Heat dissipation device and edge computing equipment

Abstract

The utility model provides a heat dissipation device and edge computing equipment. The heat dissipation device comprises a central processing unit, a temperature detection module, a current detection module, a heat dissipation component driving circuit and a heat dissipation component, the heat dissipation part comprises an internal heat dissipation part for dissipating heat of an internal structure of the edge computing equipment; the external heat dissipation part is located on the pole holding box on the outer side of the edge computing device and conducts heat dissipation on the interior of the pole holding box of the edge computing device. And one ends of the internal heat dissipation part and the external heat dissipation part are connected with the heat dissipation part driving circuit, and the other ends are connected with the central processing unit. The internal structure of the edge computing device is cooled through the internal cooling part, the interior of the holding pole box where the edge computing device is located is cooled through the external cooling part, cooling is more timely, the cooling efficiency of the edge computing device is improved, the system temperature of the edge computing device is within a reasonable range, and the service life of the edge computing device is prolonged. The system heat of the edge computing device can be effectively discharged, and the working temperature performance of the edge computing device is improved.

Description

Technical Field

[0001] The present application relates to the technical field of edge computing devices, and in particular to a heat dissipation device and an edge computing device. Background Art

[0002] The smart transportation edge computing unit is a roadside intelligent device for smart transportation scenarios. The edge computing unit is connected to various roadside devices such as the Internet of Vehicles RSU (Road Side Unit), lidar, high-definition cameras, etc., providing decision-making and other technologies and capabilities for vehicle-road collaborative applications, and realizing localized processing of roadside data and linkage control of equipment.

[0003] The edge computing unit is generally installed on the pole box on the side of the intelligent road. The edge computing unit needs to have a large processing and computing power to realize the real-time collection, storage, circulation, analysis and decision-making of roadside equipment data locally, and upload the processed valid information to the cloud control platform.

[0004] At present, the heat dissipation device of the edge computing unit generally adopts active heat dissipation, that is, by setting a fan or water cooling method inside the edge computing device. The heat dissipated by this heat dissipation method accumulates in the bracket box of the edge computing unit and cannot be dissipated, and is fed back to the shell of the edge computing unit. The heat dissipation effect is poor and cannot meet the heat dissipation requirements of the edge computing unit. Summary of the invention

[0005] In order to solve the above technical defects, the present application provides a heat dissipation device and an edge computing device.

[0006] A heat dissipation device, applied to edge computing equipment; comprising a central processing unit, a temperature detection module, a current detection module, a heat dissipation component driving circuit and a heat dissipation component;

[0007] The central processing unit is respectively connected to the temperature detection module, the current detection module, and the heat dissipation component driving circuit;

[0008] The temperature detection module is used to collect the temperature of the edge computing device;

[0009] The current detection module is used to collect the current of the edge computing device;

[0010] The heat dissipation component driving circuit is connected to the heat dissipation component;

[0011] The heat dissipation component comprises:

[0012] An internal heat dissipation component, used to dissipate heat from an internal structure of the edge computing device;

[0013] An external heat dissipation component, located on a pole box outside the edge computing device, for dissipating heat inside the pole box of the edge computing device;

[0014] One end of the internal heat dissipation component and the external heat dissipation component are both connected to the heat dissipation component driving circuit, and the other end thereof are both connected to the central processing unit.

[0015] Optionally, the internal heat dissipation component includes:

[0016] A core heat dissipation component, wherein the core heat dissipation component is mounted outside the metal housing of the edge computing device;

[0017] A heat sink fin is provided on the metal housing of the edge computing device;

[0018] A first thermally conductive silicone grease layer, used to connect a metal housing of the edge computing device and a PCB circuit board located inside the metal housing of the edge computing device;

[0019] The second thermal grease layer is used to connect the surface of the central processing unit with the boss, and the boss is located on the metal shell of the edge computing device.

[0020] Optionally, the temperature detection module includes a temperature sensor located in a heating area of ​​the system to which the edge computing device belongs, and a temperature sensor located inside the central processing unit;

[0021] The heating area includes a heating device; the temperature sensor of any heating area is no more than 10 mm away from the heating device in the heating area.

