Semiconductor detection and measurement integrated device

Abstract

The utility model provides a semiconductor detection and measurement integrated device which comprises a main machine outer cover, a horizontal movement workbench is arranged in the main machine outer cover, an FFU air purifier is arranged at the top of the main machine outer cover, and an outlet of the FFU air purifier directly faces the horizontal movement workbench. A portal frame is arranged on the horizontal movement workbench, a 2D detection unit is arranged on one side of the portal frame, a 3D measuring head is arranged on the other side of the portal frame, and the 2D detection unit and the 3D measuring head are both downwards right opposite to the horizontal movement workbench. According to the utility model, the 2D detection unit and the 3D measuring head are integrated on the horizontal movement workbench, and the horizontal movement workbench controls a product to perform XY-axis horizontal movement and theta-axis horizontal rotation, so that integrated defect detection and measurement of a semiconductor chip are realized, the chip does not need to be transferred, and the detection efficiency is improved; the 2D detection unit and the 3D measuring head are arranged on the two sides of the portal frame respectively, and mutual interference of the 2D detection unit and the 3D measuring head is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor detection devices, in particular to an integrated semiconductor detection and measurement device. Background Art

[0002] During the semiconductor chip manufacturing process, after the production line photolithography process, some photolithography patterns will have defects such as surface particles, scratches, contamination, and pattern anomalies, which require image detection; at the same time, 3D measurement of data such as the height and width of the pattern is required to determine whether it is qualified.

[0003] During traditional semiconductor chip inspection and measurement, defect detection and 3D measurement are performed on different devices respectively, and the chip needs to be transferred in the middle, which makes the operation cumbersome and the inspection efficiency low. Utility Model Content

[0004] The technical problem to be solved by the utility model is: how to realize the integration of defect detection and measurement of semiconductor chips and improve the detection efficiency.

[0005] The technical solution of the utility model to solve the above technical problems is as follows:

[0006] The utility model provides an integrated semiconductor detection and measurement device, comprising a mainframe housing, a horizontal motion workbench is arranged inside the mainframe housing, an FFU air purifier is arranged on the top of the mainframe housing, and an outlet of the FFU air purifier faces the horizontal motion workbench; a gantry is arranged on the horizontal motion workbench, a 2D detection unit is arranged on one side of the gantry, and a 3D measuring head is arranged on the other side of the gantry, and both the 2D detection unit and the 3D measuring head face downwards and face the horizontal motion workbench.

[0007] The beneficial effects of the utility model are:

[0008] With the utility model, the 2D detection unit and the 3D measuring head are integrated on the horizontal motion workbench, and the horizontal motion workbench controls the product to perform XY axis horizontal motion and θ axis horizontal rotation, so that the 2D detection unit and the 3D measuring head can both collect the front view image of each product, realizing the integrated defect detection and measurement of semiconductor chips, without the need to transfer chips, and improving the detection efficiency; the 2D detection unit and the 3D measuring head are arranged on both sides of the gantry, avoiding mutual interference between the 2D detection unit and the 3D measuring head. In addition, the working space of the horizontal motion workbench is isolated by the host cover, ensuring the cleanliness of the detection environment.

[0009] On the basis of the above technical solution, the present invention can also be improved as follows.

[0010] Furthermore, the horizontal motion workbench includes a marble platform, an X-axis linear motor and a Y-axis linear motor, the fixed end of the Y-axis linear motor is connected to the marble platform, the movable end of the Y-axis linear motor is connected to the fixed end of the X-axis linear motor, and the movable end of the X-axis linear motor is provided with a DD motor, the output shaft of the DD motor faces upward and is connected to a working turntable.

[0011] It realizes three-axis motion superposition, which facilitates the flexible control of product movement and can capture multi-directional images of the product.

[0012] Furthermore, the X-axis linear motor and the Y-axis linear motor are both air-floating linear motors.

[0013] The linear motor prevents vibration from being transmitted to the bottom of the 2D detection unit and the 3D measurement head to affect the image, and the movement accuracy is high, which improves the detection and measurement accuracy.

[0014] Furthermore, a rack is provided under the marble platform, and shock-absorbing feet are provided under the rack.

[0015] It is convenient to reduce vibration and avoid external vibration being transmitted to the horizontal motion workbench, with high motion accuracy.

[0016] Furthermore, a vibration isolation pad is provided between the frame and the marble platform.

[0017] Reduce vibration transmission between the frame and the marble platform to avoid motion errors.

