Temperature control jig and silicon-based OLED product

Abstract

The utility model discloses a temperature control jig and a silicon-based OLED (Organic Light Emitting Diode) product. The temperature control jig comprises a heat conduction module and a refrigeration module. The heat conduction module is provided with a concave cavity; an opening is formed in one end of the concave cavity; the inner surface of the concave cavity is used for placing a piece to be subjected to temperature control; the refrigeration module wraps the outer surface of the concave cavity and is tightly attached to the outer surface of the concave cavity. By arranging the refrigeration module and the heat conduction module with the concave cavity, a part to be subjected to temperature control can be placed in the concave cavity, the concave cavity is beneficial to increasing the contact area between the part to be subjected to temperature control and the heat conduction module, the heat dissipation area is increased, and the heat dissipation speed is increased; therefore, heat emitted by the to-be-temperature-controlled part can be rapidly transmitted to the refrigeration module through the heat conduction module and absorbed through the refrigeration module, and rapid heat dissipation is achieved. And compared with the heat dissipation mode of the existing silicon-based OLED product, the heat dissipation capability of the product can be improved without reducing the brightness of the silicon-based OLED product, and the application range of the product is expanded.

Description

Technical Field

[0001] The utility model relates to the field of display technology, in particular to a temperature control fixture and a silicon-based OLED product. Background Art

[0002] Silicon-based OLED products generally have heating problems, especially those with PCB binding. Due to poor heat dissipation, the product generates a lot of heat. In order to avoid excessive heat generation, the only way is to reduce the brightness of the product. However, this method will make the product unsuitable for high-brightness fields, thus greatly limiting the application range of the product. Utility Model Content

[0003] The utility model provides a temperature control fixture and a silicon-based OLED product, which can improve the heat dissipation capacity of the product without reducing the brightness of the silicon-based OLED product and expand the application range of the product.

[0004] According to one aspect of the utility model, a temperature control fixture is provided, which includes: a heat conduction module and a refrigeration module; wherein the heat conduction module is provided with a concave-shaped cavity; one end of the concave-shaped cavity is provided with an opening; the inner surface of the concave-shaped cavity is used to place a part to be temperature-controlled; the refrigeration module is coated on the outer surface of the concave-shaped cavity and is closely arranged.

[0005] Optionally, the heat-conducting module at least includes a first heat-conducting component, a second heat-conducting component, a third heat-conducting component and a fourth heat-conducting component; the first heat-conducting component, the second heat-conducting component, the third heat-conducting component and the fourth heat-conducting component enclose the concave-shaped cavity.

[0006] Optionally, the inner surface of the concave-shaped cavity includes a first inner side surface, a second inner side surface, a third inner side surface and an inner bottom surface; wherein the first inner side surface is a first heat-conducting component, the second inner side surface is a second heat-conducting component, the third inner side surface is a third heat-conducting component, and the inner bottom surface is a fourth heat-conducting component.

[0007] Optionally, along the vertical direction, the height of the refrigeration module is less than or equal to the sum of the thickness of the fourth heat conducting component and the thickness of the component to be temperature-controlled.

[0008] Optionally, the first heat-conducting component, the second heat-conducting component, the third heat-conducting component and the fourth heat-conducting component are in a rectangular parallelepiped shape.

[0009] Optionally, the refrigeration module includes at least: a first refrigeration component, a second refrigeration component and a third refrigeration component; wherein the first refrigeration component is arranged close to the outer surface of the first heat-conducting component, the second refrigeration component is arranged close to the outer surface of the second heat-conducting component, and the third refrigeration component is arranged close to the outer surface of the third heat-conducting component.

[0010] Optionally, the first refrigeration component, the second refrigeration component and the third refrigeration component are semiconductor refrigeration sheets.

[0011] Optionally, the heat-conducting module is heat-conducting glass.

[0012] Optionally, along the vertical direction, the height of the refrigeration module is greater than the height of the concave-shaped cavity.

[0013] According to another aspect of the utility model, a silicon-based OLED product is provided, and the silicon-based OLED product includes the temperature control fixture as described in the first aspect.

