Heat dissipation device based on shape memory alloy and server

Abstract

The utility model discloses a heat dissipation device based on shape memory alloy and a server, and relates to the technical field of heat dissipation structures. The heat dissipation device based on the shape memory alloy comprises a heating element and a heat dissipation assembly, wherein the heat dissipation assembly is provided with a heat dissipation fan and an air guide piece communicating the heat dissipation fan with the heating element; blowing air generated by the cooling fan is blown to the heating element through an air channel formed by the air guide piece. At least part of the side wall of the air guide piece comprises shape memory alloy, the shape memory alloy extends from the end close to the cooling fan to the end close to the heating element, and the end, close to the heating element, of the shape memory alloy has at least two different position states so as to change the size or position of an air outlet of the air guide piece. The heat dissipation device based on the shape memory alloy can achieve key cooling for a high-temperature area or large-range blowing for the high-temperature area, the heat dissipation effect is effectively improved, meanwhile, continuous energy consumption is avoided, and the energy consumption can be effectively reduced while the heat dissipation effect is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation structures, and more specifically, to a heat dissipation device based on shape memory alloys. In addition, the utility model also relates to a server comprising the heat dissipation device based on shape memory alloys. Background Art

[0002] At present, cooling fans are usually used to dissipate heat from heating elements. The cooling fans increase the airflow velocity, accelerate the efficiency of heat exchange, and achieve the effect of heat dissipation. However, when the product is dissipating heat, the temperature of different positions of the same product or different adjacent products varies. In certain states, the temperature of different positions of the same product or different adjacent products is different, or the temperature is changing to produce a temperature difference.

[0003] Existing cooling fans and cooling airflow channels are fixed during installation and cannot be adjusted according to temperature changes. When the temperature of some areas of the same product or some products in different products rises, it is necessary to comprehensively improve the cooling efficiency of the entire product or all products, resulting in energy waste.

[0004] In summary, how to provide a heat dissipation device that can effectively reduce energy consumption is a problem that needs to be urgently solved by those skilled in the art. Utility Model Content

[0005] In view of this, the purpose of the utility model is to provide a heat dissipation device based on shape memory alloy, which can automatically deform according to changes in temperature, adjust the size or position of the air outlet of the air guide, adapt to the heat dissipation requirements of different temperatures, and effectively reduce energy consumption.

[0006] Another object of the utility model is to provide a server comprising the above-mentioned heat dissipation device based on shape memory alloy.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] A heat dissipation device based on shape memory alloy, comprising:

[0009] Heating element;

[0010] A heat dissipation component is provided with a heat dissipation fan and an air guide connecting the heat dissipation fan and the heating element; the air generated by the heat dissipation fan is blown toward the heating element through the air duct formed by the air guide;

[0011] At least a portion of the side wall of the air guide comprises a shape memory alloy, the shape memory alloy extends from an end close to the cooling fan to an end close to the heating element, the end of the shape memory alloy close to the heating element has at least two different position states to change the size or position of the air outlet of the air guide, and the at least two different position states correspond to different temperatures of the heating element respectively.

[0012] Optionally, the same air guide comprises at least two different shape memory alloys, and for the heating elements at different temperatures or different temperature regions of the same heating element, there are at least two shape memory alloys having different deformations.

[0013] Optionally, when the heating element is at a first temperature, the shape memory alloy is in a first position state; when the heating element is at a second temperature, different shape memory alloys are in different second position states;

[0014] The second temperature is higher than the first temperature;

[0015] The shape memory alloy in the second position state is bent and deformed toward the outside of the air outlet of the air guide member compared to the shape memory alloy in the first position state, and the size of the air outlet of the air guide member when the shape memory alloy is in the second position state is larger than the size of the air outlet of the air guide member when the shape memory alloy is in the first position state;

[0016] Or, the shape memory alloy in the second position state is bent and deformed toward the inside of the air outlet of the air guide member compared to the shape memory alloy in the first position state, and the size of the air outlet of the air guide member when the shape memory alloy is in the second position state is smaller than the size of the air outlet of the air guide member when the shape memory alloy is in the first position state.

[0017] Optionally, the same air guide comprises at least two identical shape memory alloys, and for the heating elements at different temperatures or different temperature regions of the same heating element, at least two shape memory alloys have the same deformation.

