Pneumatic valve aging test device

By designing semiconductor cooling devices and heat dissipation components in the pneumatic valve aging test device, the overload problem of electrical components caused by poor heat dissipation effects in the prior art is solved, effective cooling of the internal environment of the test device is achieved, the risk of equipment damage is reduced, and the stability and accuracy of the detection data are improved.

CN222579585UActive Publication Date: 2025-03-07WUXI TRS HEAT EXCHANGER CO LTD
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Patent Information

Application Number
CN202323516755.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-22
Publication Date
2025-03-07
Estimated Expiration
2033-12-22

AI Technical Summary

Technical Problem

During long-term operation, the pneumatic valve aging test device is overloaded due to poor heat dissipation effect, which increases the risk of equipment damage.

Method used

A pneumatic valve aging test device including a semiconductor cooling device and a heat dissipation assembly is designed. The semiconductor cooling device consists of a breathable barrel, a first fan, a semiconductor refrigeration sheet, a copper heat sink and a heat dissipation component. Through the rapid cooling of the semiconductor refrigeration sheet and the exhaust of the fan, combined with the diffusing area of ​​the copper heat sink and the heat dissipation fin, the effective cooling of the inside of the PLC cabinet is achieved.

Benefits of technology

It effectively reduces the temperature inside the PLC cabinet, prevents electrical components from being overloaded, reduces the risk of equipment damage, and improves the stability and accuracy of pneumatic valve detection data.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an aging test device for a pneumatic valve. The aging test device comprises a mounting bottom plate; the PLC cabinet body is fixedly mounted at the top of the mounting bottom plate; and the semiconductor cooling device comprises a ventilation barrel, a first fan, a semiconductor chilling plate and a copper cooling fin. After the semiconductor refrigeration sheet is started, the refrigeration surface is rapidly cooled, then the first fan is started to exhaust air, and hot air in the PLC cabinet body is sucked from an opening in the ventilation barrel, is cooled by the copper cooling sheet and then is sucked away by the first fan. The blown-out cold air can cool the electrical elements installed on the breathable installation plate through holes in the breathable installation plate, an air channel formed by an exhaust fan and a ventilation opening can enable the cold air to circulate, and at the moment, heat generated by the heating face of the semiconductor chilling plate can be transmitted to heat dissipation fins and cooled through a second fan. By using the above structure, the internal environment of the cabinet body is cooled to prevent overload of electrical components, and the risk of equipment damage is reduced.
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Description

Technical Field

[0001] The utility model relates to the technical field of pneumatic valve detection, and more specifically, to a pneumatic valve aging test device. Background Art

[0002] A pneumatic valve is a valve that uses pneumatic force to control the on / off and regulation of fluid media (such as gas, liquid). It receives control signals, uses compressed air or other gases as a power source, and controls pneumatic actuators to achieve valve switching and regulation. After production, pneumatic valves need to be subjected to aging tests to determine their theoretical service life. Aging tests usually use PLC to simulate the use of pneumatic valves on equipment, detect the movement of pneumatic valves, and determine the service life of pneumatic valves after a long period of testing.

[0003] However, the testing process is usually long and continuous. The electrical components in the PLC cabinet will generate a lot of heat when they are running continuously. The usual natural heat dissipation and fan heat dissipation can only take away the heat on the surface of the electrical components. The ambient temperature inside the cabinet has not changed much. When the indoor ambient temperature is high, the cooling effect is not good, which can easily cause the electrical components inside the cabinet to overheat and overload, increasing the risk of equipment damage. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the utility model provides a pneumatic valve aging test device to solve the problem that the conventional heat dissipation method is not effective, resulting in overload of internal electrical components of the pneumatic valve aging test device, thereby increasing the risk of equipment damage.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions: a pneumatic valve aging test device, comprising:

[0006] Install the base plate;

[0007] A PLC cabinet, wherein the PLC cabinet is fixedly mounted on the top of the mounting base plate;

[0008] A semiconductor cooling device, the semiconductor cooling device includes an air-permeable barrel, a first fan, a semiconductor cooling sheet, a copper heat sink, and a heat dissipation component. The air-permeable barrel is fixedly installed inside a PLC cabinet, the first fan is fixedly installed on the inner surface of one end of the air-permeable barrel, the semiconductor cooling sheet is fixedly installed on the inner surface of the other end of the air-permeable barrel, the copper heat sink is fixedly connected to the outer surface of the semiconductor cooling sheet, and the heat dissipation component is fixedly connected to the outer surface of the semiconductor cooling sheet.

[0009] Wherein, the heat dissipation component includes heat dissipation fins and a second fan. The heat dissipation fins are fixedly connected to the outer surface of the semiconductor refrigeration plate, and the second fan is fixedly installed on the outer surface of the heat dissipation fins.

