Photovoltaic inverter

Abstract

The utility model provides a photovoltaic inverter, an assembly structure comprises a box body, a PCB (Printed Circuit Board) and an IGBT (Insulated Gate Bipolar Translator) module, and the IGBT module is fixedly arranged on the PCB; the control assembly comprises a heat dissipation module and a flange, and the flange is fixedly connected with the heat dissipation module and fixedly connected with the PCB, so that the control assembly and the heat dissipation assembly form an integral structure; the flange is fixedly connected with the box body, so that the integral structure is fixedly arranged in the box body; according to the scheme, the flange is arranged in the assembling structure of the inverter, the control part composed of the PCB and the IGBT module and the radiator form an integral structure outside the case through the flange, and then the integral structure is installed in the box body of the inverter, so that the PCB and the IGBT module are pre-assembled outside the case, the assembling difficulty is reduced, and the assembling efficiency is improved. And the welding parts of the PCB and the IGBT module in the case are reduced, so that the assembly efficiency is effectively improved, the welding difficulty is reduced, and the hidden danger that welding slag falls into the case is reduced.

Description

Technical Field

[0001] The utility model relates to the field of photovoltaic inverter structure design, in particular to a photovoltaic inverter. Background Art

[0002] Inverters are widely used as equipment in the photovoltaic power generation industry. Existing inverters are assembled by welding inside the chassis. The heat sink needs to be assembled on the back of the chassis first, and then the PCB board and IGBT module (power switch module) are welded inside the chassis according to the heat dissipation position. The small space inside the chassis makes it difficult for workers to move, resulting in low welding efficiency. In addition, welding slag falls into the chassis and is difficult to clean effectively, posing a high risk. In addition, when assembling the IGBT module inside the chassis, the solder feet cannot be effectively aligned, making it difficult to pre-assemble the IGBT module and the PCB board. Summary of the invention

[0003] The utility model aims to provide a photovoltaic inverter to solve the problems of low welding efficiency, much welding slag inside the chassis, and difficulty in pre-assembling an IGBT module and a PCB board caused by internal assembly of the inverter chassis in the prior art.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] The utility model provides a photovoltaic inverter, comprising:

[0006] A box body, wherein a fixing portion is arranged inside the box body;

[0007] Control components, including:

[0008] PCB board,

[0009] An IGBT module, the IGBT module is fixedly arranged on the PCB board;

[0010] Heat dissipation components, including:

[0011] Cooling module,

[0012] Assembly department, where

[0013] The first portion of the assembling portion is fixedly connected to the PCB board, the second portion of the assembling portion is fixedly connected to the heat dissipation module, and the third portion of the assembling portion is fixedly connected to the fixing portion.

[0014] Furthermore, the assembling part comprises a flange, and the flange is an annular frame structure.

[0015] Furthermore, the first surface of the flange is fixedly connected to the first surface of the PCB board, and the IGBT module is fixedly mounted on the second surface of the PCB board;

[0016] The IGBT module is installed on the back of the PCB board, and the function of the radiator is to dissipate heat for the components on the front of the PCB board, so the flange needs to be installed on the front of the PCB board. Since there are multiple components distributed on the front of the PCB board, the middle part of the flange needs to be hollowed out to avoid the components in the middle of the PCB board. The annular flange can be fixedly connected to the edge of the PCB board where there are no components, and effectively realize its function without affecting the normal operation of the PCB board.

[0017] Furthermore, a portion of the second surface of the flange close to the inner frame is fixedly connected to the heat dissipation module.

[0018] Furthermore, the assembly part includes a mounting substrate, and the second surface of the flange is fixedly connected to the mounting substrate; when the overall structure formed by the PCB board, the IGBT module, the radiator and the flange is installed in the chassis, the mounting substrate is used as a support plate, and the flange is fixedly connected to the mounting substrate, so that the overall structure is fixedly installed inside the chassis.

[0019] Furthermore, a hollow portion is provided on the mounting substrate, and the heat dissipation fins of the heat dissipation module pass through the hollow portion from the first surface of the mounting substrate to the second surface of the mounting substrate; the heat dissipation fins in the radiator function to conduct the heat generated by the components on the PCB board during operation to achieve the effect of heat dissipation of the PCB board, so the heat dissipation fins need to contact the components on the PCB board and also need to conduct the heat to the outside of the sealing area of ​​the PCB board. Therefore, a hollow portion through which the heat dissipation fins can pass is provided on the mounting substrate.

[0020] Furthermore, the flange is arranged along the circumference of the outer periphery of the hollow portion; the radiator is fixedly connected to the flange, the flange needs to be fixedly connected to the mounting substrate, and it is necessary to ensure that the cooling fins of the radiator pass through the hollow portion on the mounting substrate, so the flange needs to be close to the hollow portion and correspond to it.

