Optical mechanism

Abstract

The utility model provides an optical mechanism. The optical mechanism comprises an outer frame, a lens unit, a circuit unit, an optical sensor and a heating unit. The lens unit is arranged in the outer frame, the circuit unit is fixed on the outer frame, the optical sensor is arranged on the circuit unit, the heating unit is provided with a heating part and a conductive part which are connected with each other, the heating part is embedded in the lens unit, and the conductive part is embedded in the lens unit. And the conductive part is electrically connected with the circuit unit.

Description

Technical Field

[0001] The utility model relates to an optical mechanism, in particular to an optical mechanism with a heating unit. Background Art

[0002] With the advancement of electronic technology and the gradual popularization of electric vehicles, Advanced Driver Assistance Systems (ADAS) have been widely used in fields such as autonomous vehicles.

[0003] Since the camera modules used in vehicles are often easily affected by low temperatures, which may cause damage or failure of their optical mechanisms, designing an optical mechanism for the camera modules that can improve safety and reliability has become an important challenge for researchers in this technical field. Utility Model Content

[0004] In view of the above-mentioned known problems, an embodiment of the present invention provides an optical mechanism, including an outer frame, a lens unit, a circuit unit, an optical sensor and a heating unit. The lens unit is disposed in the outer frame, the circuit unit is fixed on the outer frame, the optical sensor is disposed on the circuit unit, and the heating unit has a heating portion and a long strip-shaped conductive portion connected to each other, wherein the heating portion is embedded in the lens unit, and the conductive portion is electrically connected to the circuit unit, wherein the conductive portion extends along a side wall of the lens unit.

[0005] In one embodiment, the outer frame includes a hollow structure and a base connected to each other. The hollow structure is cylindrical and protrudes from the base to accommodate the lens unit.

[0006] In one embodiment, the conductive portion is between the side wall of the lens unit and the hollow structure of the outer frame.

[0007] In one embodiment, the conductive portion is fixed to the circuit unit by laser welding.

[0008] In one embodiment, the optical mechanism further includes a bottom shell, wherein the bottom shell is fixed to the base by laser welding and surrounds the circuit unit.

[0009] In one embodiment, the conductive portion passes through the outer frame and is electrically connected to the circuit unit.

[0010] In one embodiment, the optical mechanism further includes a spring pin connector disposed at the tail end of the conductive portion for electrically connecting the circuit unit.

[0011] In one embodiment, the conductive portion passes through the circuit unit.

[0012] In one embodiment, the hollow structure is formed with a through hole, and the conductive portion passes through the through hole and is electrically connected to the circuit unit.

[0013] In one embodiment, the lens unit has an optical lens, and the heating portion is ring-shaped and surrounds the optical lens. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings, wherein:

[0015] Figure 1 FIG. 1 is an exploded view of an optical mechanism 100 according to an embodiment of the present invention.

[0016] Figure 2 express Figure 1 A perspective view of the optical mechanism 100 is shown.

[0017] Figure 3 A side view showing the lens unit L and the frame F of the optical mechanism 100 before assembly.

[0018] Figure 4 A cross-sectional view showing the heating unit H and the lens unit L after being assembled.

[0019] Figure 5 A schematic diagram showing that the hollow structure F1 of the outer frame F covers the conductive portion H2 of the heating unit H.

[0020] Figure 6 express Figure 5 The conductive portion H2 in FIG. 1 is connected to the circuit unit S through the electrical contact P, which is a partial enlarged view.

[0021] Figure 7 A schematic diagram showing that solder G is applied to the corners of the circuit unit S to fix the circuit unit S to the bottom side of the base F2 of the outer frame F.

[0022] Figure 8 An exploded view showing a heating unit H and an outer frame F according to another embodiment of the present invention.

[0023] Fig. 9 An exploded view showing a heating unit H and an outer frame F according to another embodiment of the present invention.

[0024] Reference numerals:

[0025] 100: Optical mechanism

[0026] B: Bottom shell

[0027] C: Optical sensor

[0028] F: Frame

[0029] F1: Hollow structure

[0030] F11: Punch

[0031] F2: Base

[0032] G:Solder

[0033] H: Heating unit

[0034] H1: Heating unit

[0035] H2: Conductive part

[0036] H21: Spring pin connector

[0037] L: Lens unit

[0038] L0: Side wall

[0039] L1: Optical lens

[0040] L2: Optical lens

[0041] O: Optical axis

[0042] P: Electrical contact

[0043] S: Circuit unit

[0044] S1: Perforation DETAILED DESCRIPTION

[0045] The optical mechanism of the present invention is described below. However, it is easy to understand that the present invention provides many suitable concepts and can be implemented in a wide variety of specific contexts. The specific embodiments disclosed are only used to illustrate the use of the present invention in a specific way, and are not intended to limit the scope of the present invention.

