Heating device, projection device and vehicle

Abstract

The utility model relates to the technical field of projection, in particular to a heating device, a projection device and a vehicle. The heating device comprises a shell, a chip, a heat conduction assembly and a heating piece. An inner cavity is formed in the inner wall of the shell, the shell is provided with a through hole, the chip is fixed at the through hole, one side, facing the inner cavity, of the chip is provided with at least one micro-mirror structural element, the micro-mirror structural element is used for reflecting a received light beam, and one side, deviating from the inner cavity, of the chip is provided with a heat exchange area; the heat conduction assembly is fixedly connected with the shell through a connecting piece, and the heat conduction assembly is attached to the heat exchange area; the heating piece is attached to the heat conduction assembly and used for heating the heat conduction assembly. The chip can be heated, the service life of the chip is prevented from being shortened due to low temperature, the chip can be heated on the basis of not changing the original overall heat dissipation structure, and the cost of heating the chip is reduced.

Description

Technical Field

[0001] The present application relates to the field of projection technology, and more specifically, to a heating device, a projection device and a vehicle. Background Art

[0002] Spatial light modulators (SLM) are optical devices used to control the spatial distribution of light waves. They can modulate the intensity, phase or polarization state of light in a predetermined manner, thereby achieving precise control during the propagation of light. They are also the core device of projectors that modulate illumination light into images. However, spatial light modulators can easily have their service life significantly shortened when working in some environments. Utility Model Content

[0003] The present application proposes a heating device, a projection device and a vehicle to improve the above-mentioned defects.

[0004] In a first aspect, the present application provides a heating device, comprising: a shell, a chip, a heat-conducting component and a heating element; the inner wall of the shell forms an inner cavity, the shell has a through hole, the chip is fixed at the through hole, the chip has at least one micromirror structure element on the side facing the inner cavity, the micromirror structure element is used to reflect the received light beam, and the chip has a heat exchange area on the side away from the inner cavity; the heat-conducting component is fixedly connected to the shell through a connecting piece, and the heat-conducting component is bonded to the heat exchange area; the heating element is bonded to the heat-conducting component for heating the heat-conducting component.

[0005] Optionally, in a possible implementation manner, the heating element is a sheet-like structure, the heating element includes two stacked insulating layers and at least one heating sheet located between the two insulating layers, and the heating sheet is a resistor sheet.

[0006] Optionally, for a possible implementation, the heat-conducting component includes a heat-conducting substrate and a heat-conducting platform, the heat-conducting substrate is fixedly connected to the shell via a connecting piece, the heating element is bonded to the heat-conducting substrate, and a side of the heat-conducting platform facing away from the shell is fixedly connected to the heat-conducting substrate; a side of the heat-conducting platform facing the shell is a heat-conducting surface, and the heat-conducting surface is bonded to the heat exchange area.

[0007] Optionally, for a possible implementation, the heating device also includes: a heat dissipation component; the side of the heat conductive substrate facing the shell is a first side, and the side away from the shell is a second side, the heat conductive platform is fixedly connected to the first side, the heat dissipation component is connected to the second side, and the heating element is bonded to the first side.

[0008] Optionally, for a possible implementation, the heating device also includes: a heat dissipation component; a side of the heat-conducting substrate facing the shell is a first side, and a side away from the shell is a second side, the heat-conducting platform is fixedly connected to the first side, and the heating element is attached to the second side; the heat dissipation component includes a heat dissipation pipe and heat dissipation fins, one end of the heat dissipation pipe is connected to the heat dissipation fins, and the other end of the heat dissipation pipe enters the heat-conducting substrate from the third side of the heat-conducting substrate, at least a portion of the heat dissipation pipe is buried in the heat-conducting substrate, and the third side is neither the first side nor the second side.

[0009] Optionally, in a possible implementation manner, a side of the heat conductive substrate facing the shell is a first side, a sunken side is provided on the first side, and the sunken side is parallel to the first side; the heating element is in contact with the sunken side, and the first side is not exposed.

[0010] Optionally, in a possible implementation manner, the heating device further includes: a temperature sensor; the temperature sensor is connected to the heat-conducting component and is used to detect the temperature of the heat-conducting component.

[0011] Optionally, for a possible implementation, the heating device further includes: a processing module; the processing module is connected to the chip, the heating element and the temperature sensor, and is used to control the heating element to heat the heat conductive component based on the temperature collected by the temperature sensor.

