Airborne multifunctional display

Abstract

The utility model provides an airborne multifunctional display. The airborne multifunctional display comprises a display module, a mainboard and a heat dissipation cold plate, the display device is characterized in that the display module and the heat dissipation cold plate are assembled and connected through screws, and a sealed cavity for accommodating the mainboard is formed between the display module and the heat dissipation cold plate; the mainboard is assembled on the inner side of the heat dissipation cold plate through screws, and heat dissipation teeth are arranged on the outer side of the heat dissipation cold plate; the heat dissipation cold plate comprises a substrate and a heat pipe; the base plate is made of aluminum alloy, a groove is formed in the base plate, and the heat pipe is embedded in the groove and fixed in a welded mode. And the heat pipe is matched with a device to be cooled on the mainboard. According to the technical scheme, the airborne multifunctional displayer is high in heat dissipation efficiency and reliability and good in electromagnetic shielding performance, and meanwhile heat dissipation of high-density, multi-heat-source and unequal-height devices can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of aircraft onboard electronic equipment, in particular to an onboard multifunctional display. Background Art

[0002] With the development of airborne electronic equipment technology, equipment functions are becoming more and more complex, equipment power is increasing, but equipment size is required to be smaller and smaller. This places higher and higher requirements on the heat dissipation of airborne electronic equipment that is already in a harsh airborne environment.

[0003] At present, there are three main directions for heat dissipation of airborne multi-function displays: natural cooling, forced air cooling, and forced liquid cooling. Natural cooling uses an aluminum or copper cold plate to conduct heat dissipation through natural convection between the device housing and the environment. Forced air cooling uses an additional cooling fan or a cooling airflow provided by the system to force air convection cooling of the device. Forced liquid cooling uses an external liquid cooling source to force the refrigerant to flow through a cold plate with a liquid flow channel, and forces liquid convection cooling of the device.

[0004] The main defects of the airborne multi-function display in the prior art are as follows:

[0005] 1. When natural cooling is used for heat dissipation, although the reliability of natural cooling is high, the heat dissipation efficiency is low.

[0006] 2. When forced air cooling is used for heat dissipation, it has problems such as poor electromagnetic compatibility, poor reliability, poor waterproofness, and is prone to noise and dust accumulation.

[0007] 3. When forced liquid cooling is used, an external liquid cooling source is required, which will increase the weight of the system and there is a risk of refrigerant leakage, reducing the reliability of the equipment.

[0008] The market urgently needs to develop an airborne multi-function display with high heat dissipation efficiency, high reliability, and good electromagnetic shielding, which can solve the problem of high-density, multi-heat source heat dissipation layout. Summary of the invention

[0009] In order to solve the problems in the prior art, the utility model provides an airborne multifunctional display, which has high heat dissipation efficiency, high reliability, and good electromagnetic shielding, and can meet the heat dissipation requirements of high-density, multi-heat source, and unequal-height devices.

[0010] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0011] An airborne multifunctional display comprises a display module, a main board, and a heat dissipation cold plate; the display module and the heat dissipation cold plate are assembled and connected by screws, and a sealed cavity for accommodating the main board is formed between the display module and the heat dissipation cold plate; the main board is assembled on the inner side of the heat dissipation cold plate by screws, and heat dissipation teeth are arranged on the outer side of the heat dissipation cold plate;

[0012] The heat dissipation cold plate includes a substrate and a heat pipe; the substrate is made of aluminum alloy and has a groove, the heat pipe is embedded in the groove and fixed by welding; the heat pipe is matched with the heat dissipation device on the mainboard.

[0013] By adopting the above technical scheme, the utility model adopts a closed natural heat dissipation structure with a heat pipe in combination. The heat of the main heat source of the motherboard is exported through the heat pipe welded on the heat dissipation cold plate, and the heat is evenly distributed to the entire plane of the cold plate, and then the heat is exported to the external environment through the heat dissipation teeth of the cold plate.

[0014] According to a preferred technical solution, the heat dissipation cold plate also includes a plurality of heat-conducting blocks, each of which is mounted on the substrate by screws; and the height of the heat-conducting blocks is matched with the height of the device to be cooled on the mainboard, one side of the heat-conducting blocks contacts the corresponding device to be cooled on the mainboard, and the other side of the heat-conducting blocks contacts the corresponding heat pipe on the substrate.

[0015] A detachable heat-conducting block is used to connect the heat-conducting components with different heights with the heat pipe, which solves the problem of inconvenient installation and layout of heat pipes when dissipating heat of high-density and unequal-height components, and improves the usability and maintainability of the product.

