Film covering carrier and film covering equipment

Abstract

The utility model provides a film covering carrier and film covering equipment, and relates to the technical field of semiconductor film covering. The film covering carrier comprises an outer frame, a surrounding part and connecting ribs, wherein the surrounding part is arranged on the inner side of the outer frame; the enclosure part is provided with an accommodating groove; the side, provided with the containing groove, of the fence part is used for being connected with the substrate so that the chip on the substrate can be located in the containing groove. The connecting ribs are used for connecting the multiple fence parts and connecting the fence parts and the outer frame. The film carrier can form an opening on the film when the film carrier is separated from the substrate, so that a cavity structure at the bottom of a chip is filled with a molding compound, and the reliability of a solder ball at the bottom of the chip is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor coating, in particular to a coating carrier and a coating device. Background Art

[0002] With the rapid development of the semiconductor industry, surface acoustic wave (SAW) filter chips are widely used in receiver front-ends, duplexers, and receive filters. However, there are usually multiple chips in a module, such as SAW filter chips and other non-filter chips, such as RF chips.

[0003] Currently, a lamination process is commonly used to apply a layer of organic film tens of microns thick to the entire module using a vacuum lamination method as a substrate protection layer. This method can form a cavity structure at the bottom of the surface acoustic wave filter chip and the non-filter chip respectively. However, the presence of a cavity structure at the bottom of the non-filter chip can easily lead to the softening and short-circuiting of the solder balls of closely spaced chips during the reflow soldering and heating and curing of the organic film.

[0004] To address this technical issue, the plastic encapsulation process is typically used to break through the film surrounding the bottom of the non-filter chip, allowing the plastic encapsulation compound to fill the bottom cavity. This prevents solder ball softening and short-circuiting, thereby improving the reliability of the bottom solder ball. However, if the mold flow pressure of the encapsulation compound is too high during the plastic encapsulation process, the film surrounding the bottom of the filter chip can be broken, destroying the cavity structure at the bottom of the filter chip and reducing the chip's filtering performance. If the mold flow pressure of the encapsulation compound is too low, it is difficult to break through the film surrounding the bottom of the non-filter chip, which can easily lead to solder ball softening and short-circuiting. Utility Model Content

[0005] The purpose of the present utility model is to provide a coating carrier and a coating device, which can form an opening on the coating around the bottom of the non-filtering chip, so as to facilitate the plastic packaging material to fill the cavity structure at the bottom of the non-filtering chip, prevent the solder ball from softening and short-circuiting, and improve the reliability of the bottom solder ball.

[0006] The embodiment of the present utility model is achieved as follows:

[0007] In a first aspect, the present invention provides a film laminating carrier, comprising:

[0008] outer frame;

[0009] The enclosure portion is provided on the inner side of the outer frame; the enclosure portion is provided with a receiving groove; the side of the enclosure portion provided with the receiving groove is used to connect with the substrate so that the chip on the substrate is located in the receiving groove;

[0010] Connecting bars are used to connect the plurality of enclosures and to connect the enclosures and the outer frame.

[0011] In an optional embodiment, a projection of the connecting rib on the substrate is located on a cutting path of the substrate.

[0012] In an optional embodiment, the accommodating groove is configured as a through groove that passes through the enclosure portion.

[0013] In an optional embodiment, the enclosure portion is independently provided on two opposite sides of the connecting reinforcement.

[0014] In an optional embodiment, the enclosure portion includes a fixing portion and a surrounding frame, the fixing portion is connected to the surrounding frame, and the fixing portion is connected to the connecting reinforcement.

[0015] In an optional embodiment, the enclosure portion passes through the connecting ribs along a first direction, and the connecting ribs are connected to both sides of the enclosure portion along a second direction; the first direction and the second direction are perpendicular.

[0016] In an optional embodiment, a positioning piece connected to the substrate is provided on the outer frame.

[0017] In an optional embodiment, the positioning member is a positioning hole or a positioning block.

[0018] In an optional embodiment, the positioning members are provided at the four corners of the outer frame.

[0019] In the second aspect, the utility model provides a coating device, comprising a substrate, a bonding glue and a coating carrier as described in any one of the aforementioned embodiments, wherein the coating carrier is attached to the substrate by the bonding glue before coating, and the coating carrier is separated from the substrate by debonding after coating, and an opening is formed on the coating.

[0020] The beneficial effects of the embodiments of the present utility model include:

[0021] The film carrier provided by the present invention comprises an outer frame, a retaining portion, and connecting ribs, resulting in a simple structure and convenient mounting. The retaining portion can be positioned around the chip, and when the film carrier is separated from the substrate, an opening is formed in the film to allow the molding compound to fill the cavity structure at the bottom of the chip, thereby improving the reliability of the solder balls at the bottom of the chip.

