Film sticking machine for thinning and grinding semiconductor wafer

Abstract

The utility model discloses a film sticking machine for thinning and grinding a semiconductor wafer, which comprises a mounting base, a servo motor is fixedly arranged at the top of the mounting base, a screw rod is fixedly arranged at the output of the servo motor, an auxiliary component is arranged at the right end of the screw rod, and a moving block is arranged on the surface of the screw rod in a threaded manner. And a film pasting table is fixedly arranged at the top of the moving block. Through the arrangement of a servo motor, a screw rod, a connecting bearing, a fixing ring, a mounting plate, a moving block, a film pasting table, a supporting frame, a limiting sliding sleeve and a limiting sliding rail, when a semiconductor wafer on one film pasting table is subjected to film pasting and is moved out, the other film pasting table can move the semiconductor wafer which is not subjected to film pasting to a film pasting position; and in the process of rolling the blue film at the cutting position by the rolling assembly, the semiconductor wafer without film pasting can be moved to the film pasting position, so that the film pasting machine for thinning and grinding the semiconductor wafer does not need to stop to take down the semiconductor wafer with the film pasted and place the semiconductor wafer without film pasting.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafer film lamination, in particular to a film lamination machine for semiconductor wafer thinning and grinding. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. After high-purity polycrystalline silicon is dissolved, silicon crystal seeds are added, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon crystal rod is ground, polished, and sliced, it forms a semiconductor wafer. In the process of semiconductor wafer processing, the semiconductor wafer needs to be filmed before cutting. When filming, in order to protect the semiconductor wafer when cutting the semiconductor wafer, the blue film is generally pasted on the semiconductor wafer after grinding, thinning and polishing.

[0003] For semiconductor wafer lamination, a laminating machine is usually used, such as

[0004] Patent CN201822271553.7 proposes a semiconductor wafer film laminating device. However, in the process of laminating the semiconductor wafer, the semiconductor wafer is first placed inside the film laminating table for film laminating. After the film laminating is completed, the semiconductor wafer is taken out and the unlaminated semiconductor wafer is put in. This operation causes the film laminating machine to stop for too long, resulting in a decrease in the speed of the film laminating machine for laminating the semiconductor wafer. Therefore, a film laminating machine for thinning and grinding semiconductor wafers is proposed. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model provides a film laminating machine for thinning and grinding semiconductor wafers, which is used to solve the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A film laminating machine for semiconductor wafer thinning and grinding comprises a mounting base, a servo motor is fixedly arranged on the top of the mounting base, a screw is fixedly arranged on the output of the servo motor, an auxiliary component is arranged on the right end of the screw, a moving block is threadedly arranged on the surface of the screw, a film laminating table is fixedly arranged on the top of the moving block, a support frame is fixedly arranged on the bottom of the film laminating table, a limiting sliding sleeve is fixedly arranged on the bottom of the support frame, a limiting sliding rail is slidingly arranged inside the limiting sliding sleeve, and the limiting sliding rail is fixedly installed on the side surface of the mounting base, and a cutting component, a unwinding component and a winding component are arranged on the top of the mounting base for facilitating film laminating for thinning and grinding.

[0008] Preferably, the auxiliary component includes a connecting bearing arranged on the surface of the screw, the inner ring of the connecting bearing is connected to the screw, the outer ring of the connecting bearing is fixedly provided with a fixing ring, the right side of the fixing ring is fixedly provided with a mounting plate, and the mounting plate is fixedly installed on the side of the mounting base.

[0009] Preferably, the cutting assembly includes a mounting frame arranged on the top of the mounting base, a vertical electric push rod is fixedly arranged on the top of the mounting frame, the output end of the vertical electric push rod passes through the mounting frame and is fixedly arranged with a moving plate, a driving motor is fixedly arranged on the top of the moving plate, the output end of the driving motor passes through the moving plate and extends to the bottom of the moving plate and is fixedly arranged with a rotating plate, a rotating shaft is fixedly arranged inside the rotating plate, a cutting knife is installed on the rotating plate through the rotating shaft, and the cutting knife is rotatably connected to the rotating shaft.

[0010] Preferably, the unwinding assembly includes a placement rack arranged on the top of the mounting base, the interior of the placement rack is overlapped with an unwinding roller, and the surface of the placement rack is provided with a pressing assembly for facilitating the bonding of the blue film and the semiconductor wafer after thinning and grinding.

[0011] Preferably, the pressing assembly includes a transverse electric push rod arranged on the placement rack, the output end of the transverse electric push rod passes through the placement rack and is fixedly provided with a connecting shaft, the output end of the transverse electric push rod is installed with a moving rack through the connecting shaft, and a pressing roller is rotatably provided inside the moving rack.