[0018] Optionally, when the heating element is at a first temperature, the shape memory alloy is in a first position state; when the heating element is at a second temperature, the shape memory alloy is in a second position state;

[0019] The second temperature is higher than the first temperature;

[0020] The shape memory alloy in the second position state is bent and deformed to the same side compared to the shape memory alloy in the first position state, and the air outlet position of the air guide member of the shape memory alloy in the second position state deviates from the air outlet position of the air guide member of the shape memory alloy in the first position state.

[0021] Optionally, all side walls of the air guide are formed by surrounding the shape memory alloy;

[0022] Alternatively, the air guide member includes at least two oppositely disposed side surfaces, and at least two oppositely disposed shape memory alloys exist in the at least two oppositely disposed side surfaces.

[0023] Optionally, the shape memory alloy is a sheet structure, and the sheet-shaped shape memory alloy extends along the flow direction of the airflow in the air duct formed by the air guide.

[0024] Optionally, the air guide member includes a deformable air guide member base and the shape memory alloy embedded in the air guide member base.

[0025] Optionally, the number of the air guide members is at least three, and at least two of the air guide members have different deformations when the temperature changes.

[0026] A server comprises any one of the above-mentioned heat dissipation devices based on shape memory alloy.

[0027] When using the heat dissipation device based on shape memory alloy provided by the utility model, the air blown by the heat dissipation fan is blown toward the heating element through the air duct formed by the air guide piece to cool the heating element; after the temperature of the heating element changes, the end of the shape memory alloy away from the air inlet end of the air guide piece will be deformed, so that the size of the air outlet of the air guide piece can be adjusted according to the temperature change, or the end of the shape memory alloy away from the air inlet end of the air guide piece will be deformed according to the temperature change at different positions in the heating element, so as to adjust the position of the air outlet of the air guide piece.

[0028] For example, in the initial state, when the shape memory alloy has not been deformed, the air outlet of the air guide blows air toward the first area of ​​the heating element. When the temperature of the first area of ​​the heating element rises, the size of the air outlet can be adjusted by the deformation of the shape memory alloy to increase the area of ​​the air outlet, thereby increasing the air outlet area of ​​the air guide and improving the heat dissipation effect of the first area of ​​the heating element. In addition, when the temperature of the second area of ​​the heating element rises and is higher than that of the first area, the second area is a position in the heating element that deviates from the first area. The position of the air outlet of the air guide can be adjusted by the deformation of the shape memory alloy so that the air outlet of the air guide faces the second area, and concentrated air blowing is performed on the second area with higher temperature to improve the heat dissipation effect of the second area.

[0029] In summary, during actual use, the heat dissipation device based on shape memory alloy provided by the utility model can automatically deform the shape memory alloy according to the change of temperature, and adjust the size and position of the air outlet of the air guide under the deformation condition of the shape memory alloy to adapt to the heat dissipation demand after the temperature change, thereby achieving focused cooling in high-temperature areas or achieving large-scale blowing in high-temperature areas, effectively improving the heat dissipation effect, and avoiding continuous energy consumption. It can effectively reduce energy consumption while ensuring the heat dissipation effect.

[0030] In addition, the utility model also provides a server including the above-mentioned heat dissipation device based on shape memory alloy. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0032] Figure 1 This is a schematic diagram of the appearance structure of the heat dissipation device based on shape memory alloy provided by the utility model;

[0033] Figure 2 This is a structural schematic diagram of the shape memory alloy in the initial state in the specific embodiment 1 of the heat dissipation device based on the shape memory alloy provided by the utility model;

[0034] Figure 3 for Figure 2 A schematic diagram of the structure of a shape memory alloy after deformation in a heat dissipation device based on shape memory alloy;

[0035] Figure 4 An axonometric diagram of a shape memory alloy in an initial state in a specific embodiment 2 of a heat dissipation device based on a shape memory alloy provided by the utility model;

[0036] Figure 5 middle Figure 4 A schematic top view of a heat dissipation device based on a shape memory alloy;

[0037] Figure 6 for Figure 4 A schematic diagram of the structure of a shape memory alloy after deformation in a heat dissipation device based on shape memory alloy;

[0038] Figure 7 for Figure 6 A schematic top view of a heat dissipation device based on a shape memory alloy;

[0039] Figure 8 This is an axonometric diagram of the shape memory alloy in the initial state in the specific embodiment 3 of the heat dissipation device based on the shape memory alloy provided by the utility model;

[0040] Fig. 9 middle Figure 8 A schematic top view of a heat dissipation device based on a shape memory alloy;

[0041] Fig.10 for Figure 8 A schematic diagram of the structure of a shape memory alloy after deformation in a heat dissipation device based on shape memory alloy;

[0042] Fig.11 for Fig.10 Schematic diagram of a top view of a heat dissipation device based on shape memory alloy.