[0021] Furthermore, a support seat is fixedly provided at the bottom of the heat dissipation fin, and there is a gap between the support seat and the edge of the hollow portion, and the second surface of the flange is abutted against the bottom of the gap to form a glue groove; the mounting substrate can isolate the PCB board in the area inside the box, and in order to ensure the passage of the heat dissipation fins, a hollow portion is opened on the mounting substrate, and the hollow portion will affect the sealing of the area where the PCB board is located, so the gap between the hollow portion and the support seat is sealed by a flange, and then glue is arranged in the formed glue groove to improve the sealing performance, thereby ensuring the sealing of the PCB board inside the box; at the same time, the glue in the glue groove can also improve the fixing effect between the flange and the mounting substrate.

[0022] Furthermore, the glue groove is a closed annular structure, which is arranged along the circumference of the support seat; the glue groove is designed to be a closed annular structure arranged along the flange to provide an effect similar to a sealing ring, effectively improving the sealing performance.

[0023] Furthermore, the notch of the glue groove faces the direction of the second surface of the mounting substrate, the second surface of the mounting substrate is the outer side of the chassis, and the notch faces the outer side to facilitate gluing.

[0024] The advantages of the utility model are as follows:

[0025] The utility model designs a photovoltaic inverter, which combines a control component composed of a PCB board and an IGBT module and a heat sink into an integral structure by arranging a flange, and then installs the control component in a box body, so that the PCB board and the IGBT module can be pre-assembled outside the box body, reducing the difficulty of assembly. At the same time, a fixed connection is formed with the inside of the box body through the flange, reducing the number of welding points of the PCB board and the IGBT module inside the box body, thereby effectively accelerating the assembly efficiency and reducing the hidden danger of welding slag falling inside the box body. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 It is an integral structure consisting of a PCB board, an IGBT module and a heat sink in one embodiment of the present application.

[0028] Figure 2 This is a schematic diagram of the flange structure in one embodiment of the present application.

[0029] Figure 3 It is a cross-sectional view of the inverter installation structure in one embodiment of the present application.

[0030] Figure 4 This is a schematic diagram of a side installation structure of a box body in one embodiment of the present application.

[0031] Figure 5 This is a partial enlarged schematic diagram of the glue groove in one embodiment of the present application.

[0032] Figure 6 This is a schematic diagram of the overall structure installed on the other side of the inverter box in one embodiment of the present application.

[0033] The components in the figure are shown as follows:

[0034] 1. Box; 2. PCB board; 3. IGBT module; 4. Heat dissipation module; 41. Heat dissipation fins; 42. Support seat; 5. Flange; 6. Mounting base plate; 7. Glue groove; 100. Overall structure. DETAILED DESCRIPTION

[0035] The following describes the preferred embodiments of the present invention with reference to the drawings in the specification to prove that the present invention can be implemented. The invention embodiments can fully introduce the present invention to those skilled in the art, making the technical content clearer and easier to understand. The present invention can be embodied through many different forms of invention embodiments, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0036] In the drawings, components with the same structure are indicated by the same numerical labels, and components with similar structures or functions are indicated by similar numerical labels. The size and thickness of each component shown in the drawings are shown arbitrarily, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0037] In addition, the following descriptions of the various embodiments of the invention are made with reference to the attached diagrams to illustrate specific embodiments of the invention that the present invention can be implemented with. The directional terms mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached diagrams. Therefore, the directional terms used are for better and clearer description and understanding of the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0038] When some components are described as being "on" another component, the component may be directly placed on the other component; there may also be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. When a component is described as being "mounted on" or "connected to" another component, the two may be understood to be directly "mounted on" or "connected", or one component may be indirectly "mounted on" or "connected to" another component via an intermediate component.

[0039] Overview

[0040] As described in the background technology, the existing inverter assembly is to first assemble the heat sink on the back of the chassis, and then weld the PCB board and IGBT module inside the chassis according to the heat dissipation position. Since the PCB board and the IGBT module need to be pre-assembled first, the internal space of the chassis is small, and the soldering feet of the IGBT module cannot be effectively aligned with the PCB board, which increases the difficulty of assembly between the two. In addition, welding and assembly inside the chassis cannot be performed due to limited welding movements, which also increases the difficulty of welding, thereby affecting the overall assembly efficiency. At the same time, the large amount of welding slag remaining in the box will also affect the overall quality of the product.

