Soldering flux depth detector

Abstract

The utility model discloses a soldering flux depth detector, and relates to the technical field of detection elements, the soldering flux depth detector is used for detecting the depth of soldering flux contained in a groove, and comprises a micro-control unit, and a plurality of detection pieces and a plurality of display assemblies which are respectively connected with the micro-control unit, the multiple display assemblies are in one-to-one corresponding signal connection with the multiple detection pieces, the detection ends of the multiple detection pieces stretch into the groove, the distances between the multiple detection ends and the micro-control unit are different, the first detection end, which is the largest distance from the control unit, makes contact with the bottom of the groove and is located above the liquid level of the scaling powder, and the second detection end is located above the liquid level of the scaling powder. The second detection end with the minimum distance from the liquid level of the soldering flux detects a depth signal, and the display assembly corresponding to the second detection end displays the depth of the soldering flux according to the depth signal. According to the flux depth detector provided by the invention, the depth of the flux can be conveniently and quickly detected, and the accuracy of a measurement result is improved.

Description

Technical Field

[0001] The present application relates to the technical field of detection elements, and in particular to a flux depth detector. Background Art

[0002] Flux is a substance with chemical and physical activation properties and is an indispensable auxiliary material in the welding process. Common fluxes include: lead-free flux, no-clean flux formula, wave soldering flux, electronic circuit board flux, etc. During the welding process, the flux can remove the oxides on the surface of the metal to be welded or other surface films that have been formed, as well as the oxides formed on the surface of the solder itself, so as to achieve the purpose of tinning and soldering the surface to be welded. The flux can also protect the metal surface so that it will no longer be oxidized in the high temperature environment of welding. In addition, the flux can also reduce the surface tension of the molten tin and promote the dispersion and flow of the solder.

[0003] How to meet the welding needs while using the least amount of flux and thinning electronic products, so that measuring the height of the flux is very important for controlling the quality of electronic products, that is, during welding, the depth of the flux needs to meet certain conditions. In the prior art, the equipment for detecting the depth of the flux uses milling machinery to mill different depth grooves in the measuring area, sets a zero point position on one side, and the depth groove height increases from left to right, and each depth groove is marked with a scale line. When measuring the depth of the flux, hold the handle, contact the measuring area with the flux, use the capillary action of the flux, check the glue creeping on the depth groove, find the flux depth on the corresponding scale line, and complete the measurement. The measured value is the scale line value. The measurement structure of the prior art is complex and the measurement results are inaccurate. Utility Model Content

[0004] The purpose of the present application is to provide a flux depth detector that can conveniently and quickly detect the depth of the flux and improve the accuracy of the measurement results.

[0005] On the one hand, an embodiment of the present application provides a flux depth detector for detecting the depth of the flux contained in a groove, including a microcontroller unit and a plurality of detection parts and a plurality of display components respectively connected to the microcontroller unit, the plurality of display components being signal-connected one-to-one with the plurality of detection parts, the detection ends of the plurality of detection parts extending into the groove, and the plurality of detection ends being at different distances from the microcontroller unit, wherein the first detection end having the largest distance from the control unit contacts the bottom of the groove and is located above the flux liquid level, and the second detection end having the smallest distance from the flux liquid level detects a depth signal, and the display component corresponding to the second detection end displays the depth of the flux according to the depth signal.

[0006] As an implementable manner, the detection end is a metal plate, the second detection end corresponds to the second metal plate, and the microcontroller unit controls the depth of the displayed flux of the display component corresponding to the second detection end according to the capacitance between the second metal plate and the flux liquid level.

[0007] As an implementable manner, a plurality of detection ends are arranged in sequence, and along the arrangement direction, the distance between the detection ends and the micro control unit gradually increases or decreases.

[0008] As an implementable manner, the display component includes an LED lamp.

[0009] As an implementable manner, the detection end is a metal plate, the first detection end corresponds to the first metal plate, the second detection end corresponds to the second metal plate, and the LED lights corresponding to the metal plate between the first metal plate and the second metal plate are all lit.

[0010] As an implementable manner, the detection end is a metal plate, the first detection end corresponds to the first metal plate, the second detection end corresponds to the second metal plate, and the LED lights corresponding to the metal plate between the first metal plate and the second metal plate are all lit.

