Multilayer flexible circuit board with PET (Polyethylene Terephthalate) structure

Abstract

The utility model provides a multilayer flexible circuit board with a PET structure. The multilayer flexible circuit board comprises a circuit board body, a first terminal riveting layer, a second terminal riveting layer, a third terminal riveting layer and a fourth terminal riveting layer, the circuit board body comprises a first PET layer, a second PET layer and a third PET layer which are sequentially arranged from top to bottom, a first circuit layer is arranged on the side face, close to the second PET layer, of the first PET layer, a second circuit layer is arranged on the side face, close to the first circuit layer, of the second PET layer, a third circuit layer is arranged on the side face, close to the third PET layer, of the second PET layer, and the third circuit layer is arranged on the side face, close to the third PET layer, of the second PET layer. A fourth circuit layer is arranged on one side surface, close to the third circuit layer, of the third PET layer, a first insulating interlayer adhesive layer is coated between the first circuit layer and the second circuit layer, and a second insulating interlayer adhesive layer is coated between the third circuit layer and the fourth circuit layer; the terminal riveting layer is formed to be matched with the wire for conduction, the structure of the PET layer does not need to be changed, and the production efficiency is improved on the basis of ensuring the product quality.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible circuits, in particular to a multi-layer flexible circuit board with a PET structure. Background Art

[0002] The Chinese patent authorization announcement number is CN 217789976 U, and the authorization announcement date is November 11, 2022. It discloses a flexible printed circuit with multiple circuits on different surfaces, including an upper PET layer, a middle PET layer and a lower PET layer that are overlapped, wherein the upper PET layer is provided with a first printed circuit on the side facing the middle PET layer, and the lower PET layer is provided with a second printed circuit on the side facing the middle PET layer, and the middle PET layer is provided with a through hole, and the through hole is provided with ACF conductive glue, and the first printed circuit and the second printed circuit are electrically connected through the ACF conductive glue. Advantages: By using ACF conductive glue to realize the electrical connection between the first printed circuit and the second printed circuit, there is no need to bend the printed circuit, which can avoid the risk of circuit folding, uneven thickness, and high defective ratio after the product is bent. The defect of the prior art is that in order to achieve circuit conduction, a through hole needs to be set on the middle PET layer, and ACF conductive glue is set in the through hole. The first printed circuit and the second printed circuit are electrically connected through the ACF conductive glue. This structure directly increases the manufacturing process and reduces the production efficiency. In view of this situation, it is urgent to improve. Utility Model Content

[0003] In view of the above problems, the utility model provides a multi-layer flexible circuit board with a PET structure, which is connected by forming a terminal riveting layer in conjunction with a wire without changing the structure of the PET layer, thereby improving production efficiency while ensuring product quality.

[0004] In order to achieve the above purpose, the utility model solves it through the following technical solutions:

[0005] A PET structure multilayer flexible circuit board, comprising a circuit board body, a first terminal riveting layer, a second terminal riveting layer, a third terminal riveting layer, and a fourth terminal riveting layer; the first terminal riveting layer, the second terminal riveting layer, the third terminal riveting layer, and the fourth terminal riveting layer are arranged linearly and orderly from left to right on one side of the length direction of the circuit board body;

[0006] The circuit board body comprises a first PET layer, a second PET layer, and a third PET layer arranged in sequence from top to bottom, a first circuit layer is arranged on a side of the first PET layer close to the second PET layer, a second circuit layer is arranged on a side of the second PET layer close to the first circuit layer, a third circuit layer is arranged on a side of the second PET layer close to the third PET layer, a fourth circuit layer is arranged on a side of the third PET layer close to the third circuit layer, a first insulating interlayer adhesive layer is coated between the first circuit layer and the second circuit layer, and a second insulating interlayer adhesive layer is coated between the third circuit layer and the fourth circuit layer;

[0007] A first extension layer is formed on one side of the first PET layer, a first terminal layer connected to the first circuit layer is arranged on the first extension layer, and the first terminal layer is riveted to a wire to form a first terminal riveted layer;

