UVC LED lamp bead packaging structure

Abstract

The utility model relates to a UVC LED lamp bead packaging structure, which comprises a substrate, a UVC LED chip and a lens, the substrate is provided with a groove, the UVC LED chip is arranged in the groove, the lens is covered in the groove and covers the UVC LED chip, and the lens is formed by curing a silicone oil material. According to the packaging structure, the lens formed by mixing a self-curing silicone oil material is introduced, so that the irradiance is improved; and beta-gallium oxide particles are further doped in the silicone oil material, so that the heat conduction capability is improved, and the formed packaging structure has a good heat dissipation effect and a relatively good optical effect.

Description

Technical Field

[0001] The utility model relates to the field of microelectronic packaging, and in particular to a UVC LED lamp bead packaging structure. Background Art

[0002] Traditional UVC LED lamp bead packaging uses a glass cover plate with a dam structure to seal the UVC LED chip. Although this method isolates the UVC LED chip from moisture, it also reduces the light output rate of the UVC LED chip. In traditional visible light LED packaging, silicone material is used to fill the space between the glass cover plate and the chip. Since silicone material has a high transmittance to the light waves emitted by the visible light LED, and can also match the refractive index of the LED chip and the air, it can improve the light output rate of the visible light LED chip and protect the visible light LED from moisture. However, the transmittance of LED silicone material to the ultraviolet light emitted by the UVC LED chip is very low, and it cannot play the role of refractive index matching.

[0003] Moreover, the packaging structure of the traditional glass cover has a cavity between the glass cover and the ceramic substrate. Due to the poor thermal conductivity of air, the heat energy emitted by the UVC LED chip can only be conducted downward through the ceramic substrate. In view of the low photoelectric conversion efficiency of UVC LED, 95% of the electrical energy will be converted into heat energy and dissipated, and the power of UVC LED chips is getting larger and larger, while the heat dissipation capacity of the existing aluminum nitride ceramic substrate is difficult to be significantly improved. Therefore, it is urgent to improve the heat dissipation capacity in the cavity of the UVC LED device. Utility Model Content

[0004] The purpose of the utility model is to overcome the above shortcomings and defects. In view of the low light output rate and poor heat dissipation of existing UVC LED devices, a lens formed by high deep ultraviolet transmittance and self-curing silicone oil material is introduced, so that the UVC LED chip is better protected, and the irradiance is improved by matching the refractive index of the UVC LED chip and the air; and β-gallium oxide particles are further introduced into the silicone oil material to enhance thermal conductivity and improve heat dissipation, while maintaining good optical effects.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A UVC LED lamp bead packaging structure comprises a substrate, a UVC LED chip and a lens, wherein the substrate has a groove, the UVC LED chip is arranged in the groove, the lens cover is arranged in the groove and covers the UVC LED chip, and the lens is formed by curing a silicone oil material.

[0007] The lens formed by the solidified silicone oil material can match the refractive index of the UVC LED chip and the air, and adjust the light-emitting angle, thereby increasing the irradiance. Moreover, the silicone oil material is initially in liquid form, and can be solidified by emitting ultraviolet light after the LED chip is powered on. After aging, the silicone oil material can be peeled off and re-solidified to form a lens, which is easy to manufacture and replace.

[0008] Furthermore, the wavelength of light emitted by the UVC LED chip is 265 or 280 nm.

[0009] Furthermore, the thermal conductivity of the silicone oil material is 0.1-0.2 W / m·K.

[0010] Furthermore, the transmittance of the silicone oil material at 280 nm is greater than 60%, and the transmittance at 265 nm is greater than 50%.

[0011] Furthermore, the substrate is a ceramic substrate.

[0012] Furthermore, the silicone oil material is hydrogen-containing silicone oil, and has good deep ultraviolet transmittance.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] To achieve this purpose, the utility model adopts the following technical solutions:

[0015] The utility model proposes a UVC LED lamp bead packaging structure. Aiming at the problems of poor light output and poor heat dissipation caused by the cavity of the existing UVC LED device sealed by the glass cover plate and the dam structure, a lens formed by a mixture of self-curing silicone oil material is introduced, so that the UVC LED chip is better protected and the irradiance is improved by matching the refractive index of the UVC LED chip and the air. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the UVC LED lamp bead packaging structure of Example 1 of the utility model;

[0017] Figure 2 A flow chart for preparing the UVC LED lamp bead packaging structure provided in Example 1;

[0018] Figure 3 The statistical results of the surface morphology and radiation power of the UVC LED lamp bead packaging structure obtained without a lens and with different lenses in Example 1;

[0019] Figure 4 This is a schematic diagram of the UVC LED lamp bead packaging structure of Example 3 of the utility model;

[0020] Figure 5A flow chart for preparing the UVC LED lamp bead packaging structure provided in Example 3;

[0021] Among them, 1-substrate; 2-UVC LED chip; 3-lens. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is described in detail below with reference to the accompanying drawings and specific embodiments.