[0016] According to a preferred technical solution, a flexible thermal pad is provided between the contact surfaces of the thermally conductive block and the heat pipe on the substrate.

[0017] A flexible thermal pad is added between the heat pipe and the thermal block, so that the contact between the thermal block and the heat pipe is indirect thermal contact, and the rigid contact is changed to flexible contact, which reduces the contact thermal resistance between the heat pipe and the thermal block, avoids rigid contact, and improves the product's adaptability to airborne vibration and impact environments.

[0018] In a preferred technical solution, a thermal pad groove is formed on the thermal block, and a flexible thermal pad is laid in the corresponding thermal pad groove. By setting the thermal pad groove, the depth of the thermal pad groove can be changed to change the compression between the thermal pad, the thermal block and the heat pipe, that is, the compression amount of the thermal pad during compression can be controlled by controlling the depth of the thermal pad groove.

[0019] In a preferred technical solution, a flexible thermal pad is provided between the contact surface of the heat conducting block and the heat dissipating device on the mainboard. The flexible thermal pad between the heat conducting block and the heat dissipating device on the mainboard is directly pressed and assembled by contacting each other.

[0020] According to a preferred technical solution, the flexible thermally conductive pad is a silicone thermally conductive pad.

[0021] A preferred technical solution, the display module includes a module housing, a display screen, a heat conducting plate, and a control board; the back of the display screen is glued to one side of the heat conducting plate by glue, and the control board is installed on the other side of the heat conducting plate by screws; the display screen, the heat conducting plate, and the control board are embedded in the module housing as a whole, and the side of the heat conducting plate is connected to the side of the module housing by screws.

[0022] The display module of the utility model conducts the heat of the display screen and the control board to the module housing through the built-in heat conduction plate, and then dissipates the heat through the module housing. The mainboard conducts the heat to the substrate through the flexible heat conduction pad, heat conduction block and heat pipe for heat dissipation. Thus, relatively independent heat dissipation between the display module and the mainboard is achieved.

[0023] In a preferred technical solution, the substrate is further provided with a heat-insulating waist-shaped groove, and the heat-insulating waist-shaped groove is located between adjacent heat-conducting blocks. The substrate between two adjacent heat-conducting blocks is provided with a heat-insulating waist-shaped groove, which can reduce the mutual heat transfer between the two heat-conducting blocks, and allow the heat of each heat-conducting block to be respectively exported through independent heat pipes, which can avoid mutual thermal coupling between close-range and high-power devices, and improve the reliability of the device.

[0024] According to a preferred technical solution, the grooves on the substrate are a plurality of grooves which are independently opened with intervals between each other, and the surfaces of the grooves are provided with a nickel-plated layer; and a heat dissipation grid is provided on the outer surface of the module housing.

[0025] In a preferred technical solution, a heat dissipation fan is further provided on the outside of the heat dissipation cold plate. The additional heat dissipation fan can achieve the same heat dissipation efficiency while reducing the height of the heat dissipation teeth on the heat dissipation cold plate. That is, under the condition of the same heat dissipation efficiency, the height of the heat dissipation teeth on the heat dissipation cold plate can be reduced by adding a heat dissipation fan, thereby reducing the weight of the entire device. Through the structure of heat pipe plus external forced air cooling, on the one hand, the heat inside the product is evenly distributed on the heat dissipation cold plate through the heat pipe, and on the other hand, the air flow is driven by the fan to enhance the convective heat transfer coefficient of the heat dissipation teeth on the heat dissipation cold plate, thereby improving the heat exchange efficiency of the entire machine.

[0026] Compared with the prior art airborne multifunctional display, the utility model has the following beneficial effects:

[0027] 1. The utility model adopts heat pipe heat dissipation technology on the airborne multi-function display, which improves the heat dissipation efficiency of the product while ensuring the high reliability of the natural heat dissipation of the airborne multi-function display. At the same time, the overall closed cavity structure also avoids the problems of electromagnetic compatibility, poor waterproofness, noise, dust accumulation, etc. when using internal forced air cooling.

[0028] 2. The utility model physically partitions the product according to the structural characteristics of the airborne multi-function display, and plans the heat dissipation path separately for the display module and the main board, thereby avoiding mutual interference of heat sources and improving the reliability of the product.