[0022] Optionally, the central processing unit is connected to the current detection module and the temperature detection module respectively through an integrated circuit bus IIC;

[0023] The central processing unit is connected to the heat dissipation component driving circuit via a pulse width modulation (PWM) pin.

[0024] Optionally, the heat dissipation fins are composed of a plurality of fins;

[0025] Each fin is 2.9 cm high and 2 mm thick;

[0026] The distance between two adjacent fins is 10 mm;

[0027] The bottom thickness of the heat sink fin is 5 mm, and the bottom area of ​​the heat sink fin covers the entire top surface of the edge computing device.

[0028] Optionally, the core heat dissipation component includes two square fans of the same specifications;

[0029] Two fans are embedded in the heat dissipation fins;

[0030] Each fan is 70mm long, 70mm wide and 15mm thick.

[0031] Optionally, the external heat dissipation component is located at the ventilation openings on the upper parts of the left and right sides of the pole box.

[0032] Optionally, the edge computing device further includes: a high-precision resistor;

[0033] The high-precision resistor is connected in series between the power input protection circuit and the power module;

[0034] One end of the current detection module is connected to the power input protection circuit side of the high-precision resistor, and the other end of the current detection module is connected to the power module side of the high-precision resistor. In a second aspect of the present application, an edge computing device is provided, the edge computing device comprising the heat dissipation device as described in the first aspect above.

[0035] The present application provides a heat dissipation device and an edge computing device. The heat dissipation device is applied to the edge computing device, including: a central processing unit, a temperature detection module, a current detection module, a heat dissipation component driving circuit and a heat dissipation component; the central processing unit is respectively connected to the temperature detection module, the current detection module, and the heat dissipation component driving circuit; the temperature detection module is used to collect the temperature of the edge computing device; the current detection module is used to collect the current of the edge computing device; the heat dissipation component driving circuit is connected to the heat dissipation component; the heat dissipation component includes: an internal heat dissipation component, which is used to dissipate the internal structure of the edge computing device; an external heat dissipation component, which is located on the holding pole box outside the edge computing device, and dissipates the inside of the holding pole box of the edge computing device; one end of the internal heat dissipation component and the external heat dissipation component are connected to the heat dissipation component driving circuit, and the other end is connected to the central processing unit. The above-mentioned heat dissipation device dissipates the internal structure of the edge computing device through the internal heat dissipation component, and dissipates the inside of the holding pole box where the edge computing device is located through the external heat dissipation component. By dissipating the heat internally and externally at the same time, the heat dissipation is more timely, the heat dissipation efficiency of the edge computing device is improved, the system temperature of the edge computing device is within a reasonable range, and the system heat of the edge computing device is ensured to be effectively discharged, and the working temperature performance of the edge computing device is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0037] Figure 1 A schematic diagram of a heat dissipation device provided in an embodiment of the present application;

[0038] Figure 2 A schematic diagram of another heat dissipation device provided in an embodiment of the present application;

[0039] Figure 3 A schematic diagram of another heat dissipation device provided in an embodiment of the present application;

[0040] Figure 4 A schematic diagram of another heat dissipation device provided in an embodiment of the present application;

[0041] Figure 5 A schematic diagram of another heat dissipation device provided in an embodiment of the present application;

[0042] Figure 6 A schematic diagram of another heat dissipation device provided in an embodiment of the present application;

[0043] Figure 7 A schematic diagram of another heat dissipation device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0044] In order to make the technical solutions and advantages in the embodiments of the present application more clearly understood, the exemplary embodiments of the present application are further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than an exhaustive list of all the embodiments. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0045] In the process of implementing the present application, the inventors discovered that the heat dissipation device of the edge computing unit generally adopts active heat dissipation, that is, by setting a fan or water cooling method inside the edge computing device. The heat dissipated by this heat dissipation method accumulates in the bracket box of the edge computing unit and cannot be dissipated, and is fed back to the shell of the edge computing unit again. The heat dissipation effect is poor and cannot meet the heat dissipation requirements of the edge computing unit.