[0022] The coating device provided by the embodiment of the present invention includes the above-mentioned coating carrier, which facilitates the formation of openings on the coating around the bottom of the chip, facilitates the filling of the molding compound into the cavity structure at the bottom of the chip, and improves the reliability of the solder balls at the bottom of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 A schematic diagram of the first structure of the film-coating carrier provided by an embodiment of the present utility model;

[0025] Figure 2 A schematic diagram of the second structure of the film-coating carrier provided by an embodiment of the present utility model;

[0026] Figure 3 This is a schematic diagram of the third structure of the film-coating carrier provided in an embodiment of the present utility model.

[0027] Icon: 100 - laminating carrier; 110 - outer frame; 120 - enclosure; 121 - receiving groove; 123 - enclosure; 125 - fixing part; 130 - connecting reinforcement; 140 - positioning piece. DETAILED DESCRIPTION

[0028] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0031] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is typically placed when in use. These terms are intended solely to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0032] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0033] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0034] During the chip packaging process, the chip is first mounted on the substrate. Since there is more than one type of chip on the substrate, for example, both a filter chip and a non-filter chip need to be mounted on the substrate. It is easy to understand that when packaging the filter chip, a cavity structure needs to be formed at the bottom of the chip to meet the filtering requirements, and this cavity structure cannot be contaminated. If the cavity structure is contaminated, it will directly affect the filtering quality of the chip and the communication quality. For the non-filter chip on the substrate, there is no need to set a cavity structure at the bottom. Moreover, if there is a cavity structure at the bottom of the non-filter chip, the solder balls of the closely spaced chips may soften and short-circuit during the subsequent reflow soldering and organic film heating and curing process. Therefore, for the packaging structure with both filter chips and non-filter chips on the substrate, it is necessary to form a cavity structure at the bottom of the filter chip, but not at the bottom of the non-filter chip. In other words, the cavity structure at the bottom of the non-filter chip is filled with plastic encapsulation material. During the plastic encapsulation process, if the mold flow pressure of the molding compound is too high, it is easy to break the film around the bottom of the filter chip, destroying the cavity structure at the bottom of the filter chip and reducing the chip's filtering performance. If the mold flow pressure of the molding compound is too low, it is difficult to break the film around the bottom of the non-filter chip, which is likely to cause solder ball softening and short circuit.

[0035] To overcome this drawback of the prior art, this embodiment proposes a film carrier 100 that facilitates the formation of openings in the film surrounding the bottom of the non-filter chip. This reduces the pressure accuracy requirements for the subsequent molding process, allowing the molding compound to more easily enter the cavity structure at the bottom of the non-filter chip through the openings and fill the cavity structure. At the same time, the molding compound is prevented from breaking through the film surrounding the bottom of the filter chip, maintaining the integrity of the cavity structure at the bottom of the filter chip and preventing contamination, thereby ensuring the reliable operation and filtering quality of the filter chip.

[0036] Please refer to Figure 1 The coating carrier 100 provided in this embodiment includes an outer frame 110, an enclosure 120 and connecting ribs 130, and the enclosure 120 is arranged on the inner side of the outer frame 110. The enclosure 120 is provided with a receiving groove 121. The side of the enclosure 120 provided with the receiving groove 121 is used to connect with the substrate so that the chip on the substrate is located in the receiving groove 121. The connecting ribs 130 are used to connect multiple enclosures 120 and to connect the enclosure 120 and the outer frame 110. The coating carrier 100 can form an opening on the coating when it is separated from the substrate so that the plastic encapsulation material can fill the cavity structure at the bottom of the chip, thereby preventing the solder ball from softening and short-circuiting, and improving the reliability of the solder balls at the bottom of the chip.

[0037] It will be appreciated that the retaining portion 120 is disposed around the non-filtering chip on the substrate, i.e., around the chip that does not require a bottom cavity. This facilitates tearing the film around the bottom of the non-filtering chip to form an opening, allowing the molding compound to enter through the opening and fill the bottom cavity. Therefore, the size, shape, position, and number of the retaining portion 120 can be designed based on the size, shape, position, and number of the chip on the substrate that does not require a bottom cavity, and are not specifically limited here.

