Wire cutting equipment

Abstract

The utility model relates to the technical field of semiconductors, in particular to wire cutting equipment. The wire cutting equipment comprises a driving mechanism, a cutting wire, a spray head and a magnetic attraction mechanism, the cutting wire is arranged on the driving mechanism, and the driving mechanism drives the cutting wire to move in the length extension direction of the cutting wire; a liquid outlet of the spray head is opposite to the cutting line, and the spray head is used for spraying working liquid to the cutting line; the magnetic attraction mechanism is arranged close to at least one of the spray head and the cutting line and used for attracting magnetic chippings generated when the cutting line cuts the crystal ingot and damping the cutting line. According to the line cutting equipment, the problem of unstable cutting of the crystal ingot caused by vibration of the cutting line can be solved, chippings generated when the crystal ingot is cut by the cutting line can be adsorbed, accumulation of the chippings in working liquid such as mortar can be reduced, the yield of finished products of wafers produced by cutting can be improved, and the service life of the working liquid can be prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wire cutting device. Background Art

[0002] Wire sawing is the main process for cutting ingots into wafer substrates in the semiconductor field. Wire sawing usually uses a flexible wire (such as steel wire) to carry abrasive grains to make reciprocating motion on the ingot, so as to continuously remove materials through the cutting and grinding action of the abrasive grains, and finally cut the ingot into wafer substrates in the form of sheets.

[0003] In the wire cutting equipment provided by the related technology, the wire is wound on a wire wheel with slots at a fixed distance. Driven by the wire wheel, the wire reciprocates with the ingot, and the abrasive carried by the wire is used for cutting, and finally cut into a wafer substrate. According to the abrasive carrying method, the wire cutting process can be divided into: fixed abrasive wire cutting and free abrasive wire cutting; fixed abrasive wire cutting uses bonding, coating, electroplating and other processes to fix the abrasive on the wire, so as to use the wire with fixed abrasive to cut the ingot, and abrasive-free coolant is used for cooling during the cutting process; free abrasive wire cutting uses ordinary wire (for example: steel wire) without fixed abrasive, and adopts the method of spraying slurry formed by mixing abrasive and liquid oil onto the wire, so that the wire carries abrasive to cut the ingot.

[0004] However, since the wire of the wire cutting equipment provided by the relevant technology is flexible, the wire will inevitably vibrate during wire cutting. The processing quality of the wire cutting process is easily affected by the above factors, resulting in unstable process performance, and easily resulting in uneven thickness of the cut wafers, obvious wire cutting marks on the wafer surface, or the curvature and warping of the cut wafers not meeting the standards. Moreover, in the process of cutting the crystal ingot, the wire itself will produce debris due to wear, and the debris will fall into the carrier liquid (mortar). It will continue to accumulate as the cutting continues, resulting in the deterioration of the mortar cutting ability, reduced stability, increased wire breakage rate, reduced processing yield, and shortened mortar life. Utility Model Content

[0005] The purpose of the utility model is to provide a wire cutting device, which can improve the problem of unstable cutting of the crystal ingot caused by the vibration of the cutting wire, and can also absorb the debris generated when the crystal ingot is cut with the cutting wire to reduce the accumulation of debris in the working fluid such as mortar, which is beneficial to improve the finished product qualification rate of the wafers produced by cutting, and can extend the service life of the working fluid.

[0006] The embodiment of the utility model is achieved as follows:

[0007] The utility model provides a wire cutting device, comprising:

[0008] Driving mechanism;

[0009] A cutting line, which is arranged on a driving mechanism and driven by the driving mechanism to move along a length extension direction of the cutting line;

[0010] A nozzle, wherein the liquid outlet of the nozzle is arranged relative to the cutting line, and the nozzle is used to spray the working liquid onto the cutting line; and,

[0011] The magnetic attraction mechanism is disposed adjacent to at least one of the nozzle and the cutting line, and is used for absorbing magnetic debris generated by the cutting line when cutting the crystal ingot and for reducing vibration of the cutting line.