[0008] A second extension layer and a third extension layer are respectively formed on one side of the second PET layer, a second terminal layer connected to the second circuit layer is provided on one side of the second extension layer corresponding to the second circuit layer, and the second terminal layer is riveted to a wire to form a second terminal riveted layer;

[0009] A third terminal layer connected to the third circuit layer is disposed on one side of the third extension layer corresponding to the third circuit layer, and the third terminal layer is riveted to a wire to form a third terminal riveted layer;

[0010] A fourth extension layer is formed on one side of the third PET layer, a fourth terminal layer connected to the fourth circuit layer is arranged on the fourth extension layer, and the fourth terminal layer is riveted to a wire to form a fourth terminal riveted layer;

[0011] In actual use, the wires of the first terminal riveting layer, the second terminal riveting layer, the third terminal riveting layer, and the fourth terminal riveting layer are matched and connected according to actual application requirements to achieve resistance output between different circuit layers.

[0012] Preferably, the thickness of the circuit board body is set to N, 75um≤N≤150um.

[0013] The beneficial effects of the utility model are as follows: the structure is composed of a circuit board body, a first terminal riveting layer, a second terminal riveting layer, a third terminal riveting layer, and a fourth terminal riveting layer. In actual operation, it only requires conventional circuit layer printing, coating of insulating interlayer glue, and drying. There is no need to change the structure of the PET layer, and no need to add additional process steps. The operation is convenient and quick, and production efficiency is improved on the basis of ensuring product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1This is a structural view of the utility model.

[0015] Figure 2 It is a planar unfolded view of the utility model.

[0016] Figure 3 It is a cross-sectional view of the present invention.

[0017] The figures are marked as follows: a first PET layer 10, a second PET layer 12, a third PET layer 14, a second insulating interlayer adhesive layer 13, a first circuit layer 15, a second circuit layer 16, a third circuit layer 17, a fourth circuit layer 18, a first extension layer 19, a second extension layer 20, a third extension layer 21, a fourth extension layer 22, a first terminal layer 23, a second terminal riveted layer 24, a third terminal layer 25, a fourth terminal layer 26, a first terminal riveted layer 27, a third terminal riveted layer 28, a fourth terminal riveted layer 29, a circuit board body 30, and a wire 31. DETAILED DESCRIPTION

[0018] The present invention is further described in detail below in conjunction with embodiments and drawings, but the implementation manner of the present invention is not limited thereto.

[0019] Reference Figure 1-3 As shown: This embodiment provides a PET structure multi-layer flexible circuit board, including a circuit board body 30, a first terminal riveting layer 27, a second terminal riveting layer 24, a third terminal riveting layer 28, and a fourth terminal riveting layer 29; the first terminal riveting layer 27, the second terminal riveting layer 24, the third terminal riveting layer 28, and the fourth terminal riveting layer 29 are arranged linearly and orderly from left to right on one side of the length direction of the circuit board body 30;

[0020] The circuit board body 30 includes a first PET layer 10, a second PET layer 12, and a third PET layer 14 arranged in sequence from top to bottom. A first circuit layer 15 is arranged on a side of the first PET layer 10 close to the second PET layer 12, a second circuit layer 16 is arranged on a side of the second PET layer 12 close to the first circuit layer 15, a third circuit layer 17 is arranged on a side of the second PET layer 12 close to the third PET layer 14, and a fourth circuit layer 18 is arranged on a side of the third PET layer 14 close to the third circuit layer 17. A first insulating interlayer adhesive layer 11 is coated between the first circuit layer 15 and the second circuit layer 16, and a second insulating interlayer adhesive layer 13 is coated between the third circuit layer 17 and the fourth circuit layer 18.

[0021] A first extension layer 19 is formed on one side of the first PET layer 10. A first terminal layer 23 connected to the first circuit layer 15 is disposed on the first extension layer 19. The first terminal layer 23 is riveted to a wire 31 to form a first terminal riveted layer 27.

[0022] A second extension layer 20 and a third extension layer 21 are formed on one side of the second PET layer 12. A second terminal layer connected to the second circuit layer 16 is provided on one side of the second extension layer 20 corresponding to the second circuit layer 16. The second terminal layer is riveted to a wire 31 to form a second terminal riveted layer 24.

