Wafer suction cup based on Bernoulli principle

Abstract

The utility model relates to a wafer suction cup based on the Bernoulli principle, and belongs to the technical field of wafer production equipment. In the wafer suction cup based on the Bernoulli principle, the annular groove of the rotating disc and the annular sealing ring on the framework form an annular air channel together, and air flows out from the air channel, passes through the middle ventilation column, the ventilation pipe and the annular groove and flows out from the air spraying opening. A middle ventilation column, a ventilation pipe, an annular groove and an air spraying opening can guarantee that the cross sectional areas of the air channels are consistent only by guaranteeing the machining precision, and the pressure of air sprayed out of the whole rotating disc is consistent. Gas is limited in the components, so that liquid can be prevented from being sucked back to corrode other components. Meanwhile, the middle ventilation column, the ventilation pipe and the annular groove are of a flat structure, and the overall height of the suction cup is reduced. Moreover, the framework is arranged to fix the annular sealing ring and the breather pipe in a matched mode, so that overall assembly is convenient, and component position positioning is accurate.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer production equipment, and in particular, relates to a wafer suction cup based on the Bernoulli principle. Background Art

[0002] The Bernoulli suction cup of the wafer single-wafer cleaning equipment is used to fix the wafer. During operation, the Bernoulli suction cup sprays gas and uses the Bernoulli principle to fix the wafer on the suction cup.

[0003] The specification of CN116053189A, paragraphs

[0028] and

[0031] and Figure 3 Figures 9 and 10 disclose a Bernoulli suction cup for single-wafer cleaning equipment, in which air holes are evenly distributed radially on the wafer suction cup, and a gas channel is formed between the upper limit plate and the wafer suction cup to adsorb and fix the wafer. Since a mounting hole is also provided in the middle of the suction cup, that is, the entire top suction cup is divided into three, the integrity of the suction cup is affected. In the case of strict requirements on processing accuracy, strict requirements on assembly accuracy are also required. After a number of air holes are evenly distributed radially on the wafer suction cup, a circular upward airflow is directly formed, and it is difficult to ensure that the cross-sectional area of ​​the gas channel formed between the upper limit plate and the wafer suction cup is exactly the same. The wafer suction cup often deviates to one side relative to the upper limit plate, resulting in uneven force on the wafer, which further causes the wafer to deviate to one side. Utility Model Content

[0004] The technical problem to be solved by the utility model is: to solve the deficiencies in the prior art, thereby providing a wafer suction cup based on the Bernoulli principle, which has uniform force on the wafer and is easy to assemble.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A wafer chuck based on Bernoulli's principle, comprising:

[0007] A turntable, the back of which is provided with an annular groove and a plurality of air jets arranged in an annular manner, with one end opening through the turntable being located on the top surface of the turntable and the other end opening being located in the annular groove;

[0008] The support plate is arranged on the back of the turntable and forms a mounting cavity between the support plate and the turntable;

[0009] A skeleton is arranged in the installation cavity, and has a central hole and a strip groove. An intermediate ventilation column is arranged in the central hole, and a ventilation pipe is arranged in the strip groove. An annular sealing ring is also arranged on the skeleton, and the annular sealing ring is arranged on the notch of the annular groove of the turntable to form an annular airway. One end of the ventilation pipe is connected with the intermediate ventilation column, and an interface is arranged on the ventilation pipe to connect the ventilation pipe with the annular groove.

[0010] Preferably, in the wafer suction cup based on Bernoulli's principle of the present invention, the annular groove comprises a first annular groove and a second annular groove, wherein the first annular groove is located outside the second annular groove.

[0011] Preferably, in the wafer suction cup based on Bernoulli principle of the utility model, the annular sealing ring comprises a circular ring and sealing rings located on both sides of the circular ring, and the circular ring has an opening for the interface to extend into.

[0012] Preferably, in the wafer suction cup based on Bernoulli's principle of the present invention, there are a plurality of ventilation tubes, all of which are connected to the middle ventilation column at the same time, and the middle ventilation column is connected to the vertically arranged gas channel.

[0013] Preferably, in the wafer suction cup based on Bernoulli's principle of the present invention, the bottom of the supporting plate is connected to the rotating shaft, the rotating shaft is driven by the driving member to rotate, so that the supporting plate, the rotating plate and the skeleton rotate together, and the gas channel is located in the rotating shaft.

[0014] Preferably, in the wafer suction cup based on Bernoulli's principle of the present invention, the end of the intermediate ventilation column is connected to the first annular groove through an L-shaped interface, and a T-shaped interface is arranged in the middle of the intermediate ventilation column to be connected to the second annular groove.

