Material storage device and die bonder
By using a sensing device in the material storage device to detect the wafer ring status and perform lifting and lowering compensation of the material collection mechanism, the problem of wafer ring damage caused by uneven material collection is solved, and the accurate placement of the wafer ring and the safe operation of the material storage device are achieved.
Patent Information
- Application Number
- CN202420190495.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-26
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-01-26
AI Technical Summary
The material collection mechanism may have uneven material extraction when picking up the wafer ring, which causes the wafer ring to be placed accurately into the storage device, causing the wafer ring to collide with the storage device and damage.
A material storage device is designed, equipped with a sensing device for detecting the state of the wafer ring and compensating by the lifting and lowering movement of the material collection mechanism so that the wafer ring can be placed in the material storage device smoothly without colliding with the material storage device.
Through detection and lift compensation, ensure that the wafer ring is aligned with the cavity port of the storage device in the up and down direction, reducing the possibility of wafer ring damage.
Smart Images
Figure CN222573130U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of material taking devices, in particular to a material storage device and a crystal bonding machine. Background Art
[0002] At present, the crystal bonding machine includes a material storage device and a material picking device. The material picking device includes a frame, a controller, and a material picking mechanism. The material storage device is arranged on the frame, and the controller is connected to the material picking mechanism. The controller controls the material picking mechanism to pick up the wafer ring and perform lifting and lowering movements on the frame to place the wafer ring into the material storage device. However, when the material picking mechanism picks up the wafer ring, there may be a phenomenon of uneven picking, which makes the wafer ring unable to be accurately placed in the material storage device, resulting in the collision of the wafer ring with the material storage device and causing damage to the wafer ring. Utility Model Content
[0003] The main purpose of the utility model is to provide a material storage device, which is designed to detect the state of a wafer ring picked up by a material picking mechanism, and compensate for the uneven state of the wafer ring by lifting and lowering the material picking mechanism, so that the wafer ring can be smoothly placed in the material storage device without colliding with the material storage device, thereby reducing the possibility of damage to the wafer ring due to collision with the material storage device.
[0004] To achieve the above-mentioned purpose, the material storage device proposed in the utility model is applied to a material taking device, the material taking device comprises a frame, a material taking mechanism that can be lifted and lowered relative to the frame, and a controller connected to the material taking mechanism, the material taking mechanism is used to move the wafer ring to the material storage device, and is characterized in that the material storage device comprises:
[0005] A material box, comprising a material box body provided with a plurality of receiving cavities, wherein the plurality of receiving cavities are spaced apart in the up-down direction, and the receiving cavities have cavities provided on the outer peripheral surface of the material box body, and the cavities are used for allowing wafer rings to enter the cavities; and
[0006] A sensor device is provided on the material box body, and the sensor device has a detection area for detecting the wafer ring. The detection area is provided in front of the receiving cavity, and the detection area is used for the wafer ring to enter in the up and down direction before entering the receiving cavity. The sensor device is used to send a signal to the controller for determining the lifting compensation value of the material picking mechanism, so that the wafer ring picked up by the material picking mechanism is aligned with the corresponding cavity opening in the up and down direction.
[0007] Optionally, the material box further comprises a plurality of support members disposed in the material box body, the plurality of support members are spaced apart in the up-and-down directions, and the material box body and the plurality of support members define a plurality of the receiving cavities.
[0008] Optionally, the support member is provided with a limiting groove for placing the wafer ring.
[0009] Optionally, a reinforcement member is provided on the support member.
[0010] Optionally, a plurality of the cavities are provided on a first side surface of the material box body, and the detection area and the first side surface are arranged opposite to each other in the direction of the cavities.
[0011] Optionally, the sensing device comprises a signal outputter and a signal receiver which jointly limit the detection area, the signal outputter and the signal receiver are arranged at the same height, and the signal outputter and the signal receiver are arranged opposite to each other.
[0012] Optionally, the material box further includes a mounting portion, and the mounting portion is used to be detachably connected to the frame.
