Cooling equipment and tritium and carbon sampling device

Abstract

The utility model relates to cooling equipment and a tritium carbon sampling device, a first liquid storage tank is provided with a first liquid storage cavity, a first liquid conveying port and a first liquid return port, the first liquid storage cavity is used for storing first cooling liquid, and the first liquid conveying port and the first liquid return port are both communicated with the first liquid storage cavity; the first conveying pump is provided with a first liquid pumping opening and a first liquid feeding opening which are communicated, and the first liquid pumping opening is communicated with the first liquid conveying opening; the refrigerating mechanism comprises a refrigerating plate and a refrigerating bin, the refrigerating plate is connected with the refrigerating bin, the refrigerating bin is provided with a first liquid inlet, a first liquid outlet and a refrigerating cavity, the first liquid inlet and the first liquid outlet are both communicated with the refrigerating cavity, and the first liquid inlet is communicated with the first liquid feeding port; one end of the heat exchange pipeline communicates with the first liquid outlet, and the other end of the heat exchange pipeline communicates with the first liquid return opening. Compared with the prior art, the cooling equipment and the tritium carbon sampling device can be used for continuously cooling the absorption liquid, so that the cooling effect is ensured.

Description

Technical Field

[0001] The present application relates to the technical field of radioactive material detection, and in particular to a cooling device and a tritium carbon sampling device. Background Art

[0002] A nuclear power plant is a facility that converts nuclear energy into electrical energy through special equipment. The nuclear fuel in the nuclear reactor releases a large amount of heat energy through nuclear fission or nuclear fusion, and then converts the heat energy into electrical energy to provide clean and efficient power resources. However, nuclear power plants generate radioactive substances during operation. These radioactive substances not only pollute the environment, but also cause harm to the human body. Therefore, these radioactive substances need to be treated. During the treatment process, the tritium carbon gas in the radioactive substances needs to be absorbed by the absorption liquid. Since the absorption liquid is easy to volatilize, the absorption liquid needs to be cooled. In traditional technology, fans are usually used to cool the absorption liquid. However, this method has poor cooling effect. Summary of the invention

[0003] Based on this, it is necessary to provide a cooling device and a tritium carbon sampling device to address the problem of poor cooling effect in traditional technologies.

[0004] The technical solution is as follows:

[0005] One embodiment provides a cooling device, comprising:

[0006] A first liquid storage tank, the first liquid storage tank having a first liquid storage cavity, a first liquid infusion port and a first liquid return port, the first liquid storage cavity is used to store a first cooling liquid, and the first liquid infusion port and the first liquid return port are both connected to the first liquid storage cavity;

[0007] a first delivery pump, the first delivery pump having a first liquid extraction port and a first liquid delivery port in communication with each other, the first liquid extraction port being in communication with the first liquid delivery port;

[0008] A refrigeration mechanism, the refrigeration mechanism comprising a refrigeration plate and a refrigeration bin, the refrigeration plate is connected to the refrigeration bin, the refrigeration bin has a first liquid inlet, a first liquid outlet and a refrigeration cavity, the first liquid inlet and the first liquid outlet are both connected to the refrigeration cavity, the first liquid inlet is connected to the first liquid delivery port; and,

[0009] A heat exchange pipeline, one end of which is connected to the first liquid outlet, and the other end of which is connected to the first liquid return port.

[0010] In the above cooling device, the first coolant in the first liquid storage cavity flows from the first liquid infusion port to the first liquid extraction port under the action of the first delivery pump, and then flows to the first liquid inlet of the refrigeration bin through the first liquid delivery port to enter the refrigeration cavity of the refrigeration bin. The refrigeration plate cools the refrigeration bin, thereby cooling the first coolant in the refrigeration cavity. The cooled first coolant flows to the heat exchange pipeline through the first liquid outlet. The heat exchange pipeline exchanges heat with the absorption liquid to cool the absorption liquid. The first coolant after heat exchange flows back to the first liquid storage cavity through the first liquid return port, and so on. Compared with the traditional technology, the above cooling device can continuously cool the absorption liquid, thereby ensuring the cooling effect.

