Heat dissipation structure of electronic equipment
By designing a heat dissipation structure of an electronic device including a box, a bottom plate, a cover plate, a fan, a radiator and a fin, the problem of poor heat dissipation effect in the prior art is solved, a wider heat dissipation area and a faster heat dissipation speed are achieved, and its safety and efficiency are verified through simulation testing.
Patent Information
- Application Number
- CN202420232825.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-30
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-01-30
AI Technical Summary
The heat dissipation structure of existing electronic equipment cannot effectively remove the heat from high-end equipment with large heating power, resulting in insufficient heat dissipation area and poor heat dissipation effect.
A heat dissipation structure for electronic devices is designed, including a box, a base plate, a cover plate, a fan, a radiator and a fin. By setting up an air duct cavity, air inlet, fan and radiator, the fan is suctioned to introduce cold air and take away heat. At the same time, the installation direction of the fins is consistent with the gas flow direction, increasing the heat dissipation area and speed.
The design significantly improves the heat dissipation effect, expands the heat dissipation area, increases the heat dissipation speed, and verifies its safety and efficiency through virtual simulation testing software.
Smart Images
Figure CN222564190U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation mechanisms, in particular to a heat dissipation structure of an electronic device. Background Art
[0002] With the continuous development of electronic technology, the power of electronic equipment systems is getting bigger and bigger, but their physical size is getting smaller and smaller. This will cause the heat flux density to increase sharply, and the problem of heat dissipation becomes particularly important. In high temperature and harsh working environment, good heat dissipation can ensure the reliability of electronic equipment, extend working time and reduce failure rate.
[0003] Most electronic devices currently have chips and optical ports. However, the existing heat dissipation structure can only meet general heat dissipation needs. For high-end devices with high heat generation power, it cannot effectively remove the heat from the chips and optical ports, resulting in insufficient heat dissipation area and poor heat dissipation effect. Utility Model Content
[0004] The main purpose of the utility model is to provide a heat dissipation structure of an electronic device, aiming to solve the problem that the heat dissipation effect of the existing heat dissipation structure is poor.
[0005] To achieve the above-mentioned purpose, the utility model proposes a heat dissipation structure of an electronic device, including a box body, the box body including a base plate and a cover plate, the cover plate is arranged on the base plate, the cover plate and the base plate are sealed to form an air duct cavity, a plurality of air inlets are opened on the frame of the base plate, a plurality of fans are installed on the side of the base plate opposite to the air inlets, and the fans are used to discharge the air in the box body to the outside; a plurality of radiators are installed between the air inlets and the fans, a plurality of fins are arranged on the radiator, and the fins are installed along the gas flow direction of the air duct cavity.
[0006] In one embodiment, the housing further includes a substrate, a first light port and a second light port mounted on the substrate, the substrate divides the air duct cavity into an upper cavity and a lower cavity, the first light port and the radiator are located in the upper cavity, and the radiator is located between the first light port and the fan, and the second light port is located in the lower cavity.
[0007] In one embodiment, the air inlet includes a first air inlet and a second air inlet, the first air inlet is arranged at the top of the first light port, and the second air inlet is arranged at the bottom of the second light port.
[0008] In one of the embodiments, the thickness of the substrate is set to 4 mm.
[0009] In one embodiment, the radiator includes a first radiator and a second radiator, and the first radiator and the second radiator are arranged side by side.
[0010] In one embodiment, the size of the first heat sink is set to 130*100*17 mm, and the size of the second heat sink is set to 290*176*16 mm.
[0011] In one embodiment, the first heat sink is configured as a pure aluminum structure, and the second heat sink is configured as copper.
[0012] In one embodiment, the number of the fins on the first heat sink is set to 75, and the number of the fins on the second heat sink is set to 115.
[0013] In one embodiment, the thickness of the fins on the first heat sink is set to 1 mm, and the thickness of the fins on the second heat sink is set to 0.5 mm.
[0014] In one of the embodiments, the number of the fans is set to 5.