[0023] A third terminal layer 25 connected to the third circuit layer 17 is disposed on one side of the third extension layer 21 corresponding to the third circuit layer 17. The third terminal layer 25 is riveted to a wire 31 to form a third terminal riveted layer 28.

[0024] A fourth extension layer 22 is formed on one side of the third PET layer 14. A fourth terminal layer 26 connected to the fourth circuit layer 18 is disposed on the fourth extension layer 22. The fourth terminal layer 26 is riveted to a wire 31 to form a fourth terminal riveted layer 29.

[0025] In actual use, the wires of the first terminal riveting layer 27 , the second terminal riveting layer 24 , the third terminal riveting layer 28 , and the fourth terminal riveting layer 29 are matched and connected according to actual application requirements to achieve resistance output between different circuit layers.

[0026] As a preferred embodiment, the thickness of the circuit board body 30 is set to N, 75um≤N≤150um.

[0027] In this embodiment, the structure is composed of a circuit board body, a first terminal riveting layer, a second terminal riveting layer, a third terminal riveting layer, and a fourth terminal riveting layer. In actual operation, it only requires conventional circuit layer printing, coating of insulating interlayer glue, and drying. There is no need to change the structure of the PET layer, and no need to add additional process steps. The operation is convenient and quick, and production efficiency is improved on the basis of ensuring product quality.

[0028] The above embodiment only expresses one implementation method of the utility model, and its description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A PET structure multilayer flexible circuit board, characterized in that: The circuit board comprises a circuit board body (30), a first terminal riveting layer (27), a second terminal riveting layer (24), a third terminal riveting layer (28), and a fourth terminal riveting layer (29); the first terminal riveting layer (27), the second terminal riveting layer (24), the third terminal riveting layer (28), and the fourth terminal riveting layer (29) are arranged linearly and orderly from left to right on one side of the length direction of the circuit board body (30); The circuit board body (30) comprises a first PET layer (10), a second PET layer (12), and a third PET layer (14) which are arranged in sequence from top to bottom; a first circuit layer (15) is arranged on a side of the first PET layer (10) close to the second PET layer (12); a second circuit layer (16) is arranged on a side of the second PET layer (12) close to the first circuit layer (15); a third circuit layer (17) is arranged on a side of the second PET layer (12) close to the third PET layer (14); a fourth circuit layer (18) is arranged on a side of the third PET layer (14) close to the third circuit layer (17); a first insulating interlayer adhesive layer (11) is coated between the first circuit layer (15) and the second circuit layer (16); and a second insulating interlayer adhesive layer (13) is coated between the third circuit layer (17) and the fourth circuit layer (18); A first extension layer (19) is formed on one side of the first PET layer (10); a first terminal layer (23) connected to the first circuit layer (15) is provided on the first extension layer (19); the first terminal layer (23) is riveted to a wire (31) to form a first terminal riveted layer (27); A second extension layer (20) and a third extension layer (21) are respectively formed on one side of the second PET layer (12); a second terminal layer connected to the second circuit layer (16) is provided on one side of the second extension layer (20) corresponding to the second circuit layer (16); the second terminal layer is riveted to a wire (31) to form a second terminal riveted layer (24); A third terminal layer (25) connected to the third circuit layer (17) is provided on one side of the third extension layer (21) corresponding to the third circuit layer (17); the third terminal layer (25) is riveted to a wire (31) to form a third terminal riveted layer (28); A fourth extension layer (22) is formed on one side of the third PET layer (14); a fourth terminal layer (26) connected to the fourth circuit layer (18) is provided on the fourth extension layer (22); the fourth terminal layer (26) is riveted to a wire (31) to form a fourth terminal riveted layer (29); In actual use, the wires of the first terminal riveting layer (27), the second terminal riveting layer (24), the third terminal riveting layer (28), and the fourth terminal riveting layer (29) are connected in a matching manner according to actual application requirements to achieve resistance output between different circuit layers.

2. A PET structure multilayer flexible circuit board according to claim 1, characterized in that: The thickness of the circuit board body (30) is set to N, 75um≤N≤150um.

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