[0012] Preferably, the winding assembly includes a support plate arranged on the top of the mounting base, a rotating motor is fixedly arranged on the left side of the support plate, an output end of the rotating motor passes through the support plate and extends to the right side of the support plate and is fixedly arranged with a winding shaft, a winding roller is overlapped on the surface of the winding shaft, a limiting ring for locking the winding roller is threaded on the winding roller, a connecting column is fixedly arranged on the front side of the support plate, and a guide roller is rotatably arranged inside the connecting column.

[0013] Preferably, there are two film sticking stations, and the two film sticking stations are distributed in a linear array.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows: the film laminating machine for thinning and grinding semiconductor wafers, through the arrangement of servo motors, screws, connecting bearings, fixing rings, mounting plates, moving blocks, film laminating tables, support frames, limiting sliding sleeves and limiting sliding rails, when the semiconductor wafer on one film laminating table is completed and moved out, the other film laminating table can move the semiconductor wafer that has not been completed with film laminating to the film laminating position, and in the process of the winding component winding the blue film at the cutting position, the semiconductor wafer that has not been completed with film laminating can be moved to the film laminating position, so that the film laminating machine for thinning and grinding semiconductor wafers does not need to stop to remove the semiconductor wafer that has been completed with film laminating and put in the semiconductor wafer that has not been completed with film laminating. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is the structural survey drawing of the utility model;

[0016] Figure 2 It is a schematic diagram of the longitudinal section of the structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the cutting components of the utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the unwinding component of the utility model;

[0019] Figure 5 This is a schematic diagram of the structure of the winding component of the utility model.

[0020] In the figure: 1. Mounting base; 2. Servo motor; 3. Screw; 4. Connecting bearing; 5. Fixing ring; 6. Mounting plate; 7. Moving block; 8. Film sticking table; 9. Support frame; 10. Limiting sleeve; 11. Limiting slide rail; 12. Mounting frame; 13. Vertical electric push rod; 14. Moving plate; 15. Driving motor; 16. Rotating plate; 17. Cutting knife; 18. Placing frame; 19. Unwinding roller; 20. Horizontal electric push rod; 21. Moving frame; 22. Laminating roller; 23. Support plate; 24. Rotating motor; 25. Winding roller; 26. Limiting ring; 27. Connecting column; 28. Guide roller; 29. ​​Winding shaft. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Reference Figure 1-5A film laminating machine for thinning and grinding semiconductor wafers comprises a mounting base 1, a servo motor 2 is fixedly arranged on the top of the mounting base 1, a screw rod 3 is fixedly arranged on the output of the servo motor 2, an auxiliary component is arranged on the right end of the screw rod 3, the auxiliary component comprises a connecting bearing 4 arranged on the surface of the screw rod 3, the inner ring of the connecting bearing 4 is connected to the screw rod 3, the outer ring of the connecting bearing 4 is fixedly arranged with a fixing ring 5, a mounting plate 6 is fixedly arranged on the right side of the fixing ring 5, and the mounting plate 6 is fixedly installed on the upper side of the mounting base 1. By arranging the connecting bearing 4, the fixing ring 5 and the mounting plate 6, the right end of the screw rod 3 is prevented from being suspended in the air, thereby preventing the screw rod 3 from bending and breaking due to the right end being suspended in the air. A moving block 7 is threadedly arranged on the surface of the screw rod 3, and a film laminating table 8 is fixedly arranged on the top of the moving block 7. There are two film laminating tables 8, and the two film laminating tables 8 are distributed in a linear array. The two film laminating tables 8 can continuously transport semiconductor wafers that need to be laminating, thereby avoiding the need to stop the film laminating machine. In this case, a support frame 9 is fixedly provided at the bottom of the film sticking table 8, a limited sliding sleeve 10 is fixedly provided at the bottom of the support frame 9, a limited sliding rail 11 is slidingly provided inside the limited sliding sleeve 10, and the limited sliding rail 11 is fixedly installed at the position on the side of the mounting base 1, and a cutting component, a unwinding component and a winding component are arranged on the top of the mounting base 1 for facilitating film sticking for thinning and grinding. Through the arrangement of the servo motor 2, the screw 3, the connecting bearing 4, the fixing ring 5, the mounting plate 6, the moving block 7, the film sticking table 8, the support frame 9, the limited sliding sleeve 10 and the limited sliding rail 11, when the semiconductor wafer on one film sticking table 8 is filmed and moved out, the other film sticking table 8 can move the semiconductor wafer that has not been filmed to the film sticking position, and in the process of the winding component winding the blue film at the cutting position, the semiconductor wafer that has not been filmed can be moved to the film sticking position, so that the film sticking machine for semiconductor wafer thinning and grinding does not need to stop to remove the semiconductor wafer that has been filmed and put in the semiconductor wafer that has not been filmed.