[0015] The beneficial effects of the utility model are:
[0016] The utility model forms an air duct cavity by setting the cover plate and the bottom plate, and sets a plurality of air inlets on the frame of the bottom plate, sets the fan corresponding to the air inlets, and sets the radiator along the gas flow direction of the air duct cavity. When the fan draws air from the inside of the box to the outside of the box, the suction force of the fan will draw the cold air outside the box into the inside of the box from the air inlet and then draw it out. This process can take away the heat of the optical port, chip and other components inside the box, and the heat dissipation area is wider and the heat dissipation effect is better. At the same time, the installation direction of the fins is consistent with the gas flow direction of the air duct cavity. In the environment of air convection, the heat dissipation area is wider and the heat dissipation speed is faster. In addition, the utility model is a product obtained through virtual simulation test software, and has higher safety after multiple tests and simulation experiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0018] Figure 1 This is an exploded view of the heat dissipation structure of the utility model;
[0019] Figure 2 Another exploded view of the heat dissipation structure of the utility model;
[0020] Figure 3 It is a structural schematic diagram of the heat dissipation structure of the utility model;
[0021] Figure 4 It is a partial structural schematic diagram of the bottom plate of the utility model;
[0022] Figure 5 This is a schematic diagram of the structure of the second radiator of the utility model;
[0023] Description of Figure Numbers:
[0024] Bottom plate 1; first air inlet 11; second air inlet 12; cover plate 2; fan 4; first heat sink 51; second heat sink 52; fin 521; substrate 6; first optical port 7; second optical port 8.
[0025] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0028] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if the meaning of "and / or" appearing in the full text is to include three parallel schemes, taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0029] Reference Figure 1 and Figure 5 As shown, an embodiment of the utility model proposes a heat dissipation structure of an electronic device, including a box body, wherein the box body includes a base plate 1 and a cover plate 2, wherein the cover plate 2 is covered on the base plate 1, and an air duct cavity is formed by sealing between the cover plate 2 and the base plate 1, and a plurality of air inlets are opened on the frame of the base plate 1, and a plurality of fans 4 are installed on the side of the base plate 1 opposite to the air inlets, and the fans 4 are used to discharge the air in the box body to the outside; a plurality of radiators are installed between the air inlets and the fans 4, and a plurality of fins 521 are arranged on the radiator, and the fins 521 are installed along the gas flow direction of the air duct cavity.
[0030] The utility model forms an air duct cavity by setting the cover plate 2 and the bottom plate 1, and sets a plurality of the air inlets on the frame of the bottom plate 1, sets the fan 4 corresponding to the air inlets, and the radiator is set along the gas flow direction of the air duct cavity. When the fan 4 draws air from the inside of the box to the outside of the box, the suction force of the fan 4 will draw the cold air outside the box from the air inlet into the inside of the box and then draw it out. This process can take away the heat of the optical port, chip and other components inside the box, and the heat dissipation area is wider and the heat dissipation effect is better; at the same time, the installation direction of the fin 521 is consistent with the gas flow direction of the air duct cavity. In the environment of air convection, the heat dissipation area is wider and the heat dissipation speed is faster. In addition, the utility model is a product obtained through virtual simulation test software, and has higher safety after multiple tests and simulation experiments.
[0031] The heat dissipation structure of this electronic device has a higher feasibility, and the simulation test software is highly realistic. It simulates the heat flow, temperature distribution and external heat alternation inside and on the surface of the object, providing detailed information and insights about the thermal characteristics for the project. Through the simulation software, we can simulate one or several dimensions of the heat dissipation design scheme, obtain its trend diagram in a certain direction, and analyze the factors affecting the air cooling effect through the results, and couple the simulation results to obtain the design trend of the optimized radiator. In addition, virtual simulation technology can simulate very realistic scenes without the need to invest in actual hardware costs, making the entire heat dissipation structure research and development process low-cost; virtual simulation technology can be used for experiments and practices in a safe environment, reducing possible safety issues in actual operations, and has high safety; the simulation test software can timely feedback the experimental data of the heat dissipation mechanism, and has stronger interactivity.
[0032] The optical port refers to the optical fiber interface, which is a physical interface used to connect optical fiber cables. The substrate 6 is the basic material for manufacturing PCB. This heat dissipation structure is mainly used in communication server products, so the optical port and chip are essential components. Figure 1 As shown, the box body also includes a substrate 6, a first optical port 7 and a second optical port 8 mounted on the substrate 6, the substrate 6 divides the air duct cavity into an upper cavity and a lower cavity, the first optical port 7 and the radiator are located in the upper cavity, and the radiator is located between the first optical port 7 and the fan 4, and the second optical port 8 is located in the lower cavity. The thickness of the substrate 6 is set to 4mm. Since the power consumption of the optical port is relatively large, in this embodiment, a certain distance is reserved between the first optical port 7 and the radiator to prevent the first optical port 7 from overheating.
