Silicon wafer cooling device

Abstract

The utility model relates to a silicon wafer cooling device, which comprises a machine frame and is characterized by further comprising a conveying belt arranged on the machine frame. The silicon wafer box with an upper opening is arranged on the conveying belt; the quenching box is arranged on the rack, an air inlet is formed in the upper portion of the quenching box, and an air supply device is arranged at the air inlet; the quenching chamber is arranged in the quenching box, the conveying belt conveys the silicon wafer box to pass through the quenching chamber, and at least one heat exchange tube is arranged in the quenching chamber above the conveying belt. The air flow blown into the quenching cavity from the air inlet is firstly subjected to heat absorption and cooling by the heat exchange tube and then blown to the silicon wafer, the temperature of the air flow is low, the effect of air cooling of the silicon wafer is enhanced, the heat exchange tube is arranged in the quenching cavity, the temperature in the quenching cavity can be continuously reduced, and the cooling effect of the silicon wafer is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a silicon chip temperature reduction cooling device. Background Art

[0002] The silicon content in the earth's crust is 25.8%, which provides an inexhaustible source for the production of monocrystalline silicon. Since silicon is one of the most abundant elements in the earth's crust, for products such as solar cells that are destined to enter the large-scale market, the advantage of reserves is also one of the reasons why silicon has become the main material for photovoltaics. The silicon wafer manufacturing process needs to be baked to dry the patina on its surface. After baking, it needs to be cooled by a cooling device before the next step can be carried out.

[0003] In order to keep the silicon wafer dry while cooling, most existing cooling devices use liquid nitrogen cooling or air cooling. However, liquid nitrogen flooding cooling consumes too much energy and is costly. Ordinary air cooling methods have low cooling efficiency and poor cooling effect. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the utility model is to provide a silicon wafer cooling device, which can quickly cool the dried silicon wafer with lower energy consumption and cost.

[0005] To achieve the above purpose, the technical solution of the utility model is as follows:

[0006] A silicon chip cooling device comprises a rack and further comprises:

[0007] A conveyor belt, wherein the conveyor belt is arranged on the frame;

[0008] A silicon wafer box, wherein the silicon wafer box with an upper opening is arranged on the conveyor belt;

[0009] A quench box, the quench box is arranged on the frame, an air inlet is provided above the quench box, and an air supply device is provided at the air inlet;

[0010] A quenching chamber is provided in the quenching box, the conveyor belt transports the silicon wafer box through the quenching chamber, and at least one heat exchange tube is arranged in the quenching chamber above the conveyor belt.

[0011] Furthermore, a sensor is provided on the frame at the horizontal end of the conveyor belt.

[0012] Furthermore, a stop portion is provided on the frame at the horizontal end of the conveyor belt, and the distance between the stop portion and the conveyor belt is smaller than the height of the silicon wafer box.

[0013] Furthermore, at least two positioning blocks are provided on the conveyor belt, and the distance between the two positioning blocks is equal to the distance from the horizontal end of the conveyor belt to the quenching chamber.

[0014] Furthermore, at least one air outlet is provided on a frame below the quench box, the air outlet is connected to the quench chamber, and a fan is provided at the air outlet.

[0015] Furthermore, air outlets are provided on the frames on both sides of the conveyor belt.

[0016] Furthermore, ventilation holes are respectively provided on the side and bottom of the silicon wafer box.

[0017] Furthermore, the conveyor belt comprises:

[0018] Chains, at least two of which are arranged in parallel;

[0019] Connecting rods, a plurality of connecting rods are horizontally and equidistantly arranged between the two chains;

[0020] Sprockets, at least four of which respectively engage with two of the chains, and the sprockets are arranged on the frame.

[0021] Furthermore, a pipe flange is provided on the outer side of the quench box, and the pipe flange is connected to the heat exchange pipe.

[0022] Compared with the prior art, the beneficial technical effects of the utility model are as follows:

[0023] (1) The silicon wafer cooling device of the utility model is provided with a quenching chamber and a conveyor belt. An air inlet is provided on the quenching chamber, and a heat exchange tube is provided in the quenching chamber. The airflow blown into the quenching chamber from the air inlet is firstly absorbed and cooled by the heat exchange tube, and then blown onto the silicon wafer. The temperature of the airflow is relatively low, and the effect of air cooling the silicon wafer is enhanced. The heat exchange tube is provided inside the quenching chamber, which can continuously reduce the temperature in the quenching chamber and ensure the cooling effect of the silicon wafer. In addition, the silicon wafer is transported to the quenching chamber by a conveyor belt, which reduces manpower consumption.

