USB (Universal Serial Bus) interface grounding conductive gasket for computer and computer

Abstract

The utility model discloses a USB interface grounding conductive gasket for a computer and the computer, the conductive gasket comprises a silica gel protective film, an upper conductive adhesive layer, a lower conductive adhesive layer and conductive cloth, and the silica gel protective film is provided with the upper conductive adhesive layer, the lower conductive adhesive layer and the conductive cloth which are matched with each other from top to bottom in sequence. The USB interface grounding conductive gasket for the computer is used at the USB interface of the computer, is mainly used for grounding and conducting, is convenient for accurate positioning by arranging the positioning hole on the silica gel protective film, and can realize avoidance of a raised element by arranging the avoidance hole on the upper conductive adhesive layer, so that the raised element is protected from being crushed, and the service life of the raised element is prolonged. When in use, a product is directly taken down from the whole release film, is positioned by using the positioning holes, is attached to a corresponding position, and then is removed from the silica gel protective film, so that the attaching process is completed, and the release film is simple in overall structure, good in conductivity and shielding performance, simple in use process, low in cost and suitable for industrial popularization and use.

Description

Technical Field

[0001] The utility model belongs to the technical field of computers, and in particular relates to a grounding conductive pad for a USB plug interface of a computer and a computer. Background Art

[0002] With the development of information technology, the penetration rate of computers is increasing. Computers connect and communicate with external devices through USB interfaces. When computer components are used for a long time, a lot of charges will be generated. If these charges are not released in time, they may be transferred to external devices such as USB flash drives through USB interfaces when using external devices such as USB flash drives, causing electric shock. Although it will not cause great harm to the human body, it will have a poor user experience and is not conducive to promoting the sales of computer products. Utility Model Content

[0003] In order to solve the technical problems existing in the prior art, the purpose of the utility model is to provide a grounding conductive pad for a USB plug interface of a computer and a computer.

[0004] In order to achieve the above purpose and the above technical effect, the technical solution adopted by the utility model is:

[0005] A grounding conductive pad for a USB plug interface of a computer comprises a silicone protective film, an upper conductive adhesive layer, a lower conductive adhesive layer and a conductive cloth, wherein the silicone protective film is provided with a matching upper conductive adhesive layer, a lower conductive adhesive layer and a conductive cloth in sequence from top to bottom.

[0006] Furthermore, the size of the upper conductive adhesive layer is smaller than that of the lower conductive adhesive layer, and the upper conductive adhesive layer cannot completely cover the lower conductive adhesive layer.

[0007] Furthermore, a plurality of positioning holes are provided on the silicone protective film.

[0008] Furthermore, two positioning holes are arranged on the silicone protective film, one positioning hole is arranged at the top of the silicone protective film, and the other positioning hole is arranged at a protrusion on one side of the bottom end of the silicone protective film.

[0009] Furthermore, a plurality of avoidance holes are arranged on the upper conductive adhesive layer.

[0010] Furthermore, the upper conductive adhesive layer, the lower conductive adhesive layer and the conductive cloth are all provided with a first avoidance step, a second avoidance step is provided on the side of the upper conductive adhesive layer away from the first avoidance step, and the silicone protective film is provided with a third avoidance step corresponding to and adapted to the position of the first avoidance step.

[0011] Furthermore, the thickness of the silicone protective film is 0.115±0.004 mm, and the viscosity is 7.5±2.5 g / 25 mm.

[0012] Furthermore, the upper conductive adhesive layer is a conductive double-sided adhesive with a viscosity of >800g / 25mm, a surface impedance of <0.2Ω / sq, and a Z impedance of <0.1Ω / in. 2 , shielding efficiency: 70-80dB.

[0013] Furthermore, the lower conductive adhesive layer is a conductive double-sided adhesive with a thickness of 0.01±0.003 mm and a viscosity of >1000 g / 25 mm.