[0012] In the second aspect, the present application also provides a projection device, which includes: a light source, a lens and the aforementioned heating device; the shell also includes a light inlet and a light outlet, the light source is used to emit a light beam and transmit the light beam to the light inlet, the micromirror structure element is used to reflect the light beam transmitted from the light inlet to obtain a reflected light beam, and the lens is used to project the reflected light beam from the light outlet.

[0013] In a third aspect, the present application further provides a vehicle, comprising: a vehicle body and the aforementioned projection device; the vehicle body has an installation position, and the installation position is used to install the projection device.

[0014] The solution provided by the present application, the heating device includes: a shell, a chip, a heat-conducting component and a heating element. The inner wall of the shell forms an inner cavity, the shell has a through hole, the chip is fixed at the through hole, the side of the chip facing the inner cavity has at least one micromirror structure element, the micromirror structure element is used to reflect the received light beam, and the side of the chip facing away from the inner cavity has a heat exchange area. The heat-conducting component is fixedly connected to the shell through a connecting piece, and the heat-conducting component is attached to the heat exchange area. The heating element is attached to the heat-conducting component and is used to heat the heat-conducting component.

[0015] The present application heats the heat-conducting component by a heating element, and then transfers the heat to the chip through the heat-conducting component to achieve heating of the chip, thereby preventing the chip from having its service life shortened due to low temperature. The chip can be heated without changing the original overall heat dissipation structure, thereby reducing the cost of heating the chip.

[0016] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or be understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the written description, claims, and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic diagram of an exploded structure of a heating device provided in an embodiment of the present application is shown;

[0019] Figure 2 A schematic cross-sectional structure diagram of a heating device provided in an embodiment of the present application is shown;

[0020] Figure 3 A partial structural schematic diagram of a heating device provided in an embodiment of the present application is shown;

[0021] Figure 4 A schematic diagram of the structure of a heating element provided in an embodiment of the present application is shown;

[0022] Figure 5 A partial structural schematic diagram of a heating device provided in another embodiment of the present application is shown;

[0023] Figure 6 Shows Figure 5 A schematic diagram of the cross-sectional structure of the AA of the middle edge heat conducting component;

[0024] Figure 7 A schematic diagram of the structure of a temperature sensor provided in an embodiment of the present application is shown.

[0025] Description of reference numerals:

[0026] 1. Shell; 2. Chip; 21. Press plate; 22. Control board; 23. First flexible part; 24. Second flexible part; 25. Adapter board; 3. Heat-conducting component; 31. Heat-conducting substrate; 32. Heat-conducting platform; 311. First surface; 312. Second surface; 313. Third surface; 314. Sinking surface; 321. Heat-conducting surface; 33. Heat-conducting pad; 4. Heating element; 41. Insulating layer; 42. Heating plate; 43. Via hole; 5. Heat dissipation component; 51. Heat pipe; 52. Heat dissipation fin; 6. Temperature sensor; 61. Metal sheet; 62. Thermistor; 7. Processing module. DETAILED DESCRIPTION

[0027] In order to make those skilled in the art better understand the present application scheme, the technical scheme in the present application embodiment will be clearly and completely described below in conjunction with the drawings in the present application embodiment. Obviously, the described embodiment is only a part of the present application embodiment, rather than all the embodiments. The components of the present application embodiment usually described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application for protection, but merely represents the selected embodiment of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0028] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0029] Spatial light modulators (SLM) are optical devices used to control the spatial distribution of light waves. They can modulate the intensity, phase or polarization state of light in a predetermined manner, thereby achieving precise control during the propagation of light. They are also the core devices of projectors that modulate illumination light into images. However, spatial light modulators working at low temperatures can easily lead to a significant shortening of their working life.

[0030] Therefore, in the embodiments of the present application, a heating device, a projection device and a vehicle are provided to solve or partially solve the above-mentioned problems.

[0031] See also Figures 1 to 3 , which shows a schematic structural diagram of a heating device provided in an embodiment of the present application, wherein the heating device comprises: a shell 1, a chip 2, a heat-conducting component 3 and a heating element 4.

[0032] The inner wall of the shell 1 forms an inner cavity, the shell 1 has a through hole, the chip 2 is fixed at the through hole, the chip 2 has at least one micromirror structure element on the side facing the inner cavity, the micromirror structure element is used to reflect the received light beam, and the chip 2 has a heat exchange area on the side away from the inner cavity.