[0024] (2) Furthermore, the conveyor belt is provided with a positioning block, a sensor and a stop portion. The positioning block can quickly locate the placement position of the silicon wafer box on the conveyor belt, thereby improving the placement efficiency of the silicon wafer box. The sensor is arranged on the stop portion. When the silicon wafer box is blocked by the stop portion, the sensor detects that the silicon wafer box immediately stops the operation of the conveyor belt. The degree of automation is high, further reducing the use of manpower. Moreover, while the previous silicon wafer box is forced to stop, the next silicon wafer box just stays in the rapid cooling chamber for rapid cooling, thereby ensuring the cooling effect of the silicon wafer.

[0025] (3) Furthermore, an air outlet is provided on the rack, and the air inlet and the air outlet cooperate to form a fixed air path in the rapid cooling chamber, thereby improving the stability of silicon wafer cooling and ensuring the cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the three-dimensional structure of a silicon wafer cooling device provided by an embodiment of the utility model is shown.

[0027] Figure 2 The internal structure schematic diagram of the silicon wafer cooling device provided by the embodiment of the utility model is shown.

[0028] Figure 3 The figure shows the airflow path of the silicon wafer cooling device provided by the embodiment of the utility model.

[0029] Markings in the accompanying drawings:

[0030] 1. Rack; 11. Sensor; 12. Stop part; 2. Conveyor belt; 21. Chain; 22. Sprocket; 23. Connecting rod; 24. Positioning block; 3. Quick cooling box; 31. Quick cooling chamber; 32. Air inlet; 33. Air outlet; 34. Heat exchange tube; 35. Fan; 36. Pipe flange; 4. Wafer box; 41. Ventilation hole. DETAILED DESCRIPTION

[0031] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the attached drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the attached drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so they have no technical substantive significance. Any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effect and purpose that can be achieved by the utility model, should still fall within the scope of the technical content disclosed by the utility model.

[0032] In the description of the present invention, the orientations or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "axial", "radial", and "circumferential" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] Figure 1 The figure shows a schematic diagram of the three-dimensional structure of the silicon wafer cooling device provided by the embodiment of the utility model. Figure 2The internal structure diagram of the silicon chip cooling device provided by the embodiment of the utility model is shown. Figure 1 and Figure 2 A silicon wafer cooling device includes a rack 1 and a conveyor belt 2, wherein the conveyor belt 2 is disposed on the rack 1. A silicon wafer box 4, wherein the silicon wafer box 4 with an opening on the top is disposed on the conveyor belt 2. A quench box 3, wherein the quench box 3 is disposed on the rack 1, wherein an air inlet 32 ​​is provided on the top of the quench box 3, and an air supply device is provided at the air inlet 32. A quench chamber 31, wherein the quench chamber 31 is provided in the quench box 3, wherein the conveyor belt 2 transports the silicon wafer box 4 through the quench chamber 31, and wherein at least one heat exchange tube 34 is provided in the quench chamber 31 above the conveyor belt 2. Specifically, the air supply device may be a fan 35, wherein the fan 35 provided at the air inlet 32 ​​supplies air into the quench chamber 31 to air-cool the silicon wafers in the silicon wafer box 4. In addition, a heat exchange tube 34 is provided between the air inlet 32 ​​and the silicon wafer box 4. By simply passing a cooling medium into the heat exchange tube 34, the heat exchange tube 34 can absorb the heat of the airflow entering the air inlet 32, and at the same time continue to absorb the heat in the quenching chamber 31, thereby ensuring the air cooling effect of the silicon wafer. The silicon wafer box 4 is transported to the quenching chamber 31 by a conveyor belt, which has a high degree of automation and reduces manpower consumption.

[0034] The specific structure of the rack 1 is described below:

[0035] Please refer to Figure 2 A sensor 11 is provided on the frame 1 at the horizontal end of the conveyor belt 2. Specifically, the sensor 11 may be a contact switch. When the conveyor belt 2 transports the cooled wafer box 4 to the position of the sensor 11, the sensor 11 senses the position of the wafer box 4 and transmits an electrical signal to the controller (not shown in the figure). The controller immediately stops the conveyor belt 2. At this time, the cooled wafer box 4 stays at the horizontal end of the conveyor belt 2, which is convenient for other unloading equipment to unload the wafer box 4.