[0046] In view of the above problems, the present application provides a heat dissipation device and an edge computing device. The heat dissipation device is applied to the edge computing device, including: a central processing unit, a temperature detection module, a current detection module, a heat dissipation component driving circuit, and a heat dissipation component; the central processing unit is respectively connected to the temperature detection module, the current detection module, and the heat dissipation component driving circuit; the heat dissipation component driving circuit is connected to the heat dissipation component; the heat dissipation component includes: an internal heat dissipation component for dissipating the internal structure of the edge computing device; an external heat dissipation component is located on the holding pole box outside the edge computing device, and dissipates the inside of the holding pole box of the edge computing device; one end of the internal heat dissipation component and the external heat dissipation component are connected to the heat dissipation component driving circuit, and the other end is connected to the central processing unit. The above heat dissipation device dissipates the internal structure of the edge computing device through the internal heat dissipation component, and dissipates the inside of the holding pole box where the edge computing device is located through the external heat dissipation component. By dissipating the heat internally and externally at the same time, the heat dissipation is more timely, the heat dissipation efficiency of the edge computing device is improved, the system temperature of the edge computing device is within a reasonable range, and the system heat of the edge computing device is ensured to be effectively discharged, and the working temperature performance of the edge computing device is improved.

[0047] The heat dissipation device provided in this embodiment is applied to edge computing equipment. Figure 1 The heat dissipation device includes: a central processing unit, a temperature detection module, a current detection module, a heat dissipation component driving circuit, and a heat dissipation component.

[0048] The central processing unit is respectively connected to the temperature detection module, the current detection module, the heat dissipation component driving circuit, and the heat dissipation component. The heat dissipation component driving circuit is connected to the heat dissipation component.

[0049] For specific implementation, see Figure 2 As shown, the central processing unit can perform two-way communication with the temperature detection module and the current detection module respectively; specifically, the connection can be achieved through conductive wires. The central processing unit and the heat dissipation component driving circuit can perform one-way communication, and the central processing unit sends the output power to the heat dissipation component driving circuit in the form of signaling, data, instructions, messages, etc. The heat dissipation component driving circuit and the heat dissipation component can perform one-way communication, and the heat dissipation component driving circuit outputs the output power to the heat dissipation component, and the output power is used to drive the operation of the heat dissipation component. Preferably, the central processing unit is located on a PCB board inside the edge computing device.

[0050] In addition, in the specific implementation, Figure 3 As shown, the CPU can also be connected to the heat sink. Figure 4 The heat dissipation component shown can communicate with the central processing unit in one direction, and the heat dissipation component sends the status (such as rotation speed) of the heat dissipation component to the central processing unit through signaling, data, instructions, messages, etc.; similarly, the above communication can be achieved through conductive lines, which will not be repeated here.

[0051] The central processing unit controls the temperature detection module to collect the temperature of the system to which the edge computing device belongs and obtains the temperature. The current detection module is controlled to collect the current of the system to which the edge computing device belongs and obtain the current. The heat dissipation component driving circuit is controlled according to the current and temperature to drive the heat dissipation component to dissipate heat for the central processing unit.

[0052] Specifically,

[0053] 1. Current detection module

[0054] The current detection module is used to collect the current of the system to which the edge computing device belongs.

[0055] The current detection module is composed of a current sensor for detecting the magnitude of the power supply current of the system, and can transmit the total current parameter of the system to the central processor through interfaces such as IIC (Inter-Integrated Circuit, integrated circuit bus).

[0056] The temperature rise of the system to which the edge computing device belongs (such as the edge computing device system) is caused by the increase in the power of the system, and the current of the system can reflect the power size of the system. The voltage of the system is fixed. The larger the current of the system, the larger the power of the system. Therefore, when the current of the system increases, it means that the power of the system increases. The heat dissipation device of this embodiment determines that the temperature of the system will begin to rise, and the heat dissipation capacity needs to be further enhanced to suppress the temperature rise process of the system. Specifically, the collected current of the edge computing device can be compared with the preset current value. When it is greater than or equal to the preset current value, the central processing unit controls the heat dissipation component driving circuit to drive the heat dissipation component to dissipate heat to the central processing unit, so as to suppress the system temperature of the edge computing device in time.