[0033] The heat conducting component 3 is fixedly connected to the housing 1 via a connecting piece, and the heat conducting component 3 is in contact with the heat exchange area.

[0034] The heating element 4 is attached to the heat-conducting component 3 and is used to heat the heat-conducting component 3 .

[0035] The present application heats the heat-conducting component 3 through the heating element 4, and then transfers the heat to the chip 2 through the heat-conducting component 3 to achieve heating of the chip 2, thereby preventing the service life of the chip 2 from being shortened due to low temperature. The heating of the chip 2 can be achieved without changing the original overall heat dissipation structure, thereby reducing the cost of heating the chip 2.

[0036] It should be noted that the heating device of the present application is used to be installed in a projector. When the projector needs to work, it is necessary to ensure that the temperature of the chip is greater than the minimum temperature allowed for its normal operation. The heat conductive component can be heated by a heating element to achieve heating of the chip.

[0037] As an implementation manner, the chip 2 is a spatial light modulator, and the chip 2 can be a digital micromirror device (DMD), liquid crystal on silicon (LCOS) or a liquid crystal display (LCD), and the chip 2 has at least one micromirror structure element on the side facing the inner cavity, and the micromirror structure element is a tiny reflector.

[0038] The chip 2 has a heat exchange area on the side facing away from the inner cavity, and the heat-conducting component 3 is in contact with the heat exchange area. When the temperature of the chip 2 is higher than the temperature of the heat-conducting component 3, the heat is transferred from the chip 2 to the heat-conducting component 3 through the heat exchange area, and the chip 2 can be cooled by the heat-conducting component 3; when the temperature of the chip 2 is low, the heat-conducting component 3 can be heated by the heating element 4, and the heat is transferred from the heat-conducting component 3 to the chip 2 through the heat exchange area, thereby achieving the heating of the chip 2.

[0039] As an example, the chip 2 has a signal interface on a side facing away from the inner cavity for connecting to other control devices.

[0040] Take DMD as an example. DMD is composed of millions of micro-mirror structural elements. Each micro-mirror structural element represents a pixel. The micro-mirror structural element can rotate quickly between two or more positions, usually +12 degrees or -12 degrees. When the micro-mirror structural element is tilted to +12 degrees, it reflects light to the projection lens, thereby forming a bright pixel on the screen or projection curtain; when the micro-mirror structural element is tilted to -12 degrees, the light is reflected to the absorber, and the corresponding position on the screen or projection curtain is displayed as a dark pixel. In this way, DMD can control the brightness of each pixel according to the input image signal to form a complete image.

[0041] Exemplarily, the lowest temperature allowed for normal operation of the DMD is -10°C. When the DMD operates in a temperature range of -10°C to 0°C, the working life of the DMD is 500 hours. When the DMD operates in a temperature environment below -10°C, the micromirror structure elements of the DMD may be easily damaged, and the working life of the DMD may be reduced to less than 25 hours. Therefore, operation of the chip 2 under extreme conditions will greatly reduce the service life of the projector. The extreme condition is that the temperature of the chip 2 is lower than the lowest temperature allowed for normal operation of the chip 2.

[0042] It should be noted that for different types of chips, the minimum temperature allowed for normal operation may be different.

[0043] As an example, the shell is used to fix the chip and the heat-conducting component. The inner wall of the shell forms a cavity, and the shell has a through hole for fixing the chip. For example, a positioning hole is opened on the shell 1, and the heat-conducting component 3 is opened with a positioning hole. The heat-conducting component 3 is fixed to the shell 1 through a connecting piece. The connecting piece can be a screw or a rivet, which is not specifically limited here.

[0044] The shell also includes a light entrance hole and a light exit hole. The inner cavity of the shell may also be fixed with an optical transmission component, which may include at least one of a prism, a reflector or a lens. When the first light beam is irradiated into the inner cavity from the light entrance hole of the shell 1, the first light beam can be transmitted to the micromirror structure element of the chip 2 through the optical transmission component, and then the first light beam is effectively reflected or ineffectively reflected by the micromirror structure element, and the light beam effectively reflected by the micromirror structure unit is used as the second light beam. The second light beam is transmitted to the light exit port through the optical transmission component and emitted from the light exit port.