[0043] Figure 1-Figure 11 middle:

[0044] 1 is a heating element, 2 is a shape memory alloy, 3 is a cooling fan, and 4 is a housing. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0046] The core of the utility model is to provide a heat dissipation device based on shape memory alloy, which can automatically deform according to temperature changes, adjust the size or position of the air outlet of the air guide part, adapt to the heat dissipation requirements of different temperatures, and effectively reduce energy consumption.

[0047] Another core of the utility model is to provide a server including the above-mentioned heat dissipation device based on shape memory alloy.

[0048] The present specific embodiment discloses a heat dissipation device based on shape memory alloy, comprising a heating element 1 and a heat dissipation assembly, wherein the heat dissipation assembly is provided with a heat dissipation fan 3 and an air guide connecting the heat dissipation fan 3 and the heating element 1; the air generated by the heat dissipation fan 3 is blown toward the heating element 1 through an air duct formed by the air guide; at least part of the side wall of the air guide comprises a shape memory alloy 2, the shape memory alloy 2 extends from an end close to the heat dissipation fan 3 to an end close to the heating element 1, and the end of the shape memory alloy 2 close to the heating element 1 has at least two different position states to change the size or position of the air outlet of the air guide, and the at least two different position states correspond to different temperatures of the heating element 1 respectively.

[0049] It should be noted that the heating element 1 in this specific embodiment can be a circuit board or a heating element, etc., which is determined according to actual conditions and will not be elaborated here.

[0050] Specifically, the air guide piece can be set to a structure including a deformable air guide piece base and a shape memory alloy 2 embedded in the air guide piece base. The air guide piece base constitutes the overall structure of the air guide piece, and the shape memory alloy 2 is embedded in the air guide piece base. When the temperature changes, the shape memory alloy 2 is deformed, and at the same time, the deformed shape memory alloy 2 drives the air guide piece base to deform, thereby changing the shape of the air guide piece base, thereby achieving adjustment of the size or position of the air outlet.

[0051] The air guide member substrate may be configured as a rubber or plastic structure having elasticity. Of course, it may also be configured as other structures that meet the requirements, which is determined based on actual conditions.

[0052] On the other hand, the air guide can also be set as a cylindrical structure formed by a plurality of side walls, one end of the cylindrical structure faces the heat dissipation fan 3, and the other end of the cylindrical structure faces the heating element 1; the plurality of side walls of the air guide can be plate-like structures for guiding, wherein at least part of the side walls of the air guide are provided with shape memory alloy 2. Specifically, the plurality of side walls of the air guide can be set as a split structure, and the shape memory alloy 2 can be provided on all the side walls of the air guide, and the side walls can be formed by the shape memory alloy 2. When the temperature changes, the shape memory alloy 2 is deformed, that is, the side wall of the air guide is deformed, and the size or position of the air outlet of the air guide is changed; the shape memory alloy 2 can also be provided at a part of the side wall, and the shape memory alloy 2 is a sheet structure, and the sheet shape memory alloy 2 extends along the flow direction of the airflow in the air duct formed by the air guide. When the temperature changes, the shape memory alloy 2 is deformed, driving the side wall of the air guide where it is located to be deformed, and the size or position of the air outlet of the air guide is changed. The specific determination is based on the actual situation, and no further description is given here.

[0053] In addition, the air guide member may include at least two oppositely disposed side surfaces, and at least two oppositely disposed shape memory alloys 2 may exist in the at least two oppositely disposed side surfaces; when the temperature changes, the oppositely disposed side surfaces with the shape memory alloys 2 may be deformed, causing the shapes of the oppositely disposed sides of the air outlet of the air guide member to change, thereby changing the size or position of the air outlet of the air guide member.

[0054] Of course, the air guide member may also include several side surfaces, and shape memory alloy 2 may exist in at least two adjacent side surfaces; when the temperature changes, the adjacent side surfaces with shape memory alloy 2 may be deformed, causing the shapes of the two adjacent sides of the air outlet of the air guide member to change, thereby changing the size or position of the air outlet of the air guide member.