[0012] In an optional embodiment, the driving mechanism includes two wire wheels, the two wire wheels are spaced apart, and the cutting wire is sleeved on the two wire wheels;

[0013] The wire cutting device includes two nozzles, which are arranged between two wire wheels and are spaced apart to form a cutting space for accommodating a crystal ingot to be cut;

[0014] The wire cutting device also includes two magnetic suction mechanisms, and the two magnetic suction mechanisms are arranged in one-to-one correspondence with the two nozzles.

[0015] In an optional embodiment, the magnetic attraction mechanism includes a plurality of magnets, and the plurality of magnets are distributed in an array.

[0016] In an alternative embodiment, the plurality of magnets are distributed in a Halbach array.

[0017] In an alternative embodiment, the plurality of magnets are arranged in a linear Halbach array.

[0018] In an optional embodiment, the plurality of magnets are arranged in a straight line along the length extension direction of any one of the magnets, the cutting line is distributed on one side of the plurality of magnets distributed in a linear Halbach array, and the cutting line is distributed parallel to the width extension direction of any one of the magnets.

[0019] In an alternative embodiment, the magnet is a permanent magnet or an electromagnet.

[0020] In an optional embodiment, the magnetic attraction mechanism is disposed adjacent to the liquid outlet.

[0021] In an optional embodiment, the nozzle is further provided with a liquid inlet, which is distributed relative to the magnetic attraction mechanism so that the working fluid entering the nozzle from the liquid inlet flows through the magnetic attraction mechanism and then flows from the liquid outlet to the cutting line.

[0022] In an optional embodiment, the nozzle is provided with a mounting groove, and the magnetic attraction mechanism is arranged in the mounting groove; and / or,

[0023] The magnetic attraction mechanism has a first side and a second side that are arranged opposite to each other, the first side is opposite to the cutting line and is arranged at intervals, the second side is opposite to the liquid inlet and is arranged at intervals, and the magnetic field strength of the first side is greater than the magnetic field strength of the second side.

[0024] The beneficial effects of the wire cutting equipment of the embodiment of the utility model include: the wire cutting equipment provided by the embodiment of the utility model is provided with a magnetic attraction mechanism at a position adjacent to the nozzle and the cutting line, and the magnetic attraction mechanism can be used to provide a magnetic field at the position of the nozzle and the cutting line, so that the cutting line vibrating in the magnetic field is suppressed by the induced eddy current in the magnetic field, thereby achieving the effect of damping and shock absorption, thereby improving the problem of poor stability of the wire cutting process caused by the vibration of the cutting line, and improving the uniformity of cutting, which is beneficial to improving the quality of the wafer obtained by cutting, that is, reducing the wire cutting marks on the wafer surface, and ensuring that the curvature and warping of the wafer meet the standards.

[0025] Moreover, a magnetic suction mechanism is arranged near the nozzle, which can also absorb the debris generated during wire cutting, so as to improve the problem of debris accumulation in the working fluid, improve the problems of working fluid deterioration, reduced stability and increased wire breakage rate, so as to further ensure the improvement of wafer cutting yield and help to extend the service life of the working fluid. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 It is a partial structural schematic diagram of the wire cutting device in the embodiment of the utility model;

[0028] Figure 2 This is a schematic diagram of the structure of the cutting wire and the magnetic attraction mechanism in the embodiment of the utility model;

[0029] Figure 3 It is a schematic diagram of the magnetic attraction mechanism, magnetic force line distribution and cutting line in the embodiment of the utility model.

[0030] Icons: 010-wire cutting equipment; 100-driving mechanism; 110-wire wheel; 200-cutting wire; 300-nozzle; 310-liquid outlet; 320-liquid inlet; 331-first channel; 332-second channel; 333-third channel; 400-magnetic attraction mechanism; 401-first side; 402-second side; 403-third side; 404-fourth side; 410-magnet; 500-ingot. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In the description of the present utility model, it should be noted that the terms "upper", "lower", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0035] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "setting" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] Please refer to Figure 1 , this embodiment provides a wire cutting device 010, which can be used to cut the ingot 500 to form wafers.