[0023] Example 1

[0024] refer to Figure 1 The present embodiment provides a UVC LED lamp bead packaging structure, including a substrate 1, a UVC LED chip 2 and a lens 3. The substrate 1 has a groove, the UVC LED chip 2 is arranged in the groove, the lens 3 is covered in the groove and covers the UVC LED chip 2, and the lens 3 is formed by curing silicone oil material.

[0025] This embodiment also provides a method for preparing the UVC LED lamp bead packaging structure. Figure 2 As shown, the following steps are included:

[0026] Step 1: Flip-chip soldering of UVC LED chip on substrate;

[0027] Step 2: Use a dispensing machine to fill the silicone oil into the substrate;

[0028] Step 3: Power on the UVC LED chip, irradiate the silicone oil and self-cure to form a lens, completing the final UVC LED device packaging.

[0029] Further, after a period of aging, the following steps may be included:

[0030] Step 4: Remove the lens by acetone soaking and plasma cleaning, and repeat the above steps 2 and 3 to complete the UVC LED device packaging.

[0031] In this embodiment, the silicone oil material is hydrogen-containing silicone oil, the thermal conductivity is 0.1-0.2 W / m·K, the silicone oil material is hydrogen-containing silicone oil, and the deep ultraviolet transmittance at 265 nm is 70%.

[0032] The wavelength of light emitted by the UVC LED chip 2 is 265 nm.

[0033] The substrate 1 is a ceramic substrate.

[0034] Figure 3The surface morphology and radiation power statistics of the package structure without lens and with different lenses in Example 1 are given in FIG. It can be seen that after adding a lens formed by curing silicone oil, the radiation power and normalized radiation power of the device are significantly improved.

[0035] Table 1 shows the variation trend of the transmittance of the lens at 265nm of a specific embodiment with the aging time. It can be seen that at 0h, the transmittance of the lens formed by curing silicone oil is 70%. As the aging time increases, the transmittance is greater than 70% before 750h. At 1000h, the material ages and the transmittance drops to 32%. At this time, the silicone oil material can be re-cured to form a lens.

[0036] Table 1. Relationship between 265nm transmittance and aging time

[0037] 0h 150h 250h 350h 500h 700h 1000h Lens transmittance at 265nm 70 81 73 87 89 74 32

[0038] Example 2

[0039] The difference from Example 1 is that the wavelength of the light emitted by the UVC LED chip 2 is 280 nm. The silicone oil material forming the lens 3 is hydrogenated silicone oil, with a thermal conductivity of 0.1-0.2 W / m·K and a deep ultraviolet transmittance of 70% at 265 nm.

[0040] Table 2 shows the variation trend of the transmittance of the lens at 280nm in a specific embodiment with the aging time. It can be seen that at 0h, the transmittance of the lens formed by curing the silicone oil is 67%. As the aging time increases, the transmittance is >80% before 750h. At 1000h, the material ages and the transmittance drops to 38%. At this time, the aged silicone oil material can be peeled off and re-cured to form a lens.

[0041] Table 2. Relationship between 280nm transmittance and aging time

[0042] 0h 150h 250h 350h 500h 700h 1000h Lens transmittance at 280nm 67 82 88 91 94 85 38

[0043] Example 3

[0044] refer to Figure 4 The present embodiment provides a UVC LED lamp bead packaging structure, including a substrate 1, a UVC LED chip 2 and a lens 3. The substrate 1 has a groove, the UVC LED chip 2 is arranged in the groove, the lens 3 is covered in the groove and covers the UVC LED chip 2. The lens 3 is solidified by a silicone oil material doped with β-gallium oxide particles.

[0045] This embodiment also provides a method for preparing the UVC LED lamp bead packaging structure. The method is as follows: Figure 5 As shown, the following steps are included:

[0046] Step 1: Flip-chip soldering of UVC LED chip on substrate;

[0047] Step 2: Evenly mix the silicone oil and β-gallium oxide particles;

[0048] Step 3: Use a dispensing machine to fill the substrate with a mixture of hydrogenated silicone oil and β-gallium oxide particles;

[0049] Step 4: Power on the UVC LED chip, irradiate the mixture of hydrogenated silicone oil and β-gallium oxide particles and self-cure to complete the final UVC LED device packaging.

[0050] Further, after a period of aging, the following steps may be included:

[0051] Step 5: Remove the lens by acetone soaking and plasma cleaning, and repeat the above steps 2 to 4 to complete the UVC LED device packaging.

[0052] In this embodiment, the silicone oil material forming the lens 3 is hydrogen-containing silicone oil, the deep ultraviolet transmittance at 280nm is 70%, and the thermal conductivity of the silicone oil material is 0.1W / m·K;

[0053] The particle size of the β-gallium oxide particles is 10-100 microns, the transmittance of the β-gallium oxide particles at 280 nm is 75%, and the thermal conductivity of the β-gallium oxide particles is 10 W / m·K.

[0054] The wavelength of light emitted by the UVC LED chip 2 is 280 nm.

[0055] The substrate 1 is a ceramic substrate.

[0056] The overall thermal conductivity of the prepared packaging structure is 2W / m·K. At 0h, the transmittance of lens 3 at 280nm is 72%, and before 750h, the transmittance is greater than 70%. At 1000h, the material ages and the transmittance decreases. At this time, the silicone oil material can be stripped and re-solidified to form a lens.