[0023] Specifically, the cutting assembly includes a mounting frame 12 arranged on the top of the mounting base 1, a vertical electric push rod 13 is fixedly arranged on the top of the mounting frame 12, the output end of the vertical electric push rod 13 passes through the mounting frame 12 and is fixedly arranged with a moving plate 14, a driving motor 15 is fixedly arranged on the top of the moving plate 14, the output end of the driving motor 15 passes through the moving plate 14 and extends to the bottom of the moving plate 14 and is fixedly arranged with a rotating plate 16, a rotating shaft is fixedly arranged inside the rotating plate 16, a cutting knife 17 is installed on the rotating plate 16 through the rotating shaft, and the cutting knife 17 is rotatably connected to the rotating shaft, the moving plate 14 is pushed downward by the vertical electric push rod 13, so that the cutting knife 17 contacts the blue film, and the driving motor 15 drives the cutting knife 17 to make a circular motion through the rotating plate 16, thereby cutting off the blue film attached to the semiconductor wafer.

[0024] Specifically, the unwinding assembly includes a placement frame 18 arranged on the top of the mounting base 1, and an unwinding roller 19 is overlapped inside the placement frame 18. The winding assembly includes a support plate 23 arranged on the top of the mounting base 1, and a rotating motor 24 is fixedly arranged on the left side of the support plate 23. The output end of the rotating motor 24 passes through the support plate 23 and extends to the right side of the support plate 23 and is fixedly provided with a winding shaft 29. A winding roller 25 is overlapped on the surface of the winding shaft 29, and a limiting ring 26 for locking the winding roller 25 is threadedly arranged on the winding roller 25. A connecting column 27 is fixedly arranged on the front side of the support plate 23, and a guide roller 28 is rotatably arranged inside the connecting column 27. By inserting the winding roller 25 into the surface of the winding shaft 29 and the limiting ring 26 It is screwed into the take-up shaft 29, and the take-up shaft 29 is driven to rotate by the rotating motor 24, and the take-up roller 25 is driven to rotate by the take-up shaft 29, so that the take-up roller 25 reels the cut blue film waste, and at the same time drives the blue film wrapped on the unwinding roller 19 to move to the film pasting table 8, so as to facilitate the film pasting of the semiconductor wafer. The surface of the placement frame 18 is provided with a pressing component for facilitating the lamination of the blue film and the semiconductor wafer after thinning and grinding. The pressing component includes a transverse electric push rod 20 arranged on the placement frame 18, and the output end of the transverse electric push rod 20 passes through the placement frame 18 and is fixedly provided with a connecting shaft. The output end of the transverse electric push rod 20 is installed with a moving frame 21 through the connecting shaft, and a pressing roller 22 is rotated inside the moving frame 21.

[0025] The electrical components mentioned in this article are all connected to an external main controller and 220V mains electricity, and the main controller can be a conventional known device for controlling a computer or the like.

[0026] When in use: semiconductor wafers without film are placed on both film laminating tables 8, and the reel-up shaft 29 is driven by the rotating motor 24 to drive the reel-up roller 25 to rotate, so that the blue film wrapped on the unwinding roller 19 passes through the top of the film laminating table 8, and then the pressing roller 22 is driven to move by the horizontal electric push rod 20, so that the moving frame 21 presses the blue film on the semiconductor wafer row, and then the output end of the vertical electric push rod 13 is driven to push the moving plate 14 downward, so that the driving motor 15 pushes the cutting knife 17 to contact the blue film through the rotating plate 16 and the rotating shaft, and the rotating plate 16 is driven by the output end of the driving motor 15 to move, so that the cutting knife 17 cuts the blue film, and the right film laminating table 8 After the film pasting of the semiconductor wafer on is completed, the output end is driven by the servo motor 2 to drive the screw 3 to rotate, so that the moving block 7 moves to the right along the thread direction of the surface of the screw 3, so that the two film pasting tables 8 move to the right through the moving block 7 at the bottom thereof, and the support frame 9 drives the limiting sliding sleeve 10 to slide to the right on the limiting sliding rail 11, so that the film pasting table 8 on the right side drives the semiconductor wafer with the film pasted to move out, and at the same time, the film pasting table 8 on the left side drives the semiconductor wafer with unfinished film pasting to move to the film pasting position, the semiconductor wafer with the film pasting on the right side is removed, and the semiconductor wafer with unfinished film pasting is placed in the film pasting table 8 on the right side, so that the semiconductor wafers can be continuously pasted.

