The overflow valve block (6) is provided with a plurality of overflow holes (601) along the width direction of the working tin pot (1). The diverter valve block (5) is provided with a plurality of diverter holes (501) along the width direction of the working tin pot (1), and the diverter holes (501) face the overflow valve block (6).
2. The waste circuit board constant liquid level detinning device according to claim 1, characterized in that: A flow regulating valve (7) is provided between the diverter valve block (5) and the tin return pipeline (4).
3. The waste circuit board constant liquid level detinning device according to claim 1, characterized in that: The outer wall of the tin return pipe (4) is wrapped with a heat preservation belt (8).
4. The waste circuit board constant liquid level detinning device according to claim 3, characterized in that: A heat insulation layer (9) is provided on the outer side of the heat preservation belt (8).
5. The waste circuit board constant liquid level detinning device according to any one of claims 1 to 4, characterized in that: The pumping assembly comprises a high-temperature tin pump (10), a machine base (11) and a driving element (12); the machine base (11) is fixedly connected to the small tin pot (2); the high-temperature tin pump (10) and the driving element (12) are transmission-connected and both are mounted on the machine base (11); the pump head of the high-temperature tin pump (10) extends into the tin liquid in the small tin pot (2) and is connected to the tin return pipe (4).
6. The waste circuit board constant liquid level detinning device according to claim 5, characterized in that: The driving element (12) is a servo motor.
7. The constant liquid level detinning device for waste circuit boards according to claim 5, characterized in that: The detinning device also includes a controller (13), a first sensor for detecting the temperature of the tin liquid inside the working tin pot (1), a second sensor for detecting the temperature of the tin liquid inside the small tin pot (2), and a third sensor for detecting the temperature of the tin liquid inside the tin return pipe (4). The first sensor, the second sensor, the third sensor, the first heating element, the second heating element, and the driving element (12) are all electrically connected to the controller (13).