[0033] Reference Figure 1 and Figure 4 As shown, the air inlet includes a first air inlet 11 and a second air inlet 12, wherein the first air inlet 11 is arranged at the top of the first optical port 7, and the second air inlet 12 is arranged at the bottom of the second optical port 8. Specifically, in this embodiment, the first air inlet 11 and the second air inlet 12 are symmetrically arranged, and the first air inlet 11 realizes oblique air intake through a structural wind guide mode. The first air inlet 11 is mainly used for heat dissipation of the first optical port 7 and the main chip, and the second air inlet 12 is mainly used for heat dissipation of the second optical port 8.
[0034] Reference Figure 2As shown, the radiator includes a first radiator 51 and a second radiator 52, and the first radiator 51 is arranged on one side of the second radiator 52. Specifically, in this embodiment, the first radiator 51 and the second radiator 52 are arranged side by side inside the housing, and the first radiator 51 can be set to any existing radiator structure, which is mainly used to assist the second radiator 52 in dissipating heat inside the housing, and the second radiator 52 is set to be a HFCBGA radiator, which plays a major role in heat dissipation. The first radiator 51 is set on the CPU buckle board, and the CPU buckle board also needs to dissipate heat when the operating temperature is high. The second radiator 52 is mainly used for heat dissipation on the main chip, and the chip package is HFCBGA.
[0035] It should be noted here that HFCBGA (High-Performance Flip-Chip Ball Grid Array) is a high-frequency ceramic ball grid array package. It uses a combination of flip-chip (Flip-Chip) and ball grid array (Ball Grid Array) to provide higher performance and better heat dissipation characteristics. HFCBGA heat sink refers to the chip that is being dissipated. The heat sink plays a role in heat dissipation in electronic devices, transferring the generated heat from the chip or other heat sources to keep the device working within a safe temperature range. For integrated circuits packaged in HFCBGA, the heat sink can effectively dissipate heat by contacting the flip-chip surface of the chip. HFCBGA heat sinks are usually made of metal, such as copper or aluminum, with good thermal conductivity. They usually have a complex structure, including components such as heat sinks, heat fins and fans to enhance the heat dissipation effect. In addition, the heat sink can also be used in conjunction with a thermally conductive medium (such as thermally conductive glue or thermally conductive pads) to improve the efficiency of heat transfer.
[0036] In summary, a HFCBGA heat sink is a heat dissipation device for integrated circuits packaged in HFCBGA, which is used to effectively dissipate heat and maintain the normal operating temperature of the device.
[0037] Reference Figure 2 As shown, the size of the first heat sink 51 is set to 130*100*17mm, and the size of the second heat sink 52 is set to 290*176*16mm. Specifically, in this embodiment, the size of the HFCBGA heat sink is set to 290*176*16mm, so that the space utilization rate of the BGA of the PCBA inside the box is 99%.
[0038] It should be noted here that BGA (Ball Grid Array) is a common electronic component packaging technology that can achieve high-density pin layout. In the design of PCBA (Printed Circuit Board Assembly), it is very important to make rational use of the space at BGA. By using BGA packaging technology, the pins of the chip can be arranged at the bottom, thereby reducing the volume of the component and improving the integration. BGA packaging also has better thermal conductivity and reliability. BGA packaging generally has better heat dissipation performance than traditional packaging. By reasonably arranging the layout of the radiator, the space at BGA can be effectively utilized and the stable operation of the component can be maintained.
[0039] Five φ12 heat pipes are also arranged in the second radiator 52. A heat pipe is a highly efficient heat conduction device, commonly used in radiators and cooling systems. It consists of a sealed pipe filled with a working fluid, and its working principle is based on the cyclic process of liquid evaporation and condensation. The "φ12" here refers to the outer diameter of the heat pipe, usually expressed in millimeters. φ12 heat pipes are widely used in the field of heat dissipation and have a large heat conduction capacity. The selection of the number of heat pipes depends on the specific heat dissipation requirements and system design. Using multiple heat pipes can increase the heat conduction area and improve the overall heat dissipation effect.
[0040] Furthermore, the first heat sink 51 is set to a pure aluminum structure, and the material of the second heat sink 52 is set to copper. Pure aluminum absorbs more heat, has good heat dissipation performance, and has a fast heat conduction speed. It can quickly transfer heat and has an excellent heat dissipation effect. Copper as a heat sink material has excellent thermal conductivity and can quickly transfer heat to the heat sink surface to improve heat transfer efficiency. Copper has good corrosion resistance and can work stably for a long time in harsh environments, extending the service life of the heat sink. Copper is a common and relatively cheap metal material with relatively low manufacturing costs, which is suitable for large-scale production and wide application.