[0057] For example, in the heat dissipation device of the present application, the temperature of the edge computing device is collected by the temperature detection module, and the current detection module collects the current of the edge computing device; dual feedback is performed through the current and temperature respectively, when the temperature is greater than or equal to the preset temperature value, or when the current is greater than or equal to the preset current value, the central processing unit controls the heat dissipation component driving circuit to drive the heat dissipation component to dissipate heat for the central processing unit; by collecting the current, it is possible to judge in advance whether the system temperature rises, and perform heat dissipation treatment in advance, so that the heat dissipation is more timely, and timely heat dissipation of the edge computing device is realized; it is ensured that the system heat can be discharged in a timely and effective manner, the working temperature performance of the edge computing device is improved, and the edge computing device runs more smoothly.

[0058] It should be noted that, for the sake of convenience in explanation in this embodiment and subsequent embodiments, the system to which the edge computing device belongs is referred to as the belonging system.

[0059] In addition, the edge computing device also includes: a high-precision resistor. The high-precision resistor is connected in series between the power input protection circuit and the power module. Therefore, one end of the current detection module is connected to the power input protection circuit side of the high-precision resistor, and the other end of the current detection module is connected to the power module side of the high-precision resistor.

[0060] In specific implementation, the current detection module (such as current sensor) used in this embodiment can be a 16-bit high-precision current sensor, such as INA232 from TI (Texas Instruments). The current detection module (such as current sensor) used in this embodiment needs to monitor a power supply network with a maximum voltage of 48V (volts), and the operating voltage range is 1.7V to 5.5V.

[0061] The current detection module (such as a current sensor) used in this embodiment can communicate with the controller via an IIC interface and can directly read the current value and the power value.

[0062] After the external power supply is input into the edge computing device, it first passes through the power input protection circuit and then is connected in series with a high-precision resistor before being output to each power module. The high-precision resistor can be 8mΩ.

[0063] The IN+ (current detection positive input) of the current detection module (such as the current sensor) used in this embodiment is connected to the power input protection circuit side of the 8mΩ high-precision resistor, and the IN- (current detection negative input) is connected to the power module side of the 8mΩ high-precision resistor. The current detection module (such as the current sensor) used in this embodiment calculates the current size by collecting the voltage of the 8mΩ high-precision resistor.

[0064] The current detection module (such as a current sensor) used in this embodiment can collect current (that is, the current of the system to which the edge computing device belongs) based on the control of the central processing unit, and transmit the collected current back to the central processing unit.

[0065] 2. Temperature detection module

[0066] The temperature detection module is used to collect the temperature of the system to which the edge computing device belongs.

[0067] In addition, the temperature detection module includes a temperature sensor located in the heating area of ​​the system to which the edge computing device belongs, and a temperature sensor located inside the central processing unit. Each temperature sensor can be transmitted back to the central processing unit through an interface such as IIC.

[0068] The collected temperature may be an internal temperature of a central processor of a system to which the edge computing device belongs, and / or a temperature of a main heating area of ​​the system to which the edge computing device belongs.

[0069] For example, temperature sensors are placed in the main heat-generating areas of the system (such as near the main power supply) and integrated into the central processing unit (such as the temperature sensor integrated on the NVIDA Jetson AGX Orin module). The temperature sensor collects the ambient temperature at multiple points in the system and transmits the temperature data back to the central processing unit, making temperature detection more timely.

[0070] In addition, the heat-generating area includes heat-generating devices, such as power supplies, solid-state drives, Jetson AGX Orin modules, etc.

[0071] The temperature sensor in any heating area needs to have an accuracy of ±0.2°C, such as the SHT3X-DIS sensor from TheSensorConmpany. The HT3X-DIS sensor is an 8-PIN DFN package with few peripheral circuits and a small size, which is convenient for integration in the temperature detection area and can communicate through the IIC interface.

[0072] The temperature sensor of any heating area is no more than 10 mm away from the heating device in the heating area. In a specific implementation, the temperature sensor of any heating area can be installed on the same surface of the heating device.

[0073] The temperature sensor located inside the central processing unit, such as the central processing unit, the 10G network PHY (physical layer) network unit chip (such as Broadcom's BCM84891l), can be directly obtained by accessing the temperature sensor register because these chips have integrated temperature sensor modules.

[0074] The temperature detection module (such as a temperature sensor) used in this embodiment can collect temperature (i.e., the temperature of the system to which the edge computing device belongs) based on the control of the central processor, and transmit the collected temperature back to the central processor.