[0041] In view of the above problems, the inventors have improved the structure of the inverter and provided a flange. The heat sink, circuit board (PCB board), and IGBT module (power switch module) are assembled into an integral structure outside the chassis through the flange, and the integral structure is then fixedly installed inside the chassis through the flange. On the one hand, this can overcome the difficulty of pre-assembling the PCB board and the IGBT module inside the chassis. On the other hand, the installation workers do not need to perform welding at multiple locations inside the chassis. The flange is fixedly connected to the fixed part inside the chassis, and only a small number of locations need to be welded to complete the assembly, which reduces the difficulty of welding, improves the installation efficiency, and reduces the hidden danger of welding slag falling inside the chassis, thereby ensuring the quality of the product.

[0042] Based on the above concept, the present application will be exemplarily described below in conjunction with the accompanying drawings.

[0043] Exemplary Devices

[0044] This embodiment provides a photovoltaic inverter, such as Figure 1 and Figure 3 As shown, the photovoltaic inverter comprises:

[0045] A box body 1, wherein a fixing part is arranged inside the box body 1;

[0046] Control components, including:

[0047] PCB board 2,

[0048] An IGBT module 3, wherein the IGBT module 3 is fixedly disposed on the PCB board 2;

[0049] Heat dissipation components, including:

[0050] A heat dissipation module 4, wherein the heat dissipation module 4 comprises heat dissipation fins 41;

[0051] Flange 5, where

[0052] The flange 5 is fixedly connected to the PCB board 2 , the flange 5 is fixedly connected to the heat dissipation module 4 , and the flange 5 is fixedly connected to the fixing portion.

[0053] Further description, such as Figure 3 As shown, according to the direction shown in the figure, the upper surface of the flange 5 is fixedly connected to the lower surface of the PCB board 2, and the IGBT module 3 is fixedly mounted on the upper surface of the PCB board 2;

[0054] The IGBT module 3 is installed on the upper surface of the PCB board 2, and the function of the radiator is to dissipate heat for the components on the lower surface of the PCB board 2, so the upper surface of the flange 5 is fixedly connected to the lower surface of the PCB board 2, and the lower surface of the flange 5 is fixedly connected to the heat dissipation module 4.

[0055] In some embodiments, Figure 2 As shown, the flange 5 is an annular frame structure;

[0056] Since a plurality of components are distributed in the middle area of ​​the surface of the PCB board 2 , the middle part of the flange 5 needs to be hollowed out to avoid the components in the middle of the PCB board 2 , and the annular flange 5 is fixedly connected to the edge of the PCB board 2 without any component part.

[0057] It should be noted that the flange 5 includes the above-mentioned rectangular annular frame structure, and can also be a circular annular structure, an elliptical annular structure, an irregular annular structure or other structures that can achieve the same functions as above. In addition, the flange 5 can be a closed ring or an unclosed ring.

[0058] In some embodiments, the fixed connection between the heat dissipation module 4 and the flange 5, and the PCB board 2 and the flange 5 can be fixedly connected by screws or by welding;

[0059] It should be noted that the use of screws for fixing the connection requires pre-opening screw holes in the corresponding parts of the flange 5, the PCB board 2 and the heat dissipation module 4, and self-tapping screws are also used for fixing the connection, which depends on the actual installation process.

[0060] It should be noted that the fixed connection methods between the heat dissipation module 4 and the flange 5, and between the PCB board 2 and the flange 5 include the above-mentioned welding and screw connections, but are not limited thereto, and may also be other connection methods that can achieve the same or similar functions.

[0061] Further description, such as Figure 3 and Figure 6 As shown, the fixing portion provided in the box body 1 includes a mounting base plate 6, and the lower surface of the flange 5 is fixedly connected to the mounting base plate 6;

[0062] When the overall structure 100 formed by the PCB board 2, IGBT module 3, heat sink and flange 5 is installed inside the chassis, the mounting substrate 6 is used as a fixing support plate, and the flange 5 is fixedly connected to the mounting substrate 6, so that the overall structure 100 is fixedly installed inside the chassis.

[0063] In some embodiments, the flange 5 and the mounting base plate 6 may be connected by screws or by welding.

[0064] It should be noted that the fixing methods of the flange 5 and the mounting base plate 6 include screw fixing and welding, but are not limited thereto, and may also be other connection methods that can achieve the same or similar functions.

[0065] It should be noted that during the assembly of the inverter, the overall structure 100 formed by the PCB board 2, IGBT module 3, heat sink and flange 5 is not only fixed between the flange 5 and the mounting substrate 6, but also needs to be welded to the inside of the chassis through a small amount of parts on the PCB board 2, IGBT module 3 and the heat sink to enhance the installation and fixing effect.

[0066] In some embodiments, Figure 3 and Figure 4 As shown, a hollow portion is provided on the mounting substrate 6 , and the heat dissipation fins 41 of the heat dissipation module 4 pass through the hollow portion from the upper surface of the mounting substrate 6 to the lower surface of the mounting substrate 6 .