[0041] Reference Figure 5 As shown, the number of the fins on the first radiator 51 is set to 75, and the number of the fins 521 on the second radiator 52 is set to 115. The thickness of the fins 521 on the first radiator 51 is set to 1 mm, and the thickness of the fins 521 on the second radiator 52 is set to 0.5 mm. The more the number of the fins 521, the wider the heat dissipation area and the faster the heat dissipation speed in the air convection environment. In this embodiment, 115 fins 521 are set to achieve a better heat dissipation effect while saving costs.
[0042] Reference Figure 2 As shown, the number of the fans 4 is set to five.
[0043] This heat dissipation structure adopts a front-to-back straight air duct design, and the five fans 4 on the rear side of the box draw air from the inside of the box to the outside of the box. At this time, the suction force of the fan 4 will draw the cold air outside the box into the inside of the box from the first air inlet 11 and the second air inlet 12 on the front side of the box and then draw it out (the air coming in from the first air inlet 11 is above the second radiator 52, and the air coming in from the second air inlet 12 is below the second radiator 52, and the two air inlets go out through the air outlet on one side). This process has a circulating heat dissipation effect. The five fans 4 are placed side by side and work at the same time, so the heat dissipation area is wider and the effect is maximized.
[0044] The heat dissipation structure of the utility model has a faster heat dissipation speed at the light port during the heat dissipation process, and the overall heat dissipation speed is uniform, which is beneficial to the heat dissipation inside the entire heat dissipation structure, and there will be no situation where some parts dissipate heat quickly and some parts dissipate heat slowly.
[0045] The heat dissipation structure of the utility model has a uniform temperature distribution during the heat dissipation process and is within a relatively low temperature range, which can ensure that components at various positions inside the heat dissipation structure will not overheat, and also that some parts will not overheat.
[0046] The above description is only an optional embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A heat dissipation structure of an electronic device, characterized in that: The invention comprises a box body, wherein the box body comprises a bottom plate and a cover plate, wherein the cover plate is arranged on the bottom plate, wherein an air duct cavity is formed by sealing between the cover plate and the bottom plate, wherein a plurality of air inlets are provided on the frame of the bottom plate, wherein a plurality of fans are installed on the side of the bottom plate opposite to the air inlets, wherein the fans are used to discharge the air in the box body to the outside; wherein a plurality of radiators are installed between the air inlets and the fans, wherein a plurality of fins are arranged on the radiator, and wherein the fins are installed along the gas flow direction of the air duct cavity.
2. The heat dissipation structure of an electronic device according to claim 1, characterized in that: The box body also includes a substrate, a first light port and a second light port installed on the substrate, the substrate divides the air duct cavity into an upper cavity and a lower cavity, the first light port and the radiator are located in the upper cavity, and the radiator is located between the first light port and the fan, and the second light port is located in the lower cavity.
3. The heat dissipation structure of an electronic device according to claim 2, characterized in that: The air inlet includes a first air inlet and a second air inlet, the first air inlet is arranged at the top of the first light port, and the second air inlet is arranged at the bottom of the second light port.
4. The heat dissipation structure of an electronic device according to claim 2, characterized in that: The thickness of the substrate is set to 4 mm.
5. The heat dissipation structure of an electronic device according to claim 1, characterized in that: The radiator includes a first radiator and a second radiator, wherein the first radiator and the second radiator are arranged side by side.
6. The heat dissipation structure of an electronic device according to claim 5, characterized in that: The size of the first radiator is set to 130*100*17 mm, and the size of the second radiator is set to 290*176*16 mm.
7. The heat dissipation structure of an electronic device according to claim 5, characterized in that: The first heat sink is configured as a pure aluminum structure, and the second heat sink is configured as copper.
8. The heat dissipation structure of an electronic device according to claim 5, characterized in that: The number of the fins on the first radiator is set to 75, and the number of the fins on the second radiator is set to 115.
9. The heat dissipation structure of an electronic device according to claim 8, characterized in that: The thickness of the fins on the first heat sink is set to 1 mm, and the thickness of the fins on the second heat sink is set to 0.5 mm.
10. The heat dissipation structure of an electronic device according to claim 1, characterized in that: The number of fans is set to 5.