[0014] Furthermore, the thickness of the conductive fabric is 33±3 μm, the surface impedance is less than 0.1Ω / sq, and the Z impedance is less than 0.05Ω.

[0015] The utility model also discloses a computer, comprising the above-mentioned USB plug interface grounding conductive pad for the computer.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] The utility model discloses a grounding conductive pad for a USB plug interface of a computer and a computer. The conductive pad is used at the USB plug interface of the computer, and its main function is to be grounded and conductive, so as to conduct static electricity and no longer cause problems such as electric shock, thereby improving user experience and promoting the expansion of sales of computer products. Positioning holes are arranged on a silicone protective film to facilitate accurate positioning, and avoidance holes are arranged on an upper conductive adhesive layer to avoid raised components, thereby protecting the raised components from being crushed. When in use, the conductive pad product is directly removed from the entire release film, and the positioning holes are used for positioning, so that the product is efficiently attached to the corresponding position, and then the silicone protective film is removed to complete the attachment process. The overall structure is simple, the conductivity and shielding performance are good, the use process is simple, the cost is low, and it is suitable for industrial promotion and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the utility model;

[0019] Figure 2 It is a front view of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the silicone protective film of the utility model;

[0021] Figure 4 It is a structural schematic diagram of the upper conductive adhesive layer of the utility model;

[0022] Figure 5 It is a structural schematic diagram of the lower conductive adhesive layer of the utility model;

[0023] Figure 6 It is a schematic structural diagram of the conductive cloth of the utility model. DETAILED DESCRIPTION

[0024] The present invention is described in detail below so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.

[0025] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or critical elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0026] like Figure 1-6 As shown, a grounding conductive pad for a USB socket of a computer is used at the USB socket of a computer. The main function is to ground and conduct electricity, and to conduct static electricity, so as to no longer cause problems such as electric shock, thereby improving the user experience. The pad mainly comprises a silicone protective film 1, an upper conductive adhesive layer 2, a lower conductive adhesive layer 3 and a conductive cloth 4, wherein the silicone protective film 1 is provided with a matching upper conductive adhesive layer 2, a lower conductive adhesive layer 3 and a conductive cloth 4 from top to bottom. The size of the upper conductive adhesive layer 2 is smaller than that of the lower conductive adhesive layer 3, and the upper conductive adhesive layer 2 cannot completely cover the lower conductive adhesive layer 3. The silicone protective film 1 is provided with a plurality of positioning holes 5, so that In order to perform precise positioning, a plurality of avoidance holes 6 are provided on the upper conductive adhesive layer 2 for avoiding the raised components, thereby protecting the raised components from being crushed, and a first avoidance step 7 is provided on the upper conductive adhesive layer 2, the lower conductive adhesive layer 3 and the conductive cloth 4, and a second avoidance step 8 is provided on the side of the upper conductive adhesive layer 2 away from the first avoidance step 7. In order to achieve structural consistency and avoidance effect, a third avoidance step 9 corresponding to and matched with the position of the first avoidance step 7 is also provided on the silicone protective film 1. The functions of the first avoidance step 7, the second avoidance step 8 and the third avoidance step 9 are all avoidance effects.

[0027] In some embodiments, two positioning holes 5 are provided on the silicone protective film 1 , wherein one positioning hole 5 is provided at the top of the silicone protective film 1 , and the other positioning hole 5 is provided at a protrusion on one side of the bottom end of the silicone protective film 1 .

[0028] The model of the silicone protective film 1 is CS10106L-25B, the thickness is 0.115±0.004mm, the adhesive surface faces upward, the viscosity is 7.5±2.5g / 25mm, the viscosity is stable, and the surface of the conductive cloth 4 will not be damaged when the silicone protective film 1 is removed.