[0075] 3. CPU

[0076] The central processor obtains the current collected by the current detection module through the integrated circuit bus IIC interface. The temperature collected by the temperature detection module is obtained through the IIC interface. The heat dissipation component drive circuit is controlled through the pulse width modulation PWM (Pulse Width Modulation) pin according to the current and temperature.

[0077] When the central processing unit is implemented specifically, it can be the NVIDA Jetson AGX Orin high-performance processing unit of the system to which the edge computing device belongs, or a separate MCU (Microcontroller Unit). The central processing unit is connected to the temperature detection module through the IIC interface to obtain temperature parameters; in other embodiments, the connection method between the central processing unit and the temperature detection module can be set according to the development of the prior art, which will not be repeated here. The central processing unit is connected to the current detection module through the IIC interface to obtain the system current parameters. The central processing unit provides a driving signal to the heat dissipation component driving circuit through the PWM pin (it can also be controlled through other interfaces).

[0078] When the heat dissipation component driving circuit is driven by the heat dissipation component to dissipate heat for the central processing unit according to the current and temperature, the output power can be determined according to the current, temperature and current threshold, and the output power is sent to the heat dissipation component driving circuit. The heat dissipation component driving circuit outputs the output power to the heat dissipation component, and the heat dissipation component operates under the drive of the output power. For example, the central processing unit can determine the output power of the heat dissipation component driving circuit according to the product of temperature and temperature coefficient, the difference between current and current threshold and the product of current coefficient, and control the output power of the heat dissipation component driving circuit to be the output power determined by it. Among them, the current threshold is determined according to the ambient temperature of the system to which it belongs and the maximum temperature of the central processing unit of the system to which it belongs. In addition, the current threshold is the quotient of the power corresponding to the temperature difference between the maximum temperature of the central processing unit and the ambient temperature and the voltage of the system to which it belongs. The above-mentioned processing process is a mature prior art. The improvement of this application lies in the connection relationship between the central processing unit, the temperature detection module and the current detection module, which does not include improvements to the method.

[0079] 4. Heat dissipation component driving circuit

[0080] The heat dissipation component driving circuit is used to output the output power to the heat dissipation component based on the control of the central processing unit. That is, the heat dissipation component driving circuit is used to drive the heat dissipation component.

[0081] For example, the heat dissipation component driving circuit is used to drive the operation of the internal heat dissipation components (such as fans or water pumps) in the heat dissipation component. The central processing unit can control the speed of the internal heat dissipation components (such as fans or water pumps) in the heat dissipation component through the output power of the heat dissipation component driving circuit.

[0082] 5. Heat dissipation components

[0083] The heat dissipation components include internal heat dissipation components and external heat dissipation components, such as Figure 5As shown. The heat dissipation component driving circuit is connected to the internal heat dissipation component and the external heat dissipation component respectively. The internal heat dissipation component is used to dissipate heat from the internal structure of the edge computing device. The external heat dissipation component is located on the pole box outside the edge computing device and dissipates heat from the inside of the pole box of the edge computing device, thereby indirectly improving the air circulation of the edge computing device and removing heat.

[0084] In addition, in the specific implementation, you can also Figure 6 The internal heat dissipation component and the external heat dissipation component are respectively connected to the central processing unit.

[0085] For example, see Figure 7 As shown, the heat dissipation component driving circuit performs unidirectional communication with the internal heat dissipation component and the external heat dissipation component, respectively, and the heat dissipation component driving circuit outputs the output power sent by the central processor to the internal heat dissipation component and / or the external heat dissipation component, and the output power is used to drive the operation of the internal heat dissipation component and / or the external heat dissipation component. The internal heat dissipation component and the external heat dissipation component respectively perform unidirectional communication with the central processor, and the internal heat dissipation component and / or the external heat dissipation component send the status (such as rotation speed) of the internal heat dissipation component and / or the external heat dissipation component to the central processor through signaling, data, indication, message, etc.