[0045] It should be noted that the effective reflection is that the micromirror structure unit reflects the first light beam to the projection lens, and the invalid reflection is that the micromirror structure unit reflects the first light beam to the absorber, wherein the direction of the first light beam is as follows: Figure 2 As shown in the direction of H1 in the figure, the direction of the second beam is Figure 2As shown in the H2 direction in FIG. 1 , the first light beam passes through the light entrance hole along the H1 direction and enters the housing, and then the second light beam is emitted from the light exit along the H2 direction.

[0046] Furthermore, the housing 1 can also be connected to a heat dissipation component 5 , a lens and a light source. The light source is used to generate a first light beam. The lens can be combined with a light outlet to achieve imaging. The heat dissipation component 5 is used to dissipate heat from the chip 2 .

[0047] The heat-conducting component 3 is made of a heat-conducting material, such as aluminum, copper, ceramic, graphite or a synthetic material, etc., which is not specifically limited here.

[0048] The heating element 4 is a device that can generate heat through resistance. The heating element 4 may include a resistance wire or a resistance sheet.

[0049] In an alternative embodiment, see Figure 4 The heating element 4 is a sheet structure, and the heating element 4 includes two insulating layers 41 stacked and distributed and at least one heating sheet 42 located between the two insulating layers 41, and the heating sheet 42 is a resistor sheet. The heating sheet 42 can generate heat by energizing the heating sheet 42. It should be noted that the two insulating layers 41 wrap the heating sheet 42, which can prevent the heating sheet 42 from leaking electricity or the resistor wire from shorting.

[0050] Exemplarily, the heating element 4 has a through hole 43 , and the heat conducting platform 32 can pass through the through hole 43 to fit with the heat exchange area.

[0051] For example, the heater plate 42 may be formed by etching a whole piece of resistor plate.

[0052] Exemplarily, the insulating layer 41 may be ceramic, or may be a polyimide (Pi) film material, or may be a polyethylene terephthalate (PET) film material.

[0053] Furthermore, the heating device includes a processing module 7, which is connected to the heating plate 42 of the heating element 4. The processing module can control the heating plate 4 to heat the heat-conducting component to achieve the purpose of heating the chip 2. The processing module 7 can be an optical machine control board.

[0054] Exemplarily, when it is determined that the chip 2 is in an extreme condition, the chip 2 needs to be heated, and the processing module 7 can control the heating element 4 to work for a preset time to achieve the heating of the chip 2. It should be noted that the preset time can be obtained in advance based on prior knowledge, so that after the heating element 4 works for the preset time, the temperature of the chip 2 meets the minimum temperature requirement allowed for its normal operation.

[0055] Furthermore, the heating device also includes a temperature sensor 6, which is connected to the heat-conducting component 3 and is used to detect the temperature of the heat-conducting component 3. The temperature sensor 6 is also connected to the processing module 7 and is used to transmit the detected temperature signal to the processing module 7. The processing module 7 determines the temperature of the chip 2 based on the detected temperature of the heat-conducting component 3, and then issues an instruction to make the heating element 4 work or not work.

[0056] It should be noted that since it is inconvenient to install the temperature sensor directly on the surface of the chip, the temperature sensor is installed on the thermal conductive component. The correspondence between the chip temperature and the thermal conductive component temperature can be obtained through prior knowledge, and then the chip temperature can be determined based on the correspondence.

[0057] Exemplarily, when the processing module determines that the temperature of the chip is greater than or equal to the minimum temperature allowed for its normal operation, a first instruction is issued to the heating element to stop the heating element from working; when the chip is in an extreme situation, a second instruction is issued to the heating element to make the heating element work for a fixed period of time, and the heating element heats the heat-conducting component, and then transfers the heat to the chip through the heat-conducting component 3, thereby achieving the purpose of heating the chip.

[0058] It should be noted that when the chip is in an extreme situation, the chip can be heated first until the temperature of the chip is no lower than the minimum temperature allowed for its normal operation, and then the chip can be turned on to work. The chip can also be heated before the chip starts working so that the temperature of the chip is no lower than the minimum temperature allowed for its normal operation.

[0059] Furthermore, the processing module can determine the working time of the heating element based on the heating power of the heating element, the temperature of the chip and the minimum temperature allowed for the normal operation of the chip. The greater the heating power, the shorter the working time of the heating element; the higher the temperature of the chip, the shorter the working time of the heating element; the lower the minimum temperature allowed for the normal operation of the chip, the shorter the heating time.

[0060] Since working under extreme conditions will shorten the service life of the chip, it is necessary to adjust the temperature of the chip to or above the minimum temperature allowed for normal operation before the chip works.