[0018] Furthermore, the 2D detection unit includes a mounting plate, on which a microscope is provided, the objective end of the microscope is arranged downward, and a camera is provided at the eyepiece end of the microscope; the mounting plate is fixed on the gantry.

[0019] It is convenient to take microscopic images of products with high detection accuracy; it is fixed on the gantry through the mounting plate and is easy to install.

[0020] Furthermore, the microscope is also provided with a light source lamp, and the emission end of the light source lamp is arranged downward.

[0021] It is convenient to fill the light of the microscope's field of view and improve the clarity of the image.

[0022] Furthermore, a loading and unloading door is provided in the middle of one side of the main engine outer cover.

[0023] When the loading and unloading doors are opened, product trays can be placed in or taken out, which is easy to operate; when the loading and unloading doors are closed, product inspection and measurement can be carried out, ensuring the closedness and cleanliness of the inspection environment.

[0024] Furthermore, maintenance doors are respectively provided on the other three sides of the main engine housing.

[0025] The maintenance door can be opened during maintenance to increase the maintenance space and facilitate maintenance.

[0026] Furthermore, an ion rod is also provided in the main engine housing, and the ion rod is located between the FFU air purifier and the horizontal motion workbench.

[0027] It is convenient to eliminate the electrostatic ions in the air discharged by the FFU air purifier, thus avoiding the damage of the chip products by static electricity; at the same time, it prevents the working process of the 2D detection unit and the 3D measurement head from being affected by the ions. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the appearance of the utility model.

[0029] Figure 2 It is a schematic diagram of the internal structure of the utility model.

[0030] Figure 3 It is a structural schematic diagram of the horizontal motion workbench.

[0031] Figure 4 Schematic diagram of the structure of the 2D detection unit.

[0032] Figure 5 A top view of the host housing.

[0033] In the accompanying drawings, the technical features represented by the reference numerals are as follows:

[0034] 1-Main unit cover; 2-Horizontal motion workbench; 3-Product tray; 4-FFU air purifier; 5-Gantry; 6-2D detection unit; 7-3D measuring head; 8-Marble platform; 9-X-axis linear motor; 10-Y-axis linear motor; 11-DD motor; 12-Working turntable; 13-Frame; 14-Shock-absorbing feet; 15-Vibration isolation pads; 16-Mounting plate; 17-Microscope; 18-Camera; 19-Light source lamp; 20-Loading and unloading doors; 21-Maintenance door; 22-Ion rod. DETAILED DESCRIPTION

[0035] The principles and features of the present invention are described below. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0036] This utility model refers to Figure 1-5 .

[0037] The utility model provides an integrated semiconductor detection and measurement device, comprising a mainframe housing 1, wherein a horizontal motion workbench 2 is arranged in the mainframe housing 1, an FFU air purifier 4 is arranged on the top of the mainframe housing 1, and an outlet of the FFU air purifier 4 faces the horizontal motion workbench 2; a gantry 5 is arranged on the horizontal motion workbench 2, a 2D detection unit 6 is arranged on one side of the gantry 5, and a 3D measuring head 7 is arranged on the other side of the gantry 5, and both the 2D detection unit 6 and the 3D measuring head 7 face downwards and face the horizontal motion workbench 2.

[0038] principle:

[0039] When inspecting and measuring semiconductor chips, the product tray 3 is placed on the horizontal motion workbench 2. The horizontal motion workbench 2 drives the product tray 3 to perform horizontal motion on the X-axis and Y-axis and horizontal rotation on the θ-axis, so that each product can move under the 2D inspection unit 6 and the 3D measuring head 7; the 2D inspection unit 6 can collect product images for defect detection, and the 3D measuring head 7 can collect product graphics and measure data such as width and height.

[0040] Explanation of prior art: The horizontal motion workbench 2 can adopt a four-axis air-floating motion platform product customized on the market, and the model can be QYAB-X30Y70. The 2D detection unit 6 can adopt an industrial microscope camera 18, which can collect product images and transmit them to a computer for image comparison detection. The 3D measurement head 7 can adopt the manufacturer's CLS2 series 3D spectral confocal sensor.

[0041] According to the utility model, the 2D detection unit 6 and the 3D measuring head 7 are integrated on the horizontal motion workbench 2, and the horizontal motion workbench 2 controls the product to perform XY axis horizontal motion and θ axis horizontal rotation, so that the 2D detection unit 6 and the 3D measuring head 7 can both collect the front view image of each product, realizing the integrated defect detection and measurement of semiconductor chips, without the need to transfer chips, and improving the detection efficiency; the 2D detection unit 6 and the 3D measuring head 7 are arranged on both sides of the gantry 5, avoiding the mutual interference between the 2D detection unit 6 and the 3D measuring head 7. In addition, the working space of the horizontal motion workbench 2 is isolated by the host cover 1, ensuring the cleanliness of the detection environment.