[0014] The technical solution of the embodiment of the utility model provides a temperature control fixture and a silicon-based OLED product, wherein the temperature control fixture includes: a heat conduction module and a refrigeration module; wherein the heat conduction module is provided with a concave-shaped cavity; an opening is provided at one end of the concave-shaped cavity; the inner surface of the concave-shaped cavity is used to place the temperature-controlled part; and the refrigeration module is coated on the outer surface of the concave-shaped cavity and is closely arranged. It can be seen that by providing a refrigeration module and a heat conduction module with a concave-shaped cavity, the temperature-controlled part can be placed in the concave-shaped cavity. The concave-shaped cavity is provided to increase the contact area between the temperature-controlled part and the heat conduction module, thereby increasing the heat dissipation area and heat dissipation speed, so that the heat emitted by the temperature-controlled part can be quickly transferred to the refrigeration module through the heat conduction module, and the heat is absorbed by the refrigeration module, thereby realizing the rapid heat dissipation of the temperature-controlled part and improving the heat dissipation capacity. Compared with the existing heat dissipation method of silicon-based OLED products, the heat dissipation capacity of the product can be improved without reducing the brightness of the silicon-based OLED product, thereby expanding the scope of application of the product.

[0015] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present utility model, nor are they intended to limit the scope of the present utility model. Other features of the present utility model will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 It is a structural schematic diagram of a temperature control fixture provided in an embodiment of the utility model;

[0018] Figure 2 It is provided in the embodiment of the utility model Figure 1Schematic diagram of the cross-sectional structure along the AA direction;

[0019] Figure 3 It is a structural schematic diagram of another temperature control fixture provided in an embodiment of the utility model;

[0020] Figure 4 It is a kind of embodiment provided in the utility model Figure 3 Schematic diagram of the cross-sectional structure along the BB direction;

[0021] Figure 5 Another embodiment of the utility model provides Figure 3 Schematic diagram of the cross-sectional structure along the BB direction;

[0022] Figure 6 It is a structural schematic diagram of another temperature control fixture provided in an embodiment of the utility model;

[0023] Figure 7 It is provided in the embodiment of the utility model Figure 6 Schematic diagram of the cross-sectional structure along the CC direction. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0025] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0026] Figure 1 It is a structural schematic diagram of a temperature control fixture provided in an embodiment of the utility model. Figure 2 It is provided in the embodiment of the utility model Figure 1Schematic diagram of the cross-section structure along the AA direction. Figure 1 and Figure 2 The temperature control fixture includes: a heat conduction module 10 and a refrigeration module 20; wherein the heat conduction module 10 is provided with a concave-shaped cavity Q; an opening K is provided at one end of the concave-shaped cavity Q; an inner surface Q1 of the concave-shaped cavity Q is used to place the temperature-controlled component; the refrigeration module 20 is covered on the outer surface Q2 of the concave-shaped cavity Q and is closely arranged.

[0027] Among them, an opening K is provided at one end of the concave-shaped cavity Q, and the opening K is used to facilitate the placement of the temperature-controlled component into the concave-shaped cavity Q.

[0028] Among them, the concave-shaped cavity Q is used to place the temperature-controlled component. The temperature-controlled component is placed on the inner surface of the concave-shaped cavity Q and is set closely to the inner surface of the concave-shaped cavity Q. The advantage of such a setting is that by setting the concave-shaped cavity Q and placing the temperature-controlled component closely to the inner surface of the concave-shaped cavity Q, the contact area between the temperature-controlled component and the heat-conducting module 10 can be increased, the heat dissipation area can be increased, and the heat dissipation speed can be increased, which is beneficial to quickly transfer the heat emitted by the temperature-controlled component to the refrigeration module 20 through the concave-shaped cavity Q, and then it is beneficial to improve the heat dissipation capacity of the temperature-controlled component.

[0029] The part to be temperature-controlled may be a silicon-based OLED product, especially a PCB-bound product.

[0030] Among them, the refrigeration module 20 is covered on the outer surface Q2 of the concave cavity Q and is set closely. The advantage of such a setting is that it can increase the efficiency of heat transfer from the thermal conductive module 10 to the refrigeration module 20, thereby increasing the heat dissipation efficiency of the temperature-controlled component and improving the heat dissipation capacity of the temperature-controlled component.

[0031] The refrigeration module 20 is used to absorb the heat conducted by the heat conduction module 10 and to control the temperature. The refrigeration module 20 may be a semiconductor refrigeration sheet. The refrigeration module 20 may be connected to a power source through a wire, and after the power source is turned on, the temperature of the temperature-controlled component (such as a silicon-based OLED product) may be controlled within a certain range.

[0032] Among them, temperature control can be achieved through semiconductor cooling chips. The specific implementation method can be: electrically connect the semiconductor cooling chip with the control power supply, and integrate the control power supply with the product host computer. The host computer algorithm can read the product temperature in real time, and then adjust the output power of the semiconductor cooling chip in real time according to the product temperature, thereby achieving the purpose of intelligent temperature control.

