Silicon carbide ceramic radiating fin
By designing a silicon carbide ceramic heat sink with a thermal grease cavity and a movable connecting plate, the problem of thermal grease spillage is solved, achieving efficient heat dissipation and preventing poor connection of electronic components.
Patent Information
- Application Number
- CN202420564327.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-03-22
AI Technical Summary
When thermal grease is applied to the contact surface of the electronic components and the heat sink, the thermal grease can easily cause the thermal grease to overflow to the welding connection pins around the electronic components, resulting in poor connection of the electronic components.
A silicon carbide ceramic heat sink is designed, and the top of the heat dissipation plate is concave to form a thermal grease cavity. A threaded column is set at the bottom of the thermal grease cavity. A connecting plate is set on the threaded column. A threaded cylinder is set on the top of the connecting plate. A threaded cylinder is set on the threaded column. Several heat sink bodies are set on the connecting plate. By rotating the threaded cylinder in reverse, driving the connecting plate upward, adding thermal grease, and then rotating the threaded cylinder in forward, driving the connecting plate downward, extruding the thermal grease, so that it is laid flat in the thermal grease cavity.
It effectively avoids direct contact and overflow of thermally conductive grease with electronic components, prevents poor connection of electronic components, and at the same time, heat dissipation is performed through the heat sink body, improving heat dissipation efficiency.
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Figure CN222582814U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat sinks, in particular to a silicon carbide ceramic heat sink. Background Art
[0002] Heat sink is a device for dissipating heat from heat-prone electronic components in electrical appliances. It is mostly made of aluminum alloy, brass or bronze in the form of plates, sheets, or multiple sheets. For example, the central processing unit of a computer needs to use a relatively large heat sink, and the power tube, line tube, and power amplifier tube in a TV all need to use heat sinks. Silicon carbide ceramic, also known as corundum, is a compound with a strong covalent bond, and has excellent mechanical properties at room temperature, high bending strength, excellent oxidation resistance, good corrosion resistance, high wear resistance, and low friction coefficient. Heat sinks made of silicon carbide ceramic have good heat dissipation and high temperature resistance. Silicon carbide ceramic heat sinks are widely used in some precision equipment electronic components. At present, silicon carbide ceramic heat sinks need to be coated with a layer of thermal conductive silicone grease on the contact surface between the electronic component and the heat sink during use, so that the heat generated by the components can be more effectively transferred to the heat sink, and then dissipated to the surrounding air through the heat sink. This can easily cause the thermal conductive silicone grease to overflow onto the connecting pins welded around the electronic component, thereby causing poor connection of the electronic component. Utility Model Content
[0003] In view of the above problems in the prior art, the utility model provides a silicon carbide ceramic heat sink, which solves the problem in the prior art that a layer of thermal grease is applied on the contact surface between the electronic component and the heat sink, which easily causes the thermal grease to overflow onto the connecting pins welded around the electronic component, resulting in poor connection of the electronic component.
[0004] In order to achieve the above utility model purpose, the technical solution adopted by the utility model is as follows:
[0005] A silicon carbide ceramic heat sink is provided, comprising a heat sink, the top of the heat sink is concave to form a thermal grease cavity, a threaded column is vertically arranged at the bottom of the thermal grease cavity, a connecting plate matching the thermal grease cavity is sleeved on the threaded column, a threaded barrel is rotatably arranged on the top of the connecting plate, the threaded barrel is sleeved on the threaded column and threadedly connected to the threaded column, and a plurality of heat sink bodies are arranged on the top of the connecting plate.
[0006] In some embodiments, the top of the connecting plate is concave to form a plurality of mutually parallel slots, one end of the slot passes through the first side surface of the connecting plate, and a clip matching the slot is provided at the bottom of the heat sink body, and the heat sink body is connected to the connecting plate by engaging the clip into the corresponding slot through the clip.
[0007] In some embodiments, the other end of the card slot passes through a second side surface of the connecting plate, and the second side surface is arranged opposite to the first side surface.
[0008] In some embodiments, a mounting circular hole is provided through the top of the connecting plate, a mounting bearing is provided in the mounting circular hole, and the threaded tube extends into the mounting bearing to be rotatably connected to the mounting bearing.
[0009] In some embodiments, the connecting plate is slidably connected to the inner wall of the thermal grease cavity, and the connecting plate can move up and down in a vertical direction.
[0010] In some embodiments, two opposite inner walls of the thermal grease cavity are provided with a slide groove extending in a vertical direction, one end of the slide groove passes through the top of the heat sink, and two opposite side surfaces of the connecting plate are provided with sliders, and the connecting plate extends into the corresponding slide groove through the sliders to be slidably connected to the inner wall of the thermal grease cavity.
[0011] In some embodiments, the threaded column is provided with a through hole passing through the top and the bottom along the length direction, and a plurality of guide holes connected to the through hole are provided at one end of the threaded column close to the bottom of the thermal grease cavity, and a threaded cap is threadedly connected to the top of the threaded column.