[0067] The main function of the heat dissipation fins 41 in the radiator is to conduct the heat generated by the components on the PCB board 2 during operation, so as to achieve the effect of heat dissipation of the PCB board 2. The heat dissipation fins 41 need to contact the components on the PCB board 2 and also need to conduct the heat to the outside of the sealed area of ​​the PCB board 2. Therefore, a hollow portion is opened on the mounting substrate 6 to allow the heat dissipation fins 41 to pass through.

[0068] In some embodiments, the flange 5 is arranged along the outer circumference of the hollow portion; the heat sink is fixedly connected to the flange 5, and the flange 5 needs to be fixedly connected to the mounting substrate 6, and it is necessary to ensure that the heat dissipation fins 41 of the heat sink pass through the hollow portion on the mounting substrate 6, so the flange 5 needs to be close to the hollow portion and correspond to it.

[0069] In some embodiments, Figure 3 and Figure 5 As shown, a support seat 42 is fixedly provided at the bottom of the heat dissipation fin 41, and there is a gap between the support seat 42 and the edge of the hollow portion, and the flange 5 is attached to the bottom of the gap to form a glue groove 7;

[0070] The mounting substrate 6 can isolate the PCB board 2 in the area inside the box body 1. In order to ensure that the heat dissipation fins 41 pass through, a hollow portion is opened on the mounting substrate 6. The hollow portion will affect the sealing of the area where the PCB board 2 is located, so the gap between the hollow portion and the support seat 42 is sealed by the flange 5, and then glue is set in the formed glue groove 7 to improve the sealing performance and ensure the sealing of the PCB board 2 inside the box body 1; at the same time, the glue in the glue groove 7 can also improve the fixing effect between the flange 5 and the mounting substrate 6.

[0071] In some embodiments, Figure 4 As shown, the glue groove 7 is a closed annular structure, which is arranged along the circumference of the support seat 42;

[0072] The glue groove 7 is designed to be a closed annular structure arranged along the flange 5 to provide an effect similar to a sealing ring, thereby effectively improving the sealing performance.

[0073] It should be noted that the shape of the glue groove 7 includes the above-mentioned closed ring structure arranged along the circumference of the flange 5, but is not limited thereto, and may also be other shapes that can achieve the same or similar functions.

[0074] In some embodiments, Figure 3 As shown, the notch of the glue groove 7 faces the lower surface of the mounting substrate.

[0075] The lower surface of the mounting base 6 is the outer side of the chassis, and the notch faces the outer side for easy gluing.

[0076] Although the present invention is described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. It should therefore be understood that many modifications may be made to the exemplary embodiments, and other arrangements may be designed without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the features described in the various dependent claims and herein may be combined in a manner different from that described in the original claims. It may also be understood that the features described in conjunction with the individual embodiments may be used in other described embodiments.

Claims

1. A photovoltaic inverter, characterized in that: include: A box body, wherein a fixing portion is arranged inside the box body; Control components, including: PCB board, An IGBT module, the IGBT module is fixedly arranged on the PCB board; Heat dissipation components, including: Cooling module, Assembly department, where The first part of the assembling part is fixedly connected to the PCB board, the second part of the assembling part is fixedly connected to the heat dissipation module, and the third part of the assembling part is fixedly connected to the fixing part in the box body.

2. The photovoltaic inverter according to claim 1, characterized in that: The assembling part comprises a flange, and the flange is an annular frame structure.

3. The photovoltaic inverter according to claim 2, characterized in that: The first surface of the flange is fixedly connected to the first surface of the PCB board, and the IGBT module is fixedly mounted on the second surface of the PCB board.

4. The photovoltaic inverter according to claim 2, characterized in that: The second surface of the flange is fixedly connected to the heat dissipation module.

5. The photovoltaic inverter according to claim 2, characterized in that: The assembling portion includes a mounting base plate, and the second surface of the flange is fixedly connected to the mounting base plate.

6. The photovoltaic inverter according to claim 5, characterized in that: A hollow portion is formed on the mounting substrate, and the heat dissipation fins of the heat dissipation module pass through the hollow portion from the first surface of the mounting substrate to the second surface of the mounting substrate.

7. The photovoltaic inverter according to claim 6, characterized in that: The flange is arranged circumferentially along the outer periphery of the hollow portion.

8. The photovoltaic inverter according to claim 6, characterized in that: A support base is fixedly arranged at the bottom of the heat dissipation fin, a gap exists between the support base and the edge of the hollow portion, and the second surface of the flange is abutted against the bottom of the gap to form a glue groove.

9. The photovoltaic inverter according to claim 8, characterized in that: The glue groove is a closed annular structure, which is arranged along the circumference of the support seat.

10. The photovoltaic inverter according to claim 8, characterized in that: The notch of the glue groove faces the direction of the second surface of the mounting substrate.

Images