[0010] It also includes a clamping device, an exhaust fan, a vent, a breathable mounting plate, and an operating screen. The clamping device is fixedly installed on the top of the mounting base plate, the exhaust fan is fixedly installed on the top of the PLC cabinet, the vent is opened on one side of the PLC cabinet, the breathable mounting plate is fixedly installed inside the PLC cabinet, and the operating screen is fixedly connected to the outer surface of the PLC cabinet.

[0011] Among them, the clamping device includes a limit shell, a loading platform, a double-headed threaded rod, a moving block, a rubber splint, and a signal output line. The limit shell is fixedly connected to the top of the mounting base plate, the loading platform is fixedly connected to the top of the mounting base plate, the double-headed threaded rod is rotatably installed inside the limit shell, the moving block is movably sleeved on the outer surface of the double-headed threaded rod, the rubber splint is fixedly connected to the top of the moving block, and the signal output line is fixedly connected to the outer surface of the PLC cabinet.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] In the above scheme, after the semiconductor refrigeration plate is started, the cooling surface will cool down rapidly, and the first fan will then start to exhaust air. The hot air in the PLC cabinet will be sucked in from the openings on the air barrel, cooled through the copper heat sink, and then sucked away by the first fan. The blown cold air will pass through the openings on the air permeable mounting plate to cool the electrical components installed on the air permeable mounting plate. The air duct formed by the exhaust fan and the vents will allow the cold air to circulate. At this time, the heat generated by the heating surface of the semiconductor refrigeration plate will be transferred to the heat sink fins and cooled by the second fan. Utilizing the above structure, the internal environment of the cabinet can be cooled to prevent overload of electrical components and reduce the risk of equipment damage.

[0014] In the above scheme, the staff places the pneumatic valve to be tested on the stage and then rotates the double-headed threaded rod to make the two groups of moving blocks move synchronously in opposite directions, thereby driving the rubber clamps to move inward to reduce the spacing and thus clamp the pneumatic valve to be tested. Fixing the pneumatic valve will reduce the impact of external interference and changes in the valve's own opening and closing on the test results. The above structure is used to increase the stability and accuracy of the pneumatic valve test data. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the semiconductor cooling device of the utility model;

[0018] Figure 4This is a schematic diagram of the heat dissipation component structure of the utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the clamping device of the utility model.

[0020] [reference numerals]

[0021] 1. Installation base plate; 2. PLC cabinet; 3. Semiconductor cooling device; 4. Clamping device; 5. Exhaust fan; 6. Ventilation port; 7. Breathable installation plate; 8. Operation screen; 31. Breathable barrel; 32. First fan; 33. Semiconductor cooling plate; 34. Copper heat sink; 35. Heat dissipation assembly; 351. Heat dissipation fins; 352. Second fan; 41. Limiting shell; 42. Stage; 43. Double-headed threaded rod; 44. Moving block; 45. Rubber splint; 46. Signal output line. DETAILED DESCRIPTION

[0022] In order to make the technical problems to be solved, technical solutions and advantages of the present invention more clear, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0023] As attached Figure 1 To Attachment Figure 5 The embodiment of the utility model provides a pneumatic valve aging test device, comprising:

[0024] Install the base plate 1;

[0025] PLC cabinet 2, PLC cabinet 2 is fixedly installed on the top of the installation base plate 1;

[0026] The semiconductor cooling device 3 includes an air-permeable barrel 31, a first fan 32, a semiconductor cooling sheet 33, a copper heat sink 34, and a heat dissipation assembly 35. The air-permeable barrel 31 is fixedly mounted inside the PLC cabinet 2, the first fan 32 is fixedly mounted on the inner surface of one end of the air-permeable barrel 31, the semiconductor cooling sheet 33 is fixedly mounted on the inner surface of the other end of the air-permeable barrel 31, the copper heat sink 34 is fixedly connected to the outer surface of the semiconductor cooling sheet 33, and the heat dissipation assembly 35 is fixedly connected to the outer surface of the semiconductor cooling sheet 33; the semiconductor cooling sheet 33 is an existing structure, and its characteristics make it cool on one side and heat on the other side after being turned on.

[0027] The heat dissipation assembly 35 includes heat dissipation fins 351 and a second fan 352 . The heat dissipation fins 351 are fixedly connected to the outer surface of the semiconductor cooling sheet 33 , and the second fan 352 is fixedly installed on the outer surface of the heat dissipation fins 351 .

[0028] Among them, it also includes a clamping device 4, an exhaust fan 5, a vent 6, a breathable mounting plate 7, and an operating screen 8. The clamping device 4 is fixedly installed on the top of the mounting base 1, the exhaust fan 5 is fixedly installed on the top of the PLC cabinet 2, the vent 6 is opened on one side of the PLC cabinet 2, the breathable mounting plate 7 is fixedly installed inside the PLC cabinet 2, and the operating screen 8 is fixedly connected to the outer surface of the PLC cabinet 2.