[0013] Optionally, an outer peripheral surface of the material box body is provided with an observation hole connected to the plurality of receiving cavities.
[0014] Optionally, a crystal bonding machine includes the aforementioned material storage device and material taking device.
[0015] Optionally, the die bonding machine further comprises an alarm connected to the controller, and the alarm is used to issue a warning when the lifting compensation value exceeds a preset lifting compensation value.
[0016] In the technical solution of the utility model, the material storage device is applied to a material picking device, which includes a frame, a material picking mechanism that can be lifted and lowered relative to the frame, and a controller connected to the material picking mechanism, the material picking mechanism is used to move the wafer ring to the material storage device; the material storage device includes a material box and a sensor device, the material box includes a material box body provided with a plurality of receiving cavities, the plurality of receiving cavities are spaced apart along the up-down direction, the receiving cavity has a cavity opening provided on the outer peripheral surface of the material box body, the cavity opening is used for the wafer ring to enter the receiving cavity; the sensor device is provided on the material box body, the sensor device has a detection area for detecting the wafer ring, the detection area is provided between two receiving cavities that are farthest apart in the up-down direction, the detection area is used for the wafer ring to enter along the up-down direction before entering the receiving cavity, the sensor device is used to send a signal to the controller for determining the lifting and lowering compensation value of the material picker, so that the wafer ring picked up by the material picker is aligned with the corresponding cavity opening in the up-down direction. In this way, a sensing device is provided on a storage device for placing wafer rings. Before the wafer ring picked up by the material picking mechanism is placed in the storage device, it is first inspected in a detection area. Without loss of generality, the material picking device has a picking position for the material picking mechanism to pick up the wafer ring, and a preset position higher than the picking position, and the material picking mechanism can pick up the wafer ring at the picking position. When the material picking mechanism rises from the picking position to the preset position, if the sensor device detects the wafer ring, it means that the wafer ring is clamped normally, there is no up and down offset, and the lifting compensation value is zero. In the process of the material picking mechanism moving from the picking position to the preset position, if the sensor device does not detect the wafer ring, it means that the end of the wafer ring away from the material picking mechanism has deviated downward, and the controller controls the material picking mechanism to move upward a distance so that the wafer ring is detected. This distance is the lifting compensation value. Before the material picking mechanism moves from the picking position to the preset position, the sensor device has detected the wafer ring, which means that the end of the wafer ring away from the material picking mechanism has deviated upward, and the controller controls the material picking mechanism to move downward a distance so that the wafer ring is detected. This distance is the lifting compensation value. In this way, after the lifting compensation, the material picking mechanism can make the wafer ring face the corresponding cavity opening, and align with the cavity opening in the up and down direction, reducing the possibility of the wafer ring being damaged due to uneven material picking and collision with the material box body. For ease of understanding, an example is given here. For example, the material picking mechanism needs to move to a distance A from the picking position so that the wafer ring in normal condition is aligned with the corresponding cavity opening. Then the actual distance the material picking mechanism rises from the picking position is the sum of A and the lifting compensation value. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0018] Figure 1 This is a structural schematic diagram of an embodiment of the material storage device of the utility model;
[0019] Figure 2 It is a structural schematic diagram of an embodiment of a die bonding machine of the utility model.
[0020] Description of Figure Numbers:
[0021]
[0022] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.
[0025] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or abutment, and it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0026] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0027] At present, the crystal bonding machine includes a storage device and a material picking device, the material picking device includes a frame, a controller, and a material picking mechanism, the storage device is arranged on the frame, and the controller is connected to the material picking mechanism. The controller controls the material picking mechanism to pick up the wafer ring and make a lifting movement on the frame to put the wafer ring into the storage device. However, when the material picking mechanism picks up the wafer ring, there may be a phenomenon of uneven material picking, which makes the wafer ring cannot be accurately placed in the storage device, and causes the wafer ring to collide with the storage device and cause damage to the wafer ring. For this reason, the utility model proposes a storage device, which is intended to detect the state of the wafer ring picked up by the material picking mechanism, and compensate for the uneven material picking state of the wafer ring by lifting the material picking mechanism, so that the wafer ring can be smoothly placed in the storage device without colliding with the storage device, reducing the possibility of damage caused by the collision between the wafer ring and the storage device.
