Wafer cleaning device

Abstract

The utility model relates to a wafer cleaning device which comprises a cleaning table provided with a plurality of adsorption holes; the cleaning assembly is used for cleaning the wafer; the adsorption assembly comprises a hollow shaft which is connected with the cleaning table and communicates with the multiple adsorption holes and a negative pressure source; the driving assembly comprises a rotating shaft sleeving the outer side of the hollow shaft and a shaft sleeve arranged on the outer side of the rotating shaft, and can drive the hollow shaft and the cleaning table to rotate; the cleaning device further comprises a connecting shell for connecting the rotating shaft and the hollow shaft, and the connecting shell is provided with an air inlet hole. A first gap is formed between the connecting shell and the rotating shaft, a second gap is formed between the connecting shell and the hollow shaft, and the air inlet is communicated with the first gap and the second gap; when the wafer cleaning device is in a working state, external air flow always flows through the first gap and the second gap from the air inlet holes, so that corrosive gas generated by wafer cleaning is prevented from flowing into the first gap and / or the second gap and further entering the driving assembly, and the driving assembly is prevented from being damaged.

Description

Technical Field

[0001] The utility model relates to a wafer cleaning device and belongs to the technical field of semiconductor processing. Background Art

[0002] A wafer refers to the silicon chip used to make silicon semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit component structures can be processed on the silicon wafer to become IC products with specific electrical functions.

[0003] With the development of semiconductor technology, the integration of semiconductor devices is getting higher and higher, and the requirements for cleaning the wafer surface are also getting higher and higher. The existing technology usually uses clean water and organic solvents to clean the wafer, but after cleaning with organic solvents, various gases are often generated, including corrosive gases. If the gas enters the drive component, it will cause the drive component to be corroded and damaged, reduce the service life of the drive component, and affect the working efficiency of the cleaning device.

[0004] To this end, we propose a wafer cleaning device. Utility Model Content

[0005] The utility model aims to provide a wafer cleaning device, which can prevent the corrosive gas generated by cleaning the wafer from contacting the driving component and causing the driving component to have a shorter service life or be damaged.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solution: a wafer cleaning device, comprising:

[0007] A cleaning table, used for carrying wafers, having a plurality of adsorption holes;

[0008] A cleaning component, arranged on one side of the cleaning table, for cleaning the wafer;

[0009] An adsorption assembly, comprising a hollow shaft connected to the cleaning table and in communication with a plurality of adsorption holes, and a negative pressure source connected to the hollow shaft;

[0010] A driving assembly, including a rotating shaft sleeved on the outside of the hollow shaft and a shaft sleeve arranged on the outside of the rotating shaft, capable of driving the hollow shaft and the cleaning table to rotate;

[0011] Wherein, the cleaning device further comprises a connecting shell connecting the rotating shaft and the hollow shaft, and the connecting shell is provided with an air inlet hole;

[0012] There is a first gap between the connecting shell and the rotating shaft, there is a second gap between the connecting shell and the hollow shaft, and the air inlet is connected to the first gap and the second gap respectively; when the wafer cleaning device is in working state, the external airflow always flows from the air inlet through the first gap and the second gap respectively.

[0013] Furthermore, when the wafer cleaning device is in operation, the air pressure in the first gap and the second gap is greater than the air pressure outside the driving component.

[0014] Furthermore, the hollow shaft has a supporting portion formed along the outer circumferential surface, and the end of the rotating shaft is in contact with the bottom surface of the supporting portion.

[0015] Furthermore, the cleaning platform includes a bearing platform and a connecting portion connected to the bearing platform, and at least a portion of the hollow shaft extends into the connecting portion and is connected to a plurality of the adsorption holes;

[0016] The connecting shell comprises an upper end portion, a lower end portion and a main body portion connecting the upper end portion and the lower end portion, and the upper end portion is clamped between the abutting portion and the connecting portion.

[0017] Further, the connecting portion has a mounting hole;

[0018] The cleaning device further comprises a positioning member installed in the mounting hole, and the positioning member can move relative to the mounting hole under the action of an external force to clamp or release the hollow shaft.

[0019] Furthermore, when the cleaning table is in working state, the adsorption component adsorbs the cleaning table, and the positioning member clamps the hollow shaft;

[0020] The cleaning station stops running, the adsorption component stops the adsorption action, a force is applied to the connecting portion, and the positioning member releases the hollow shaft.