[0012] The beneficial effects of the utility model are:
[0013] The threaded barrel is rotated in the reverse direction to drive the connecting plate to move up along the threaded column until the connecting plate leaves the thermal grease cavity, and then thermal grease is added to the thermal grease cavity. The threaded barrel is rotated in the forward direction to drive the connecting plate to move down along the threaded column, squeezing the thermal grease in the thermal grease cavity so that the thermal grease is spread flat in the thermal grease cavity. The heat absorbed by the thermal grease is dissipated through a number of heat sink bodies arranged on the connecting plate, which can prevent the thermal grease from directly contacting the electronic components and overflowing to the soldered pins of the electronic components, thereby preventing poor connection of the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 A schematic diagram of the structure provided for an embodiment of the present application;
[0015] Figure 2 An enlarged schematic diagram of A provided in an embodiment of the present application;
[0016] Among them, 1. heat sink; 2. thermal grease cavity; 3. threaded column; 4. connecting plate; 5. threaded cylinder; 6. heat sink body; 7. slot; 8. clamping strip; 9. mounting bearing; 10. slide groove; 11. slider; 12. through hole; 13. guide hole; 14. threaded cap. DETAILED DESCRIPTION
[0017] The specific implementation methods of the utility model are described below to facilitate technical personnel in this technical field to understand the utility model, but it should be clear that the utility model is not limited to the scope of the specific implementation methods. For ordinary technical personnel in this technical field, as long as various changes are within the spirit and scope of the utility model defined and determined by the attached claims, these changes are obvious, and all utility model creations using the concept of the utility model are protected.
[0018] Embodiment 1
[0019] The embodiment of the present application provides a silicon carbide ceramic heat sink, such as Figure 1 As shown, it includes a heat sink 1, the top of the heat sink 1 is concave to form a thermal grease cavity 2, a threaded column 3 is vertically arranged at the bottom of the thermal grease cavity 2, a connecting plate 4 matching the thermal grease cavity 2 is sleeved on the threaded column 3, a threaded barrel 5 is rotatably arranged on the top of the connecting plate 4, the threaded barrel 5 is sleeved on the threaded column 3 and threadedly connected to the threaded column 3, and a plurality of heat sink bodies 6 are arranged on the top of the connecting plate 4.
[0020] In the embodiment of the present application, the heat sink 1 is connected to the electronic component that needs heat dissipation by screws, and then the threaded barrel 5 is rotated in the reverse direction to drive the connecting plate 4 to move up along the threaded column 3 until the connecting plate 4 leaves the thermal grease cavity 2, and then thermal grease is added to the thermal grease cavity 2, and the threaded barrel 5 is rotated forward to drive the connecting plate 4 to move down along the threaded column 3, squeezing the thermal grease in the thermal grease cavity 2 so that the thermal grease is spread flat in the thermal grease cavity 2. The heat absorbed by the thermal grease is dissipated through a number of heat sink bodies 6 arranged on the connecting plate 4, which can avoid direct contact between the thermal grease and the electronic components and overflow to the soldered pins of the electronic components, thereby preventing poor connection of the electronic components.
[0021] Embodiment 2
[0022] On the basis of the first embodiment, Figure 1 , Figure 2 As shown, the top of the connecting plate 4 is concave to form a plurality of mutually parallel slots 7, one end of the slot 7 passes through the first side surface of the connecting plate 4, and the bottom of the heat sink body 6 is provided with a clip 8 matching the slot 7, and the heat sink body 6 is connected to the connecting plate 4 by snapping the clip 8 into the corresponding slot 7.
[0023] In the embodiment of the present application, the slot 7 is a T-shaped slot, and the clip 8 is a T-shaped clip. The heat sink body 6 is inserted into the slot 7 from the first side of the connecting plate 4 through the clip 8 and is engaged with the connecting plate 4. The heat sink body 6 is limited by the inner wall of the thermal grease cavity 2, which can prevent the heat sink body 6 from separating from the connecting plate 4. The corresponding number of heat sink bodies 6 can be configured according to the heat dissipation requirements, which is convenient for installing and disassembling the heat sink. The damaged heat sink body 6 can be replaced, or the heat sink body 6 can be cleaned to prevent stains on the heat sink body 6 from affecting the heat dissipation performance of the heat sink body 6.
[0024] Embodiment 3
[0025] On the basis of the second embodiment, the other end of the slot 7 passes through the second side surface of the connecting plate 4 , and the second side surface is arranged opposite to the first side surface.
[0026] In the embodiment of the present application, the other end of the slot 7 passes through the second side surface of the connecting plate 4, so that when installing or removing the heat sink body 6, it can be installed or removed through any end of the slot 7, thereby improving the efficiency of installation and removal.
[0027] Embodiment 4
[0028] On the basis of the first embodiment, Figure 1 As shown, a mounting circular hole is provided through the top of the connecting plate 4 , a mounting bearing 9 is provided in the mounting circular hole, and the threaded tube 5 extends into the mounting bearing 9 and is rotatably connected to the mounting bearing 9 .