[0028] Reference Figures 1 to 2In the technical solution of the utility model, the material storage device is applied to a material picking device, which includes a frame 310, a material picking mechanism 320 that can be lifted and lowered relative to the frame 310, and a controller connected to the material picking mechanism 320, and the material picking mechanism 320 is used to move the wafer ring to the material storage device; the material storage device includes a material box and a sensor device 200, the material box includes a material box body 110 provided with a plurality of receiving cavities 111, the plurality of receiving cavities 111 are spaced apart in the up-down direction, and the receiving cavities 111 have a cavity 112 provided on the outer peripheral surface of the material box body 110, The cavity opening 112 is used for the wafer ring to enter the receiving cavity 111; the sensor device 200 is arranged on the material box body 110, and the sensor device 200 has a detection area for detecting the wafer ring. The detection area is arranged between the two receiving cavities 111 that are farthest apart in the vertical direction. The detection area is used for the wafer ring to enter in the vertical direction before entering the receiving cavity 111. The sensor device 200 is used to send a signal to the controller for determining the lifting compensation value of the material picker, so that the wafer ring picked up by the material picker is aligned with the corresponding cavity opening 112 in the vertical direction. In this way, the sensor device 200 is set on the storage device for placing the wafer ring. Before the wafer ring picked up by the material picking mechanism 320 is placed in the storage device, it is first detected by the detection area. Without loss of generality, the material picking device has a picking position for the material picking mechanism 320 to pick up the wafer ring, and a preset position higher than the picking position. The material picking mechanism 320 can pick up the wafer ring at the picking position. When the material picking mechanism 320 rises from the picking position to the preset position, if the sensor device 200 detects the wafer ring, it means that the clamping state of the wafer ring is normal, there is no up and down deviation, and the lifting compensation value is zero. In the process of the material picking mechanism 320 moving from the picking position to the preset position, if the sensor device 200 does not detect the wafer ring, it means that the end of the wafer ring away from the material picking mechanism 320 has deviated downward. The controller controls the material picking mechanism 320 to move upward for a distance so that the wafer ring is detected. The distance is the lifting compensation value. Before the material picking mechanism 320 moves from the picking position to the preset position, the sensor device 200 has already detected the wafer ring, it means that the end of the wafer ring away from the material picking mechanism 320 has deviated upward. The controller controls the material picking mechanism 320 to move downward for a distance so that the wafer ring is detected. The distance is the lifting compensation value. In this way, after the lifting compensation, the material picking mechanism 320 can make the wafer ring face the corresponding cavity 112, and align with the cavity 112 in the vertical direction, reducing the possibility of the wafer ring being damaged by colliding with the material box body 110 due to uneven material picking. For ease of understanding, an example is given here, for example, the material picking mechanism 320 needs to move to a distance A from the picking position to make the normal wafer ring face the corresponding cavity 112, then the actual rising distance of the material picking mechanism 320 from the picking position is the sum of A and the lifting compensation value.
[0029] In another embodiment, there are many types of sensor devices 200. Optionally, the sensor device 200 may be an infrared sensor or a fiber optic photoelectric sensor, as long as it can accomplish the above-mentioned detection function on the wafer ring.
[0030] Optionally, in one embodiment, the material box further includes a plurality of support members 120 disposed in the material box body 110, the plurality of support members 120 are spaced apart in the up-down direction, and the material box body 110 and the plurality of support members 120 define a plurality of receiving cavities 111. In this way, a plurality of support members 120 are disposed in the material box body 110 to support the wafer ring placed in the material box body 110, and the receiving cavity 111 is formed by limiting between adjacent support members 120 and between the support member 120 and the material box body 110, so as to facilitate the reception of the wafer ring.
[0031] In another embodiment, there are multiple ways to support and place the wafer ring, which are not limited to the form of setting the support member 120. It can also be that a groove is set in an annular manner along the side wall of the material box body 110 in the receiving cavity 111 for the wafer ring to be clamped and placed.