[0086] 1) Internal heat dissipation components

[0087] The internal heat dissipation component includes a core heat dissipation component, heat dissipation fins, a first thermal conductive silicone grease layer and a second thermal conductive silicone grease layer. The core heat dissipation component is installed on the outside of the metal shell of the edge computing device; the metal shell of the edge computing device is provided with heat dissipation fins; the first thermal conductive silicone grease layer is used to connect the metal shell of the edge computing device and the PCB circuit board located inside the metal shell of the edge computing device; the second thermal conductive silicone grease layer is used to connect the surface of the central processing unit with the boss, the boss is located on the metal shell of the edge computing device, and the boss is in soft contact with the surface of the central processing unit through the thermal conductive silicone grease.

[0088] In addition, the heat dissipation fin is composed of a plurality of fins.

[0089] Each fin is 2.9cm high and 2mm thick.

[0090] The distance between two adjacent fins is 10 mm.

[0091] The bottom thickness of the heat sink fin is 5 mm, and the bottom area of ​​the heat sink covers the entire top surface length of the edge computing device, for example, the entire top surface length is 22 cm * width 15 cm.

[0092] In addition, the core heat dissipation components include two square fans of the same specifications.

[0093] Both fans are embedded in the heat sink fins, such as two fans installed side by side and embedded in the heat sink fins.

[0094] The power supply voltage of each fan is 12V, the rated power is not less than 2W, the rated speed is not less than 4500RPM (revolutions per minute), and the maximum air volume is not less than 29CFM (cubic feet per minute).

[0095] Each fan is 70mm long, 70mm wide and 15mm thick.

[0096] The internal heat dissipation component used in this embodiment adopts an active heat dissipation method. It includes a core heat dissipation component, which is installed on the outside of the metal shell of the edge computing device. The metal shell is designed with heat dissipation fins. The heat dissipation fins and the metal shell are connected to thermal grease.

[0097] For example, the internal heat dissipation components use active cooling and are composed of fans, which can transmit speed information back to the central processing unit.

[0098] Among them, active heat dissipation can also be composed of water cooling or water cooling and air cooling. The water cooling method is to control a water pump to circulate water for heat dissipation.

[0099] The heat sink fins on the metal shell of the edge computing device and the metal shell are connected to the thermal grease on the PCB (Printed Circuit Board). The metal shell has a corresponding boss extending to the chip surface corresponding to the main heat-generating chip position on the edge computing device circuit board, and the metal boss and the chip surface are softly contacted by the thermal grease.

[0100] The fan is installed outside the metal casing. When the fan is turned on, air flows on the surface of the casing to take away the heat. Heat dissipation fins can be designed on the metal casing to increase the heat dissipation area.

[0101] 2) External heat dissipation components

[0102] External heat dissipation components are located at the vents of the pole box, for example, the vents located at the upper left and right sides of the pole box.

[0103] In specific implementation, the external heat dissipation component is composed of fans installed in the vents on the upper part of the left and right sides of the pole box, which realize the exchange of hot air inside the pole box and cold air outside, play a role in cooling the inside of the pole box, and further enhance the heat dissipation capacity of the system.

[0104] The heat dissipation component is used to control the heat dissipation capacity of the central processing unit under the drive of the output power of the heat dissipation component driving circuit. The effect of the heat dissipation capacity (such as the rotation speed) can be output to the central processing unit to further dissipate the heat of the central processing unit.

[0105] In a specific implementation, the CPU outputs a signal to control the output power of the heat sink drive circuit. The greater the output power of the heat sink drive circuit, the faster the speed of the heat sink fan, and the faster the system dissipates heat. The smaller the output power of the heat sink drive circuit, the slower the speed of the heat sink fan, and the slower the system dissipates heat.

[0106] When the heat dissipation device provided in this embodiment is implemented,

[0107] The current detection module collects the current of the system to which the edge computing device belongs, and transmits the collected current to the central processing unit.

[0108] The temperature detection module collects the temperature of the system to which the edge computing device belongs and transmits the collected temperature to the central processor.

[0109] The CPU dissipates heat based on current and temperature.

[0110] Specifically, the central processing unit determines the output power of the heat dissipation component driving circuit according to the product of the temperature and the temperature coefficient, the difference between the current and the current threshold and the product of the current coefficient. The central processing unit controls the heat dissipation component driving circuit to output the output power to the heat dissipation component, and the heat dissipation component adjusts the heat dissipation capacity (such as the number of fan revolutions) driven by the output power of the heat dissipation component driving circuit, thereby dissipating the heat of the central processing unit. The software control part for determining the output power by the specific temperature, temperature coefficient, current and current threshold can be set according to the prior art, and the improvement of the present application lies in the connection relationship between the modules.

