Fixed-length cutting equipment for silicon wafer cutting lining plate

Abstract

The utility model is suitable for the technical field of silicon wafer cutting lining plate cutting, and provides silicon wafer cutting lining plate fixed-length cutting equipment which comprises a workbench and further comprises a plurality of guide sliding grooves formed in one end of the workbench, guide sliding blocks are connected into the guide sliding grooves in a sliding mode, and fixed-length plates are fixed to the upper ends of the guide sliding blocks; a lead screw adjusting assembly is arranged at the lower end of the workbench and used for adjusting the positions of the guide sliding blocks on the guide sliding grooves. A cutting groove is formed in the position, close to the middle, of the workbench, a movable frame is arranged in the cutting groove, and a blade is rotationally connected to the movable frame. The right end of the silicon wafer cutting lining plate abuts against the left side of the fixed-length plate, the fixed-length plate limits movement of the silicon wafer cutting lining plate, and therefore supply of the silicon wafer cutting lining plate is completed, the conveying length of the silicon wafer cutting lining plate each time is fixed, fixed-length supply of the silicon wafer cutting lining plate is achieved, and the first motor drives the blade to rotate.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer cutting lining plate cutting, in particular to a silicon wafer cutting lining plate fixed-length cutting device. Background Art

[0002] Cutting liner is the product name of a liner used for silicon wafer cutting. Silicon wafer cutting liner is produced by profile extrusion technology.

[0003] After the silicon wafer cutting liner is extruded and solidified, it needs to be cut according to the use requirements. When cutting the existing silicon wafer cutting liner, the silicon wafer cutting liner is generally measured and marked with a ruler, and then a cutting device is used to cut the marked part of the silicon wafer cutting liner.

[0004] The existing cutting method of the silicon wafer cutting liner is relatively complicated. The silicon wafer cutting liner needs to be measured and marked in advance before cutting. When cutting the silicon wafer cutting liner, it is necessary to cut along the markings of the silicon wafer cutting liner. The cutting accuracy is high and it is inconvenient to cut the silicon wafer cutting liner. Utility Model Content

[0005] The purpose of the embodiment of the utility model is to provide a silicon wafer cutting liner fixed-length cutting device, aiming to solve the problem that the cutting method of the existing silicon wafer cutting liner is relatively complicated.

[0006] The utility model is implemented as follows: a silicon wafer cutting liner fixed-length cutting device comprises a workbench, and also comprises: a plurality of guide slots arranged at one end of the workbench, a plurality of guide slots are slidably connected with guide sliders, a fixed-length plate is fixed at the upper end of the guide slider; a screw adjustment assembly is arranged at the lower end of the workbench, and the screw adjustment assembly is used to adjust the position of the guide slider on the guide slot; a cutting slot is arranged near the middle of the workbench, a movable frame is arranged in the cutting slot, a blade is rotatably connected to the movable frame, the blade is arranged in the cutting slot, a first motor is fixed on the movable frame, and the rotating end of the first motor is connected to the blade; a linear moving assembly is arranged at the lower end of the workbench, and the linear moving assembly is used to drive the movable frame to move linearly in the cutting slot.

[0007] According to a further technical solution, the screw adjustment assembly includes a first screw rotatably connected to the lower end of the workbench, the first screw is threadedly connected to one of the guide sliders, and a handwheel is fixed to one end of the first screw.

[0008] A further technical solution is that the linear moving assembly includes a fixed plate fixed at the lower end of the workbench, a guide shaft and a second motor are fixed on the fixed plate, a second screw rod is rotatably connected to the fixed plate, the rotating end of the second motor is connected to the second screw rod, the moving frame is slidably connected to the guide shaft, and the second screw rod passes through the moving frame and is threadedly connected to the moving frame.

[0009] According to a further technical solution, a fixing component is provided on the upper end of the workbench near the other end, and the fixing component is used to limit the movement of the silicon wafer cutting liner.

[0010] A further technical solution is that the fixed assembly includes two fixed vertical shafts fixed to the upper end of the workbench, a top plate is fixed to the upper end of the fixed vertical shaft, a telescopic cylinder is fixed to the upper end of the top plate, a pressing plate is slidably connected to the fixed vertical shaft, and the telescopic end of the telescopic cylinder penetrates downward through the top plate and is connected to the pressing plate.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] The utility model provides a silicon wafer cutting liner fixed-length cutting device, wherein the right end of the silicon wafer cutting liner is against the left side of the fixed-length plate, and the fixed-length plate limits the movement of the silicon wafer cutting liner, thereby completing the supply of the silicon wafer cutting liner, and further making the conveying length of the silicon wafer cutting liner fixed each time, thereby realizing the fixed-length supply of the silicon wafer cutting liner, the first motor drives the blade to rotate, the linear moving component drives the moving frame to move linearly in the cutting groove, and the moving frame drives the blade to cut the silicon wafer cutting liner, thereby completing the fixed-length cutting of the silicon wafer cutting liner; the position of the guide slider on the guide slide groove can be adjusted by the screw rod adjustment component, thereby adjusting the position of the fixed-length plate, and adjusting the cutting length of the silicon wafer cutting liner, thereby being able to cut silicon wafer cutting liners of different lengths. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic diagram of the structure of a silicon wafer cutting liner fixed-length cutting device provided by the utility model;