[0061] Therefore, in addition to heating the chip, the heating device also needs to make the heating speed meet the startup requirements. Before the startup is completed, the temperature of the chip is adjusted to the minimum temperature allowed for normal operation or above. For example, the required startup time is t0, and the time t has been spent. Then, the temperature of the chip must be increased to the minimum temperature allowed for normal operation or above within (t0-t). To this end, it is necessary to adjust the input voltage of the heating element 4 to meet the startup time requirement.

[0062] Furthermore, under the condition that the heating power remains unchanged, when it is detected that the temperature rise rate of the chip cannot keep up with the startup time requirement, the processing module can calculate the safety factor μ, μ=[(T0-T)*t0] / [(T0-Tmin)*(t0-t)], T represents the temperature of the chip, T0 represents the minimum temperature allowed for normal operation of the chip, Tmin represents the minimum temperature allowed by vehicle regulations, and the input voltage of the heater U=U0*μ, U0 is the preset voltage value, μ>1, that is, the heating time can be shortened by increasing the input voltage to avoid the chip being in extreme conditions when starting up.

[0063] Exemplarily, the temperature sensor 6 detects the temperature of the heat-conducting component 3 in real time and transmits the detected temperature signal to the processing module 7, which converts the temperature signal into the temperature of the chip 2 and determines whether the chip 2 is in an extreme condition. When the chip 2 is in an extreme condition, it is determined that the heating element 4 needs to work, and then the input voltage of the heating element 4 is determined according to the startup time requirement of the projector, the time already spent at the current moment, and the heating power of the heating element 4. Then the processing module 7 issues a third instruction to adjust the input voltage of the heating element 4, and outputs a second instruction to make the heating element 4 work, so as to heat the chip 2 to a normal working temperature while meeting the startup requirements.

[0064] For further information, please refer to 1- Figure 3 The heat-conducting component 3 includes a heat-conducting substrate 31 and a heat-conducting platform 32. The heat-conducting substrate 31 is fixedly connected to the shell 1 through a connecting piece. The heating element 4 is attached to the heat-conducting substrate 31. The heat-conducting platform 32 is fixedly connected to the heat-conducting substrate 31 on a side facing away from the shell 1.

[0065] The side of the heat conducting platform 32 facing the housing 1 is a heat conducting surface 321 , and the heat conducting surface 321 is in contact with the heat exchange area.

[0066] Exemplarily, the heating element 4 generates heat and transfers it to the heat-conducting substrate 31 and the heat-conducting platform 32 , and then the heat-conducting substrate 31 transfers the heat to the heat-conducting platform 32 , and the heat-conducting platform 32 transfers the heat to the chip 2 through the heat exchange area to achieve the purpose of heating the chip 2 .

[0067] It should be noted that the lamination may be lamination without squeezing force or lamination with squeezing force.

[0068] As an example, the heat conducting platform 32 may be in contact with the heat exchange area, and there is no squeezing force between the heat conducting platform and the heat exchange area.

[0069] As an example, the heat conducting platform 32 may be in contact with the heat exchange area, and there is a squeezing force between the heat conducting platform and the heat exchange area.

[0070] Furthermore, the heat-conducting surface 321 abuts against the heat exchange area through the heat-conducting pad 33 to improve the heat transfer efficiency between the heat exchange area and the heat-conducting platform 32. The heat-conducting pad 33 can be heat-conducting silicone grease or heat-conducting silica gel.

[0071] For further information, see Figure 1-Figure 3 and Figure 7 The temperature sensor 6 is connected to the heat-conducting substrate 31 and is used to detect the temperature of the heat-conducting substrate 31. The temperature sensor 6 comprises a thermistor 62 and a metal sheet 61, wherein the metal sheet 61 is connected to the thermistor 62, and the metal sheet 61 is attached to the heat-conducting substrate 31, and is used to transfer the heat of the heat-conducting substrate 31 to the thermistor 62, so as to detect the temperature of the heat-conducting substrate 31.

[0072] It should be noted that the heating device may further include: a pressing plate 21 , a control plate 22 , a first flexible member 23 , a second flexible member 24 and an adapter plate 25 .

[0073] The pressing plate 21 has a first opening, the control plate 22 has a second opening, the adapter plate 25 has a third opening, and the heat conducting platform 32 passes through the first opening, the second opening and the third opening in sequence to fit the heat exchange area.