[0011] In one embodiment, the cooling device also includes a second liquid storage tank and a second delivery pump, the second liquid storage tank has a second liquid storage cavity, a second infusion port and a second liquid return port, the second liquid storage cavity is used to store a second coolant, the second infusion port and the second liquid return port are both connected to the second liquid storage cavity, the second delivery pump has a connected second liquid extraction port and a liquid delivery port, the second liquid extraction port is connected to the second liquid infusion port, the refrigeration mechanism also includes a heat absorption bin, the refrigeration plate has a refrigeration surface and a heating surface, the refrigeration bin is arranged on the refrigeration surface, the heat absorption bin is arranged on the heating surface, the heat absorption bin has a second liquid inlet, a second liquid outlet and a heat absorption cavity, the second liquid inlet and the second liquid outlet are both connected to the heat absorption cavity, the second liquid inlet is connected to the second liquid delivery port, and the second liquid outlet is connected to the second liquid return port.

[0012] In one embodiment, the cooling device also includes a heat dissipation mechanism, which includes a heat dissipation pipe and a fin, one end of the heat dissipation pipe is connected to the second liquid outlet, the other end of the heat dissipation pipe is connected to the second liquid return port, and the fin is arranged on the outer wall of the heat dissipation pipe.

[0013] In one embodiment, at least two fins are provided, and all the fins are spaced apart along the axial direction of the heat dissipation pipe.

[0014] In one embodiment, the heat dissipation mechanism also includes an assembly frame and a fan, the assembly frame has an assembly cavity, the heat dissipation pipe is arranged in the assembly cavity, the fan is arranged on the assembly frame and has an air inlet side and an air supply side, the air inlet side faces the assembly cavity, and the air supply side faces the refrigeration mechanism.

[0015] In one embodiment, the heat dissipation mechanism further includes a protective mesh cover, and the protective mesh cover is arranged on the air supply side of the fan.

[0016] In one embodiment, at least two fans are provided, and all of the fans are provided on the assembly frame.

[0017] In one embodiment, the cooling device also includes a base, which includes a first support plate, a second support plate and a first mounting plate, the first support plate and the second support plate are respectively connected to two sides of the first mounting plate, the first support plate, the first mounting plate and the second support plate are arranged to form a first mounting cavity, the first delivery pump is arranged on the first support plate and located in the first mounting cavity, and the second delivery pump is arranged on the second support plate and located in the first mounting cavity.

[0018] In one embodiment, the base also includes a third support plate, a fourth support plate and a second mounting plate, the third support plate and the fourth support plate are respectively connected to two sides of the second mounting plate, the third support plate and the fourth support plate are both arranged on the first mounting plate, the second mounting plate is spaced apart from the first mounting plate to form a second mounting cavity, the refrigeration mechanism is arranged on the first mounting plate and located in the second mounting cavity, and the first liquid storage tank and the second liquid storage tank are both arranged on a side of the second mounting plate away from the refrigeration mechanism.

[0019] Another embodiment provides a tritium carbon sampling device, comprising a cooling device as described in any of the above embodiments.

[0020] In the above tritium carbon sampling device, the first coolant in the first liquid storage cavity flows from the first liquid infusion port to the first liquid extraction port under the action of the first delivery pump, and then flows to the first liquid inlet of the refrigeration bin through the first liquid delivery port to enter the refrigeration cavity of the refrigeration bin. The refrigeration plate cools the refrigeration bin, thereby cooling the first coolant in the refrigeration cavity. The cooled first coolant flows to the heat exchange pipeline through the first liquid outlet. The heat exchange pipeline exchanges heat with the absorption liquid to cool the absorption liquid. The first coolant after heat exchange flows back to the first liquid storage cavity through the first liquid return port, and so on. Compared with traditional technology, the above cooling device can continuously cool the absorption liquid, thereby ensuring the cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a schematic diagram of the overall structure of the cooling device in one embodiment of the present application.