[0029] The upper conductive adhesive layer 2 is a conductive double-sided adhesive, model PS-1347, thickness 0.25mm, viscosity: >800g / 25mm, surface impedance: <0.2Ω / sq, Z impedance: <0.1Ω / in2 , shielding efficiency: 70-80dB (30MHz-1.5GHz), with conductive properties and shielding effects in XY and Z directions.

[0030] The lower conductive adhesive layer 3 is a conductive double-sided adhesive, model TT-219H-1, with a thickness of 0.01±0.003mm, ultra-thin, more space-saving, and super strong viscosity, viscosity: >1000g / 25mm, impedance value (to copper foil): <0.01Ω (25mm*25mm), <0.05Ω (2mm*2mm), and has excellent conductive properties.

[0031] The model of the conductive cloth 4 is SH-90803WB-33, and the thickness is 33±3μm. The colors of the two opposite sides of the conductive cloth 4 are different, one side is gray and the other side is black. The gray side faces up and the black side faces down and is controlled by glossiness. The glossiness of the black side is 1.2±0.5GU, which is consistent with the color inside the computer and is more beautiful. The surface impedance is <0.1Ω / sq, the Z impedance is <0.05Ω, and it has conductive properties in the XY direction and the Z direction.

[0032] When not in use, the upper conductive adhesive layer 2 is covered with a release film for protection. When in use, the product is removed from the entire release film; the positioning holes 5 on the silicone protective film 1 are used for positioning, and the product is attached to the corresponding position; and then the silicone protective film 1 is removed to complete the attachment process.

[0033] The utility model also discloses a computer, comprising the above-mentioned USB plug interface grounding conductive pad for the computer.

[0034] Example 1

[0035] like Figure 1-6As shown, a grounding conductive pad for a USB socket of a computer is used at the USB socket of a computer. It is mainly used for grounding and conducting electricity. It mainly includes a silicone protective film 1, an upper conductive adhesive layer 2, a lower conductive adhesive layer 3 and a conductive cloth 4. The silicone protective film 1 is provided with a matching upper conductive adhesive layer 2, a lower conductive adhesive layer 3 and a conductive cloth 4 from top to bottom. The size of the upper conductive adhesive layer 2 is smaller than that of the lower conductive adhesive layer 3. The upper conductive adhesive layer 2 cannot completely cover the lower conductive adhesive layer 3. Two positioning holes 5 are provided on the silicone protective film 1 to facilitate precise positioning. One positioning hole 5 is provided at the top of the silicone protective film 1, and the other positioning hole 5 is provided at the bottom of the silicone protective film 1. At the protrusion on one side of the bottom end of the silicone protective film 1, two avoidance holes 6 are provided on the upper conductive adhesive layer 2 for avoiding the protruding components, thereby protecting the protruding components from being crushed. The upper conductive adhesive layer 2, the lower conductive adhesive layer 3 and the conductive cloth 4 are all provided with a first avoidance step 7 at the same position at the top, and a second avoidance step 8 is provided on the side of the upper conductive adhesive layer 2 away from the first avoidance step 7. In order to achieve structural consistency and avoidance effect, a third avoidance step 9 corresponding to and adapted to the position of the first avoidance step 7 is also provided on the silicone protective film 1. The functions of the first avoidance step 7, the second avoidance step 8 and the third avoidance step 9 are all avoidance effects.

[0036] In this embodiment, the model of the silicone protective film 1 is CS10106L-25B, blue, 0.115 mm thick, with the adhesive surface facing upward, and the viscosity is 7.5 g / 25 mm. The viscosity is stable, and the surface of the conductive cloth 4 will not be damaged when the silicone protective film 1 is removed.

[0037] The upper conductive adhesive layer 2 is a conductive double-sided adhesive, gray, model PS-1347, thickness 0.25mm, viscosity: >800g / 25mm, surface impedance: <0.2Ω / sq, Z impedance: <0.1Ω / in 2 , shielding efficiency: 70-80dB (30MHz-1.5GHz), with conductive properties and shielding effects in XY and Z directions.