[0074] As an example, the adapter board 25 is used to connect with the signal interface of the chip 2, and is used to connect with the interface of the control board 22, and transmit signals between the chip 2 and the control board 22. The control board 22 is used to connect with the processing module 7, and the control board 22 controls the micromirror structure unit of the chip 2 according to the signal of the processing module 7. The pressing plate 21 is an auxiliary pressing structure, and the pressing plate 21 is connected to the housing 1 through a connecting piece, which can fix the relative positions of the control board 22, the adapter board 25 and the chip 2, so as to facilitate the installation of the heat conducting component 3 at a later stage.

[0075] As an example, the pressure plate 21 is in contact with the control board 22 through the first flexible member 23, and the adapter plate 25 is in contact with the control board 22 through the second flexible member 24, so that the control board 22 can be fixed without damaging the control board 22. Exemplarily, the material of the pressure plate 21 can be a galvanized steel plate, the first flexible member 23 can be a rubber pad or a silicone pad, and the second flexible member 24 can be a rubber pad or a silicone pad.

[0076] For further information, see Figure 1-Figure 3 , the heating device also includes.

[0077] Heat dissipation component 5.

[0078] The side of the heat-conducting substrate 31 facing the shell 1 is a first side 311 , and the side away from the shell 1 is a second side 312 . The heat-conducting base 32 is fixedly connected to the first side 311 , the heat dissipation component 5 is connected to the second side 312 , and the heating element 4 is in contact with the first side 311 .

[0079] Exemplarily, the heat dissipation component 5 is connected to the second surface 312, and the heating element 4 is attached to the first surface 311, so that the heat dissipation component 5 can be farther away from the heating element 4. When the heating element 4 heats the conductive substrate, the conductive substrate 31 can transfer more heat to the conductive platform 32, thereby improving the heating efficiency of the chip 2.

[0080] In an exemplary embodiment, the heat dissipation assembly 5 includes a heat dissipation pipe 51 and a heat dissipation fin 52 , one end of the heat dissipation pipe 51 is connected to the heat dissipation fin 52 , and the other end of the heat dissipation pipe 51 is connected to the second surface 312 .

[0081] For further information, see Figure 3 The side of the heat-conducting substrate 31 facing the housing 1 is a first side 311 . A sinking side 314 is formed on the first side 311 . The sinking side 314 is parallel to the first side 311 .

[0082] The heating element is in contact with the sunken surface 314 and is not exposed from the first surface.

[0083] Exemplarily, the distance between the sunken surface 314 and the first surface 311 may be 0.2 mm-0.4 mm.

[0084] The present application makes full use of the thickness space and area of ​​the heat-conducting substrate, installs the heating element on the sunken surface and fits it with the sunken surface, and the heating element is not exposed on the first surface. It can heat the chip without affecting the normal operation of the original heat dissipation structure, and is very easy to implement, which greatly saves heating costs.

[0085] For further information, see Figure 5-Figure 6 , the heating device also includes.

[0086] Heat dissipation component 5.

[0087] The side of the heat-conducting substrate 31 facing the shell is a first side 311 , and the side away from the shell is a second side 312 . The heat-conducting base is fixedly connected to the first side 311 , and the heating element 4 is in contact with the second side 312 .

[0088] The heat dissipation assembly includes a heat dissipation pipe 51 and a heat dissipation fin 52. One end of the heat dissipation pipe 51 is connected to the heat dissipation fin 52, and the other end of the heat dissipation pipe 51 enters the heat-conducting substrate 31 from the third surface 313 of the heat-conducting substrate 31. At least a portion of the heat dissipation pipe 51 is buried in the heat-conducting substrate 31, and the third surface 313 is not the first surface 311 and not the second surface 312.

[0089] The other end of the heat pipe 51 enters the heat conductive substrate 31 from the third surface 313 of the heat conductive substrate 31, that is, the heat pipe 51 is neither connected to the first surface 311 nor to the second surface 312. Since the first surface 311 of the heat conductive substrate 31 is fixedly connected to the heat conductive platform 32, the surface area of ​​the first surface 311 is smaller than the surface area of ​​the second surface 312. By fitting the heating element 4 to the second surface 312, the area of ​​the heating plate can be maximized, and a larger area of ​​the heat conductive substrate 31 can be heated, thereby improving the heating efficiency of the chip.

[0090] Furthermore, the present application proposes a projection device, which includes.

[0091] A light source, a lens and the aforementioned heating device.