[0011] As an implementable manner, a plurality of detection elements are connected to the micro control unit via a connector, and a side of the connector close to the detection end and a surface of the detection end are coated with a protective layer.

[0012] As an implementable manner, the micro control unit includes a judgment module, and the judgment module judges whether the depth of the soldering flux detected by the detection member is within a preset depth value range.

[0013] As an implementable manner, the soldering flux depth detector further includes an alarm device connected to the judgment module, which alarms when the depth of the soldering flux exceeds a preset depth value.

[0014] As an implementable approach, the number of detection terminals is between 6 and 10.

[0015] As an implementable manner, the size occupied by the multiple detection ends in the direction away from or close to the micro control unit is between 20-100 μm.

[0016] The beneficial effects of the embodiments of the present application include:

[0017] The flux depth detector provided in the present application is used to detect the depth of the flux contained in the groove, including a microcontroller unit and a plurality of detection parts and a plurality of display components respectively connected to the microcontroller unit, the plurality of display components are signal-connected to the plurality of detection parts in a one-to-one correspondence, the detection ends of the plurality of detection parts extend into the groove, and the plurality of detection ends are at different distances from the microcontroller unit, wherein the first detection end having the largest distance from the control unit contacts the bottom of the groove and is located above the flux liquid level, and the second detection end having the smallest distance from the flux liquid level detects a depth signal, and the display component corresponding to the second detection end displays the depth of the flux according to the depth signal. The distance between the second detection end and the first detection end is a fixed value. When the first detection end contacts the bottom of the groove, the second detection end is located above the liquid surface and is the detection end with the smallest distance from the flux liquid surface. At this time, the depth of the flux is close to the distance between the first detection end and the second detection end. At this time, the display component corresponding to the second detection end displays according to the depth signal. When the display component corresponding to the second detection end displays, at this time, the depth of the flux is close to the distance between the first detection end and the second detection end. Since the distance between the first detection end and the second detection end is a fixed value, the flux depth can be obtained according to the display of the display component to complete the measurement of the flux depth. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram of the structure of a flux depth detector provided in an embodiment of the present application.

[0020] Icons: 100 - flux depth detector; 110 - micro control unit; 120 - display component; 130 - detection piece; 131 - first detection end; 132 - second detection end; 140 - battery; 200 - slot; 210 - flux. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0023] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0024] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0025] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0026] The flux 210 is used to improve the welding surface quality and welding stability during welding. During the welding process, too much or too little flux 210 will affect the welding quality. In order to control the amount of flux 210, after the flux 210 is placed in the groove 200, the depth of the flux 210 is measured.

[0027] The embodiment of the present application provides a soldering flux depth detector 100 for detecting the depth of the soldering flux 210 contained in the groove 200. Figure 1 As shown, it includes a microcontroller unit 110 and a plurality of detection components 130 and a plurality of display components 120 respectively connected to the microcontroller unit 110. The plurality of display components 120 are signal-connected to the plurality of detection components 130 in a one-to-one correspondence. The detection ends of the plurality of detection components 130 extend into the groove 200, and the distances between the plurality of detection ends and the microcontroller unit 110 are all different. Among them, the first detection end 131 which is the longest distance from the control unit contacts the bottom of the groove 200 and is located above the liquid level of the flux 210. The second detection end 132 which is the shortest distance from the liquid level of the flux 210 detects a depth signal. The display component 120 corresponding to the second detection end 132 displays the depth of the flux 210 according to the depth signal.