[0029] 3. The utility model solves the problem of inconvenient installation and layout of heat pipes when dissipating high-density and unequal-height devices by adopting a detachable heat-conducting block with a height that matches the unequal-height devices to be dissipated (i.e., if the device to be dissipated is high, the corresponding heat-conducting block is low; if the device to be dissipated is low, the corresponding heat-conducting block is high; the overall height consistency is maintained so that the heat pipe can be laid flat on the heat dissipation cold plate), thereby improving the usability and maintainability of the product. At the same time, a flexible thermal pad is added between the heat pipe and the heat-conducting block to reduce the rigid contact thermal resistance between the heat pipe and the heat-conducting block (changing rigid direct contact to flexible indirect thermal contact), avoiding rigid contact, and improving the product's adaptability to airborne vibration and impact environments.

[0030] 4. The heat pipes of the utility model are relatively independent, and the corresponding heat dissipation devices, corresponding heat conduction blocks, and corresponding heat pipes on the mainboard are matched and arranged accordingly. At the same time, a heat-insulating waist-shaped groove is designed between two heat conduction blocks that are close together, which is beneficial to avoid the mutual coupling of heat between close-range and high-power devices, and improves the reliability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a front perspective structural diagram of an airborne multi-function display in Example 1 of the utility model;

[0032] Figure 2 This is a schematic diagram of the back three-dimensional structure of an airborne multi-function display in Example 1 of the utility model;

[0033] Figure 3 This is a schematic diagram of the exploded structure of an airborne multi-function display in Example 1 of the utility model;

[0034] Figure 4 This is a schematic diagram of the exploded structure of the display module in Example 1 of the utility model;

[0035] Figure 5 This is a schematic diagram of the exploded structure of the heat dissipation cold plate in Example 1 of the utility model;

[0036] Figure 6 This is a schematic front view of the heat dissipation cold plate in Example 1 of the utility model;

[0037] Figure 7 for Figure 6 Schematic cross-sectional view along the AA direction;

[0038] Figure 8This is a schematic diagram of the assembly between the heat dissipation cold plate and the main board in Example 1 of the utility model;

[0039] Fig. 9 It is a schematic diagram of the three-dimensional structure of an airborne multi-functional display in Example 2 of the utility model.

[0040] The main component symbols are described as follows:

[0041] Onboard multi-function display 1, display module 2, module housing 201, display screen 202, heat conducting plate 203, control board 204, heat dissipation grid 205, main board 3, heat dissipation cold plate 4, heat conducting block 401, screw 402, flexible thermal pad 403, base plate 404, thermal insulation waist-shaped groove 404a, heat pipe 405, groove 406, thermal pad groove 407, heat dissipation fan 5. DETAILED DESCRIPTION

[0042] Example 1

[0043] like Figures 1 to 8 As shown, an airborne multifunctional display 1 includes a display module 2, a main board 3, and a heat dissipation cold plate 4; the display module 2 and the heat dissipation cold plate 4 are assembled and connected by screws 402, and a sealed cavity for accommodating the main board 3 is formed between the display module 2 and the heat dissipation cold plate 4; the main board 3 is assembled on the inner side of the heat dissipation cold plate 4 by screws 402, and heat dissipation teeth are provided on the outer side of the heat dissipation cold plate 4;

[0044] The heat dissipation cold plate 4 includes a substrate 404 and a heat pipe 405; the substrate 404 is made of aluminum alloy, and a groove 406 is opened on the substrate 404. The heat pipe 405 is embedded in the groove 406 and fixed by welding; the heat pipe 405 is matched with the heat dissipation device on the mainboard 3.

[0045] The heat dissipation cold plate 4 may further include a plurality of heat-conducting blocks 401, each of which is mounted on the substrate 404 by means of screws 402; and the height of the heat-conducting blocks 401 is matched with the height of the device to be cooled on the mainboard 3, one side of the heat-conducting blocks 401 is in contact with the corresponding device to be cooled on the mainboard 3, and the other side of the heat-conducting blocks 401 is in contact with the corresponding heat pipe 405 on the substrate 404.

[0046] A flexible thermal pad 403 is further provided between the contact surfaces of the thermal conductive block 401 and the heat pipe 405 on the substrate 404 .

[0047] The heat conductive block 401 is provided with a heat conductive pad groove 407 , and the flexible heat conductive pad 403 is placed in the corresponding heat conductive pad groove 407 .

[0048] A flexible thermal pad 403 is also provided between the contact surface of the heat-conducting block 401 and the heat-dissipating device on the mainboard 3. The flexible thermal pad 403 is a silicone grease thermal pad.