[0111] The heat dissipation device provided in this embodiment can adjust the output power of the heat dissipation component driving circuit according to different heating areas of the system, and further enhance the output power of the heat dissipation component when the maximum operating temperature of the chip in the heating area is low (temperature sensitive area).

[0112] The heat dissipation device provided in this embodiment can realize timely heat dissipation of edge computing equipment to ensure that system heat is discharged in a timely and effective manner.

[0113] The heat dissipation device provided in this embodiment adjusts the heat dissipation by detecting the current size of the system. The temperature rise of the system is caused by the increase of the power of the system (the increase of the system power supply current). When the power of the system increases, it will bring more heat, and this heat will cause the temperature of the system to rise. By detecting the current of the system, the heat can be dissipated in advance, without waiting until the temperature of the system has risen.

[0114] In the heat dissipation device provided in this embodiment, the output power of the heat dissipation component driving circuit is dynamically adjusted according to the temperature and power of the system to which it belongs, so that the temperature change of the system to which it belongs is more stable, the fluctuation of the temperature of the system to which it belongs is reduced, and the central processing unit is prevented from repeatedly adjusting the operating frequency due to repeated temperature changes, thereby affecting the working stability.

[0115] The heat dissipation components (fans) of the heat dissipation device provided in this embodiment are installed on the edge computing device housing and inside the pole box where the edge computing device is placed. The edge computing device can simultaneously control the operation of the heat dissipation components installed on the edge computing device housing and inside the pole box where the edge computing device is placed, thereby further enhancing the heat dissipation effect.

[0116] The output power of the heat dissipation component driving circuit in the heat dissipation device provided in this embodiment can be adjusted according to the temperature of the system to which it belongs. On this basis, it can also be further adjusted according to the current of the system to which it belongs, so that the temperature control of the system to which it belongs is more stable and has the ability to suppress the temperature rise in advance. Since the heat dissipation control can be performed according to the current size of the system to which it belongs, the heat dissipation can be performed in advance when the temperature of the system has not risen but is about to rise. The heat dissipation device of the edge computing device provided in this embodiment can judge the temperature rise of the system in advance according to the increase in the power of the system to which it belongs, and can perform heat dissipation processing in advance to make the heat dissipation more timely. That is, the heat dissipation processing can be performed in advance to make the heat dissipation more timely, and it has the characteristics of early heat dissipation and simple implementation.

[0117] The heat dissipation device provided in this embodiment has a heat-conducting boss design added to the main heat-generating area, which not only dissipates heat for the central processing unit but also allows heat-generating areas such as the power supply to dissipate heat well through the heat-conducting boss.

[0118] The heat dissipation capacity (such as fan speed) of the heat dissipation component of the heat dissipation device provided in this embodiment can be adjusted according to different heating areas of the system to which it belongs, and the output power of the heat dissipation component is further enhanced when the maximum operating temperature of the chip in the heating area is low.

[0119] This embodiment provides a heat dissipation device and an edge computing device. The heat dissipation device is applied to the edge computing device, including: a central processing unit, a temperature detection module, a current detection module, a heat dissipation component driving circuit and a heat dissipation component; the central processing unit is respectively connected to the temperature detection module, the current detection module, and the heat dissipation component driving circuit; the temperature detection module is used to collect the temperature of the edge computing device; the current detection module is used to collect the current of the edge computing device; the heat dissipation component driving circuit is connected to the heat dissipation component; the heat dissipation component includes: an internal heat dissipation component, which is used to dissipate the internal structure of the edge computing device; an external heat dissipation component is located on the holding pole box outside the edge computing device, and dissipates the inside of the holding pole box of the edge computing device; one end of the internal heat dissipation component and the external heat dissipation component are connected to the heat dissipation component driving circuit, and the other end is connected to the central processing unit. The above heat dissipation device dissipates the internal structure of the edge computing device through the internal heat dissipation component, and dissipates the inside of the holding pole box where the edge computing device is located through the external heat dissipation component. By dissipating the heat internally and externally at the same time, the heat dissipation is more timely, the heat dissipation efficiency of the edge computing device is improved, the system temperature of the edge computing device is within a reasonable range, and the system heat of the edge computing device can be effectively discharged, and the working temperature performance of the edge computing device is improved.