[0028] The soldering flux depth detector 100 provided in the embodiment of the present application is used to detect the depth of the soldering flux 210 contained in the groove 200. Specifically, Figure 1 As shown, the soldering flux 210 is placed in the groove 200. The soldering flux 210 has a certain fluidity, fills the bottom of the groove 200 and has a certain depth. The flux depth detector 100 is used to detect the depth of the flux 210 filled in the bottom of the groove 200. Specifically, the flux depth detector 100 of the embodiment of the present application includes a microcontroller unit 110, and a plurality of detection components 130 and a display component 120 respectively connected to the microcontroller unit 110. The plurality of detection components 130 are at different distances from the microcontroller unit 110. During detection, a plurality of detection ends extend into the groove 200. Among them, according to the depth of the flux 210 in the groove 200, some of the detection ends of the plurality of detection components 130 extend below the liquid surface of the flux 210, and some are located above the liquid surface. Among them, the detection end with the largest distance from the microcontroller unit 110 is a first detection end 131. The first detection end 131 contacts the bottom of the groove 200 and is located above the liquid surface of the flux 210. The detection end with the smallest distance from the liquid surface of the flux 210 is a second detection end 131. 2, wherein the distance between the second detection end 132 and the first detection end 131 is a fixed value, when the first detection end 131 contacts the bottom of the groove 200, the second detection end 132 is located above the liquid surface, and is the detection end with the smallest distance from the liquid surface of the flux 210, at this time, the depth of the flux 210 is close to the distance between the first detection end 131 and the second detection end 132, at this time, the display component 120 corresponding to the second detection end 132 displays according to the depth signal, when the display component 120 corresponding to the second detection end 132 displays, at this time, the depth of the flux 210 is close to the distance between the first detection end 131 and the second detection end 132, because the distance between the first detection end 131 and the second detection end 132 is a fixed value, in this way, the depth of the flux 210 can be obtained according to the display of the display component 120, and the measurement of the depth of the flux 210 is completed.

[0029] In actual applications, the depth of the flux 210 can meet the needs within a certain range, that is, in actual applications, assuming that the preset range of the flux 210 is between the first preset depth and the second preset depth, wherein the first preset depth is the distance between the first detection end 131 and the second detection end 132, and the second preset depth is the distance between the first detection end 131 and the third detection end, and the distance between the second detection end 132 and the third detection end and the microcontroller unit is adjacent, that is, along the vertical direction, the distance between the second detection end 132 and the third detection end is closest. In this way, when the display component 120 corresponding to the second detection end 132 is displayed and the display component 120 corresponding to the third detection end is not displayed, the depth of the flux 210 meets the needs.

[0030] In addition, in actual applications, in order to facilitate the insertion of multiple detection members 130 into the groove 200, multiple detection members 130 are usually arranged on the same side of the microcontroller unit 110, and multiple display components 120 are arranged on the other side of the microcontroller unit 110. In this way, it is convenient for multiple detection members to insert into the groove 200, and it is also convenient for the display of the display component 120 to be observed.

[0031] It is understandable that the micro control unit 110 and the display component 120 both require electricity when displaying, so the solder flux depth detector 100 further includes a battery 140 .

[0032] The flux depth detector 100 provided in the present application is based on the distance between the second detection end 132 and the first detection end 131 being a fixed value. When the first detection end 131 contacts the bottom of the groove 200, the second detection end 132 is located above the liquid surface and is the detection end with the smallest distance from the liquid surface of the flux 210. The depth of the flux 210 is close to the distance between the first detection end 131 and the second detection end 132. When the display component 120 corresponding to the second detection end 132 is based on the depth signal, at this time, the depth of the flux 210 is close to the distance between the first detection end 131 and the second detection end 132. Since the distance between the first detection end 131 and the second detection end 132 is a fixed value, the depth of the flux 210 can be obtained according to the display of the display component 120, and the measurement of the depth of the flux 210 is completed.

[0033] Optional, such as Figure 1 As shown, the detection end is a metal plate, the second detection end 132 corresponds to the second metal plate, and the microcontroller unit controls the depth of the display flux 210 of the display component 120 corresponding to the second detection end 132 according to the capacitance between the second metal plate and the liquid surface of the flux 210.

[0034] When the detection end is a metal plate and the detection end is located above the liquid surface, the metal plate and the flux 210 are both metals, and the metal plate and the liquid surface of the flux 210 are equivalent to two relatively arranged flat plates. Therefore, a capacitor is formed between the metal plate and the liquid surface of the flux 210. Since the distance between each metal plate and the liquid surface is different, the capacitance between each metal plate and the liquid surface is different. In this way, the metal plate with the smallest distance from the liquid surface can be determined according to the numerical value of the capacitance as the second metal plate. After the second metal plate is determined, the display component 120 corresponding to the second metal plate is controlled to display.

[0035] In addition, those skilled in the art may also select a specific structure of the detection element 130 according to actual conditions. For example, the detection element 130 may also be a distance detector or the like.