[0033] The technical solution of this embodiment provides a temperature control fixture, which includes: a heat conduction module and a refrigeration module; wherein the heat conduction module is provided with a concave-shaped cavity; one end of the concave-shaped cavity is provided with an opening; the inner surface of the concave-shaped cavity is used to place the temperature-controlled part; the refrigeration module is coated on the outer surface of the concave-shaped cavity and is arranged closely. It can be seen that by providing a refrigeration module and a heat conduction module with a concave-shaped cavity, the temperature-controlled part can be placed in the concave-shaped cavity. The concave-shaped cavity is provided to increase the contact area between the temperature-controlled part and the heat conduction module, thereby increasing the heat dissipation area and heat dissipation speed, so that the heat emitted by the temperature-controlled part can be quickly transferred to the refrigeration module through the heat conduction module, and the heat is absorbed by the refrigeration module, thereby realizing the rapid heat dissipation of the temperature-controlled part and improving the heat dissipation capacity. Compared with the existing heat dissipation method of silicon-based OLED products, the heat dissipation capacity of the product can be improved without reducing the brightness of the silicon-based OLED product, thereby improving the brightness of the silicon-based OLED product and expanding the scope of application of the product.

[0034] Based on the above implementation scheme, optionally, continue to refer to Figure 2 , along the vertical direction Y, the height H1 of the refrigeration module 20 is greater than the height H2 of the concave-shaped cavity Q.

[0035] Exemplary, reference Figure 2 In the vertical direction Y, the height H1 of the refrigeration module 20 is greater than the height H2 of the concave cavity Q, and therefore, the height H1 of the refrigeration module 20 must be greater than the height H3 of the thermal conductive module 10. The advantage of this arrangement is that it increases the contact area between the thermal conductive module and the refrigeration module, and transfers the heat absorbed by the concave cavity Q to the refrigeration module 20 as much as possible, thereby improving the heat dissipation capacity of the product.

[0036] Optionally, the heat-conducting module is heat-conducting glass.

[0037] Among them, the thermal conductive module is a highly transparent thermal conductive glass. The advantage of this setting is that when the temperature-controlled component is a silicon-based OLED product, since the thermal conductive module is a highly transparent thermal conductive glass, it is possible to dissipate the heat emitted by the silicon-based OLED product through the thermal conductive module while not affecting the normal display function of the silicon-based OLED product. In other words, the temperature control fixture can improve the heat dissipation capacity of the silicon-based OLED product without affecting the display function of the silicon-based OLED product.

[0038] Figure 3 It is a structural schematic diagram of another temperature control fixture provided in an embodiment of the utility model. Figure 4 It is a kind of embodiment provided in the utility model Figure 3 A schematic diagram of the cross-sectional structure along the BB direction. Based on the above implementation scheme, optionally, refer to Figure 3 and Figure 4 The heat-conducting module at least includes a first heat-conducting component 11, a second heat-conducting component 12, a third heat-conducting component 13 and a fourth heat-conducting component 14; the first heat-conducting component 11, the second heat-conducting component 12, the third heat-conducting component 13 and the fourth heat-conducting component 14 enclose a concave-shaped cavity Q.

[0039] refer to Figure 3 and Figure 4 The first heat-conducting component 11, the second heat-conducting component 12 and the third heat-conducting component 13 are used as the side surfaces of the concave-shaped cavity Q, and the fourth heat-conducting component 14 is used as the bottom surface of the concave-shaped cavity Q, thereby enclosing a concave-shaped cavity Q with an opening K at one end.

[0040] Figure 5 Another embodiment of the utility model provides Figure 3 There are two ways to enclose the concave cavity Q by the first heat-conducting component 11, the second heat-conducting component 12, the third heat-conducting component 13 and the fourth heat-conducting component 14: one is as follows Figure 4 As shown, the fourth heat-conducting component 14 is used as the bottom surface of the concave cavity Q, and the first heat-conducting component 11, the second heat-conducting component 12 and the third heat-conducting component 13 are surrounded on the front surface of the fourth heat-conducting component 14 to form the side surface of the concave cavity Q. Figure 5 As shown, the fourth heat-conducting component 14 is used as the bottom surface of the concave-shaped cavity Q, and the first heat-conducting component 11, the second heat-conducting component 12 and the third heat-conducting component 13 are enclosed from the side of the fourth heat-conducting component 14 to form the side of the concave-shaped cavity Q. The specific enclosing method can be set according to actual conditions and is not specifically limited here.

[0041] Optionally, the concave-shaped cavity Q can be formed by combining the first heat-conducting component 11, the second heat-conducting component 12, the third heat-conducting component 13 and the fourth heat-conducting component 14 through heat-conducting adhesive or the like to form a concave-shaped cavity. It can also be directly made in one piece. The specific setting can be made according to the actual situation and is not specifically limited here.