[0029] Among them, the clamping device 4 includes a limit shell 41, a loading platform 42, a double-headed threaded rod 43, a moving block 44, a rubber clamp 45, and a signal output line 46. The limit shell 41 is fixedly connected to the top of the mounting base plate 1, the loading platform 42 is fixedly connected to the top of the mounting base plate 1, the double-headed threaded rod 43 is rotatably installed inside the limit shell 41, the moving block 44 is movably sleeved on the outer surface of the double-headed threaded rod 43, the rubber clamp 45 is fixedly connected to the top of the moving block 44, and the signal output line 46 is fixedly connected to the outer surface of the PLC cabinet 2; the two ends of the double-headed threaded rod 43 have a threaded structure with the same structure but opposite directions, so that when the double-headed threaded rod 43 rotates, the moving block 44 with the threads engaged at both ends can perform synchronous reverse movement.

[0030] The working process of the utility model is as follows:

[0031] After the staff puts the pneumatic valve to be tested on the stage 42, they rotate the double-headed threaded rod 43 to make the two groups of moving blocks 44 move synchronously in opposite directions, thereby driving the rubber clamping plate 45 to move inward to reduce the spacing, thereby clamping the pneumatic valve to be tested, and then connect the signal output line 46 to the signal line interface on the pneumatic valve, set the detection time and detection switch times of the pneumatic valve through the operation screen 8, and then start the detection of the pneumatic valve. When the ambient temperature is too high, the semiconductor cooling device 3 can be started to cool it down, the cooling surface of the semiconductor cooling plate 33 will rapidly cool down, and the copper heat sink 34 can expand and close to the air The contact area of ​​air increases and cold air is dissipated. The first fan 32 is then turned on for exhaust. The hot air in the PLC cabinet 2 will be sucked in from the openings on the air barrel 31, cooled by the copper heat sink 34, and then sucked away by the first fan 32. The blown cold air will pass through the openings on the air permeable mounting plate 7 to cool the electrical components installed on the air permeable mounting plate 7. The air duct formed by the exhaust fan 5 and the vent 6 will allow the cold air to circulate. At this time, the heat generated by the heating surface of the semiconductor refrigeration plate 33 will be transferred to the heat sink fins 351 and cooled by the second fan 352, thereby ensuring the stability of the cooling effect.

[0032] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0033] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0034] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A pneumatic valve aging test device, characterized in that: include: Installing the base plate (1); A PLC cabinet (2), wherein the PLC cabinet (2) is fixedly mounted on the top of the mounting base plate (1); A semiconductor cooling device (3), the semiconductor cooling device (3) comprising an air-permeable barrel (31), a first fan (32), a semiconductor cooling sheet (33), a copper heat sink (34), and a heat dissipation component (35), the air-permeable barrel (31) being fixedly mounted inside a PLC cabinet (2), the first fan (32) being fixedly mounted on the inner surface of one end of the air-permeable barrel (31), the semiconductor cooling sheet (33) being fixedly mounted on the inner surface of the other end of the air-permeable barrel (31), the copper heat sink (34) being fixedly connected to the outer surface of the semiconductor cooling sheet (33), and the heat dissipation component (35) being fixedly connected to the outer surface of the semiconductor cooling sheet (33).

2. A pneumatic valve aging test device according to claim 1, characterized in that: The heat dissipation assembly (35) comprises heat dissipation fins (351) and a second fan (352); the heat dissipation fins (351) are fixedly connected to the outer surface of the semiconductor cooling sheet (33); and the second fan (352) is fixedly installed on the outer surface of the heat dissipation fins (351).

3. The pneumatic valve aging test device according to claim 1, characterized in that: It also includes a clamping device (4), an exhaust fan (5), a vent (6), a breathable mounting plate (7), and an operating screen (8), wherein the clamping device (4) is fixedly mounted on the top of the mounting base plate (1), the exhaust fan (5) is fixedly mounted on the top of the PLC cabinet (2), the vent (6) is opened on one side of the PLC cabinet (2), the breathable mounting plate (7) is fixedly mounted inside the PLC cabinet (2), and the operating screen (8) is fixedly connected to the outer surface of the PLC cabinet (2).

4. The pneumatic valve aging test device according to claim 3, characterized in that: The clamping device (4) comprises a limit shell (41), a loading platform (42), a double-headed threaded rod (43), a moving block (44), a rubber clamp (45), and a signal output line (46); the limit shell (41) is fixedly connected to the top of the mounting base plate (1); the loading platform (42) is fixedly connected to the top of the mounting base plate (1); the double-headed threaded rod (43) is rotatably mounted inside the limit shell (41); the moving block (44) is movably sleeved on the outer surface of the double-headed threaded rod (43); the rubber clamp (45) is fixedly connected to the top of the moving block (44); and the signal output line (46) is fixedly connected to the outer surface of the PLC cabinet (2).