[0057] Example 4

[0058] The difference from Example 3 is that the silicone oil material forming the lens 3 is hydrogen-containing silicone oil, the deep ultraviolet transmittance at 280nm is 70%, and the thermal conductivity of the silicone oil material is 0.12W / m·K;

[0059] The particle size of the β-gallium oxide particles is 10-100 microns, the transmittance of the β-gallium oxide particles at 280nm is 80%, and the thermal conductivity of the β-gallium oxide particles is 15W / m·K.

[0060] The wavelength of light emitted by the UVC LED chip 2 is 280 nm.

[0061] The substrate 1 is a ceramic substrate.

[0062] The overall thermal conductivity of the prepared packaging structure is 3W / m·K. At 0h, the transmittance of lens 3 at 280nm is 72%. Before 750h, the lens transmittance is greater than 70%. At 1000h, the material ages and the transmittance decreases. At this time, the silicone oil material can be stripped off and re-solidified to form a lens.

[0063] Example 5

[0064] The difference from Example 3 is that the silicone oil material forming the lens 3 is hydrogen-containing silicone oil, the deep ultraviolet transmittance at 280nm is 70%, and the thermal conductivity of the silicone oil material is 0.2W / m·K;

[0065] The particle size of the β-gallium oxide particles is 10-100 microns, the transmittance of the β-gallium oxide particles at 280nm is 75%, and the thermal conductivity of the β-gallium oxide particles is 20W / m·K.

[0066] The wavelength of light emitted by the UVC LED chip 2 is 280 nm.

[0067] The substrate 1 is a ceramic substrate.

[0068] The overall thermal conductivity of the prepared packaging structure is 4 W / m·K. At 0 h, the transmittance of lens 3 at 280 nm is 72%. Before 750 h, the lens transmittance is greater than 70%. At 1000 h, the material ages and the transmittance decreases. At this time, the silicone oil material can be stripped off and re-solidified to form a lens.

[0069] Example 6

[0070] The difference from Example 3 is that the silicone oil material forming the lens 3 is hydrogen-containing silicone oil, the deep ultraviolet transmittance at 280nm is 70%, and the thermal conductivity of the silicone oil material is 0.15W / m·K;

[0071] The thermal conductivity of the β-gallium oxide particles is 27 W / m·K, the particle size of the β-gallium oxide particles is 10-100 microns, and the transmittance of the β-gallium oxide particles at 280 nm is 75%.

[0072] The wavelength of the emitted light of the UVC LED chip 2 is 280 nm.

[0073] The substrate 1 is a ceramic substrate.

[0074] The overall thermal conductivity of the prepared packaging structure is 4.3 W / m·K. At 0 h, the transmittance of lens 3 at 280 nm is 72%. Before 750 h, the lens transmittance is greater than 70%. At 1000 h, the material ages and the transmittance decreases. At this time, the silicone oil material can be stripped off and re-solidified to form a lens.

[0075] In summary, in Examples 1 to 6, the utility model introduces a lens formed of a self-curing silicone oil material into the UVC LED lamp bead packaging structure, so that the UVC LED chip is better protected, while the irradiance is improved by matching the refractive index of the UVC LED chip and the air; and further introduces β-gallium oxide particles into the silicone oil material to enhance thermal conductivity and improve heat dissipation, while maintaining a good optical effect.

[0076] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A UVC LED lamp bead packaging structure, characterized in that: The invention comprises a substrate, a UVC LED chip and a lens. The substrate is provided with a groove. The UVC LED chip is arranged in the groove. The lens cover is arranged in the groove and covers the UVC LED chip. The lens is formed by curing silicone oil material.

2. The UVC LED lamp bead packaging structure according to claim 1, characterized in that: The wavelength of light emitted by the UVC LED chip is 265 or 280 nm.

3. The UVC LED lamp bead packaging structure according to claim 1, characterized in that: The transmittance of the silicone oil material at 280 nm is greater than 60%, or the transmittance at 265 nm is greater than 50%.

4. The UVC LED lamp bead packaging structure according to claim 1, characterized in that: The substrate is a ceramic substrate.

5. The UVC LED lamp bead packaging structure according to claim 1, characterized in that: The silicone oil material is hydrogen-containing silicone oil.

6. The UVC LED lamp bead packaging structure according to claim 1, characterized in that: The thermal conductivity of the silicone oil material is 0.1-0.2 W / m·K.

7. The UVC LED lamp bead packaging structure according to any one of claims 1 to 6, characterized in that: The silicone oil material is also doped with β-gallium oxide particles.

8. The UVC LED lamp bead packaging structure according to claim 7, characterized in that: The thermal conductivity of the β-gallium oxide particles is 10-27 W / m·K.

9. The UVC LED lamp bead packaging structure according to claim 7, characterized in that: The transmittance of the β-gallium oxide particles at 280 nm is greater than 70%, or the transmittance of the gallium oxide particles at 265 nm is greater than 70%.

10. The UVC LED lamp bead packaging structure according to claim 7, characterized in that: The particle size of the β-gallium oxide particles is micron-level.

Images