[0032] Optionally, in one embodiment, the support member 120 is provided with a limiting groove 121 for placing the wafer ring. In this way, the limiting groove 121 for placing the wafer ring is provided on the support member 120 to limit the movement of the wafer ring on the support member 120, so that the wafer ring is not easy to move on the support member 120, thereby improving the stability of the wafer ring on the support member 120.
[0033] In another embodiment, there may be multiple structures for limiting the wafer ring, not limited to the above-mentioned situation. A rubber pad with a smaller thickness may be arranged on the plane of the support 120 supporting the wafer ring to increase the friction between the wafer ring and the support 120, so that the wafer ring is not easy to move on the support 120.
[0034] Optionally, in one embodiment, a reinforcing member 122 is provided on the supporting member 120. Thus, the reinforcing member 122 is provided to enhance the structural strength of the supporting member 120 and reduce the possibility of deformation of the supporting member 120 under load.
[0035] In another embodiment, the reinforcement member 122 provided on the support member 120 may be of multiple types. For example, a rib plate with a smaller thickness is provided in the middle of the support member 120 to strengthen the structural strength of the support member 120 .
[0036] Optionally, in one embodiment, a plurality of cavities 112 are provided on the first side of the magazine body 110, and the detection area is arranged opposite to the first side in the direction of the cavities 112. In this way, the cavities 112 are arranged on the first side of the magazine body 110, so that the material picking mechanism 320 can pick up and put the wafer ring in, and the detection area is arranged opposite to the cavities 112 on the first side in the direction of the cavities 112, so that the material picking mechanism 320 can detect the wafer ring before putting the wafer ring into the storage cavity.
[0037] In another embodiment, there can be multiple positions between the detection area and the cavity 112. The signal outputter 210 and the signal receiver 220 can also be arranged on the top of the material box body 110 and set at the same height. In this way, the detection area is set relative to the top of the material box body 110, and the detection of the wafer ring can also be completed.
[0038] Optionally, in one embodiment, the sensor device 200 includes a signal output device 210 and a signal receiver 220 that jointly limit a detection area, and the signal output device 210 and the signal receiver 220 are arranged at the same height, and the signal output device 210 and the signal receiver 220 are arranged opposite to each other. In this way, the signal output device 210 sends out a detection signal for detecting the wafer ring, and the signal receiver 220 is used to receive the signal sent by the signal output device 210. The signal output device 210 and the signal receiver 220 are arranged at the same height, which ensures the accuracy of the signal transmitted by the sensor device 200 when the wafer ring passes through the detection area for detection, and reduces the possibility of repeated detection of the wafer ring and the erroneous detection result caused by the inconsistent height of the signal output device 210 and the signal receiver 220.
[0039] In another embodiment, the configuration of the signal output device 210 and the signal receiver 220 is not limited to the above-mentioned case, and the signal output device 210 and the signal receiver 220 may be integrated into the same device to form a reflective sensor.
[0040] Optionally, in one embodiment, the material box further includes a mounting portion 130, and the mounting portion 130 is used to be detachably connected to the frame 310. In this way, the mounting portion 130 is provided on the material box, so that the material box can be detachably connected to the frame 310, which is convenient for flexibly adjusting the position of the material box on the frame 310, and at the same time, it is also convenient for replacing, repairing and installing the material box.
[0041] In another embodiment, there may be multiple ways of detachably connecting the material box and the frame 310. Alternatively, a plurality of through holes for bolts to pass through may be provided at the bottom of the material box, and the material box and the frame 310 may be detachably connected by bolts.
[0042] Optionally, in one embodiment, the outer peripheral surface of the material box body 110 is provided with an observation hole 113 connected to the multiple receiving chambers 111. In this way, the observation hole 113 connected to the receiving chamber 111 is provided to expose the field of view in the receiving chamber 111, so that the staff can observe the situation of the wafer ring being placed in the receiving chamber 111, and take corresponding measures in time for the abnormal placement of the wafer ring in the material box body 110. In addition, the provision of multiple observation holes 113 can also reduce the weight of the material box body 110, save the material used to produce the material box body 110, and save costs.