[0014] Figure 2 The utility model provides Figure 1 Schematic diagram of the structure when looking up at the tilt angle;

[0015] Figure 3 The utility model provides Figure 2 Schematic diagram of the enlarged structure of A.

[0016] In the attached drawings: workbench-1, guide slide-2, fixed-length plate-3, guide slide block-4, first screw rod-5, hand wheel-6, cutting groove-7, blade-8, fixed plate-9, guide shaft-10, second screw rod-11, movable frame-12, first motor-13, second motor-14, fixed vertical shaft-15, top plate-16, telescopic cylinder-17, pressing plate-18. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0018] The specific implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0019] like Figure 1-Figure 3 As shown, a silicon wafer cutting liner fixed-length cutting device provided by an embodiment of the utility model includes a workbench 1, and also includes: a plurality of guide slots 2 arranged at one end of the workbench 1, a guide slider 4 is slidably connected in the plurality of guide slots 2, and a fixed-length plate 3 is fixed to the upper end of the guide slider 4; a screw adjustment assembly is arranged at the lower end of the workbench 1, and the screw adjustment assembly is used to adjust the position of the guide slider 4 on the guide slot 2; a cutting slot 7 is arranged near the middle of the workbench 1, a moving frame 12 is arranged in the cutting slot 7, a blade 8 is rotatably connected to the moving frame 12, the blade 8 is arranged in the cutting slot 7, a first motor 13 is fixed on the moving frame 12, and the rotating end of the first motor 13 is connected to the blade 8; a linear moving assembly is arranged at the lower end of the workbench 1, and the linear moving assembly is used to drive the moving frame 12 to move linearly in the cutting slot 7.

[0020] In the embodiment of the utility model, when in use, the silicon wafer cutting lining is supplied from the left end of the workbench 1. The silicon wafer cutting lining can be supplied manually or by a conveying device, without limitation, until the right end of the silicon wafer cutting lining is against the left side of the fixed-length plate 3. The fixed-length plate 3 limits the movement of the silicon wafer cutting lining, thereby completing the supply of the silicon wafer cutting lining, and then making the conveying length of the silicon wafer cutting lining fixed each time, thereby realizing the fixed-length supply of the silicon wafer cutting lining, the first motor 13 drives the blade 8 to rotate, the linear moving component drives the moving frame 12 to move linearly in the cutting groove 7, and the moving frame 12 drives the blade 8 to cut the silicon wafer cutting lining, thereby completing the fixed-length cutting of the silicon wafer cutting lining; the position of the guide slider 4 on the guide slide groove 2 can be adjusted by the screw adjustment component, thereby adjusting the position of the fixed-length plate 3, and adjusting the cutting length of the silicon wafer cutting lining, thereby being able to cut silicon wafer cutting liners of different lengths.

[0021] like Figure 1 and Figure 2 As shown, as a preferred embodiment of the utility model, the screw adjustment assembly includes a first screw 5 rotatably connected to the lower end of the workbench 1, the first screw 5 is threadedly connected to one of the guide sliders 4, and a handwheel 6 is fixed to one end of the first screw 5.

[0022] In the embodiment of the utility model, the hand wheel 6 is rotated, the hand wheel 6 drives the first screw rod 5 to rotate, the rotating first screw rod 5 drives the guide slider 4 to move through thread transmission, and the guide slider 4 drives the fixed-length plate 3 to move.

[0023] like Figure 1-Figure 3 As shown, as a preferred embodiment of the utility model, the linear moving assembly includes a fixed plate 9 fixed at the lower end of the workbench 1, a guide shaft 10 and a second motor 14 are fixed on the fixed plate 9, a second screw rod 11 is rotatably connected to the fixed plate 9, the rotating end of the second motor 14 is connected to the second screw rod 11, the moving frame 12 is slidably connected to the guide shaft 10, and the second screw rod 11 passes through the moving frame 12 and is threadedly connected to the moving frame 12.

[0024] In the embodiment of the utility model, the second motor 14 drives the second screw rod 11 to rotate, and the rotating second screw rod 11 drives the moving frame 12 to move through thread transmission.