[0120] This embodiment provides an edge computing device, which includes: Figures 1 to 7 Any heat sink shown in FIG.

[0121] The implementation scheme of the heat dissipation device is detailed in Figures 1 to 7 The illustrated embodiment will not be described in detail here.

[0122] The present application provides an edge computing device, which includes a heat dissipation device. The central processing unit in the heat dissipation device controls the temperature detection module to collect the temperature of the system to which the edge computing device belongs; controls the current detection module to collect the current of the system to which the edge computing device belongs; controls the heat dissipation component driving circuit according to the current and temperature to drive the heat dissipation component to dissipate the central processing unit, thereby ensuring the timely and effective dissipation of heat, improving the operating temperature performance of the edge computing device, and making the edge computing device run more smoothly.

[0123] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0124] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A heat dissipation device, applied to edge computing equipment; characterized in that: It includes a central processing unit, a temperature detection module, a current detection module, a heat dissipation component driving circuit and a heat dissipation component; The central processing unit is respectively connected to the temperature detection module, the current detection module, and the heat dissipation component driving circuit; The temperature detection module is used to collect the temperature of the edge computing device; The current detection module is used to collect the current of the edge computing device; The heat dissipation component driving circuit is connected to the heat dissipation component; The heat dissipation component comprises: An internal heat dissipation component, used to dissipate heat from an internal structure of the edge computing device; An external heat dissipation component, located on a pole box outside the edge computing device, for dissipating heat inside the pole box of the edge computing device; One end of the internal heat dissipation component and the external heat dissipation component are both connected to the heat dissipation component driving circuit, and the other end thereof are both connected to the central processing unit.

2. The heat dissipation device according to claim 1, characterized in that: The internal heat dissipation component comprises: A core heat dissipation component, wherein the core heat dissipation component is mounted outside the metal housing of the edge computing device; A heat sink fin is provided on the metal housing of the edge computing device; A first thermally conductive silicone grease layer, used to connect a metal housing of the edge computing device and a PCB circuit board located inside the metal housing of the edge computing device; The second thermal grease layer is used to connect the surface of the central processing unit with the boss, and the boss is located on the metal shell of the edge computing device.

3. The heat dissipation device according to claim 1, characterized in that: The temperature detection module includes a temperature sensor located in a heating area of ​​the system to which the edge computing device belongs, and a temperature sensor located inside the central processing unit; The heating area includes a heating device; the temperature sensor of any heating area is no more than 10 mm away from the heating device in the heating area.

4. The heat dissipation device according to claim 1, characterized in that: The central processing unit is connected to the current detection module and the temperature detection module respectively through an integrated circuit bus IIC; The central processing unit is connected to the heat dissipation component driving circuit via a pulse width modulation (PWM) pin.

5. The heat dissipation device according to claim 2, characterized in that: The heat dissipation fins are composed of a plurality of fins; Each fin is 2.9 cm high and 2 mm thick; The distance between two adjacent fins is 10 mm; The bottom thickness of the heat sink fin is 5 mm, and the bottom area of ​​the heat sink fin covers the entire top surface of the edge computing device.

6. The heat dissipation device according to claim 2, characterized in that: The core heat dissipation component includes two square fans of the same specifications; Two fans are embedded in the heat dissipation fins; Each fan is 70mm long, 70mm wide and 15mm thick.

7. The heat dissipation device according to claim 1, characterized in that: The external heat dissipation components are located at the ventilation openings on the upper parts of the left and right sides of the pole box.

8. The heat dissipation device according to claim 1, characterized in that: The edge computing device also includes: a high-precision resistor; The high-precision resistor is connected in series between the power input protection circuit and the power module; One end of the current detection module is connected to the power input protection circuit side of the high-precision resistor, and the other end of the current detection module is connected to the power module side of the high-precision resistor.

9. An edge computing device, characterized in that: The edge computing device comprises the heat dissipation device according to any one of claims 1 to 8.

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