[0038] The connecting ribs 130 can connect multiple enclosures 120 together to form a whole with the outer frame 110, which is convenient for mounting the film carrier 100 on the substrate at one time, thereby improving mounting efficiency. Without the provision of the connecting ribs 130, the enclosures 120 will be attached to the periphery of the chip one by one, which is very inefficient, and the precision deviation of multiple mountings is large. Optionally, the projection of the connecting ribs 130 on the substrate is located on the cutting path of the substrate. In this way, the design of the connecting ribs 130 can be reduced, materials can be saved, and the structure can be compact. Moreover, when the film carrier 100 is separated from the substrate, the connecting ribs 130 can remove the film on the cutting path at the same time, reducing the area of ​​the film that ultimately remains on the substrate, which is beneficial to improving the bonding strength of the plastic package and making the structure more reliable. If there is a lot of residual film, it is easy to cause the plastic package to delaminate, reducing the bonding strength of the plastic package.

[0039] Optionally, the receiving groove 121 is configured as a through groove that passes through the enclosure 120, that is, only the annular peripheral wall of the enclosure 120 blocks the periphery of the chip. In this way, when the film carrier 100 is separated and removed, the film around the chip can be torn open to form an opening, making it easier for the molding compound to fill the bottom cavity structure.

[0040] Combine Figure 1 、 Figure 2 Preferably, in this embodiment, the receiving groove 121 is a blind hole and does not penetrate the enclosure 120. That is, the enclosure 120 has an annular peripheral wall that blocks the periphery of the chip and a top wall that blocks the side of the chip away from the substrate, completely covering the chip. This arrangement allows the film around and on the top of the chip to be torn open when the film carrier 100 is separated and removed, allowing the film on the top of the chip to be removed, reducing the remaining film on the substrate and improving the bonding strength of the plastic package.

[0041] Combine Figure 1 Optionally, the enclosure portion 120 is independently arranged on two opposite sides of the connecting rib 130. Optionally, the enclosure portion 120 includes a fixing portion 125 and a frame 123, the fixing portion 125 is connected to the frame 123, and the fixing portion 125 is connected to the connecting rib 130. The frame 123 is arranged on two opposite sides of the connecting rib 130. This structure is suitable for the symmetrical part of the non-filter chip on the substrate along the cutting path, and accordingly, the enclosure portion 120 is also symmetrically distributed along the connecting rib 130. Of course, the frame 123 can also be set on one side of the connecting rib 130 according to the actual chip mounting layout. That is, an asymmetric design is adopted, which has better flexibility and is suitable for asymmetric designs such as random layout and irregular layout of non-filter chips on the substrate.

[0042] Combine Figure 2 、 Figure 3 Optionally, the retaining portion 120 extends through the connecting rib 130 along a first direction, and the connecting rib 130 connects to both sides of the retaining portion 120 along a second direction; the first direction and the second direction are perpendicular. That is, the retaining portions 120 are continuously arranged at the connecting rib 130. In this way, the same retaining portion 120 can block the periphery of multiple non-filtering chips, reducing the number of retaining portions 120. When separating and removing the film carrier 100, a larger area of ​​the film is removed, and a smaller area of ​​the film remains, which is beneficial for improving the bonding strength of the plastic package. In addition, this design can also reduce the number of connecting ribs 130.

[0043] I understand. Figure 2 The receiving groove 121 of the middle enclosure portion 120 is a through groove. Figure 3 The receiving groove 121 of the middle enclosure portion 120 is a blind hole and does not penetrate the enclosure portion 120 .

[0044] Optionally, the outer frame 110 is provided with a positioning member 140 connected to the substrate. The positioning member 140 is a positioning hole or a positioning block. If a positioning hole is provided on the substrate, a positioning block is provided on the outer frame 110. If a positioning block is provided on the substrate, a positioning hole is provided on the outer frame 110. When attaching the laminating carrier 100 to the substrate, the positioning block is inserted into the positioning hole to facilitate the positioning of the laminating carrier 100 on the substrate. In this embodiment, the outer frame 110 is provided with positioning blocks, and the positioning blocks are located at the four corners of the outer frame 110.

[0045] The outer frame 110 is fixed to the substrate by bonding adhesive. After lamination, the lamination carrier 100 is separated from the substrate by a debonding process. Optionally, the bonding adhesive can be a photosensitive thermoplastic. During the debonding process, the bonding adhesive is irradiated with ultraviolet light to separate the lamination carrier 100 from the substrate.

[0046] An embodiment of the present invention also provides a coating device, including a substrate, bonding glue and a coating carrier 100 as any one of the aforementioned embodiments. The coating carrier 100 is mounted on the substrate by bonding glue before coating. After coating, the coating carrier 100 is separated from the substrate by debonding and an opening is formed on the coating.