[0042] Optionally, continue to refer to Figure 3 The inner surface of the concave cavity Q includes a first inner side surface Q11, a second inner side surface Q12, a third inner side surface Q13 and an inner bottom surface Q14; wherein the first inner side surface Q11 is the first heat-conducting component 11, the second inner side surface Q12 is the second heat-conducting component 12, the third inner side surface Q13 is the third heat-conducting component 13, and the inner bottom surface Q14 is the fourth heat-conducting component 14.

[0043] The fourth heat-conducting component 14 is the bottom surface of the concave-shaped cavity Q, and the first heat-conducting component 11, the second heat-conducting component 12 and the third heat-conducting component 13 enclose the side surface of the concave-shaped cavity Q. Therefore, the bottom surface of the concave-shaped cavity Q is provided by one surface of the fourth heat-conducting component 14, the first inner side surface Q11 of the concave-shaped cavity Q is provided by one surface of the first heat-conducting component 11, the second inner side surface Q12 of the concave-shaped cavity Q is provided by one surface of the second heat-conducting component 12, and the third inner side surface Q13 of the concave-shaped cavity Q is provided by one surface of the third heat-conducting component 13.

[0044] Optionally, refer to Figures 3 to 5 The first heat conducting component 11, the second heat conducting component 12, the third heat conducting component 13 and the fourth heat conducting component 14 are in a rectangular parallelepiped shape.

[0045] Optionally, the first heat-conducting component, the second heat-conducting component, the third heat-conducting component and the fourth heat-conducting component are highly transparent heat-conducting glass. The advantage of such a setting is that when the temperature-controlled component is a silicon-based OLED product, since the first heat-conducting component, the second heat-conducting component, the third heat-conducting component and the fourth heat-conducting component are highly transparent heat-conducting glass, the heat emitted by the silicon-based OLED product can be dissipated through the heat-conducting module while not affecting the normal display function of the silicon-based OLED product. In other words, the temperature control fixture can improve the heat dissipation capacity of the silicon-based OLED product without affecting the display function of the silicon-based OLED product.

[0046] Optionally, refer to Figure 5 , along the vertical direction Y, the height H1 of the refrigeration module 20 is less than or equal to the sum of the thickness h1 of the fourth heat conducting component and the thickness h2 of the temperature-controlled component 30 .

[0047] Exemplarily, the temperature-controlled component 30 is a PCB-bound product of a silicon-based OLED. The height H1 of the refrigeration module 20 is set to be less than or equal to the sum of the thickness h1 of the fourth heat-conducting component and the thickness h2 of the temperature-controlled component 30. The advantages of such a setting are: on the one hand, it is conducive to increasing the area of ​​heat conduction and heat dissipation, and improving the heat dissipation capacity of the silicon-based OLED product; on the other hand, it will not affect the spatial layout of the silicon-based OLED product.

[0048] Figure 6 It is a structural schematic diagram of another temperature control fixture provided in an embodiment of the utility model. Figure 7 It is provided in the embodiment of the utility model Figure 6 A schematic diagram of the cross-sectional structure along the CC direction in FIG. Based on the above implementation scheme, optionally, refer to Figure 6 and Figure 7The refrigeration module at least includes: a first refrigeration component 21, a second refrigeration component 22 and a third refrigeration component 23; wherein the first refrigeration component 21 is arranged close to the outer surface of the first heat-conducting component 11, the second refrigeration component 22 is arranged close to the outer surface of the second heat-conducting component 12, and the third refrigeration component 23 is arranged close to the outer surface of the third heat-conducting component 13.

[0049] Among them, the advantage of arranging the first refrigeration component 21, the second refrigeration component 22 and the third refrigeration component 23 closely on the outer surfaces of the first heat-conducting component 11, the second heat-conducting component 12 and the third heat-conducting component 13 respectively is that the contact area between each heat-conducting component and the corresponding refrigeration component can be increased, that is, the contact area between the first heat-conducting component 11 and the first refrigeration component 21 is increased, the contact area between the second heat-conducting component 12 and the second refrigeration component 22 is increased, and the contact area between the third heat-conducting component 13 and the third refrigeration component 23 is increased, thereby improving the ability of the heat-conducting component to transfer heat to the refrigeration component, thereby improving the heat dissipation capacity of the silicon-based OLED product, and compared with the prior art, the heat dissipation capacity of the product can be improved without reducing the brightness of the silicon-based OLED product, thereby expanding the application range of the product.