[0042] Further, such as Figure 2-3 As shown: the horizontal motion workbench 2 includes a marble platform 8, an X-axis linear motor 9 and a Y-axis linear motor 10, the fixed end of the Y-axis linear motor 10 is connected to the marble platform 8, the movable end of the Y-axis linear motor 10 is connected to the fixed end of the X-axis linear motor 9, and the movable end of the X-axis linear motor 9 is provided with a DD motor 11, the output shaft of the DD motor 11 faces upward and is connected to a working turntable 12.

[0043] During operation, the product tray 3 is placed on the working turntable 12, the Y-axis linear motor 10 can drive the X-axis linear motor 9 to move along the Y-axis, the X-axis linear motor 9 drives the DD motor 11 to move along the X-axis, and the DD motor 11 can drive the working turntable 12 to rotate, thereby realizing the superposition of XY axis movement and horizontal rotation, and enabling each product on the product tray 3 to move to the bottom of the 2D detection unit 6 and the bottom of the 3D measurement head 7. The linear motor is an existing technology, including an air-floating guide rail part and a sliding part, the air-floating guide rail part is its fixed end, and the sliding part is its moving end.

[0044] It realizes three-axis motion superposition, which facilitates the flexible control of product movement and can capture multi-directional images of the product.

[0045] Furthermore, the X-axis linear motor 9 and the Y-axis linear motor 10 are both air-floating linear motors.

[0046] The linear motor prevents vibration from being transmitted to the bottom of the 2D detection unit 6 and the 3D measurement head 7 to affect the image, and the movement accuracy is high; the detection and measurement accuracy is improved.

[0047] Furthermore, a frame 13 is provided below the marble platform 8 , and shock-absorbing feet 14 are provided below the frame 13 .

[0048] It is convenient to reduce vibration and avoid external vibration being transmitted to the horizontal motion workbench 2, and the motion accuracy is high.

[0049] Furthermore, a vibration isolation pad 15 is provided between the frame 13 and the marble platform 8 .

[0050] Reduce the vibration transmission between the frame 13 and the marble platform 8 to avoid motion errors.

[0051] Further, such as Figure 4 As shown: the 2D detection unit 6 includes a mounting plate 16 , on which a microscope 17 is disposed, the objective end of the microscope 17 is arranged downward, and a camera 18 is disposed at the eyepiece end of the microscope 17 ; the mounting plate 16 is fixed on the gantry 5 .

[0052] Note: The camera 18 may adopt CXP series products, etc.; the objective lens of the microscope 17 may adopt PAL series products, etc.

[0053] It is convenient to take microscopic images of products with high detection accuracy; it is fixed on the gantry 5 through the mounting plate 16 and is easy to install.

[0054] Furthermore, the microscope 17 is also provided with a light source lamp 19 , and the emission end of the light source lamp 19 is arranged downward.

[0055] Note: The light source lamp 19 can be i LS-HWS model product.

[0056] This facilitates supplementary light to the visual field of the microscope 17 and improves the clarity of the image.

[0057] Further, such as Figure 1 , 5 As shown: a loading and unloading door 20 is provided in the middle of one side of the main machine cover 1.

[0058] When the loading and unloading door 20 is opened, the product tray 3 can be placed in or taken out, which is easy to operate; when the loading and unloading door 20 is closed, product testing and measurement can be carried out, ensuring the closedness and cleanliness of the testing environment.

[0059] Furthermore, maintenance doors 21 are respectively provided on the other three sides of the main engine housing 1 .

[0060] The maintenance door 21 can be opened during maintenance to increase the maintenance space and facilitate maintenance.

[0061] Furthermore, an ion rod 22 is also provided in the main unit housing 1 , and the ion rod 22 is located between the FFU air purifier 4 and the horizontal motion workbench 2 .

[0062] It is convenient to eliminate the electrostatic ions in the air discharged by the FFU air purifier 4, thus avoiding the damage of the chip products by static electricity; at the same time, it prevents the working process of the 2D detection unit 6 and the 3D measurement head 7 from being affected by the ions.