[0037] The wire cutting device 010 includes a frame (not shown), a driving mechanism 100, a cutting line 200 and a nozzle 300. The driving mechanism 100 and the nozzle 300 are both assembled on the frame. The cutting line 200 is arranged on the driving mechanism 100, and the driving mechanism 100 drives the cutting line 200 to move along the length extension direction thereof; the liquid outlet 310 of the nozzle 300 is distributed relative to the cutting line 200, and the nozzle 300 is used to spray the working fluid on the cutting line 200.

[0038] The driving mechanism 100 drives the cutting line 200 to move along its length extension direction, so as to cut the ingot 500 to obtain a wafer. The working fluid sprayed by the nozzle 300 on the cutting line 200 can be a slurry containing abrasives or a coolant, which is not specifically limited here.

[0039] It should be noted that the cutting wire 200 includes but is not limited to a steel wire; of course, it can also be other metal wires, or nylon wires, etc., which are not specifically limited here.

[0040] Optionally, the driving mechanism 100 includes two wire wheels 110, which are rotatably mounted on the frame and are spaced apart; the cutting wire 200 is sleeved on the two wire wheels 110 and driven to move by the two wire wheels 110, and the wire wheels 110 also have the function of guiding the cutting wire 200 and controlling the spacing of the cutting wire 200. In this arrangement, the two wire wheels 110 can be used to drive the cutting wire 200 to move along the direction in which its length extends.

[0041] Furthermore, the wire cutting device 010 also includes a motor (not shown), which is mounted on the frame and is in transmission connection with the wire wheel 110, so that the motor drives the wire wheel 110 to rotate, thereby driving the cutting wire 200 to move.

[0042] Furthermore, the wire cutting device 010 includes two motors, both of which are mounted on a frame and are transmission-connected to the two wire wheels 110 in a one-to-one correspondence.

[0043] Of course, in other embodiments, the wire cutting device 010 includes a motor and a gear transmission assembly, the two wire wheels 110 are connected to each other through the gear transmission assembly, and the motor is connected to one of the wire wheels 110 or the gear transmission assembly, so that the driving of the two wire wheels 110 can be achieved by one motor.

[0044] It should be noted that, in the present embodiment, any one of the wire wheels 110 is configured to rotate alternately in two opposite directions, that is, the two wire wheels 110 rotate simultaneously in the first direction for a first preset time, so that the cutting line 200 moves in the third direction, and then the rotation direction of the two wire wheels 110 is switched, so that the two wire wheels 110 rotate simultaneously in the second direction opposite to the first direction for a second preset time, so that the cutting line 200 moves in the fourth direction opposite to the third direction, and the two wire wheels 110 rotate alternately in this way, so as to drive the cutting line 200 to reciprocate along the length extension direction thereof, so as to facilitate more reliable wire cutting. Among them, one of the first direction and the second direction can be a clockwise direction, and the other can be a counterclockwise direction.

[0045] Of course, in other embodiments, the two wire wheels 110 may be configured to rotate in one direction all the time, for example, the two wire wheels 110 rotate in the first direction all the time, so that the cutting wire 200 moves in only one direction.

[0046] Please continue to refer to Figure 1 In this embodiment, the wire cutting device 010 includes two nozzles 300, and the two nozzles 300 are arranged between the two wire wheels 110, and the two nozzles 300 are distributed at intervals to form a cutting space for accommodating the crystal ingot 500 to be cut, that is, the crystal ingot 500 to be cut can be placed between the two nozzles 300 and cut by the cutting wire 200; in this way, when the wire cutting device 010 is used to cut the crystal ingot 500, nozzles 300 are set at the wire inlet and the wire outlet of the crystal ingot 500 to spray the cutting wire 200, so as to ensure better cutting effect and cutting stability.