[0015] Preferably, in the wafer suction cup based on Bernoulli's principle of the present invention, the outer side of the turntable has a recess, and the positioning pin is arranged in the recess.

[0016] Preferably, in the wafer suction cup based on Bernoulli's principle of the present invention, the turntable, the annular sealing ring, the interface, the ventilation pipe, the middle ventilation column and the gas channel are plastic parts.

[0017] Preferably, in the wafer suction cup based on Bernoulli's principle of the present invention, the turntable has a downward outer edge to cover the support plate.

[0018] The beneficial effects of the utility model are:

[0019] The wafer suction cup based on Bernoulli principle of the present application, the annular groove of the turntable and the annular sealing ring on the skeleton together form an annular airway, the gas flows from the gas channel, through the intermediate ventilation column, the ventilation pipe, the annular groove, and flows out from the air jet. The intermediate ventilation column, the ventilation pipe, the annular groove and the air jet only need to ensure the processing accuracy to ensure the consistency of the cross-sectional area of ​​the airway, so that the pressure of the gas sprayed on the entire turntable is consistent. The gas is confined in the above-mentioned components, which can prevent the liquid from being sucked back and corroding other components. At the same time, the intermediate ventilation column, the ventilation pipe, and the annular groove are flat structures, which reduces the overall height of the suction cup. In addition, a skeleton is set to cooperate with the fixed annular sealing ring and the ventilation pipe, so that the overall assembly is convenient and the positioning of the components is accurate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The technical solution of the present application is further described below in conjunction with the accompanying drawings and embodiments.

[0021] Figure 1 is a stereoscopic diagram of a wafer chuck based on the Bernoulli principle according to an embodiment of the present application;

[0022] Figure 2 yes Figure 1 A cross-sectional view of

[0023] Figure 3 is a three-dimensional diagram of a skeleton with an annular sealing ring according to an embodiment of the present application;

[0024] Figure 4 is a three-dimensional diagram of a skeleton of an embodiment of the present application;

[0025] Figure 5 is a three-dimensional diagram of a turntable according to an embodiment of the present application;

[0026] Figure 6 It is a cross-sectional view of the structure between the support plate and the rotating plate of the embodiment of the present application; the reference numerals in the figure are:

[0027] 1 turntable;

[0028] 2 skeleton;

[0029] 3 Support plate;

[0030] 4. Positioning pins;

[0031] 10 jets;

[0032] 11 annular groove;

[0033] 13 Depression;

[0034] 14 Mounting block;

[0035] 21 intermediate ventilation column;

[0036] 22 ventilator;

[0037] 23, 24 annular sealing ring;

[0038] 61 gas channel;

[0039] 63 shaft;

[0040] 64 dowel pin drive assembly;

[0041] 111 first annular groove;

[0042] 112 second annular groove;

[0043] 201 center hole;

[0044] 202 strip slots;

[0045] 231, 241 Ring

[0046] 232, 242 sealing ring;

[0047] 251 L-shaped interface;

[0048] 252 T-shaped interface. DETAILED DESCRIPTION

[0049] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application may be combined with each other.

[0050] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention of the present utility model, unless otherwise specified, "multiple" means two or more.

[0051] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood by specific circumstances.

[0052] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0053] Example

[0054] This embodiment provides a wafer chuck based on the Bernoulli principle, such as Figure 2 As shown, including:

[0055] Turntable 1, such as Figure 1 and 5As shown, the back of the turntable 1 has an annular groove 11 and a plurality of circular air jets 10 arranged in an annular manner, with one end opening through the turntable 1 located on the top surface of the turntable 1 and the other end opening located in the annular groove 11;

[0056] Support plate 3, such as Figure 3 and Figure 4 As shown, it is arranged on the back of the turntable 1, and a mounting cavity is formed between the turntable 1;

[0057] Skeleton 2, such as Figure 4 As shown, it is arranged in the installation cavity, has a center hole 201 and a strip groove 202, an intermediate ventilation column 21 is arranged in the center hole 201, a ventilation pipe 22 is arranged in the strip groove 202, and annular sealing rings 23 and 24 are also arranged on the skeleton 2, and the annular sealing rings 23 and 24 are arranged on the notch of the annular groove 11 of the turntable 1 to form an annular airway, one end of the ventilation pipe 22 is connected with the intermediate ventilation column 21 (connected with the side wall of the intermediate ventilation column 21), and an interface is arranged on the ventilation pipe 22 to connect the ventilation pipe 22 with the annular groove 11.