[0036] Please refer to Figure 2 A stopper 12 is provided on the frame 1 at the horizontal end of the conveyor belt 2, and the distance between the stopper 12 and the conveyor belt 2 is less than the height of the wafer box 4. Specifically, the stopper 12 stops the wafer box 4 transported to the horizontal end of the conveyor belt 2, which is convenient for loading and unloading. The sensor 11 can be provided on the stopper 12, and the sensor 11 is close to the wafer box 4 to ensure the detection accuracy of the sensor 11.

[0037] Please refer to Figure 3 The racks 1 on both sides of the conveyor belt 2 are provided with air outlets 33. At least two air outlets 33 cooperate with each other to ensure that the airflow can repeatedly flow over the entire surface of the silicon wafer box 4 when flowing in the quenching chamber 31, thereby ensuring the cooling effect of the silicon wafer.

[0038] The specific structure of the conveyor belt 2 is described below:

[0039] Please refer to Figure 2 At least two positioning blocks 24 are provided on the conveyor belt 2, and the distance between the two positioning blocks 24 is equal to the distance from the horizontal end of the conveyor belt 2 to the quenching chamber 31. Specifically, the positioning blocks 24 can quickly locate the placement position of the silicon wafer box 4 on the conveyor belt 2, thereby improving the placement efficiency of the silicon wafer box 4, and the distance between the two positioning blocks 24 is equal to the distance from the horizontal end of the conveyor belt 2 to the quenching chamber 31, so that when the front silicon wafer box 4 is forced to stop by the stop portion 12, the rear silicon wafer box 4 just stays in the quenching chamber 31 for quenching, thereby ensuring the cooling effect of the silicon wafers.

[0040] Please refer to Figure 1 and Figure 2 The conveyor belt 2 includes a chain 21, at least two chains 21 are arranged in parallel. A connecting rod 23, a plurality of connecting rods 23 are arranged horizontally and equidistantly between the two chains 21. A sprocket 22, at least four sprockets 22 respectively engage the two chains 21, and the sprocket 22 is arranged on the frame 1. Specifically, the chain 21 and the sprocket 22 cooperate with each other, have high impact strength, good friction performance, good self-lubrication, small weight, and are easy to carry and install. While the connecting rod 23 synchronizes the two chains, it bears and carries the silicon wafer box 4, and the conveyor belt 2 composed of multiple connected and parallel arrangements can easily allow gas to pass through, which is convenient for the gas flow in the quenching chamber 31.

[0041] The specific structures of the quench box 3 and the silicon wafer box 4 are described below:

[0042] Figure 3 The airflow path of the silicon chip cooling device provided by the embodiment of the utility model is shown. Please refer to Figure 3 At least one air outlet 33 is provided on the frame 1 below the quench box 3. The air outlet 33 is connected to the quench chamber 31, and a fan 35 is provided at the air outlet 33. Specifically, the air inlet 32 ​​and the air outlet 33 cooperate with each other, and the airflow entering the quench chamber 31 from the air inlet 32 ​​is discharged from the quench chamber 31 by the fan 35 at the air outlet 33, forming a fixed airflow path in the quench chamber 31, and the quenching effect is more stable. The air outlet 33 is arranged below the quench box 3, and the airflow flowing along the air inlet 32, the quench chamber 31 and the air outlet 33 will flow through the silicon wafer box 4, thereby improving the stability of silicon wafer cooling and ensuring the cooling effect.

[0043] Please refer to Figure 1 A pipe flange 36 is provided on the outside of the quench box 3, and the pipe flange 36 is connected to the heat exchange pipe 34. It is convenient for the condensing medium main pipeline (not shown in the figure) to be connected to the heat exchange pipe 34.

[0044] Please refer to Figure 2 and Figure 3The side and bottom of the wafer box 4 are respectively provided with ventilation holes 41. Specifically, airflow is blown in from the upper opening of the wafer box 4, and then blown out from the ventilation holes on the side and bottom of the wafer box 4 to fully dry the wafers in the wafer box 4 and ensure the cooling effect.