[0063] In the description of the present invention, it should be understood that if there are descriptive terms indicating orientation, direction or positional relationship, such as: "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated in this specification is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of understanding the present invention and simplifying the description, and does not indicate or imply that the referred part, element or whole must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0064] In addition, if there are order description terms, such as "first", "second", etc., their purpose in this specification is to facilitate understanding or simplify description. For example, in order to distinguish multiple technical features of the same type or function, but they have to be mentioned separately, this specification may use prefix or suffix order description terms to distinguish them. Therefore, it cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0065] In the present utility model, if the terms describing the relative functional relationship of the structures are used, such as "install", "connect", "connect", "fix", etc., they should be understood in a broad sense unless otherwise clearly specified and limited. For example, "install", "connect", "connect", etc. can be a fixed connection, a detachable connection, or an integrated one; can be a mechanical connection or an electrical connection; can be a direct connection or an indirect connection through an intermediate medium, can be the internal connection of two elements or the interaction relationship between two elements; "fix" can be an integrated fixation or a detachable fixation through fasteners; can be a direct fixation or a fixation through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above-mentioned descriptive terms in the present utility model can be understood according to the specific circumstances, the context, the coherence of the context, etc.

[0066] In the present invention, if there are descriptive terms with subsidiary or connecting meanings, for example, a first feature is "on" or "below" a second feature, unless otherwise clearly specified and limited, it should not be understood in a restrictive manner. For example, "on" or "below" may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above descriptive terms in the present invention can be understood according to the specific circumstances, the context, the coherence of the context, etc.

[0067] Furthermore, the first feature being “above”, “above”, and “above” the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being “below”, “below”, and “below” the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0068] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art may combine and combine the different embodiments, examples and features of the different embodiments and examples described in this specification without contradiction, and these combinations or combinations shall all fall within the scope summarized by the utility model.

[0069] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are illustrative and cannot be construed as limitations on the present invention. A person skilled in the art can change, modify, replace and modify the above embodiments within the scope of information available from public channels and in combination with the technical inspiration provided by the present application documents.

Claims

1. A semiconductor detection and measurement integrated device, characterized in that: The invention comprises a main machine housing (1), wherein a horizontal motion workbench (2) is arranged inside the main machine housing (1), an FFU air purifier (4) is arranged on the top of the main machine housing (1), and the outlet of the FFU air purifier (4) faces the horizontal motion workbench (2); a gantry (5) is arranged on the horizontal motion workbench (2), a 2D detection unit (6) is arranged on one side of the gantry (5), and a 3D measurement head (7) is arranged on the other side of the gantry (5), and both the 2D detection unit (6) and the 3D measurement head (7) face downwards and face the horizontal motion workbench (2).

2. The semiconductor detection and measurement integrated device according to claim 1, characterized in that: The horizontal motion workbench (2) comprises a marble platform (8), an X-axis linear motor (9) and a Y-axis linear motor (10), wherein the fixed end of the Y-axis linear motor (10) is connected to the marble platform (8), the movable end of the Y-axis linear motor (10) is connected to the fixed end of the X-axis linear motor (9), and the movable end of the X-axis linear motor (9) is provided with a DD motor (11), the output shaft of the DD motor (11) faces upward and is connected to a working turntable (12).

3. The semiconductor detection and measurement integrated device according to claim 2, characterized in that: The X-axis linear motor (9) and the Y-axis linear motor (10) are both air-floating linear motors.

4. The semiconductor detection and measurement integrated device according to claim 2, characterized in that: A machine frame (13) is also provided below the marble platform (8), and a shock-absorbing foot (14) is provided below the machine frame (13).

5. The semiconductor detection and measurement integrated device according to claim 4, characterized in that: A vibration isolation pad (15) is provided between the frame (13) and the marble platform (8).

6. The semiconductor detection and measurement integrated device according to claim 1, characterized in that: The 2D detection unit (6) comprises a mounting plate (16), a microscope (17) is arranged on the mounting plate (16), the objective end of the microscope (17) is arranged downward, and a camera (18) is arranged at the eyepiece end of the microscope (17); the mounting plate (16) is fixed on the gantry (5).

7. The semiconductor detection and measurement integrated device according to claim 6, characterized in that: The microscope (17) is also provided with a light source lamp (19), and the emission end of the light source lamp (19) is arranged downward.

8. The semiconductor detection and measurement integrated device according to claim 1, characterized in that: A loading and unloading door (20) is provided in the middle of one side of the main machine outer cover (1).

9. The semiconductor detection and measurement integrated device according to claim 8, characterized in that: The other three sides of the main engine outer cover (1) are respectively provided with maintenance doors (21).

10. The semiconductor detection and measurement integrated device according to claim 1, characterized in that: An ion rod (22) is also provided in the main unit outer cover (1), and the ion rod (22) is located between the FFU air purifier (4) and the horizontal motion workbench (2).

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