[0055] It should be noted that the shape memory alloy 2 mentioned in this specific embodiment can be a nickel-titanium-based shape memory alloy 2, a copper-based shape memory alloy 2 or an iron-based shape memory alloy 2, which is determined according to actual conditions.

[0056] When using the heat dissipation device based on shape memory alloy provided in this specific embodiment, the air blown by the heat dissipation fan 3 is blown toward the heating element 1 through the air duct formed by the air guide piece to cool the heating element 1; after the temperature of the heating element 1 changes, the end of the shape memory alloy 2 away from the air inlet end of the air guide piece will be deformed, so as to adjust the size of the air outlet of the air guide piece according to the temperature change, or according to the temperature change at different positions in the heating element 1, the end of the shape memory alloy 2 away from the air inlet end of the air guide piece will be deformed, so as to adjust the position of the air outlet of the air guide piece.

[0057] For example, in the initial state, when the shape memory alloy 2 has not been deformed, the air outlet of the air guide blows air toward the first area of ​​the heating element 1. When the temperature of the first area of ​​the heating element 1 increases, the size of the air outlet can be adjusted by the deformation of the shape memory alloy 2 to increase the area of ​​the air outlet, thereby increasing the air outlet area of ​​the air guide and improving the heat dissipation effect of the first area of ​​the heating element 1. In addition, when the temperature of the second area of ​​the heating element 1 increases and is higher than that of the first area, the second area is a position in the heating element 1 that deviates from the first area. The position of the air outlet of the air guide can be adjusted by the deformation of the shape memory alloy 2 to direct the air outlet of the air guide toward the second area, thereby concentrating the blowing on the second area with a higher temperature and improving the heat dissipation effect of the second area.

[0058] In summary, the heat dissipation device based on shape memory alloy provided in this specific embodiment can automatically deform the shape memory alloy 2 according to the change of temperature during actual use, and adjust the size and position of the air outlet of the air guide under the deformation condition of the shape memory alloy 2 to adapt to the heat dissipation demand after the temperature change, so as to achieve focused cooling in high-temperature areas or achieve large-scale blowing in high-temperature areas, effectively improve the heat dissipation effect, and avoid continuous energy consumption, which can effectively reduce energy consumption while ensuring the heat dissipation effect. In addition, the shape memory alloy 2 can automatically adjust its shape according to the temperature change of the equipment without external intervention. When the temperature of the heating element 1 rises, the shape memory alloy 2 can turn in time and dissipate the heat more effectively; through the adaptive adjustment of the shape memory alloy 2, the wind flow can be guided to the part of the heating element 1 that needs to be dissipated to the maximum extent, thereby improving the heat dissipation efficiency and maintaining the normal working state of the equipment.

[0059] In addition, in the same heat sink based on shape memory alloy, at least three air guides may be provided, and at least two of the air guides have different deformations when the temperature changes.

[0060] In actual use, in response to temperature changes, at least two air guides may have different deformations to meet different heat dissipation requirements.

[0061] In a specific embodiment, the same air guide includes at least two different shape memory alloys 2 , and for heating elements 1 of different temperatures or different temperature regions of the same heating element 1 , there are at least two shape memory alloys 2 with different deformations.

[0062] Specifically, when the heating element 1 is at a first temperature, the shape memory alloy 2 is in a first position state; when the heating element 1 is at a second temperature, different shape memory alloys 2 are in different second position states; the second temperature is higher than the first temperature; the shape memory alloy 2 in the second position state is bent and deformed toward the outside of the air outlet of the air guide compared to the shape memory alloy 2 in the first position state, and the size of the air outlet of the air guide when the shape memory alloy 2 is in the second position state is larger than the size of the air outlet of the air guide when the shape memory alloy 2 is in the first position state; Figure 2 As shown, the shape memory alloy 2 is in the first position. When the temperature rises, Figure 3 As shown, the shape memory alloy 2 is in the second position. At this time, the size of the air outlet of the air guide is increased, so that the area of ​​the heating element 1 covered by the airflow of the air outlet of the air guide can be increased. This is suitable for the situation where the temperature of the heating element 1 increases due to the increase in the heating area, and can effectively increase the heat dissipation area and improve the heat dissipation efficiency.