[0047] In order to improve the qualified rate of finished wafers cut from the ingot 500, the wire cutting device 010 also includes a magnetic suction mechanism 400, which is arranged adjacent to the nozzle 300 and the cutting line 200. The magnetic suction mechanism 400 is used to absorb the magnetic debris generated by the cutting line 200 when cutting the ingot 500 and to reduce the vibration of the cutting line 200. With such an arrangement, the magnetic suction mechanism 400 can be used to provide a magnetic field at the position of the nozzle 300 and the cutting line 200, so that the cutting line 200 vibrating in the magnetic field is suppressed by the induced eddy current in the magnetic field, thereby achieving the effect of damping and shock reduction, thereby improving the problem of poor stability of the wire cutting process caused by the vibration of the cutting line 200, and improving the uniformity of cutting, which is conducive to improving the quality of the wafer obtained by cutting, that is, reducing the wire cutting marks on the surface of the wafer, and ensuring the compliance rate of the curvature and warpage of the wafer. Moreover, a magnetic suction mechanism 400 is arranged adjacent to the nozzle 300, which can also absorb the debris generated during wire cutting, so as to improve the problem of debris accumulation in the working fluid, improve the problems of working fluid deterioration, reduced stability, and increased wire breakage rate, so as to further ensure the improvement of the wafer cutting yield and help to extend the service life of the working fluid.

[0048] In other words, the wire cutting device 010 of this embodiment combines the functions of magnetic field damping and separation of (magnetic) ferromagnetic particles (or debris) by setting a magnetic attraction mechanism 400 near the nozzle 300 and the cutting wire 200, greatly improving the stability of the wire cutting process, extending the service life of the working fluid, and effectively improving the yield rate of the cut wafers. Moreover, only the setting of the magnetic attraction mechanism 400 is added, which is easy to modify the wire cutting device 010, simple in structure, and can ensure the controllability of costs.

[0049] It should be noted that the magnetic attraction mechanism 400 is arranged adjacent to the nozzle 300 and the cutting line 200, which means that the magnetic attraction mechanism 400 can simultaneously absorb the (magnetic) ferromagnetic particles in the nozzle 300, the (magnetic) ferromagnetic particles sprayed from the nozzle 300, and the (magnetic) ferromagnetic particles sprayed onto the cutting line 200.

[0050] Of course, in other embodiments, the magnetic attraction mechanism 400 may be disposed adjacent to one of the nozzle 300 and the cutting line 200 .

[0051] It should be noted that the magnetic debris generated by the cutting wire 200 cutting the ingot 500 may be debris generated by the wear of the cutting wire 200 or debris in the working fluid, etc., which is not specifically limited here.

[0052] Furthermore, the wire cutting device 010 includes two magnetic suction mechanisms 400, and the two magnetic suction mechanisms 400 are arranged in a one-to-one correspondence with the two nozzles 300. In this way, the cutting wire 200 located at the wire inlet and the wire outlet of the crystal ingot 500 can be located in the magnetic field, so as to make full use of the magnetic field to make the moving cutting wire 200 generate induced eddy currents and suppress its own vibration, thereby effectively achieving the effect of damping and vibration reduction. Moreover, the magnetic suction mechanisms 400 are arranged at the wire inlet and the wire outlet of the crystal ingot 500, which can fully absorb the debris generated by the cutting, which is conducive to effectively extending the service life of the working fluid and ensuring the yield rate of the cutting.

[0053] Optionally, the magnetic attraction mechanism 400 is connected to the frame or the nozzle 300, and the connection methods include but are not limited to clamping, bonding, and connection with fasteners such as bolts.

[0054] The damping and vibration reduction effect of the magnetic field and the adsorption and separation effect on magnetic particles are positively correlated with the magnetic field strength and gradient. Improving the magnetic field strength and gradient can achieve better vibration reduction and separation performance. Generally speaking, the purpose of enhancing the magnetic field can be achieved by increasing the size of the magnet 410 in the magnetic mechanism, but the space size of the wire cutting device 010 is limited, and the size of the ingot 500 can also be considered, and the magnet 410 cannot interfere with the movement of the cutting wire 200. Please refer to Figure 2In a preferred embodiment, the magnetic attraction mechanism 400 is configured as a plurality of magnets 410 distributed in an array to provide a stronger magnetic field and meet the space requirements of the device, etc.

[0055] Of course, in other implementations, the magnetic attraction mechanism 400 may also be configured with only one magnet 410, which is not specifically limited here.

