Cell structure photovoltaic diode

Abstract

The utility model discloses a Cell structure photovoltaic diode, which comprises a resin packaging shell and a resin packaging cover matched with the resin packaging shell, a positioning frame is fixedly mounted at the bottom of the inner wall of the resin packaging shell, a cell chip is clamped on the positioning frame, contact terminals are fixedly arranged at the two ends of the cell chip, and the contact terminals are fixedly connected with the resin packaging shell. The two sides of the positioning frame are respectively and fixedly provided with a wiring pin assembly, the two ends of the resin packaging shell are respectively and fixedly provided with a pin protection assembly, and the two sides of the bottom end of the resin packaging cover are respectively and fixedly provided with a pressing assembly used for pressing a contact terminal. According to the cell structure photovoltaic diode, the cell chip is packaged by adopting the detachable resin packaging shell, the chip can be quickly positioned and pressed, and the chip can be specifically disassembled and replaced after a fault occurs, so that the later maintenance cost is reduced, and the cell structure photovoltaic diode has the characteristics of stable heat dissipation, convenience in disassembly and assembly, low pin fracture rate and low overall cost.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaic diodes, in particular to a photovoltaic diode with a Cell structure. Background Art

[0002] The diode is an electronic device made of semiconductor materials such as silicon, selenium, and germanium, and is widely used in photovoltaic power supply control circuit boards. Currently, common photovoltaic diodes are mainly composed of three parts, namely a resin packaging shell, a cell semiconductor chip, and positive and negative pins. The cell semiconductor chip is sealed and packaged in a resin shell. For example, a small photovoltaic high-heat dissipation module diode with application number CN202121380993.1 includes a positive terminal, a negative terminal, a diode chip, and a package body; the positive terminal and the negative terminal are both composed of a terminal body in the middle and wiring terminals and chip terminals at both ends of the terminal body, and the chip end of the positive terminal, the chip end of the negative terminal, and the diode chip are all encapsulated in the package body; the above common types of photovoltaic diodes have the following shortcomings in actual applications:

[0003] The chip of the diode is sealed as a whole in a resin shell. During use, if the chip has poor contact, conductive failure and other phenomena, the diode needs to be discarded and replaced as a whole, and the cost of replacement and maintenance is high. Utility Model Content

[0004] The purpose of the utility model is to provide a Cell structure photovoltaic diode to solve the problem of high maintenance cost of the existing photovoltaic diodes mentioned in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a Cell-structured photovoltaic diode, comprising a resin packaging shell and a resin packaging cover matching the resin packaging shell, a positioning frame fixedly installed at the bottom of the inner wall of the resin packaging shell, a cell chip clamped on the positioning frame, contact terminals fixedly installed at both ends of the cell chip, wiring pin assemblies fixedly installed on both sides of the positioning frame, pin protection assemblies fixedly installed at both ends of the resin packaging shell, clamping assemblies for clamping the contact terminals fixedly installed on both sides of the bottom end of the resin packaging cover, and a thermal conductive pad fixedly installed in the middle of the resin packaging cover.

[0006] Preferably, the wiring pin assembly includes a pin terminal and a diode pin fixedly arranged on the pin terminal, and one end of the diode pin extends to the outside of the resin packaging shell; the wiring is convenient to use.

[0007] Preferably, the pin protection assembly includes a pin end shield and positive and negative pole markings fixedly arranged on the surface of the pin end shield, and the pin end shield is arranged on the outside of the diode pin; it is convenient for wiring and use of the diode and can protect the diode pin.

[0008] Preferably, the clamping assembly includes a presser foot column and an insulating pad fixedly arranged at the bottom end of the presser foot column, the contact terminal is arranged opposite to the pin terminal, and the insulating pad is arranged opposite to the contact terminal; the clamping is stable and reliable, and the contact is sufficient.

[0009] Preferably, a sealing pad is fixedly provided on the edge of the resin packaging cover, which can improve the sealing performance of the diode after packaging.

[0010] Preferably, the four corners at the top of the resin packaging cover are all threadedly connected with locking pins, so as to facilitate the disassembly, assembly and maintenance of the diode.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] The cell structure photovoltaic diode uses a detachable resin packaging shell to package the cell chip, which can quickly position and press the chip. After the chip fails, it can be disassembled and replaced in a targeted manner, thereby reducing the subsequent maintenance cost. It has the characteristics of stable heat dissipation, convenient disassembly and assembly, low pin breakage rate and low overall cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the structure of the diode of the utility model;

[0014] Figure 2 It is a front cross-sectional view of the diode of the utility model;

[0015] Figure 3 This is a schematic diagram of the disassembled structure of the diode of the utility model.