[0046] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as those commonly understood by those skilled in the art to which this utility model belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the utility model, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0047] The above-mentioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only the directions with reference to the attached drawings. Therefore, the directional terms used in the embodiments are used to illustrate and not to limit the present invention.

[0048] First, please refer to Figure 1 , 2 , 3, 4, which show an exploded view of an optical mechanism 100 according to an embodiment of the present invention, Figure 2 express Figure 1 The perspective view of the optical mechanism 100 is shown in FIG. Figure 3 A side view showing the lens unit L and the outer frame F of the optical mechanism 100 before assembly, Figure 4 A cross-sectional view showing a heating unit H embedded in a lens unit L.

[0049] like Figure 1 , 2 As shown in FIGS. 3 and 4 , the optical mechanism 100 is, for example, a camera module that can be installed on a vehicle, and mainly includes a lens unit L, a heating unit H, an outer frame F, a circuit unit S, an optical sensor C and a bottom shell B.

[0050] In this embodiment, the outer frame F includes a hollow structure F1 and a base F2 connected to each other, wherein the hollow structure F1 is cylindrical and protrudes upward from the base F2 to accommodate the lens unit L. On the other hand, the optical sensor C is disposed on the circuit unit S, and the circuit unit S and the bottom shell B are fixed to the bottom side of the outer frame F, wherein the bottom shell B surrounds and protects the circuit unit S after assembly.

[0051] For example, Figure 1 As shown, solder can be applied to the through holes S1 at the four corners of the circuit unit S, so that the circuit unit S can be fixed to the bottom side of the base F2 of the outer frame F by soldering or laser welding. It should be understood that the bottom shell B can be fixed to the bottom side of the base F2 of the outer frame F by laser welding again, so as to surround and protect the circuit unit S and the optical sensor C therein.

[0052] The aforementioned optical sensor C may include an infrared or CCD image sensor, and the aforementioned circuit unit S may include a printed circuit board; it should be understood that the light can enter the lens unit L along the optical axis O of the lens unit L, and then the aforementioned light will reach the optical sensor C on the circuit unit S after passing through the lens unit L, thereby generating a digital image.

[0053] from Figure 1 , 3 As can be seen from FIG. 4 , the heating unit H of the present embodiment mainly comprises an annular heating portion H1 and two long strip-shaped conductive portions H2, wherein the heating portion H1 is embedded in the lens unit L to heat the optical lens in the lens unit L, thereby ensuring that the optical lens in the lens unit L can be maintained in an appropriate operating temperature range without fogging, and the conductive portion H2 extends downward along the side wall L0 of the lens unit L and enters the interior of the outer frame F ( Figure 3 ).

[0054] Again, if Figure 4 As shown, an optical lens L1 and an optical lens L2 are provided inside the aforementioned lens unit L, wherein the heating portion H1 of the aforementioned heating unit H is embedded in the lens unit L and surrounds the optical lens L1, thereby heating the optical lens L1 so that the optical lens L1 can be maintained within an appropriate operating temperature range; in addition, the conductive portion H2 of the heating unit H extends along the side wall L0 of the lens unit L and toward the optical axis O, so as to electrically connect to the aforementioned circuit unit S.

[0055] Please also read Figure 5 , 6 , 7, among which Figure 5 A schematic diagram showing that the hollow structure F1 of the outer frame F covers the conductive portion H2 of the heating unit H, Figure 6 express Figure 5 The conductive portion H2 in FIG. 1 is connected to the circuit unit S through the electrical contact P. Figure 7 A schematic diagram showing that solder G is applied to the corners of the circuit unit S to fix the circuit unit S to the bottom side of the base F2 of the outer frame F.

[0056] like Figure 5 , 6As shown in , 7, the conductive portion H2 of the heating unit H will extend along the side wall L0 of the lens unit L after assembly, and pass through the hollow structure F1 of the outer frame F and the base F2 in sequence to reach the circuit unit S located at the bottom side of the outer frame F; that is, the conductive portion H2 of the heating unit H will be located between the side wall L0 of the lens unit L and the hollow structure F1 of the outer frame F after assembly, and the conductive portion H2 will be covered by the hollow structure F1 of the outer frame F and will not be exposed to the outside, thereby preventing the conductive portion H2 from short-circuiting or being damaged, thereby greatly improving the safety and reliability of the optical mechanism 100.