[0092] The shell also includes a light inlet and a light outlet. The light source is used to emit a light beam and transmit the light beam to the light inlet. The micromirror structure element is used to reflect the light beam transmitted from the light inlet to obtain a reflected light beam. The lens is used to project the reflected light beam from the light outlet.

[0093] Furthermore, the present application proposes a vehicle, comprising.

[0094] The vehicle body and the aforementioned projection device.

[0095] The vehicle body has an installation position, and the installation position is used to install the projection device.

[0096] The heating device of the present application is installed in the projector. When the projector is in an environment and needs to work, the temperature is detected by a temperature sensor, and then the temperature of the chip is determined based on the temperature. Then, the heating time and input voltage value of the heating element are determined based on the power-on time requirement of the projector. The chip is heated by the heating element, so that the chip can be heated to the lowest temperature allowed for its normal operation before the power-on is completed, thereby ensuring the normal operation of the chip and reducing unnecessary damage to the chip.

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A heating device, characterized in that: The heating device comprises: Shell, chip, heat conducting component and heating element; The inner wall of the shell forms an inner cavity, the shell has a through hole, the chip is fixed at the through hole, the chip has at least one micromirror structure element on a side facing the inner cavity, the micromirror structure element is used to reflect the received light beam, and the chip has a heat exchange area on a side away from the inner cavity; The heat conducting component is fixedly connected to the shell through a connecting piece, and the heat conducting component is in contact with the heat exchange area; The heating element is attached to the heat-conducting component and is used to heat the heat-conducting component.

2. The heating device according to claim 1, characterized in that The heating element is a sheet-like structure, comprising two stacked insulating layers and at least one heating sheet located between the two insulating layers, and the heating sheet is a resistor sheet.

3. The heating device according to claim 1, characterized in that: The heat-conducting assembly comprises a heat-conducting substrate and a heat-conducting platform, wherein the heat-conducting substrate is fixedly connected to the shell through a connecting piece, the heating element is attached to the heat-conducting substrate, and the heat-conducting platform is fixedly connected to the heat-conducting substrate on a side away from the shell; A side of the heat conducting platform facing the shell is a heat conducting surface, and the heat conducting surface is in contact with the heat exchange area.

4. The heating device according to claim 3, characterized in that: The heating device also includes: Heat dissipation components; The side of the heat-conducting substrate facing the shell is the first side, and the side away from the shell is the second side. The heat-conducting platform is fixedly connected to the first side, the heat dissipation component is connected to the second side, and the heating element is attached to the first side.

5. The heating device according to claim 3, characterized in that: The heating device also includes: Heat dissipation components; The side of the heat-conducting substrate facing the shell is a first side, and the side away from the shell is a second side. The heat-conducting platform is fixedly connected to the first side, and the heating element is attached to the second side. The heat dissipation assembly includes a heat dissipation pipe and a heat dissipation fin, one end of the heat dissipation pipe is connected to the heat dissipation fin, and the other end of the heat dissipation pipe enters the heat conductive substrate from the third surface of the heat conductive substrate, at least part of the heat dissipation pipe is buried in the heat conductive substrate, and the third surface is not the first surface and not the second surface.

6. The heating device according to claim 3, characterized in that: The side of the heat-conducting substrate facing the shell is a first side, and a sinking surface is provided on the first side, and the sinking surface is parallel to the first side; The heating element is in contact with the sunken surface and is not exposed from the first surface.

7. The heating device according to claim 1, characterized in that: The heating device also includes: Temperature sensor; The temperature sensor is connected to the heat-conducting component and is used to detect the temperature of the heat-conducting component.

8. The heating device according to claim 7, characterized in that: The heating device also includes: Processing module; The processing module is connected to the chip, the heating element and the temperature sensor, and is used to control the heating element to heat the heat-conducting component based on the temperature collected by the temperature sensor.

9. A projection device, characterized in that: The projection device comprises: A light source, a lens, and a heating device according to any one of claims 1 to 8; The shell also includes a light inlet and a light outlet. The light source is used to emit a light beam and transmit the light beam to the light inlet. The micromirror structure element is used to reflect the light beam transmitted from the light inlet to obtain a reflected light beam. The lens is used to project the reflected light beam from the light outlet.

10. A vehicle, characterized in that: The vehicle comprises: A vehicle body and the projection device according to claim 9; The vehicle body has an installation position, and the installation position is used to install the projection device.

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