[0038] The lower conductive adhesive layer 3 is a conductive double-sided adhesive, transparent, model TT-219H-1, with a thickness of 0.01mm, ultra-thin, more space-saving, and super strong viscosity, viscosity: >1000g / 25mm, impedance value (to copper foil): <0.01Ω (25mm*25mm), <0.05Ω (2mm*2mm), and has excellent conductive properties.

[0039] The model of the conductive cloth 4 is SH-90803WB-33, with a thickness of 33 μm. The colors of the two opposite sides of the conductive cloth 4 are different, one side is gray and the other side is black. The gray side faces up and the black side faces down and is controlled by glossiness. The glossiness of the black side is 1.2±0.5GU, which is consistent with the color inside the computer and is more beautiful. The surface impedance is <0.1Ω / sq, the Z impedance is <0.05Ω, and it has conductive properties in the XY direction and the Z direction.

[0040] When not in use, the upper conductive adhesive layer 2 is covered with a release film for protection. When in use, the product is removed from the entire release film; the positioning holes 5 on the silicone protective film 1 are used for positioning, and the product is attached to the corresponding position; and then the silicone protective film 1 is removed to complete the attachment process.

[0041] This embodiment also discloses a computer, including the above-mentioned USB socket grounding conductive pad for the computer.

[0042] Parts or structures not specifically described in the present invention may adopt existing technologies or existing products and will not be described in detail here.

[0043] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A grounding conductive pad for a USB socket for a computer, characterized in that: It comprises a silicone protective film, an upper conductive adhesive layer, a lower conductive adhesive layer and a conductive cloth. The silicone protective film is provided with the upper conductive adhesive layer, the lower conductive adhesive layer and the conductive cloth which are matched with each other in sequence from top to bottom.

2. A grounding conductive pad for a USB socket for a computer according to claim 1, characterized in that: The silicone protective film is provided with a plurality of positioning holes.

3. A grounding conductive pad for a USB socket for a computer according to claim 2, characterized in that: The silicone protective film is provided with two positioning holes, one of which is provided at the top of the silicone protective film, and the other is provided at a protrusion on one side of the bottom of the silicone protective film.

4. A grounding conductive pad for a USB socket for a computer according to claim 1, characterized in that: The upper conductive adhesive layer is provided with a plurality of avoidance holes.

5. The grounding conductive pad for a USB socket for a computer according to claim 1, characterized in that: The upper conductive adhesive layer, the lower conductive adhesive layer and the conductive cloth are all provided with a first avoidance step, a second avoidance step is provided on the side of the upper conductive adhesive layer away from the first avoidance step, and a third avoidance step corresponding to and matching the position of the first avoidance step is provided on the silicone protective film.

6. A grounding conductive pad for a USB socket for a computer according to claim 1, characterized in that: The thickness of the silicone protective film is 0.115±0.004 mm, and the viscosity is 7.5±2.5 g / 25 mm.

7. A grounding conductive pad for a USB socket for a computer according to claim 1, characterized in that: The upper conductive adhesive layer is a conductive double-sided adhesive with a viscosity of >800g / 25mm, a surface impedance of <0.2Ω / sq, and a Z impedance of <0.1Ω / in. 2 , shielding efficiency: 70-80dB.

8. The grounding conductive pad for a USB socket for a computer according to claim 1, characterized in that: The lower conductive adhesive layer is a conductive double-sided adhesive with a thickness of 0.01±0.003mm and a viscosity of >1000g / 25mm.

9. The grounding conductive pad for a USB socket for a computer according to claim 1, characterized in that: The conductive fabric has a thickness of 33±3 μm, a surface impedance of less than 0.1 Ω / sq, and a Z impedance of less than 0.05 Ω.

10. A computer, characterized in that: The invention comprises a grounding conductive pad for a USB socket for a computer as described in any one of claims 1-9.

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