[0056] Furthermore, the plurality of magnets 410 are arranged in a Halbach array. As a high-efficiency magnet, the Halbach array can generate a high-intensity, high-gradient magnetic field to improve the utilization efficiency of the magnetic field and magnetic field energy, that is, the Halbach array has a stronger magnetic induction intensity and a stronger magnetic particle adsorption force. Moreover, the plurality of magnets 410 are arranged in a Halbach array, and have a "single-sided magnetic field" characteristic, that is, the magnetic field energy is concentrated and emitted from one side, the magnetic field intensity is high, the gradient is high, and it has a stronger magnetic damping effect, and at the same time has a stronger adsorption effect on large particles. Although the magnetic field intensity on the opposite side (i.e., the second side 402) is small, the gradient is high, and small particles can be adsorbed to achieve a better debris separation effect.

[0057] Furthermore, the plurality of magnets 410 are distributed in a linear Halbach array. The linear Halbach array has two sides with significantly different magnetic field strengths, so as to effectively reduce vibration and adsorb the side with a stronger magnetic field.

[0058] Of course, in other embodiments, other configurations of Halbach arrays or other array forms may also be used, which are not specifically limited here.

[0059] Optionally, the plurality of magnets 410 are arranged in a straight line along the length extension direction of any magnet 410, the cutting line 200 is distributed on one side of the plurality of magnets 410 distributed in a linear Halbach array, and the cutting line 200 is distributed parallel to the width extension direction of any magnet 410. For details, please refer to Figure 3 The multiple magnets 410 are arranged in a straight line along the X-axis, and the length of any magnet 410 extends along the X-axis. Along the arrangement direction of the multiple magnets 410, the magnetization directions of the magnets 410 are sequentially arranged according to Figure 2 Rotate 90° clockwise, that is Figure 3 The arrow on each magnet 410 points to the N pole, the tail of the arrow points to the S pole, and the N poles of two adjacent magnets 410 are rotated 90° clockwise; Figure 3 The direction of the Z axis is the height direction of each magnet 410 , the direction of the Y axis is the width direction of each magnet 410 , and the X axis, Y axis and Z axis are perpendicular to each other.

[0060] The magnetic field gradient of the linear Halbach array magnet 410 is larger in the Z-axis direction and the X-axis direction. Setting the cutting line 200 parallel to the width direction of the magnet 410 (i.e., the Y-axis direction) can better suppress the main vibration direction of the cutting line 200 (i.e., the Z-axis direction and the X-axis direction) during wire cutting.

[0061] Please refer to Figure 1 and Figure 3 In order to improve the wire cutting efficiency of the wire cutting device 010, the wire cutting device 010 can be equipped with multiple cutting wires 200 and multiple driving mechanisms 100, and the multiple cutting wires 200 and the multiple driving mechanisms 100 are arranged one by one, so that the ingot 500 can be cut in multiple sections. Among them, the multiple cutting wires 200 are arranged in parallel in sequence, and the multiple cutting wires 200 are arranged in sequence along the Halbach array arrangement direction of the multiple magnets 410 (i.e., the X-axis direction); such an arrangement can effectively achieve the shock absorption effect of the multiple cutting wires 200 and the corresponding adsorption effect.

[0062] Optionally, the wire cutting device 010 includes a plurality of nozzles 300 , two nozzles 300 are provided corresponding to each cutting line 200 , and a cutting space is formed between the two nozzles 300 corresponding to each cutting line 200 .

[0063] Of course, in other embodiments, the wire cutting device 010 includes only two nozzles 300, and each nozzle 300 has multiple liquid outlets 310; the two nozzles 300 are arranged at intervals at both ends of the cutting line 200 along the length extension direction of the cutting line 200, and the multiple liquid outlets 310 of any nozzle 300 are distributed one-to-one with the multiple cutting lines 200.

[0064] Optionally, the magnet 410 is a permanent magnet or an electromagnet, which is not specifically limited here.

[0065] Please refer to Figure 3 In this embodiment, the magnetic suction mechanism 400 is arranged adjacent to the liquid outlet 310 of the nozzle 300; in this way, the magnetic suction mechanism 400 can be effectively utilized to absorb and remove debris in the working liquid sprayed from the nozzle 300, thereby ensuring the stability of wire cutting, which is beneficial to improving the yield rate of wire cutting.