[0021] Furthermore, the positioning member includes a shell, a stopper arranged in the shell, a positioning bead, and an elastic member arranged between the positioning bead and the stopper, and the positioning bead can move relative to the hollow shaft under the action of the elastic member under external force.

[0022] Furthermore, the cleaning component includes a first cleaning part, a second cleaning part and a recovery part, the first cleaning part and the second cleaning part can move relative to the cleaning table in response to a signal to spray two liquids; the recovery part is configured to be able to clean and dry the second cleaning part.

[0023] Furthermore, there are a plurality of liquid spray holes and a first inlet, wherein the first inlet connects the liquid supply device and the liquid spray holes.

[0024] Furthermore, the recovery member also includes an annular vent and a second inlet connected to the annular vent.

[0025] The beneficial effect of the utility model lies in that an air inlet is provided on the connecting shell, and a first gap is provided between the connecting shell and the rotating shaft, and a second gap is provided between the connecting shell and the hollow shaft, and the air inlet is communicated with the first gap and the second gap respectively. When the wafer cleaning device is in working state, the external airflow can always flow from the air inlet through the first gap and the second gap respectively, thereby preventing the corrosive gas generated by cleaning the wafer from flowing into the first gap and / or the second gap and then entering the interior of the driving component, causing damage to the driving component.

[0026] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a structural schematic diagram of a wafer cleaning device of the utility model;

[0028] Figure 2 for Figure 1 A schematic diagram of a portion of the structure of a wafer cleaning device shown;

[0029] Figure 3 for Figure 2 Sectional drawing;

[0030] Figure 4 for Figure 3 Partial magnified image;

[0031] Figure 5 for Figure 2 A cross-section in another direction;

[0032] Figure 6 for Figure 5 A partial enlarged view of . DETAILED DESCRIPTION

[0033] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the mechanism or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0037] Please refer to Figure 1 , Figure 2 as well as Figure 3 As shown, a wafer cleaning device shown in a preferred embodiment of the utility model comprises a cleaning table 1, a cleaning component 2 arranged on one side of the cleaning table 1, an adsorption component and a driving component 4. Among them, the cleaning table 1 is used to carry wafers, the cleaning component 2 is used to clean the wafers, and the driving component 4 can drive the cleaning table 1 to rotate. It should be noted that, in this embodiment, the cleaning table 1 has a plurality of adsorption holes 11, and the adsorption component is connected to the plurality of adsorption holes 11 to fix the wafer in the working state by adsorption force, so as to prevent the wafer from being thrown out of the cleaning table 1 under the centrifugal force generated by the rotation.

[0038] Please refer to Figure 1As shown, the cleaning assembly 2 includes a first cleaning member 21, a second cleaning member 22 and a recovery member 23. The first cleaning member 21 and the second cleaning member 22 can move relative to the cleaning station 1 in response to a signal to spray two liquids toward the cleaning station 1; the recovery member 23 is configured to be able to clean and dry the second cleaning member 22. In this embodiment, the first cleaning member 21 and the second cleaning member 22 can spray liquids toward the cleaning station 1 in turn in response to a signal, wherein the first cleaning member 21 is used to spray clean water onto the wafer on the cleaning station 1, and the second cleaning member 22 is used to spray an organic solvent onto the wafer. The recovery member 23 can clean and dry the second cleaning member 22 after spraying the organic solvent, so as to prevent contamination of the wafer when spraying the wafer next time or cross-contamination of different organic solvents.

[0039] Specifically, the recovery member 23 includes a plurality of liquid spray holes (not shown) and a first inlet (not shown), wherein the first inlet connects the liquid supply device and the liquid spray holes. The recovery member 23 also includes an annular vent (not shown) and a second inlet (not shown) connected to the annular vent. In this embodiment, the annular vent is located above the plurality of liquid spray holes.