[0047] The operating principle of the film laminating carrier 100 is as follows:

[0048] First, chips are mounted on the substrate, where the chips include filter chips and non-filter chips, such as non-filter chips including but not limited to radio frequency chips, memory chips, switch chips, etc.

[0049] The film carrier 100 is then mounted on the substrate. The film carrier 100 is positioned by the positioning members 140 and the substrate, and then secured to the substrate using bonding adhesive. After the film carrier 100 is mounted, the enclosure 120 is positioned around the non-filtering chip, or positioned above the non-filtering chip. In other words, the non-filtering chip is positioned within the receiving groove 121 of the enclosure 120.

[0050] A covering film is laid on the substrate, and cavity structures are formed at the bottom of the filter chip and the bottom of the non-filter chip respectively.

[0051] The film carrier 100 and the substrate are separated by a debonding process. When the film carrier 100 is separated, the film is torn upwards to form openings at locations corresponding to the film carrier 100. The film around the bottom and top of the non-filter chip is removed.

[0052] The encapsulating compound enters the substrate, encapsulating the filter chip and the non-filter chip. The encapsulating compound enters the bottom of the non-filter chip from the opening of the film, filling the cavity structure at the bottom of the non-filter chip and improving the reliability of the solder balls at the bottom of the non-filter chip. Since the retaining portion 120 of the film carrier 100 is only provided on the periphery of the non-filter chip, and there is no retaining portion 120 around the filter chip, when the film carrier 100 is separated, the film around the filter chip is not torn, thereby ensuring the integrity of the cavity structure at the bottom of the filter chip, preventing it from being impacted and contaminated by the plastic molding flow, and ensuring the working reliability and filtering quality of the filter chip.

[0053] In summary, the laminating carrier 100 and the laminating device provided by the embodiment of the present invention have the following beneficial effects, including:

[0054] The film carrier 100 provided in this embodiment of the utility model comprises an outer frame 110, a retaining portion 120, and connecting ribs 130, exhibiting a simple structure and convenient mounting. The retaining portion 120 can be positioned around the non-filtering chip. When separated from the substrate, the film carrier 100 forms an opening in the film, allowing the plastic encapsulation compound to fill the cavity structure at the bottom of the non-filtering chip, thereby improving the reliability of the solder balls at the bottom of the non-filtering chip. This also helps reduce residual film on the substrate, improves the bonding strength of the plastic encapsulation, prevents structural delamination, and provides a more reliable structure.

[0055] The coating device provided by the embodiment of the present invention includes the above-mentioned coating carrier 100, which facilitates the formation of openings on the coating around the bottom of the non-filtering chip, facilitates the filling of the plastic packaging material into the cavity structure at the bottom of the non-filtering chip, and improves the reliability of the solder balls at the bottom of the chip.

[0056] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A film-coating carrier, characterized in that: include: External frame; The enclosure part is arranged on the inner side of the outer frame; the enclosure part is provided with a receiving groove; the side of the enclosure part provided with the receiving groove is used to connect with the substrate so that the chip on the substrate is located in the receiving groove; Connecting bars are used to connect the plurality of enclosures and to connect the enclosures and the outer frame.

2. The film-coating carrier according to claim 1, characterized in that: The projection of the connecting rib on the substrate is located on the cutting path of the substrate.

3. The film-coating carrier according to claim 1, characterized in that: The accommodating groove is configured as a through groove, penetrating the enclosure portion.

4. The film-coating carrier according to claim 1, characterized in that: The enclosure parts are independently arranged on two opposite sides of the connecting reinforcement.

5. The film-coating carrier according to claim 4, characterized in that: The enclosure portion includes a fixing portion and an enclosure frame, wherein the fixing portion is connected to the enclosure frame, and the fixing portion is connected to the connecting reinforcement.

6. The film-coating carrier according to claim 1, characterized in that: The enclosure portion penetrates the connecting ribs along a first direction, and the connecting ribs are connected to two sides of the enclosure portion along a second direction; the first direction is perpendicular to the second direction.

7. The film-coated carrier according to any one of claims 1 to 6, characterized in that: The outer frame is provided with a positioning piece connected with the base plate.

8. The film-coating carrier according to claim 7, characterized in that: The positioning piece is a positioning hole or a positioning block.

9. The film-coating carrier according to claim 7, characterized in that: The positioning members are arranged at four corners of the outer frame.

10. A film coating device, characterized in that: It comprises a substrate, a bonding adhesive and a coating carrier as described in any one of claims 1 to 9, wherein the coating carrier is attached to the substrate by the bonding adhesive before coating, and the coating carrier is separated from the substrate by debonding after coating, and an opening is formed on the coating.

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