[0058] In the wafer suction cup based on Bernoulli's principle of this embodiment, the annular groove of the turntable 1 and the annular sealing ring 24 on the skeleton 2 form an annular airway, and the gas flows from the gas channel 61, through the intermediate ventilation column 21, the vent pipe 22, the annular groove 11, and flows out from the air jet 10. The intermediate ventilation column 21, the vent pipe 22, the annular groove 11 and the air jet 10 only need to ensure the processing accuracy to ensure that the cross-sectional area of ​​the airway is consistent, so that the pressure of the gas ejected from the entire turntable is consistent. The gas is confined in the above-mentioned components, which can prevent the liquid from being sucked back (the liquid flows back from the air jet 10 to the intermediate ventilation column 21 and other components), thereby corroding other components. At the same time, the intermediate ventilation column 21, the vent pipe 22, and the annular groove 11 are flat structures, which reduce the overall height of the suction cup. In addition, the skeleton 2 is set to cooperate with the fixed annular sealing rings 23, 24 and the vent pipe 22, so that the overall assembly is convenient and the component position is accurately positioned.

[0059] Furthermore, if Figure 2 , 3 As shown in FIG. 5 , the annular groove includes a first annular groove 111 and a second annular groove 112, wherein the first annular groove 111 is located outside the second annular groove 112 to form two circles of annular grooves and two circularly arranged air jets 10. The wafer can be acted upon by the gas ejected from the two circles of air jets 10, so that the force acting on the entire wafer is more uniform.

[0060] Furthermore, if Figure 3As shown, the annular sealing rings 23, 24 include circular rings 231, 241 and sealing rings 232, 242 located on both sides of the circular rings 231, 241, and the circular rings 231, 241 have openings for the L-shaped interface 251 or the T-shaped interface 252 to extend into. The sealing rings 232, 242 are used to seal the gap between the circular rings 231, 241 and the rotating disk 1, and the two sealing rings 232, 242 seal the outer diameter and the inner diameter respectively, so that the annular groove 11 is sealed.

[0061] Furthermore, if Figure 3 As shown, there are a plurality of (six) ventilation pipes 22, and the six ventilation pipes 22 are simultaneously connected to the middle ventilation column 21, and the middle ventilation column 21 is connected to the vertically arranged gas channel 61. The six ventilation pipes 22 are arranged radially.

[0062] Furthermore, the end of the intermediate ventilation column 21 is connected to the first annular groove 111 through an L-shaped interface 251, and a T-shaped interface 252 is arranged in the middle of the intermediate ventilation column 21 to communicate with the second annular groove 112, that is, the L-shaped interface 251 and one of the openings of the T arranged in the middle are respectively connected to the first annular groove 111 and the second annular groove 112. The two interfaces are used to correspond to different positions of the intermediate ventilation column 21, the T-shaped interface 252 can allow gas to pass directly, and the L-shaped interface 251 can both seal the end and allow gas to flow upward, so that the same intermediate ventilation column 21 can supply gas to the two annular grooves at the same time.

[0063] The frame 2 is directly fixed to the turntable 1 by screws, and the frame 2 (including the middle ventilation column 21 and the ventilation pipe 22) rotates together with the turntable 1.

[0064] Furthermore, the turntable 1 has a mounting hole in the middle, and a mounting block 14 is provided in the mounting hole to block the mounting hole, and the middle ventilation column 21 is correspondingly provided at the mounting hole position. The mounting block 14 and the body of the turntable 1 are sealed by a sealing ring. The mounting hole is provided in the middle of the turntable 1 to facilitate the installation of the middle ventilation column 21.

[0065] Furthermore, the bottom of the support plate 3 is connected to the rotating shaft 63, and the rotating shaft 63 is driven by the driving member to rotate, so that the support plate 3, the rotating plate 1, and the frame 2 rotate together, and the gas channel 61 is located in the rotating shaft 63. The top of the gas channel 61 has a protrusion, which extends into the protrusion on the middle ventilation column 21, thereby forming a labyrinth seal structure. When the middle ventilation column 21 rotates with the rotating plate 1, the gas channel 61 does not rotate. The support plate 3 is provided with a recess 203 on its circumference for the positioning pin driving assembly 64 to pass through.

[0066] The positioning pin drive assembly 64 drives the positioning pin 4 to rotate to clamp the wafer or release the wafer. The claws at the top of the positioning pin 4 move closer to each other to clamp the wafer, and move away from each other to release the clamp. The positioning pin 4 is limited to a position and exerts a clamping force to prevent the wafer from being crushed.