[0057] In this embodiment, two electrical contacts P are provided on the surface of the circuit unit S for electrically connecting the conductive portion H2 of the heating unit H and the circuit unit S. For example, the electrical contacts P may include a metal pad ( Figure 6 ), and a pogo pin connector H21 (pogo pin) may be provided at the tail end of the conductive portion H2 of the heating unit H for electrically connecting the aforementioned electrical contact P.

[0058] On the other hand, from Figure 7 As can be seen in the figure, a plurality of solders G can be respectively disposed in the through holes S1 at the corners of the circuit unit S, so that during the assembly process of the optical mechanism 100, the circuit unit S can be fixed to the bottom side of the base F2 of the outer frame F by welding or laser welding. In addition, the bottom shell B can also be fixed to the bottom side of the base F2 of the outer frame F by laser welding to surround and protect the circuit unit S and the optical sensor C therein.

[0059] Please see again Figure 8 ,in Figure 8 An exploded view showing a heating unit H and an outer frame F according to another embodiment of the present invention.

[0060] like Figure 8 As shown, in this embodiment, the hollow structure F1 of the outer frame F is formed with a through hole F11 extending toward the optical axis O, corresponding to the conductive portion H2 of the heating unit H. During the assembly process of the optical mechanism 100, the conductive portion H2 of the heating unit H can be respectively passed through the through holes F11 and connected to the circuit unit S fixed to the bottom side of the base F2 of the outer frame F, so that not only the conductive portion H2 of the heating unit H can be effectively protected, but also the miniaturization of the optical mechanism 100 can be achieved.

[0061] Next, please refer to Fig. 9 ,in Fig. 9 An exploded view showing a heating unit H and an outer frame F according to another embodiment of the present invention.

[0062] like Fig. 9As shown, in the optical mechanism 100 of another embodiment of the present invention, the conductive portion H2 of the heating unit H can also pass through the circuit unit S, and the conductive portion H2 of the heating unit H can be combined and fixed to the bottom side of the circuit unit S by laser welding. Finally, the bottom shell B can be fixed to the bottom side of the base F2 of the outer frame F by laser welding again. However, the connection position of the conductive portion H2 and the circuit unit S is not limited to that disclosed in the embodiment of the present invention.

[0063] Although the embodiments and advantages of the utility model have been disclosed as above, it should be understood that any person with ordinary knowledge in the relevant technical field can make changes, substitutions and modifications without departing from the spirit and scope of the utility model. In addition, the scope of protection of the utility model is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiment described in the specification. Any person with ordinary knowledge in the relevant technical field can understand the current or future developed process, machine, manufacture, material composition, device, method and steps from the disclosure of the utility model. As long as the same function can be implemented in the embodiments described herein or the same result can be obtained, they can be used according to the utility model. Therefore, the scope of protection of the utility model includes the above-mentioned process, machine, manufacture, material composition, device, method and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the utility model also includes the combination of each claim and embodiment.

[0064] Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the above-attached claims.

Claims

1. An optical mechanism, characterized in that: include: an outer frame; A lens unit is disposed in the outer frame; A circuit unit fixed on the outer frame; an optical sensor disposed on the circuit unit; and A heating unit has a heating portion and at least one elongated conductive portion connected to each other, wherein the heating portion is embedded in the lens unit and the conductive portion is electrically connected to the circuit unit, wherein the conductive portion extends along a side wall of the lens unit.

2. The optical mechanism according to claim 1, characterized in that The outer frame includes a hollow structure and a base which are connected to each other. The hollow structure is cylindrical and protrudes from the base to accommodate the lens unit.

3. The optical mechanism according to claim 2, characterized in that The conductive portion is between the side wall of the lens unit and the hollow structure of the outer frame.

4. The optical mechanism according to claim 2, characterized in that The conductive part is fixed to the circuit unit by laser welding.

5. The optical mechanism according to claim 2, characterized in that: The optical mechanism further comprises a bottom shell, wherein the bottom shell is fixed to the base through laser welding and surrounds the circuit unit.

6. The optical mechanism according to claim 2, characterized in that The conductive part passes through the outer frame and is electrically connected to the circuit unit.

7. The optical mechanism according to claim 2, characterized in that: The optical mechanism further comprises a spring pin connector, which is arranged at the tail end of the conductive part and is used for electrically connecting the circuit unit.

8. The optical mechanism according to claim 2, characterized in that The conductive portion passes through the circuit unit.

9. The optical mechanism according to claim 2, characterized in that: The hollow structure is formed with a through hole, and the conductive part passes through the through hole and is electrically connected to the circuit unit.

10. The optical mechanism according to claim 1, characterized in that The lens unit has an optical lens, and the heating portion is ring-shaped and surrounds the optical lens.

Images