Bonding plate pressing die

Abstract

The utility model discloses a bonding pressing plate die, which relates to the technical field of lead bonding and comprises a pressing plate body, a bonding hole is arranged on the pressing plate body, fixing wing plates for fixing the pressing plate body on bonding equipment are arranged on two sides of the pressing plate body, an insulating diaphragm is covered on the upper surface of the pressing plate body, and the other insulating diaphragm is covered on the upper surface of the pressing plate body. The insulating diaphragm plays a role in isolation, so that the stability during operation is improved, the alarm frequency of equipment and the wire threading frequency are reduced, the current is prevented from being externally released, and the stability of operation is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wire bonding, in particular to a bonding pressure plate mold. Background Art

[0002] In the semiconductor packaging process, in order to electrically connect the pads on the chip to the substrate (or lead frame), a wire bonding process is usually used. At present, wire bonding technology can be divided into ultrasonic bonding, thermal compression bonding and thermal ultrasonic bonding according to the characteristics of the bonding process.

[0003] The patent application with patent publication number CN104617010A discloses a copper wire bonding platen, which includes a plate body, and the plate body has fixing parts on both sides for fixing the bonding platen to the bonding device, and the plate body has through holes, and the copper wire passes through the through holes during the copper wire bonding process, characterized in that the thickness of the plate body is less than the thickness of an ordinary bonding platen. The bonding platen is made of high temperature resistant material, and its lower surface has an insulating protective layer. Since the thickness of the bonding platen is less than that of an ordinary bonding platen, and the hardness of the platen can be maintained at the same time, it is possible to increase the space for the wire head to move during the copper wire bonding process, thereby improving the production yield of the bonding platen.

[0004] However, the bonding operation opening of the existing bonding pressure plate is relatively large, and the components that have been installed before and do not need to undergo bonding process on their main body are also accommodated within the bonding operation opening. However, during the production of traditional pressure plates, there is occasional current discharge, which causes damage to the installed component body during the bonding process. Utility Model Content

[0005] In order to overcome the defect in the prior art that the main body of the installed component is damaged due to the external current release, the utility model provides a bonding press plate mold.

[0006] The utility model solves the technical problem by adopting the following technical solution: a bonding platen mold, comprising a platen body, a bonding hole being arranged on the platen body, fixing wing plates being arranged on both sides of the platen body for fixing the platen body to the bonding device, and an insulating diaphragm covering the upper surface of the platen body.

[0007] As a further improvement of the utility model, a receiving hole is provided on the pressing plate body, and a pin pressing portion is provided between the receiving hole and the bonding hole. The pin pressing portion isolates the receiving hole from the bonding hole.

[0008] As a further improvement of the present invention, the inner diameter of the lower surface of the bonding hole is smaller than the inner diameter of the upper surface of the bonding hole, presenting a partially inverted cone structure. Such a large upward opening bonding hole provides a wider working space for the bonding tool above the pressure plate, facilitating the implementation of the bonding process.

[0009] As a further improvement of the present invention, the material of the pressing plate body is a high temperature resistant material.

[0010] As a further improvement of the utility model, an insulating protective layer is provided on the lower surface of the pressing plate body to eliminate discharge between the spark rod and the pressing plate during the wire bonding process.

[0011] As a further improvement of the utility model, the insulating diaphragm is made of mica and ceramic materials.

[0012] Compared with the prior art, the utility model has the beneficial effects: in this solution, the upper surface of the pressure plate body is covered with an insulating diaphragm, which plays an isolating role, thereby improving the stability during operation, reducing the equipment alarm frequency and the number of wire threading times, ensuring that the current will not be discharged, and improving the stability of the operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The utility model is further described below in conjunction with the accompanying drawings and specific implementation methods.

[0014] Figure 1 The utility model is a structural schematic diagram of a bonding pressure plate mold.

[0015] In the figure: 1. Pressing plate body; 2. Keying hole; 3. Fixed wing plate; 4. Insulating diaphragm; 5. Insulating protective layer; 6. Accommodating hole; 7. Pin pressing part. DETAILED DESCRIPTION

[0016] In order to make the technical solution and beneficial effects of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.

[0017] Reference Figure 1 The utility model discloses a bonding platen die, including a platen body 1, a bonding hole 2 is provided on the platen body 1, and fixing wing plates 3 are provided on both sides of the platen body 1 to fix the platen body 1 to the bonding device. The upper surface of the platen body 1 is covered with an insulating diaphragm 4, and the insulating diaphragm 4 plays an isolating role, thereby improving the stability during operation, reducing the alarm frequency of the equipment and the number of wire threading. It ensures that the current will not be released, and improves the stability of the operation.

[0018] The pressing plate body 1 is provided with a receiving hole 6 , and a pin pressing portion 7 is provided between the receiving hole 6 and the bonding hole 2 , and the pin pressing portion 7 isolates the receiving hole 6 from the bonding hole 2 .

[0019] Reference Figure 1 The inner diameter of the lower surface of the bonding hole 2 is smaller than the inner diameter of the upper surface of the bonding hole 2, presenting a partially inverted cone structure. Such a bonding hole with a large upward opening provides a wider working space for the bonding tool above the pressure plate, facilitating the implementation of the bonding process.

[0020] The material of the pressing plate body 1 is a high temperature resistant material. The lower surface of the pressing plate body 1 is provided with an insulating protective layer 5 to eliminate discharge during the wire bonding process. The insulating diaphragm 4 and the insulating protective layer 5 are made of mica and ceramic materials, and have insulation and high temperature resistance properties.

[0021] It should be understood that the specific embodiments described herein are only used to understand the present invention and are not used to limit the present invention. All other embodiments obtained by those skilled in the art without making any creative work are within the scope of protection of the present invention.

Claims

1. A bonding platen mold, characterized in that: The device comprises a pressure plate body (1), a bonding hole (2) being provided on the pressure plate body (1), fixing wing plates (3) being provided on both sides of the pressure plate body (1) for fixing the pressure plate body (1) to a bonding device, an upper surface of the pressure plate body (1) being covered with an insulating diaphragm (4), a receiving hole (6) being provided on the pressure plate body (1), a pin pressing portion (7) being provided between the receiving hole (6) and the bonding hole (2), and an inner diameter of the lower surface of the bonding hole (2) being smaller than an inner diameter of the upper surface of the bonding hole (2), presenting a partially inverted cone structure.

2. A bonding plate mold according to claim 1, characterized in that: The material of the pressing plate body (1) is a high temperature resistant material.

3. A bonding plate mold according to claim 2, characterized in that: An insulating protective layer (5) is provided on the lower surface of the pressing plate body (1).

4. A bonding plate mold according to claim 3, characterized in that: The insulating diaphragm (4) is made of mica and ceramic materials.

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