[0023] Figure 2 This is a schematic structural diagram from another angle of the cooling device in one embodiment of the present application.

[0024] Figure 3 It is a structural schematic diagram of a refrigeration mechanism in one embodiment of the present application.

[0025] Notes on the attached drawings:

[0026] 100, first liquid storage tank; 110, first liquid infusion port; 120, first liquid return port; 200, first delivery pump; 210, first liquid extraction port; 220, first liquid delivery port; 300, refrigeration mechanism; 310, refrigeration plate; 320, refrigeration chamber; 321, first liquid inlet; 322, first liquid outlet; 330, heat absorption chamber; 331, second liquid inlet; 332, second liquid outlet; 400, second liquid storage tank; 410, second liquid infusion port; 4 20, second liquid return port; 500, second delivery pump; 510, second liquid extraction port; 520, second liquid delivery port; 600, heat dissipation mechanism; 610, heat dissipation pipe; 620, fin; 630, assembly frame; 640, fan; 650, protective mesh cover; 700, base; 710, first support plate; 720, second support plate; 730, third support plate; 740, fourth support plate; 750, first mounting plate; 760, second mounting plate. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0028] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0029] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0030] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0031] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0032] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0033] See also Figure 1 to Figure 2An embodiment of the present application provides a cooling device, including a first liquid storage tank 100, a first delivery pump 200, a refrigeration mechanism 300 and a heat exchange pipeline (not shown in the figure), the first liquid storage tank 100 has a first liquid storage cavity, a first liquid infusion port 110 and a first liquid return port 120, the first liquid storage cavity is used to store a first cooling liquid, the first liquid infusion port 110 and the first liquid return port 120 are both connected to the first liquid storage cavity; the first delivery pump 200 has a first liquid extraction port 210 and a first liquid delivery port 220 that are connected, the first liquid storage cavity is used to store a first cooling liquid, the first liquid infusion port 110 and the first liquid return port 120 are both connected to the first liquid storage cavity; the first liquid delivery pump 200 has a first liquid extraction port 210 and a first liquid delivery port 220 that are connected, The liquid extraction port 210 is connected to the first liquid infusion port 110; the refrigeration mechanism 300 includes a refrigeration plate 310 and a refrigeration bin 320, the refrigeration plate 310 is connected to the refrigeration bin 320, the refrigeration bin 320 has a first liquid inlet 321, a first liquid outlet 322 and a refrigeration cavity, the first liquid inlet 321 and the first liquid outlet 322 are both connected to the refrigeration cavity, and the first liquid inlet 321 is connected to the first liquid delivery port 220; one end of the heat exchange pipeline is connected to the first liquid outlet 322, and the other end of the heat exchange pipeline is connected to the first liquid return port 120.

[0034] In the above cooling device, the first coolant in the first liquid storage cavity flows from the first liquid infusion port 110 to the first liquid extraction port 210 under the action of the first delivery pump 200, and then flows to the first liquid inlet 321 of the refrigeration bin 320 through the first liquid delivery port 220 to enter the refrigeration cavity of the refrigeration bin 320. The refrigeration plate 310 cools the refrigeration bin 320, thereby cooling the first coolant in the refrigeration cavity. The cooled first coolant flows to the heat exchange pipeline through the first liquid outlet 322. The heat exchange pipeline exchanges heat with the absorption liquid to cool the absorption liquid. The first coolant after heat exchange flows back to the first liquid storage cavity through the first liquid return port 120, and so on. Compared with the traditional technology, the above cooling device can continuously cool the absorption liquid, thereby ensuring the cooling effect.

[0035] In addition, by cooling the absorption liquid, the solubility of the radioactive gas in the absorption liquid can be increased, thereby improving the absorption capacity of the absorption liquid for radioactive substances.

[0036] In one embodiment, the cooling device also includes a plurality of connecting pipelines (not shown in the figure), and the first infusion port 110 and the first liquid extraction port 210, the first liquid delivery port 220 and the first liquid inlet 321, the first liquid outlet 322 and the heat exchange pipeline, and the heat exchange pipeline and the first liquid return port 120 are all connected through connecting pipelines, which has a simple structure and strong connection reliability.