[0045] The specific working process of the utility model is as follows:

[0046] When cooling the silicon wafers, the loading device (not shown in the figure) quickly positions the silicon wafer box 4 loaded with silicon wafers according to the position of the positioning block 24 and places it on the conveyor belt 2. The conveyor belt 2 transports the silicon wafer box 4 into the quenching chamber 31. The airflow in the quenching chamber 31 is blown by the fan 35 along the air inlet 32, the quenching chamber 31 and the air outlet 33. When the airflow flows in the quenching chamber 31, it first flows through the heat exchange tube 34. At this time, the airflow is absorbed by the heat exchange tube 34 and cooled. Then, the cooled airflow flows through the silicon wafer box 4, cools the silicon wafers in the silicon wafer box 4 and is discharged. The conveyor belt 2 continues to run, and the cooled silicon wafer box 4 is moved out of the quenching chamber 31 until the silicon wafer box 4 is stopped by the stop part 12. At this time, the sensor 11 detects that the silicon wafer box 4 has reached the unloading position. The sensor 11 transmits an electrical signal to the controller, and the controller drives the conveyor belt 2 to stop and wait for the silicon wafer box 4 at the unloading position to be unloaded. At this time, the wafer box 4 at the position of the next positioning block 24 on the conveyor belt 2 stays in the quenching chamber 31 and is continuously cooled. After the wafer box 4 waiting for the unloading position is unloaded, the sensor 11 transmits an electrical signal indicating that there is no wafer box 4 at the unloading position to the controller, and the controller controls the conveyor belt 2 to run until the next wafer box 4 enters the unloading position to continuously cool the wafers.

[0047] It can be seen that the above-mentioned silicon wafer cooling device is equipped with a quenching chamber 31 and a conveyor belt 2. The quenching chamber 31 is provided with an air inlet 32, and a heat exchange tube 34 is arranged in the quenching chamber 31. The airflow blown into the quenching chamber 31 from the air inlet 32 ​​is first absorbed and cooled by the heat exchange tube 34, and then blown onto the silicon wafer. The temperature of the airflow is relatively low, and the effect of air cooling the silicon wafer is enhanced. The heat exchange tube 34 is arranged inside the quenching chamber 31, which can continuously reduce the temperature in the quenching chamber 31 and ensure the cooling effect of the silicon wafer. In addition, the silicon wafer is transported to the quenching chamber 31 by a conveyor belt, and the degree of automation is high.

[0048] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A silicon wafer cooling device, comprising a rack, characterized in that: Also includes, A conveyor belt, wherein the conveyor belt is arranged on the frame; A silicon wafer box, wherein the silicon wafer box with an upper opening is arranged on the conveyor belt; A quench box, the quench box is arranged on the frame, an air inlet is provided above the quench box, and an air supply device is provided at the air inlet; A quenching chamber is provided in the quenching box, the conveyor belt transports the silicon wafer box through the quenching chamber, and at least one heat exchange tube is arranged in the quenching chamber above the conveyor belt.

2. The silicon wafer cooling device according to claim 1, characterized in that: A sensor is arranged on the frame at the horizontal end of the conveyor belt.

3. The silicon wafer cooling device according to claim 1, characterized in that: A stopper is provided on the frame at the horizontal end of the conveyor belt, and the distance between the stopper and the conveyor belt is smaller than the height of the wafer box.

4. The silicon wafer cooling device according to claim 1, characterized in that: At least two positioning blocks are arranged on the conveyor belt, and the distance between the two positioning blocks is equal to the distance from the horizontal end of the conveyor belt to the quenching chamber.

5. The silicon wafer cooling device according to claim 1, characterized in that: At least one air outlet is provided on the frame below the quench box, the air outlet is connected to the quench chamber, and a fan is provided at the air outlet.

6. The silicon wafer cooling device according to claim 5, characterized in that: Air outlets are provided on the frames on both sides of the conveyor belt.

7. The silicon wafer cooling device according to claim 1, characterized in that: The side surface and the bottom surface of the silicon wafer box are respectively provided with ventilation holes.

8. The silicon wafer cooling device according to claim 1, characterized in that: The conveyor belt comprises: Chains, at least two of which are arranged in parallel; Connecting rods, a plurality of connecting rods are horizontally and equidistantly arranged between the two chains; Sprockets, at least four of which respectively engage with two of the chains, and the sprockets are arranged on the frame.

9. The silicon wafer cooling device according to claim 1, characterized in that: A pipeline flange is arranged on the outer side of the quench box, and the pipeline flange is connected to the heat exchange pipe.

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