[0043] In another embodiment, the number of the observation holes 113 may be varied, or only one observation hole 113 may be provided, as long as the viewing field of the wafer ring in the receiving cavity 111 can be provided.
[0044] The utility model also proposes a crystal bonding machine 300, which includes a material storage device and a material picking device. The specific structures of the material storage device and the material picking device refer to the above-mentioned embodiments. Since the material storage device and the material picking device adopt all the technical solutions of all the above-mentioned embodiments, they at least have all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.
[0045] Optionally, in one embodiment, the crystal bonding machine 300 also includes an alarm connected to the controller, and the alarm is used to issue a warning when the lifting compensation value exceeds the preset lifting compensation value. In this way, because the compensation for the wafer ring is limited, an alarm is set. When the lifting compensation value of the wafer ring picked up by the material picking mechanism 320 exceeds the preset maximum value, it means that the upward or downward offset value of the wafer ring is too large, so that it cannot be adjusted to be placed in the receiving cavity 111. At this time, the alarm receives the signal sent by the controller and issues an alarm to remind the staff to perform manual processing, reduce the possibility of collision between the wafer ring and the storage device, and improve the safety of the operation of the crystal bonding machine 300.
[0046] In another embodiment, the alarm may be an independent device connected to the controller, or a component integrated in the controller, as long as it can realize the alarm function when the die bonding machine 300 is in an abnormal working state.
[0047] The above description is only an optional embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A material storage device, applied to a material taking device, the material taking device comprises a frame, a material taking mechanism that can be lifted and lowered relative to the frame, and a controller connected to the material taking mechanism, the material taking mechanism is used to move a wafer ring to the material storage device, characterized in that: include: A material box, comprising a material box body provided with a plurality of receiving cavities, wherein the plurality of receiving cavities are spaced apart in the up-down direction, and the receiving cavities have cavities provided on the outer peripheral surface of the material box body, and the cavities are used for allowing wafer rings to enter the cavities; as well as A sensor device is provided on the material box body, and the sensor device has a detection area for detecting the wafer ring. The detection area is provided in front of the receiving cavity, and the detection area is used for the wafer ring to enter in the up and down direction before entering the receiving cavity. The sensor device is used to send a signal to the controller for determining the lifting compensation value of the material picking mechanism, so that the wafer ring picked up by the material picking mechanism is aligned with the corresponding cavity opening in the up and down direction.
2. The storage device according to claim 1, characterized in that: The material box further comprises a plurality of supporting members arranged in the material box body, the plurality of supporting members are arranged at intervals in the up-down direction, and the material box body and the plurality of supporting members define a plurality of the receiving cavities.
3. The storage device according to claim 2, characterized in that: The support member is provided with a limiting groove for placing the wafer ring.
4. The storage device according to claim 2, characterized in that: A reinforcing member is provided on the supporting member.
5. The storage device according to claim 1, characterized in that: The plurality of cavities are arranged on the first side surface of the material box body, and the detection area and the first side surface are arranged opposite to each other in the direction of the cavities.
6. The storage device according to claim 1, characterized in that: The sensor device comprises a signal output device and a signal receiver which jointly limit the detection area. The signal output device and the signal receiver are arranged at the same height and are arranged opposite to each other.
7. The storage device according to claim 1, characterized in that: The material box also includes a mounting portion, and the mounting portion is used for being detachably connected to the frame.
8. The storage device according to claim 1, characterized in that: An observation hole communicating with the plurality of receiving cavities is formed on the outer peripheral surface of the material box body.
9. A die bonding machine, characterized in that: It comprises a material storage device and a material taking device as claimed in any one of claims 1 to 8.
10. The die bonding machine according to claim 9, characterized in that: The die bonding machine further comprises an alarm connected to the controller, and the alarm is used to issue a warning when the lifting compensation value exceeds a preset lifting compensation value.