[0067] The outer side of the turntable 1 has a recess 13 , and the positioning pin 4 is arranged in the recess 13 . Such an arrangement can reduce the arrangement height of the positioning pin 4 , so that the wafer can be closer to the turntable 1 .

[0068] The turntable 1, the annular sealing ring 24, the interface (L-shaped interface 251 or T-shaped interface 252), the vent pipe 22, the intermediate vent column 21 and the gas channel 61 are made of plastic parts, such as polyvinylidene fluoride (PVDF). Plastic parts have the function of acid and alkali corrosion resistance. Once an acid cleaning liquid or an alkaline cleaning liquid is used in the cleaning liquid, it is possible to enter the turntable 1 and other parts through the air jet 10. The use of plastic parts can prevent the cleaning liquid from corroding.

[0069] Furthermore, the turntable 1 has a downward outer edge to cover the support disk 3 to completely cover the support disk 3. The turntable 1 can protect the support disk 3 from being corroded by acidic and alkaline cleaning solutions.

[0070] To ensure strength, the support plate 3 , the frame 2 and the like are metal parts, and the frame 2 is completely located between the turntable 1 and the support plate 3 .

[0071] Based on the above ideal embodiments of this application, the relevant staff can make various changes and modifications without departing from the technical concept of this application through the above description. The technical scope of this application is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wafer chuck based on Bernoulli's principle, characterized in that: include: A turntable (1), the back side of the turntable (1) having an annular groove (11) and a plurality of circular air jets (10) arranged in an annular pattern, one end opening of the turntable (1) being located on the top surface of the turntable (1) and the other end opening being located in the annular groove (11); A support plate (3) is arranged on the back of the turntable (1) and forms a mounting cavity between the support plate and the turntable (1); A skeleton (2) is arranged in the installation cavity and has a central hole (201) and a strip groove (202); an intermediate ventilation column (21) is arranged in the central hole (201); a ventilation pipe (22) is arranged in the strip groove (202); an annular sealing ring (23, 24) is also arranged on the skeleton (2); the annular sealing ring (23, 24) is arranged on the notch of the annular groove (11) of the turntable (1) to form an annular airway; one end of the ventilation pipe (22) is connected to the intermediate ventilation column (21); and an interface is arranged on the ventilation pipe (22) to connect the ventilation pipe (22) with the annular groove (11).

2. The wafer chuck based on the Bernoulli principle according to claim 1, characterized in that: The annular groove comprises a first annular groove (111) and a second annular groove (112), wherein the first annular groove (111) is located outside the second annular groove (112).

3. The wafer chuck based on the Bernoulli principle according to claim 1 or 2, characterized in that: The annular sealing ring (23, 24) comprises a circular ring (231, 241) and sealing rings (232, 242) located on both sides of the circular ring (231, 241); the circular ring (231, 241) has an opening for the interface to extend into.

4. The wafer chuck based on the Bernoulli principle according to claim 1, characterized in that: There are a plurality of ventilation pipes (22), and all of the ventilation pipes (22) are simultaneously connected to the middle ventilation column (21), and the middle ventilation column (21) is connected to a vertically arranged gas channel (61).

5. The wafer chuck based on the Bernoulli principle according to claim 4, characterized in that: The bottom of the support plate (3) is connected to the rotating shaft (63), and the rotating shaft (63) is driven by the driving member to rotate, thereby causing the support plate (3), the rotating plate (1), and the frame (2) to rotate together, and the gas channel (61) is located inside the rotating shaft (63).

6. The wafer chuck based on the Bernoulli principle according to claim 1, characterized in that: The end of the intermediate ventilation column (21) is connected to the first annular groove (111) via an L-shaped interface (251), and a T-shaped interface (252) is provided in the middle of the intermediate ventilation column (21) and is connected to the second annular groove (112).

7. The wafer chuck based on the Bernoulli principle according to claim 1, characterized in that: The outer side of the rotating disk (1) has a recess (13), and the positioning pin (4) is arranged in the recess (13).

8. The wafer chuck based on the Bernoulli principle according to claim 1, characterized in that: The rotating disk (1), the annular sealing ring (24), the interface, the vent pipe (22), the middle vent column (21) and the gas channel (61) are plastic parts.

9. The wafer chuck based on the Bernoulli principle according to claim 8, characterized in that: The turntable (1) has a downward outer edge to cover the support plate (3).

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