[0066] Furthermore, the nozzle 300 is also provided with a liquid inlet 320, which is arranged opposite to the magnetic attraction mechanism 400, so that the working fluid entering the nozzle 300 from the liquid inlet 320 flows through the magnetic attraction mechanism 400 and then flows from the liquid outlet 310 to the cutting line 200. In this way, when the working fluid enters the nozzle 300, it can immediately start to absorb and remove debris, so as to ensure the reliability of debris removal.

[0067] Furthermore, the liquid outlet 310 is distributed on the side of the magnetic suction mechanism 400, and the liquid outlet 310 and the liquid inlet 320 are staggered in the horizontal direction, the liquid inlet 320 is located above the liquid outlet 310, and the nozzle 300 has a flow channel connecting the liquid inlet 320 and the liquid outlet 310, and the flow channel is curved; specifically, the flow channel includes a first channel 331, a second channel 332 and a third channel 333 connected in sequence at an angle, the end of the first channel 331 away from the second channel 332 is connected to the liquid inlet 320, and the end of the third channel 333 away from the second channel 332 is connected to the liquid outlet 310; one side of the magnetic suction mechanism 400 is distributed at the position where the first channel 331 and the second channel 332 are connected, and the other side of the magnetic suction mechanism 400 is distributed on one side of the third channel 333. After the working fluid enters the flow channel from the liquid inlet 320, it flows along the first channel 331 to the second channel 332, and flows through the magnetic suction mechanism 400 in the process of flowing to the second channel 332, so that the debris in the working fluid can be reliably adsorbed by the magnetic suction mechanism 400, and when the working fluid flows in the flow channel of the nozzle 300, the flow direction will turn, and the flow rate can be reduced, so as to improve the adsorption effect of the magnetic suction mechanism 400 on the debris in the working fluid.

[0068] The angle between the first channel 331 and the second channel 332 , and the angle between the second channel 332 and the third channel 333 are selected as needed, for example, 90°, 95°, 86°, which are not specifically limited here.

[0069] Optionally, the nozzle 300 is provided with an installation groove, and the magnetic attraction mechanism 400 is arranged in the installation groove. Such an arrangement can ensure the assembly stability of the magnetic attraction mechanism 400 on the one hand, and the vibration reduction and impurity removal reliability of the magnetic attraction mechanism 400 on the other hand, thereby ensuring the cutting yield.

[0070] Optionally, the magnetic attraction mechanism 400 has a first side 401 and a second side 402 that are oppositely distributed, the first side 401 is opposite to the cutting line 200 and is spaced apart, the second side 402 is opposite to the liquid inlet 320 and is spaced apart, and the magnetic field strength of the first side 401 is greater than that of the second side 402, that is, relative to the second side 402, the first side 401 is a reinforced surface. In this way, the side with a stronger magnetic field is opposite to the cutting line 200, which can effectively achieve the shock absorption effect of the cutting line 200 and effectively reduce the debris in the working fluid attached to the cutting wound, fully ensure the cutting quality, and improve the yield rate; moreover, the side with a smaller magnetic field can first absorb the small debris in the working fluid entering the nozzle 300 from the liquid inlet 320, and then use the side with a larger magnetic field to absorb the large debris in the working fluid output from the liquid outlet 310. Compared with the conventional array, the first side 401 and the second side 402 have a larger magnetic field gradient, which fully ensures the debris removal effect.

[0071] It should be noted that the magnetic attraction mechanism 400 also includes a third side 403 and a fourth side 404 connected between the first side 401 and the second side 402 , and the third side 403 is opposite to the fourth side 404 and is spaced apart; the third side 403 is adjacent to the third channel 333 and the liquid outlet 310 .

[0072] It is also necessary to note that please refer to Figure 2 , wherein the plurality of cutting lines 200 are arranged in sequence on the side of the magnetic attraction mechanism 400 where the magnetic field is larger.