[0036] Using a metal plate as the detection end to form a side plate of the capacitor can simplify the structure of the detection element 130 and facilitate manufacturing. When the metal plate is used as the detection end, the metal plate needs to be connected to the micro control unit 110 by a connector, so that the distance between each metal plate and the micro control unit 110 can be adjusted by adjusting the length of the connector.

[0037] The detection end extending into the soldering flux 210 is in contact with the soldering flux 210 , and there is no capacitance signal.

[0038] It is understandable that when the thickness of the metal plate is small, the thickness of the metal plate can be ignored, and when the thickness of the metal plate is large, the lower end surface of the metal plate can be used to calculate the distance between the micro control unit 110 and the bottom of the groove 200 .

[0039] In one possible implementation of the embodiment of the present application, Figure 1 As shown, a plurality of detection ends are arranged in sequence, and along the arrangement direction, the distance between the detection ends and the micro control unit 110 gradually increases or decreases.

[0040] The multiple detection ends are arranged in sequence, and along the arrangement direction, the distance between the detection end and the micro control unit 110 gradually increases or decreases, so that the display components 120 are arranged in sequence, and the depth of the soldering flux 210 represented by the display components 120 gradually increases or decreases. In this way, when the display components 120 display, it is easier for the operator to judge which display component 120 is displayed, so that it is easier to obtain the depth of the soldering flux 210.

[0041] Optionally, the display assembly 120 includes an LED light.

[0042] The display component 120 includes an LED light. When the display component 120 needs to display, the LED light is on, and the operator obtains the depth of the flux 210 according to the depth represented by the detection part 130 corresponding to the LED light. When the LED light is on, it is easy to observe, so that the display effect of the display component 120 is good.

[0043] In order to further improve the convenience of obtaining the depth of the soldering flux 210 , a depth mark may be posted at the LED light, and the depth mark indicates the depth of the soldering flux 210 corresponding to the detection element 130 corresponding to the LED light.

[0044] In one achievable method of the embodiment of the present application, the detection end is a metal plate, the first detection end 131 corresponds to the first metal plate, the second detection end 132 corresponds to the second metal plate, and the LED lights corresponding to the metal plate between the first metal plate and the second metal plate are all lit.

[0045] In order to enable the operator to intuitively perceive the depth of the soldering flux 210 , the LED lights corresponding to the metal plates between the first metal plate and the second metal plate are all lit up, so that the operator can determine the depth of the soldering flux 210 according to the number of lit LED lights.

[0046] Optionally, the plurality of detection elements 130 are connected to the micro control unit via a connector, and a side of the connector close to the detection end and a surface of the detection end are coated with a protective layer.

[0047] According to the foregoing, among the multiple detection ends of the multiple detection parts 130, some extend into the interior of the flux 210, and some are located above the liquid level of the flux 210. For the detection end extending into the interior of the flux 210, the connector extends into the flux 210. In order to prevent the flux 210 from adhering to the connector and the detection end and affecting the secondary application of the flux depth detector 100, the embodiment of the present application coats a protective layer on the side of the connector close to the detection end and on the surface of the detection end. The protective layer is made of non-conductive material. The protective layer isolates the connector and the flux 210 as well as the detection end and the flux 210, thereby preventing the adhered flux 210 from affecting the secondary application of the flux depth detector.

[0048] The material of the specific protective layer is not limited in the embodiments of the present application, and those skilled in the art can make specific settings according to actual conditions, which may be an oxide layer, a nitride layer, etc.

[0049] In addition, the specific method of the connecting piece is not limited in the embodiment of the present application, and those skilled in the art can make specific settings according to actual conditions. When the metal plate is heavy and can sink below the liquid level of the flux 210 by its own gravity, the connecting piece can be set to a soft connection; when the metal plate is light and is not enough to sink below the surface of the flux 210 by its own gravity, the connecting piece can be set to a hard connection, as long as the distance between the metal plate and the microcontroller unit 110 can be fixed.

[0050] It can be understood that the metal plate is used to form a capacitor with the liquid surface of the soldering flux 210. In order to transmit the capacitance signal to the micro control unit, the connector should be a connector that can transmit electrical signals.

[0051] In one implementable manner of the embodiment of the present application, the micro control unit 110 includes a judgment module, which judges whether the depth of the soldering flux 210 detected by the detection element 130 is within a preset depth value range.