[0025] like Figure 1 and Figure 2 As shown, as a preferred embodiment of the utility model, a fixing component is provided on the upper end of the workbench 1 near the other end, and the fixing component is used to limit the movement of the silicon wafer cutting liner. The fixing component includes two fixed vertical shafts 15 fixed on the upper end of the workbench 1, and a top plate 16 is fixed to the upper end of the fixed vertical shafts 15. A telescopic cylinder 17 is fixed to the upper end of the top plate 16. A pressing plate 18 is slidably connected to the fixed vertical shaft 15, and the telescopic end of the telescopic cylinder 17 penetrates downward through the top plate 16 and is connected to the pressing plate 18.

[0026] In the embodiment of the utility model, the telescopic cylinder 17 is extended, and under the guidance of the fixed vertical shaft 15, the telescopic cylinder 17 drives the pressing plate 18 to move downward, and the pressing plate 18 presses and fixes the silicon wafer cutting liner on the workbench 1.

[0027] The above embodiment of the utility model provides a silicon wafer cutting liner fixed-length cutting equipment. When in use, the silicon wafer cutting liner is supplied from the left end of the workbench 1. The silicon wafer cutting liner can be supplied manually or by a conveying device, without limitation, until the right end of the silicon wafer cutting liner abuts against the left side of the fixed-length plate 3, and the fixed-length plate 3 limits the movement of the silicon wafer cutting liner, thereby completing the supply of the silicon wafer cutting liner, and then making the conveying length of the silicon wafer cutting liner fixed each time, thereby realizing the fixed-length supply of the silicon wafer cutting liner, the first motor 13 drives the blade 8 to rotate, and the second motor 14 drives the second screw rod 11 to rotate The rotating second screw rod 11 drives the moving frame 12 to move through the thread transmission, the moving frame 12 moves linearly in the cutting groove 7, and the moving frame 12 drives the blade 8 to cut the silicon wafer cutting liner, thereby completing the fixed-length cutting of the silicon wafer cutting liner; the hand wheel 6 can be rotated, the hand wheel 6 drives the first screw rod 5 to rotate, the rotating first screw rod 5 drives the guide slider 4 to move through the thread transmission, the guide slider 4 drives the fixed-length plate 3 to move, adjust the position of the guide slider 4 on the guide slide groove 2, and then adjust the position of the fixed-length plate 3, adjust the cutting length of the silicon wafer cutting liner, and then cut silicon wafer cutting liners of different lengths.

[0028] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A silicon wafer cutting liner fixed length cutting device, comprising a workbench, characterized in that: Also includes: A plurality of guide slots are arranged at one end of the workbench, wherein a guide slider is slidably connected in each of the plurality of guide slots, and a fixed-length plate is fixed on the upper end of the guide slider; A screw adjustment assembly is provided at the lower end of the workbench, and the screw adjustment assembly is used to adjust the position of the guide slider on the guide slot; A cutting groove is provided near the middle of the workbench, a moving frame is provided in the cutting groove, a blade is rotatably connected to the moving frame, the blade is provided in the cutting groove, a first motor is fixed on the moving frame, and a rotating end of the first motor is connected to the blade; A linear moving component is arranged at the lower end of the workbench, and the linear moving component is used to drive the moving frame to move linearly in the cutting groove.

2. The silicon wafer cutting liner fixed-length cutting equipment according to claim 1, characterized in that: The screw rod adjustment assembly includes a first screw rod rotatably connected to the lower end of the workbench, the first screw rod is threadedly connected to one of the guide sliders, and a hand wheel is fixed to one end of the first screw rod.

3. The silicon wafer cutting liner fixed-length cutting equipment according to claim 1, characterized in that: The linear motion assembly includes a fixed plate fixed at the lower end of the workbench, a guide shaft and a second motor are fixed on the fixed plate, a second screw rod is rotatably connected to the fixed plate, the rotating end of the second motor is connected to the second screw rod, the moving frame is slidably connected to the guide shaft, and the second screw rod passes through the moving frame and is threadedly connected to the moving frame.

4. The silicon wafer cutting liner fixed length cutting equipment according to claim 1, characterized in that: A fixing component is arranged on the upper end of the workbench near the other end, and the fixing component is used to limit the movement of the silicon wafer cutting liner.

5. The silicon wafer cutting liner fixed-length cutting equipment according to claim 4, characterized in that: The fixing assembly includes two fixed vertical shafts fixed on the upper end of the workbench, a top plate fixed on the upper end of the fixed vertical shaft, a telescopic cylinder fixed on the upper end of the top plate, a pressing plate slidably connected on the fixed vertical shaft, and the telescopic end of the telescopic cylinder penetrates downward through the top plate and is connected to the pressing plate.

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