[0016] In the figure: 1. Resin packaging shell; 2. Resin packaging cover; 3. Pin end shield; 4. Positive and negative electrode identification; 5. Diode pin; 6. Thermal pad; 7. Positioning frame; 8. Cell chip; 9. Pin terminal; 10. Contact terminal; 11. Presser foot post; 12. Insulation pad; 13. Locking pin; 14. Sealing pad. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0018] See also Figure 1-3The utility model provides a Cell structure photovoltaic diode, comprising a resin packaging shell 1 and a resin packaging cover 2 matched with the resin packaging shell 1, a positioning frame 7 is fixedly installed at the bottom of the inner wall of the resin packaging shell 1, a cell chip 8 is clamped on the positioning frame 7, contact terminals 10 are fixedly installed at both ends of the cell chip 8, wiring pin components are fixedly installed on both sides of the positioning frame 7, pin protection components are fixedly installed at both ends of the resin packaging shell 1, pressing components for pressing the contact terminals 10 are fixedly installed on both sides of the bottom of the resin packaging cover 2, a thermal pad 6 is fixedly installed in the middle of the resin packaging cover 2, a sealing rubber pad 14 is fixedly installed on the edge of the resin packaging cover 2, and four corners of the top of the resin packaging cover 2 are threadedly connected with locking pins 13;

[0019] When in use, the thermal pad 6 directly extends to the bottom of the resin packaging cover 2 and contacts the cell chip 8. The heat generated by the cell chip 8 during operation is transferred to the outside through heat transfer, thereby ensuring the stability of the diode operation.

[0020] See also Figure 1 , Figure 2 and Figure 3 , further, the wiring pin assembly includes a pin terminal 9 and a diode pin 5 fixedly arranged on the pin terminal 9, one end of the diode pin 5 extends to the outside of the resin package shell 1, the pressing assembly includes a presser foot column 11 and an insulating pad 12 fixedly arranged at the bottom end of the presser foot column 11, the contact terminal 10 is arranged opposite to the pin terminal 9, and the insulating pad 12 is arranged opposite to the contact terminal 10;

[0021] When in use, after the resin packaging cover 2 is buckled, the presser foot 11 will pass through the insulating pad 12 from the top of the contact terminal 10 to firmly press the contact terminal 10 onto the pin terminal 9, thereby connecting the cell chip 8 to electricity and ensuring tight contact to avoid poor contact.

[0022] See also Figure 1 and Figure 2 , further, the pin protection assembly includes a pin end shield 3 and a positive and negative electrode mark 4 fixedly arranged on the surface of the pin end shield 3, and the pin end shield 3 is arranged on the outside of the diode pin 5;

[0023] When in use, positive and negative pole markings 4 are set on the surface of the pin end shield 3 to facilitate wiring of the diode. The pin end shield 3 can protect the end of the diode pin 5 to prevent the pin from breaking from the end, thereby extending the service life of the diode.

[0024] When the embodiment of the present application is in use: after the cell chip 8 fails, the maintenance personnel can successively loosen and remove the locking pins 13, open the resin packaging cover 2, buckle the damaged cell chip 8 from the positioning frame 7, and re-clamp the new one on the positioning frame 7, so that the contact terminals 10 of the cell chip 8 are respectively pressed on the two pin terminals 9, and finally cover the resin packaging cover 2 and re-tighten the locking pins 13 to facilitate later maintenance and replacement.

[0025] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A cell structure photovoltaic diode, comprising a resin packaging shell (1) and a resin packaging cover (2) matching the resin packaging shell (1), characterized in that: A positioning frame (7) is fixedly mounted on the bottom of the inner wall of the resin packaging shell (1), a cell chip (8) is clamped on the positioning frame (7), contact terminals (10) are fixedly mounted on both ends of the cell chip (8), wiring pin assemblies are fixedly mounted on both sides of the positioning frame (7), pin protection assemblies are fixedly mounted on both ends of the resin packaging shell (1), pressing assemblies for pressing the contact terminals (10) are fixedly mounted on both sides of the bottom end of the resin packaging cover (2), and a thermal pad (6) is fixedly mounted in the middle of the resin packaging cover (2).

2. The Cell structure photovoltaic diode according to claim 1, characterized in that: The wiring pin assembly comprises a pin terminal (9) and a diode pin (5) fixedly arranged on the pin terminal (9), and one end of the diode pin (5) extends to the outside of the resin packaging shell (1).

3. The Cell structure photovoltaic diode according to claim 2, characterized in that: The pin protection component comprises a pin end shield (3) and positive and negative pole markings (4) fixedly arranged on the surface of the pin end shield (3); the pin end shield (3) is arranged on the outside of a diode pin (5).

4. The Cell structure photovoltaic diode according to claim 2, characterized in that: The clamping assembly comprises a presser foot column (11) and an insulating pad (12) fixedly arranged at the bottom end of the presser foot column (11); the contact terminal (10) is arranged opposite to the pin terminal (9); and the insulating pad (12) is arranged opposite to the contact terminal (10).

5. The Cell structure photovoltaic diode according to claim 1, characterized in that: A sealing rubber pad (14) is fixedly arranged on the edge of the resin packaging cover (2).

6. The Cell structure photovoltaic diode according to claim 1, characterized in that: The four corners at the top of the resin packaging cover (2) are all threadedly connected with locking pins (13).

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