[0050] It should be noted that Figure 7 The first heat conducting component 11, the second heat conducting component 12, the third heat conducting component 13 and the fourth heat conducting component 14 are merely exemplarily shown as a way of enclosing a concave-shaped cavity Q (i.e., Figure 4 The same way), or another way (that is, Figure 5 The same method) can be set according to actual conditions and is not specifically limited here.

[0051] Optionally, the first refrigeration component, the second refrigeration component and the third refrigeration component are semiconductor refrigeration sheets.

[0052] Among them, the semiconductor cooling plate can be connected to the control power supply through a wire, and after the power is turned on, the temperature of the temperature-controlled component (such as silicon-based OLED products) can be controlled within a certain range.

[0053] Exemplary, reference Figure 6 and Figure 7The implementation process of the temperature control fixture is as follows: place the silicon-based OLED product in the concave-shaped cavity Q, and connect the three semiconductor refrigeration plates (i.e., the first refrigeration component 21, the second refrigeration component 22, and the third refrigeration component 23) to the power supply. After the power is turned on, the semiconductor refrigeration plate starts to work, and the heat emitted by the silicon-based OLED product is transferred to the semiconductor refrigeration plate through the first heat-conducting component 11, the second heat-conducting component 12, the third heat-conducting component 13, and the fourth heat-conducting component 14 covering its surface. The control power supply of the semiconductor refrigeration plate is integrated with the product host computer. The actual temperature of the product can be read in real time through the host computer algorithm, and the output power of the semiconductor refrigeration plate can be adjusted according to the actual temperature of the product, thereby achieving the purpose of intelligent temperature control, thereby realizing the temperature control of the silicon-based OLED product and improving the heat dissipation capacity of the product. Compared with the existing heat dissipation method of silicon-based OLED products, this solution can improve the heat dissipation capacity of the product without reducing the brightness of the silicon-based OLED product, thereby improving the brightness of the silicon-based OLED product and expanding the scope of application of the product.

[0054] An embodiment of the utility model further provides a silicon-based OLED product, which includes the temperature control fixture provided by any embodiment of the utility model.

[0055] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0056] The above specific implementations do not constitute a limitation on the protection scope of the present utility model. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A temperature control fixture, characterized in that: include: A heat conduction module and a refrigeration module; wherein the heat conduction module is provided with a concave-shaped cavity; an opening is provided at one end of the concave-shaped cavity; the inner surface of the concave-shaped cavity is used to place the temperature-controlled component; the refrigeration module is coated on the outer surface of the concave-shaped cavity and is closely arranged.

2. The temperature control fixture according to claim 1, characterized in that: The heat-conducting module at least includes a first heat-conducting component, a second heat-conducting component, a third heat-conducting component and a fourth heat-conducting component; the first heat-conducting component, the second heat-conducting component, the third heat-conducting component and the fourth heat-conducting component enclose the concave-shaped cavity.

3. The temperature control fixture according to claim 2, characterized in that: The inner surface of the concave-shaped cavity includes a first inner side surface, a second inner side surface, a third inner side surface and an inner bottom surface; wherein the first inner side surface is a first heat-conducting component, the second inner side surface is a second heat-conducting component, the third inner side surface is a third heat-conducting component, and the inner bottom surface is a fourth heat-conducting component.

4. The temperature control fixture according to claim 3, characterized in that: In the vertical direction, the height of the refrigeration module is less than or equal to the sum of the thickness of the fourth heat conducting component and the thickness of the component to be temperature-controlled.

5. The temperature control fixture according to claim 2, characterized in that: The first heat conducting component, the second heat conducting component, the third heat conducting component and the fourth heat conducting component are in a rectangular parallelepiped shape.

6. The temperature control fixture according to claim 2, characterized in that: The refrigeration module at least includes: a first refrigeration component, a second refrigeration component and a third refrigeration component; wherein the first refrigeration component is arranged close to the outer surface of the first heat-conducting component, the second refrigeration component is arranged close to the outer surface of the second heat-conducting component, and the third refrigeration component is arranged close to the outer surface of the third heat-conducting component.

7. The temperature control fixture according to claim 6, characterized in that: The first refrigeration component, the second refrigeration component and the third refrigeration component are semiconductor refrigeration sheets.

8. The temperature control fixture according to claim 1, characterized in that: The heat conduction module is heat conduction glass.

9. The temperature control fixture according to claim 1, characterized in that: In the vertical direction, the height of the refrigeration module is greater than the height of the concave-shaped cavity.

10. A silicon-based OLED product, characterized in that: Comprising the temperature control fixture as described in any one of claims 1 to 9.

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