[0063] Alternatively, the shape memory alloy 2 in the second position is bent and deformed toward the inner side of the air outlet of the air guide member compared to the shape memory alloy 2 in the first position, and the size of the air outlet of the air guide member when the shape memory alloy 2 is in the second position is smaller than the size of the air outlet of the air guide member when the shape memory alloy 2 is in the first position. Figure 2 The figure shows the state of the shape memory alloy 2 when it is in the first position. When the temperature rises, the shape memory alloy 2 is bent and deformed toward the inner side of the air outlet of the air guide, so that the area of ​​the air outlet of the air guide is reduced, and the airflow is blown out of the air outlet and concentrated on the heating part of the heating element 1; it is suitable for the situation where the heating element 1 needs to dissipate heat urgently due to the increase of the temperature in the local area, and the specific area of ​​the heating element 1 can be concentrated to dissipate heat.

[0064] In this specific embodiment, the size of the air outlet is changed by the deformation of the shape memory alloy 2, so that the area of ​​the heating element 1 that can be covered by the airflow flowing out of the air duct formed by the air guide piece changes, which can achieve large-area heat dissipation or concentrated heat dissipation in a designated area, which is beneficial to improving the heat dissipation effect; in addition, the shape memory alloy 2 will only deform when the temperature changes, changing the size of the air outlet of the air guide piece, avoiding continuous energy consumption, effectively saving energy, and improving the energy efficiency performance of the equipment.

[0065] In addition, if Figure 1 As shown, a shell 4 can be provided on the heat dissipation device based on shape memory alloy, and the heating element 1 and the shape memory alloy 2 can be provided in the shell, so as to effectively protect the heating element 1 and the shape memory alloy 2.

[0066] Apart from Figure 2 , Figure 3 The shape change of the shape memory alloy 2 shown in FIG. 1 can also make the shape memory alloy 2 be in the state of the first position state, such as Figure 4 , Figure 5 As shown; when the temperature rises, Figure 6 , Figure 7 As shown, the shape memory alloy 2 is in the second position state, at which time the air guide member is not Figure 3 As shown, the bending occurs, but Figure 6 , Figure 7 As shown, the shape memory alloy 2 is tilted outward, and the size of the air outlet of the air guide increases, so that the area of ​​the heating element 1 covered by the airflow of the air outlet of the air guide increases, which is suitable for the case where the temperature of the heating element 1 increases due to the increase in the heating area, and can effectively increase the heat dissipation area and improve the heat dissipation efficiency. Of course, when the shape memory alloy 2 is in the second position state, it can also be in other deformation forms, which are determined according to actual conditions and will not be described here.

[0067] In another specific embodiment, the same air guide comprises at least two identical shape memory alloys 2 , and for the heating elements 1 at different temperatures or different temperature regions of the same heating element 1 , at least the two shape memory alloys 2 have the same deformation.

[0068] Specifically, when the heating element 1 is at a first temperature, the shape memory alloy 2 is in a first position state; when the heating element 1 is at a second temperature, the shape memory alloy 2 is in a second position state; the second temperature is higher than the first temperature; the shape memory alloy 2 in the second position state is bent and deformed to the same side compared with the shape memory alloy 2 in the first position state, and the air outlet position of the air guide member when the shape memory alloy 2 is in the second position state deviates from the air outlet position of the air guide member when the shape memory alloy 2 is in the first position state.

[0069] like Figure 8 , Fig. 9 As shown in FIG. 1 , the shape memory alloy 2 is in the first position. When the temperature rises, as shown in FIG. Fig.10 , Fig.11 As shown, the shape memory alloys 2 are all bent and deformed toward the same side. At this time, the position of the air outlet of the air guide is offset so that the air outlet faces the area with higher temperature, thereby achieving concentrated heat dissipation in the area with higher temperature.

[0070] In this specific embodiment, by setting the shape memory alloy 2 that bends and deforms to the same side to change the position of the air outlet of the air guide, concentrated heat dissipation in the area with higher temperature can be achieved, which can be beneficial to improving the heat dissipation effect; in addition, the shape memory alloy 2 will only deform when the temperature changes, changing the position of the air outlet of the air guide, avoiding continuous energy consumption, effectively saving energy, and improving the energy efficiency performance of the equipment.