[0052] Optionally, the soldering flux depth detector 100 further includes an alarm device connected to the judgment module, which alarms when the depth of the soldering flux 210 exceeds a preset depth value.

[0053] In order to be more clearly perceived by the operator, the flux depth detector 100 of the embodiment of the present application also includes a judgment module and an alarm device. The judgment module is arranged in the microcontroller unit 110. According to the depth of the flux 210 detected by the detection element 130 and the preset depth value, it is judged whether the depth of the flux 210 is within the preset depth value range. If it exceeds the preset depth value, the alarm device is controlled to alarm to prompt the operator that the depth of the flux 210 exceeds the preset range.

[0054] Specifically, the specific structure of the alarm device is not limited in the embodiment of the present application, and for example, it can be a sound alarm.

[0055] In one achievable manner of the embodiment of the present application, the number of detection terminals is between 6 and 10.

[0056] When the vertical dimensions occupied by multiple detection ends are relatively fixed, the more detection ends are set, the more accurate the depth of the flux 210 detected will be. At the same time, the number of detection pieces 130 and display components 120 will also increase, increasing the volume and cost of the flux depth detector 100. Based on considerations of detection accuracy and the complexity of the flux depth detector 100, the embodiment of the present application sets the number of detection ends between 6 and 10, and the corresponding number of display components 120 is also between 8 and 10 and is the same as the number of detection pieces 130, so that the number of terminals of the microcontroller unit 110 is between 14 and 22.

[0057] The specific number of detection terminals is not limited in the present embodiment of the present application, and can be, for example, Figure 1 The 7 shown can also be 8 or 10.

[0058] Optionally, the size occupied by the multiple detection ends in the direction away from or close to the micro control unit 110 is between 20-100 μm.

[0059] In practical applications, the depth of the groove 200 for placing the flux 210 is limited, and the depth variation of the flux 210 is limited. In order to reduce the volume of the flux depth detector 100, the size occupied by the multiple detection ends in the vertical direction is set between 20-100 μm.

[0060] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A flux depth detector for detecting the depth of flux contained in a slot, characterized in that: It includes a microcontroller unit and a plurality of detection parts and a plurality of display components respectively connected to the microcontroller unit. The plurality of display components are signal-connected to the plurality of detection parts in a one-to-one correspondence. The detection ends of the plurality of detection parts extend into the groove, and the distances between the plurality of detection ends and the microcontroller unit are all different. The first detection end having the largest distance from the control unit contacts the bottom of the groove and is located above the liquid level of the flux. The second detection end having the smallest distance from the liquid level of the flux detects a depth signal, and the display component corresponding to the second detection end displays the depth of the flux according to the depth signal.

2. The soldering flux depth detector according to claim 1, characterized in that: The detection end is a metal plate, the second detection end corresponds to the second metal plate, and the microcontroller unit controls the depth of the displayed flux of the display component corresponding to the second detection end according to the capacitance between the second metal plate and the flux liquid level.

3. The soldering flux depth detector according to claim 1, characterized in that: The plurality of detection ends are arranged in sequence, and along the arrangement direction, the distance between the detection end and the micro control unit gradually increases or decreases.

4. The soldering flux depth detector according to claim 3, characterized in that: The display assembly includes an LED lamp.

5. The soldering flux depth detector according to claim 4, characterized in that: The detection end is a metal plate, the first detection end corresponds to the first metal plate, the second detection end corresponds to the second metal plate, and the LED lights corresponding to the metal plate between the first metal plate and the second metal plate are all lit.

6. The soldering flux depth detector according to claim 1, characterized in that: The plurality of detection elements are connected to the micro control unit via a connector, and a protective layer is coated on one side of the connector close to the detection end and on the surface of the detection end.

7. The soldering flux depth detector according to claim 1, characterized in that: The micro control unit includes a judgment module, and the judgment module judges whether the depth of the soldering flux detected by the detection element is within a preset depth value range.

8. The soldering flux depth detector according to claim 7, characterized in that: It also includes an alarm device connected to the judgment module, which alarms when the depth of the soldering flux exceeds a preset depth value.

9. The soldering flux depth detector according to claim 1, characterized in that: The number of the detection terminals is between 6 and 10.

10. The soldering flux depth detector according to claim 2, characterized in that: The size occupied by the multiple detection ends in the direction away from or close to the micro control unit is between 20-100 μm.

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