[0040] When the second cleaning part 22 completes the cleaning of the wafer, the controller controls the second cleaning part 22 to move to the top of the recovery part 23, and makes the nozzle of the second cleaning part 22 located in the recovery box, starts the liquid supply device, so that the water in the liquid supply device can be sprayed onto the nozzle of the second cleaning part 22 through the first inlet 2312 and a plurality of liquid spray holes 2325, so as to clean the nozzle; after the cleaning is completed, the second cleaning part 22 moves upward, and the external air flow is connected with the annular vent 2314 through the second inlet 2313, so that the external air flow can flow into the surface of the nozzle through the annular vent 2314, so as to dry the nozzle. It should be noted that in this embodiment, a plurality of liquid spray holes 2325 are evenly spaced along the circumference of the inner wall of the recovery part 23. A plurality of second inlets 2313 are provided, and a plurality of second inlets 2313 are evenly spaced along the circumference of the recovery part 23. During the cleaning and drying process of the nozzle of the second cleaning member 22, the second cleaning member 22 may be pulled up multiple times to achieve multiple cleaning or drying thereof, which is not specifically limited herein as long as the cleaning and drying standards of the second cleaning member 22 can be met.

[0041] Please refer to Figure 2-Figure 5 As shown, the adsorption assembly includes a hollow shaft connected to the cleaning table 1 and connected to a plurality of adsorption holes 11, and a negative pressure source connected to the hollow shaft. When the cleaning table 1 is in operation, the negative pressure source generates negative pressure to generate adsorption force through the hollow shaft and the plurality of adsorption holes 11 to fix the wafer to the cleaning table 1. It should be noted that the plurality of adsorption holes 11 are evenly spaced and distributed along the cleaning table 1. The purpose of this arrangement is to make the adsorption force acting on the wafer uniform and prevent the wafer from breaking.

[0042] Specifically, the cleaning table 1 includes a carrier 12 and a connecting portion 13 connected to the carrier 12 . The plurality of adsorption holes 11 are arranged on the carrier, and at least part of the hollow shaft extends into the connecting portion 13 and communicates with the plurality of adsorption holes 11 .

[0043] The connection part 13 has a mounting hole 131. The cleaning device further includes a positioning member 5 mounted in the mounting hole 131. The positioning member 5 can move relative to the mounting hole 131 under the action of an external force to clamp or release the hollow shaft. When the cleaning table 1 is in a working state, the adsorption component adsorbs the cleaning table 1, and the positioning member 5 clamps the hollow shaft; when the cleaning table 1 stops running, the adsorption component stops the adsorption action, applies a force to the connection part 13, and the positioning member 5 releases the hollow shaft.

[0044] More specifically, the positioning member 5 includes a shell 51, a stopper 52 disposed in the shell 51, a positioning bead 53, and an elastic member disposed between the positioning bead 53 and the stopper 52. The positioning bead 53 can move relative to the hollow shaft under the action of the elastic member under the external force. When the cleaning table 1 is in working state, the adsorption component adsorbs the cleaning table 1 to fix the cleaning table 1 and the wafer located on the cleaning table 1. At this time, the positioning bead 53 of the positioning member 5 abuts against the outer circumference of the hollow shaft under the action of the elastic member to clamp the hollow shaft; when the cleaning table 1 stops working and needs to be disassembled, replaced or maintained, the adsorption component stops the adsorption action and applies force to the connecting part 13. When the connecting part 13 is pulled out, the positioning bead 53 is squeezed and retracts relative to the mounting hole 131. The positioning bead 53 leaves the outer circumference of the hollow shaft, so that the cleaning table 1 can be disassembled with only one hand, with a simple structure and convenient operation.

[0045] The driving assembly 4 includes a rotating shaft 41 sleeved on the outside of the hollow shaft and a sleeve 42 arranged on the outside of the rotating shaft 41, which can drive the hollow shaft and the cleaning table 1 to rotate. In this embodiment, the cleaning device also includes a connecting shell 6 connecting the rotating shaft 41 and the hollow shaft. The hollow shaft has a supporting portion formed along the outer peripheral surface, and the end of the rotating shaft 41 is supported by the bottom surface of the supporting portion. The connecting shell 6 includes an upper end 61, a lower end 62 and a main body 63 connecting the upper end 61 and the lower end 62, and the upper end 61 is clamped between the supporting portion and the connecting portion 13.

[0046] It is worth noting that in this embodiment, the connecting shell 6 is provided with an air inlet 66; there is a first gap 64 between the connecting shell 6 and the rotating shaft 41, and there is a second gap 65 between the connecting shell 6 and the hollow shaft, and the air inlet 66 is connected to the first gap 64 and the second gap 65 respectively; (For details, please refer to the attached Figure 6 , Figure 6The middle arrow indicates the airflow path. When the wafer cleaning device is in operation, the external airflow always flows through the first gap 64 and the second gap 65 from the air inlet 66. That is, when the wafer cleaning device is in operation, the air pressure in the first gap 64 and the second gap 65 is greater than the air pressure outside the driving assembly 4.