[0071] In addition to the above-mentioned heat dissipation device based on shape memory alloy, the present invention also provides a server including the heat dissipation device based on shape memory alloy disclosed in the above-mentioned embodiment. For the structures of other parts of the server, please refer to the prior art and will not be described in detail herein.

[0072] Each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referenced to each other. Any combination of all embodiments provided by the utility model is within the protection scope of this utility model and will not be described in detail here.

[0073] The above is a detailed introduction to the heat dissipation device and server based on shape memory alloy provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiment is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the utility model.

Claims

1. A heat dissipation device based on shape memory alloy, characterized in that: include: Heating element (1); A heat dissipation component, comprising a heat dissipation fan (3) and an air guide connecting the heat dissipation fan (3) and the heating element (1); the air generated by the heat dissipation fan (3) is blown toward the heating element (1) through an air duct formed by the air guide; At least part of the side wall of the air guide member comprises a shape memory alloy (2), the shape memory alloy (2) extending from an end close to the heat dissipation fan (3) to an end close to the heating element (1), the end of the shape memory alloy (2) close to the heating element (1) having at least two different position states so as to change the size or position of the air outlet of the air guide member, and the at least two different position states respectively correspond to different temperatures of the heating element (1).

2. The heat dissipation device based on shape memory alloy according to claim 1, characterized in that: The same air guide comprises at least two different shape memory alloys (2), and for the heating elements (1) at different temperatures or different temperature regions of the same heating element (1), there are at least two shape memory alloys (2) having different deformations.

3. The heat dissipation device based on shape memory alloy according to claim 2, characterized in that: When the heating element (1) is at a first temperature, the shape memory alloys (2) are all in a first position state; when the heating element (1) is at a second temperature, different shape memory alloys (2) are in different second position states; The second temperature is higher than the first temperature; The shape memory alloy (2) in the second position state is bent and deformed toward the outside of the air outlet of the air guide member compared to the shape memory alloy (2) in the first position state, and the size of the air outlet of the air guide member when the shape memory alloy (2) is in the second position state is larger than the size of the air outlet of the air guide member when the shape memory alloy (2) is in the first position state; Alternatively, the shape memory alloy (2) in the second position state is bent and deformed toward the inside of the air outlet of the air guide member compared to the shape memory alloy (2) in the first position state, and the size of the air outlet of the air guide member when the shape memory alloy (2) is in the second position state is smaller than the size of the air outlet of the air guide member when the shape memory alloy (2) is in the first position state.

4. The heat dissipation device based on shape memory alloy according to claim 1, characterized in that: The same air guide comprises at least two identical shape memory alloys (2), and for the heating elements (1) at different temperatures or different temperature regions of the same heating element (1), at least two of the shape memory alloys (2) have the same deformation.

5. The heat dissipation device based on shape memory alloy according to claim 4, characterized in that: When the heating element (1) is at a first temperature, the shape memory alloy (2) is in a first position state; when the heating element (1) is at a second temperature, the shape memory alloy (2) is in a second position state; The second temperature is higher than the first temperature; The shape memory alloy (2) in the second position state is bent and deformed toward the same side compared to the shape memory alloy (2) in the first position state, and the air outlet position of the air guide member when the shape memory alloy (2) is in the second position state deviates from the air outlet position of the air guide member when the shape memory alloy (2) is in the first position state.

6. The heat dissipation device based on shape memory alloy according to any one of claims 1 to 5, characterized in that: All side walls of the air guide are formed by surrounding the shape memory alloy (2); Alternatively, the air guide member comprises at least two oppositely disposed side surfaces, and at least two oppositely disposed shape memory alloys (2) exist in the at least two oppositely disposed side surfaces.

7. The heat dissipation device based on shape memory alloy according to claim 6, characterized in that: The shape memory alloy (2) is a sheet-like structure, and the sheet-like shape memory alloy (2) extends along the flow direction of the airflow in the air duct formed by the air guide.

8. The heat dissipation device based on shape memory alloy according to any one of claims 1 to 5, characterized in that: The air guide member comprises a deformable air guide member base and the shape memory alloy (2) embedded in the air guide member base.

9. The heat dissipation device based on shape memory alloy according to any one of claims 1 to 5, characterized in that: The number of the air ducts of the air guide member is at least three, and at least two of the air guide members have different deformations when the temperature changes.

10. A server, characterized in that: A heat dissipation device based on shape memory alloy comprising any one of claims 1-9.

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