[0029] In the embodiment of the present application, a mounting circular hole is provided through the top of the connecting plate 4, a mounting bearing 9 is provided in the mounting circular hole, and the threaded cylinder 5 is rotatably connected to the mounting bearing 9, thereby ensuring that the connecting plate 4 will not rotate with the threaded cylinder 5 when the threaded cylinder 5 is rotated.
[0030] Embodiment 5
[0031] On the basis of the first embodiment, the connecting plate 4 is slidably connected to the inner wall of the thermal grease cavity 2, and the connecting plate 4 can move up and down in the vertical direction.
[0032] In the embodiment of the present application, when the threaded cylinder 5 is rotated forward to drive the connecting plate 4 to move downward, the connecting plate 4 is slidingly connected to the inner wall of the thermal grease cavity 2, and the direction of the connecting plate 4 can be quickly adjusted to facilitate the connecting plate 4 to enter the thermal grease cavity 2, thereby improving the installation efficiency.
[0033] In some embodiments, Figure 1As shown, two opposite inner side walls of the thermal grease cavity 2 are provided with a slide groove 10 extending in the vertical direction, one end of the slide groove 10 passes through the top of the heat sink 1, and two opposite side surfaces of the connecting plate 4 are provided with a slider 11, and the connecting plate 4 extends into the corresponding slide groove 10 through the slider 11 to be slidably connected with the inner wall of the thermal grease cavity 2.
[0034] In the embodiment of the present application, the slide groove 10 is a square groove, the slider 11 is a square block, and the connecting plate 4 extends from the top of the heat sink 1 into the slide groove 10 through the slider 11 and is slidably connected to the inner wall of the thermal grease cavity 2, thereby ensuring that the connecting plate 4 quickly enters the thermal grease cavity 2 and preventing the connecting plate 4 from moving horizontally when the threaded tube 5 rotates.
[0035] Embodiment 6
[0036] On the basis of the first embodiment, Figure 1 As shown, the threaded column 3 is provided with a through hole 12 passing through the top and the bottom along the length direction, and one end of the threaded column 3 close to the bottom of the thermal grease cavity 2 is provided with a plurality of guide holes 13 connected with the through hole 12, and the top of the threaded column 3 is threadedly connected with a threaded cap 14.
[0037] In the embodiment of the present application, the threaded cap 14 is rotated to separate the threaded cap 14 from the threaded column 3, and then thermal grease is added through the through hole 12. The thermal grease in the through hole 12 enters the thermal grease cavity 2 through the guide hole 13. After the addition is completed, the threaded cap 14 is threadedly connected to the threaded column 3. There is no need to separate the connecting plate 4 from the thermal grease cavity 2, thereby improving the efficiency of adding thermal grease.
[0038] It should be understood by those skilled in the art that, although preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they are aware of the basic creative concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the equivalent technology of the claims of the present invention, the present invention is also intended to include these modifications and variations.
Claims
1. A silicon carbide ceramic heat sink, characterized in that: It includes a heat sink, the top of the heat sink is concave to form a thermal grease cavity, a threaded column is vertically arranged at the bottom of the thermal grease cavity, a connecting plate matching the thermal grease cavity is sleeved on the threaded column, a threaded barrel is rotatably arranged on the top of the connecting plate, the threaded barrel is sleeved on the threaded column and threadedly connected to the threaded column, and a plurality of heat sink bodies are arranged on the top of the connecting plate.
2. The silicon carbide ceramic heat sink according to claim 1, characterized in that: The top of the connecting plate is concave to form a plurality of mutually parallel slots, one end of the slot passes through the first side surface of the connecting plate, and a clip matching the slot is provided at the bottom of the heat sink body, and the heat sink body is connected to the connecting plate by snapping the clip into the corresponding slot.
3. The silicon carbide ceramic heat sink according to claim 2, characterized in that: The other end of the card slot passes through a second side surface of the connecting plate, and the second side surface is arranged opposite to the first side surface.
4. The silicon carbide ceramic heat sink according to claim 1, characterized in that: A mounting circular hole is provided through the top of the connecting plate, a mounting bearing is provided in the mounting circular hole, and the threaded cylinder extends into the mounting bearing and is rotatably connected to the mounting bearing.
5. The silicon carbide ceramic heat sink according to claim 1, characterized in that: The connecting plate is slidably connected to the inner side wall of the thermal grease cavity, and the connecting plate can move up and down in a vertical direction.
6. The silicon carbide ceramic heat sink according to claim 5, characterized in that: Two opposite inner side walls of the thermal grease cavity are each provided with a slide groove extending in a vertical direction, one end of the slide groove passes through the top of the heat sink, and two opposite side surfaces of the connecting plate are each provided with a slider, and the connecting plate extends into the corresponding slide groove through the slider to be slidably connected to the inner wall of the thermal grease cavity.
7. The silicon carbide ceramic heat sink according to claim 1, characterized in that: The threaded column is provided with a through hole penetrating the top and the bottom along the length direction, and one end of the threaded column close to the bottom of the thermal grease cavity is provided with a plurality of guide holes connected with the through hole, and the top of the threaded column is threadedly connected with a threaded cap.