[0049] The display module 2 includes a module housing 201, a display screen 202, a heat conducting plate 203, and a control board 204; the back of the display screen 202 is glued to one side of the heat conducting plate 203, and the control board 204 is installed on the other side of the heat conducting plate 203 by screws 402; the display screen 202, the heat conducting plate 203, and the control board 204 are integrally embedded in the module housing 201, and the side of the heat conducting plate 203 is connected to the side of the module housing 201 by screws 402 to form a relatively closed space.

[0050] The base plate 404 is further provided with a heat-insulating waist-shaped groove 404 a , and the heat-insulating waist-shaped groove 404 a is located between adjacent heat-conducting blocks 401 .

[0051] The grooves 406 on the substrate 404 are multiple grooves that are independently opened and separated from each other, and the surfaces of the grooves 406 are provided with a nickel-plated layer; the outer surface of the module housing 201 is provided with a heat dissipation grid 205 .

[0052] In this embodiment, the heat pipe 405 is a 6mm or 8mm diameter powder sintered copper tube filled with coolant, which can be bent and flattened. The substrate 404 is made of aluminum alloy, and the groove 406 on the substrate 404 can be surface treated with nickel plating to improve copper-aluminum weldability. After the heat pipe 405 is embedded in the groove 406 on the substrate 404, vacuum brazing is performed, and then the surface is processed to be flat. Screw holes are opened on the substrate 404, and screws 402 are used to install the heat conductive block 401 on the substrate 404.

[0053] Example 2

[0054] like Fig. 9 As shown, based on the structure of the embodiment 1, a heat dissipation fan 5 is further provided on the outer side of the heat dissipation cold plate 4. The other parts of the structure of the embodiment 2 are the same as those of the embodiment 1, so they will not be described here.

[0055] The above are only preferred application embodiments of the present invention and are not intended to limit the present invention. It should be pointed out that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An airborne multifunctional display, comprising a display module, a main board, and a heat dissipation cold plate; characterized in that: The display module is connected to the heat dissipation cold plate by screw assembly, and a sealed cavity for accommodating the mainboard is formed between the display module and the heat dissipation cold plate; the mainboard is assembled on the inner side of the heat dissipation cold plate by screws, and heat dissipation teeth are provided on the outer side of the heat dissipation cold plate; The heat dissipation cold plate includes a substrate and a heat pipe; the substrate is made of aluminum alloy and has a groove, the heat pipe is embedded in the groove and fixed by welding; the heat pipe is matched with the heat dissipation device on the mainboard.

2. An airborne multifunctional display according to claim 1, characterized in that: The heat dissipation cold plate also includes a plurality of heat-conducting blocks, each of which is mounted on the substrate by screws; and the height of the heat-conducting blocks is matched with the height of the device to be cooled on the mainboard, one side of the heat-conducting blocks contacts the corresponding device to be cooled on the mainboard, and the other side of the heat-conducting blocks contacts the corresponding heat pipe on the substrate.

3. An airborne multifunctional display according to claim 2, characterized in that: A flexible thermal pad is also provided between the contact surfaces of the thermal conductive block and the heat pipe on the substrate.

4. An airborne multifunctional display according to claim 3, characterized in that: The heat-conducting block is provided with a heat-conducting pad groove, and the flexible heat-conducting pad is laid in the corresponding heat-conducting pad groove.

5. The airborne multifunctional display according to claim 2, characterized in that: A flexible thermal pad is also provided between the contact surface of the thermal conductive block and the heat dissipation device on the mainboard.

6. An airborne multifunctional display according to any one of claims 3 or 5, characterized in that: The flexible thermally conductive pad is a silicone thermally conductive pad.

7. The airborne multifunctional display according to claim 1, characterized in that: The display module includes a module shell, a display screen, a heat conducting plate, and a control board; the back of the display screen is glued to one side of the heat conducting plate by glue, and the control board is installed on the other side of the heat conducting plate by screws; the display screen, the heat conducting plate, and the control board are embedded in the module shell as a whole, and the side of the heat conducting plate is connected to the side of the module shell by screws.

8. An airborne multifunctional display according to claim 2, characterized in that: The base plate is also provided with a heat-insulating waist-shaped groove, and the heat-insulating waist-shaped groove is located between adjacent heat-conducting blocks.

9. An airborne multifunctional display according to claim 7, characterized in that: The grooves on the substrate are multiple grooves that are independently opened with intervals between each other, and the surfaces of the grooves are provided with a nickel-plated layer; and a heat dissipation grid is provided on the outer surface of the module shell.

10. The airborne multifunctional display according to claim 1, characterized in that: A heat dissipation fan is also provided on the outer side of the heat dissipation cold plate.

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