[0047] The purpose of such a setting is that, since the organic solvent will produce corrosive gas when cleaning the wafer, when the corrosive gas enters into the interior of the driving component 4, the internal components of the driving component 4 will be corroded or damaged, etc., which will reduce its service life and affect the working efficiency. An air inlet 66 is provided, and when the cleaning station 1 is in working state, the external airflow can always keep flowing from the air inlet 66 through the first gap 64 and the second gap 65. The airflow in the first gap 64 and the second gap 65 will fill the gaps between the components to prevent the corrosive gas from entering between the components of the driving component 4. At the same time, the airflow always flows through the first gap 64 and the second gap 65, which can also achieve a certain heat dissipation effect on the components of the driving component 4.

[0048] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A wafer cleaning device, characterized in that: include: A cleaning table, used for carrying wafers, having a plurality of adsorption holes; A cleaning component, arranged on one side of the cleaning table, for cleaning the wafer; An adsorption assembly, comprising a hollow shaft connected to the cleaning table and in communication with a plurality of adsorption holes, and a negative pressure source connected to the hollow shaft; A driving assembly, including a rotating shaft sleeved on the outside of the hollow shaft and a shaft sleeve arranged on the outside of the rotating shaft, capable of driving the hollow shaft and the cleaning table to rotate; Wherein, the cleaning device further comprises a connecting shell connecting the rotating shaft and the hollow shaft, and the connecting shell is provided with an air inlet hole; There is a first gap between the connecting shell and the rotating shaft, there is a second gap between the connecting shell and the hollow shaft, and the air inlet is connected to the first gap and the second gap respectively; when the wafer cleaning device is in working state, the external airflow always flows from the air inlet through the first gap and the second gap respectively.

2. The wafer cleaning device according to claim 1, characterized in that: When the wafer cleaning device is in operation, the air pressure in the first gap and the second gap is greater than the air pressure outside the driving component.

3. The wafer cleaning device according to claim 1, characterized in that: The hollow shaft has a supporting portion formed along the outer peripheral surface, and the end of the rotating shaft is in contact with the bottom surface of the supporting portion.

4. The wafer cleaning device according to claim 3, characterized in that: The cleaning platform comprises a carrying platform and a connecting portion connected to the carrying platform, and at least a portion of the hollow shaft extends into the connecting portion and communicates with a plurality of the adsorption holes; The connecting shell comprises an upper end portion, a lower end portion and a main body portion connecting the upper end portion and the lower end portion, and the upper end portion is clamped between the abutting portion and the connecting portion.

5. The wafer cleaning device according to claim 4, characterized in that: The connecting portion has a mounting hole; The cleaning device further comprises a positioning member installed in the mounting hole, and the positioning member can move relative to the mounting hole under the action of an external force to clamp or release the hollow shaft.

6. The wafer cleaning device according to claim 5, characterized in that: When the cleaning table is in working state, the adsorption component adsorbs the cleaning table, and the positioning member clamps the hollow shaft; The cleaning station stops running, the adsorption component stops the adsorption action, a force is applied to the connecting portion, and the positioning member releases the hollow shaft.

7. The wafer cleaning device according to claim 5, characterized in that: The positioning member includes a shell, a stopper arranged in the shell, a positioning bead, and an elastic member arranged between the positioning bead and the stopper. The positioning bead can move relative to the hollow shaft under the action of the elastic member under the external force.

8. The wafer cleaning device according to claim 1, characterized in that: The cleaning assembly includes a first cleaning member, a second cleaning member and a recovery member. The first cleaning member and the second cleaning member can move relative to the cleaning table in response to a signal to spray two liquids. The recovery member is configured to be able to clean and dry the second cleaning member.

9. The wafer cleaning device according to claim 8, characterized in that: The recovery component includes a plurality of liquid spray holes and a first inlet, and the first inlet is connected with the liquid supply device and the liquid spray holes.

10. The wafer cleaning device according to claim 9, characterized in that: The recovery member further includes an annular vent and a second inlet communicating with the annular vent.

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