[0027] To summarize, the film laminating machine for thinning and grinding semiconductor wafers is provided with a servo motor 2, a screw 3, a connecting bearing 4, a fixing ring 5, a mounting plate 6, a moving block 7, a film laminating table 8, a supporting frame 9, a limiting sliding sleeve 10 and a limiting sliding rail 11. When the semiconductor wafer on one film laminating table 8 is film-laminating completed and moved out, the other film laminating table 8 can move the semiconductor wafer that has not been film-laminating completed to the film laminating position, and in the process of the winding component winding the blue film at the cutting position, the semiconductor wafer that has not been film-laminating completed can be moved to the film laminating position, so that the film laminating machine for thinning and grinding semiconductor wafers does not need to stop to remove the semiconductor wafer that has been film-laminating completed and put in the semiconductor wafer that has not been film-laminating completed, which is used to solve the problems raised in the above-mentioned background technology.

[0028] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A film laminating machine for semiconductor wafer thinning and polishing, comprising a mounting base (1), characterized in that: A servo motor (2) is fixedly arranged on the top of the mounting base (1), a screw (3) is fixedly arranged at the output of the servo motor (2), an auxiliary component is arranged at the right end of the screw (3), a moving block (7) is threadedly arranged on the surface of the screw (3), a film pasting table (8) is fixedly arranged on the top of the moving block (7), a support frame (9) is fixedly arranged at the bottom of the film pasting table (8), a limit sleeve (10) is fixedly arranged at the bottom of the support frame (9), a limit slide rail (11) is slidably arranged inside the limit sleeve (10), and the limit slide rail (11) is fixedly installed at a position on the upper side of the mounting base (1), and a cutting component, a reeling component and a reeling component are arranged on the top of the mounting base (1) for facilitating film pasting for thinning and grinding.

2. A film laminating machine for semiconductor wafer thinning and polishing according to claim 1, characterized in that: The auxiliary component comprises a connecting bearing (4) arranged on the surface of the screw rod (3), the inner ring of the connecting bearing (4) is connected to the screw rod (3), the outer ring of the connecting bearing (4) is fixedly provided with a fixing ring (5), the right side of the fixing ring (5) is fixedly provided with a mounting plate (6), and the mounting plate (6) is fixedly installed at a position on the side of the mounting base (1).

3. The film laminating machine for semiconductor wafer thinning and polishing according to claim 1, characterized in that: The cutting assembly comprises a mounting frame (12) arranged on the top of the mounting base (1); a vertical electric push rod (13) is fixedly arranged on the top of the mounting frame (12); an output end of the vertical electric push rod (13) passes through the mounting frame (12) and is fixedly arranged with a moving plate (14); a driving motor (15) is fixedly arranged on the top of the moving plate (14); an output end of the driving motor (15) passes through the moving plate (14) and extends to the bottom of the moving plate (14) and is fixedly arranged with a rotating plate (16); a rotating shaft is fixedly arranged inside the rotating plate (16); a cutting knife (17) is installed on the rotating plate (16) via the rotating shaft, and the cutting knife (17) is rotatably connected to the rotating shaft.

4. The film laminating machine for semiconductor wafer thinning and polishing according to claim 1, characterized in that: The unwinding assembly comprises a placement frame (18) arranged on the top of the mounting base (1), an unwinding roller (19) is overlappedly arranged inside the placement frame (18), and a pressing assembly is arranged on the surface of the placement frame (18) to facilitate the bonding of the blue film and the semiconductor wafer after thinning and grinding.

5. The film laminating machine for semiconductor wafer thinning and polishing according to claim 4, characterized in that: The pressing assembly comprises a transverse electric push rod (20) arranged on a placement frame (18), the output end of the transverse electric push rod (20) passes through the placement frame (18) and is fixedly provided with a connecting shaft, the output end of the transverse electric push rod (20) is installed with a moving frame (21) via the connecting shaft, and a pressing roller (22) is rotatably provided inside the moving frame (21).

6. The film laminating machine for semiconductor wafer thinning and polishing according to claim 1, characterized in that: The winding assembly comprises a support plate (23) arranged on the top of the mounting base (1), a rotating motor (24) is fixedly arranged on the left side of the support plate (23), an output end of the rotating motor (24) passes through the support plate (23) and extends to the right side of the support plate (23) and is fixedly provided with a winding shaft (29), a winding roller (25) is overlapped on the surface of the winding shaft (29), a limiting ring (26) for locking the winding roller (25) is threadedly arranged on the winding roller (25), a connecting column (27) is fixedly arranged on the front side of the support plate (23), and a guide roller (28) is rotatably arranged inside the connecting column (27).

7. The film laminating machine for semiconductor wafer thinning and polishing according to claim 1, characterized in that: The number of the film sticking stations (8) is two, and the two film sticking stations (8) are distributed in a linear array.

Images