[0073] In summary, when the wire cutting device 010 of the utility model is used to cut the crystal ingot 500, the magnetic suction mechanism 400 can be used to provide a magnetic field at the position of the nozzle 300 and the cutting wire 200, so that the cutting wire 200 vibrating in the magnetic field is suppressed by the induced eddy current in the magnetic field, thereby achieving the effect of damping and shock absorption, thereby improving the problem of poor stability of the wire cutting process caused by the vibration of the cutting wire 200, and improving the uniformity of cutting, which is conducive to improving the quality of the wafer obtained by cutting, that is, reducing the wire cutting marks on the surface of the wafer, and ensuring that the curvature and warpage of the wafer meet the standard rate. In addition, the magnetic suction mechanism 400 is arranged near the nozzle 300, and the debris generated during wire cutting can also be adsorbed to improve the problem of debris accumulation in the working fluid, improve the problem of deterioration of the working fluid, reduced stability, and increased wire breakage rate, so as to further ensure that the yield rate of wafer cutting is improved, and is conducive to extending the service life of the working fluid.

[0074] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be subject to various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wire cutting device, characterized in that: include: A driving mechanism (100); A cutting line (200), wherein the cutting line (200) is arranged on the driving mechanism (100), and the driving mechanism (100) drives the cutting line (200) to move along a length extension direction thereof; a spray head (300), wherein a liquid outlet (310) of the spray head (300) is arranged opposite to the cutting line (200), and the spray head (300) is used to spray a working liquid onto the cutting line (200); and A magnetic attraction mechanism (400) is provided adjacent to at least one of the nozzle (300) and the cutting line (200), and is used to absorb magnetic debris generated by the cutting line (200) when cutting the crystal ingot (500) and to reduce vibration of the cutting line (200).

2. The wire cutting device according to claim 1, characterized in that: The driving mechanism (100) comprises two wire wheels (110), the two wire wheels (110) are spaced apart, and the cutting wire (200) is sleeved on the two wire wheels (110); The wire cutting device comprises two nozzles (300), the two nozzles (300) are arranged between the two wire wheels (110), and the two nozzles (300) are spaced apart to form a cutting space for accommodating a crystal ingot (500) to be cut; The wire cutting device further comprises two magnetic attraction mechanisms (400), and the two magnetic attraction mechanisms (400) are arranged in a one-to-one correspondence with the two nozzles (300).

3. The wire cutting device according to claim 1, characterized in that: The magnetic attraction mechanism (400) comprises a plurality of magnets (410), and the plurality of magnets (410) are distributed in an array.

4. The wire cutting device according to claim 3, characterized in that: The plurality of magnets (410) are distributed in a Halbach array.

5. The wire cutting device according to claim 4, characterized in that: The plurality of magnets (410) are distributed in a linear Halbach array.

6. The wire cutting device according to claim 5, characterized in that: The plurality of magnets (410) are arranged in a straight line along the length extension direction of any one of the magnets (410), the cutting line (200) is distributed on one side of the plurality of magnets (410) distributed in a linear Halbach array, and the cutting line (200) is distributed in parallel with the width extension direction of any one of the magnets (410).

7. The wire cutting device according to claim 3, characterized in that: The magnet (410) is a permanent magnet or an electromagnet.

8. The wire cutting device according to claim 1, characterized in that: The magnetic attraction mechanism (400) is arranged adjacent to the liquid outlet (310).

9. The wire cutting device according to claim 8, characterized in that: The nozzle (300) is also provided with a liquid inlet (320), and the liquid inlet (320) is arranged relative to the magnetic attraction mechanism (400), so that the working fluid entering the nozzle (300) from the liquid inlet (320) flows through the magnetic attraction mechanism (400) and then flows from the liquid outlet (310) to the cutting line (200).

10. The wire cutting device according to claim 9, characterized in that: The nozzle (300) is provided with a mounting groove, and the magnetic attraction mechanism (400) is arranged in the mounting groove; and / or, The magnetic attraction mechanism (400) has a first side (401) and a second side (402) that are arranged in opposite directions, the first side (401) is opposite to the cutting line (200) and is arranged at an interval, the second side (402) is opposite to the liquid inlet (320) and is arranged at an interval, and the magnetic field strength of the first side (401) is greater than the magnetic field strength of the second side (402).

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