[0037] See also Figures 1 to 3In one embodiment, the cooling device further comprises a second liquid storage tank 400 and a second delivery pump 500, wherein the second liquid storage tank 400 comprises a second liquid storage cavity, a second liquid infusion port 410 and a second liquid return port 420, wherein the second liquid storage cavity is used to store a second cooling liquid, and the second liquid infusion port 410 and the second liquid return port 420 are both connected to the second liquid storage cavity, and the second delivery pump 500 comprises a second liquid extraction port 510 and a second liquid delivery port 520 connected to each other, and the second liquid extraction port 510 is connected to the second liquid infusion port 410 and the second liquid return port 420. 10 is connected, the refrigeration mechanism 300 also includes a heat absorption chamber 330, the refrigeration plate 310 has a refrigeration surface and a heating surface, the refrigeration chamber 320 is arranged on the refrigeration surface, the heat absorption chamber 330 is arranged on the heating surface, the heat absorption chamber 330 has a second liquid inlet 331, a second liquid outlet 332 and a heat absorption cavity, the second liquid inlet 331 and the second liquid outlet 332 are both connected to the heat absorption cavity, the second liquid inlet 331 is connected to the second liquid delivery port 520, and the second liquid outlet 332 is connected to the second liquid return port 420.

[0038] Under the action of the second delivery pump 500, the second coolant in the second liquid storage tank 400 flows from the second infusion port 410 to the first liquid extraction port 210, and then flows through the second liquid delivery port 520 to the second liquid inlet 331 of the heat absorption bin 330, so as to enter the heat absorption cavity of the heat absorption bin 330. Since the heat absorption bin 330 is located on the heating surface of the refrigeration plate 310, the second coolant in the heat absorption bin 330 can exchange heat with the heating surface to take away the heat of the heating surface of the refrigeration plate 310. The second coolant after heat exchange flows to the second liquid return port 420 through the second liquid outlet 332, and then flows back to the second liquid storage cavity, and so on and so forth to fully take away the heat of the heating surface, thereby ensuring that the refrigeration surface of the refrigeration plate 310 can have a better refrigeration effect.

[0039] Specifically, the cooling plate 310 is a semiconductor refrigerator (TEC, Thermoelectric Coole), which includes a semiconductor crystal, a cold end substrate arranged at the cold end of the semiconductor crystal, and a hot end substrate at the hot end. The semiconductor crystal includes at least two Peltier elements, which are arranged in series between the hot end and the cold end, with an N-type semiconductor between the two P-type semiconductors, and a P-type semiconductor between the two N-type semiconductors; specifically in the above embodiment, the hot end substrate serves as a heating surface, and the cold end substrate serves as a cooling surface. The cooling effect of the cooling surface is usually determined by the temperature of the heating surface. The lower the temperature of the heating surface, the better the cooling effect of the cooling surface. Therefore, the heating surface is cooled by the second coolant to ensure that the cooling surface has a better cooling effect.

[0040] Optionally, the first coolant may be water, or liquids such as oil, and the second coolant may be water, or liquids such as oil, which are not specifically limited here.

[0041] Furthermore, the first liquid storage tank 100 is provided with a first liquid exchange port, which is connected to the first liquid storage chamber, and the staff can replace the first coolant in the first liquid storage chamber through the first liquid exchange port. The second liquid storage tank 400 is provided with a second liquid exchange port, which is connected to the second liquid storage chamber, and the staff can replace the second coolant in the second liquid storage chamber through the second liquid exchange port, thereby improving operational convenience.

[0042] Please refer to 1. In one embodiment, at least two refrigeration mechanisms 300 are provided, and the first coolant can be cooled by at least two refrigeration mechanisms 300 to further improve the refrigeration efficiency.

[0043] Furthermore, at least two refrigeration plates 310, refrigeration bins 320 and heat absorption bins 330 are provided, and the refrigeration bins 320 and the refrigeration plates 310 are arranged in a one-to-one correspondence, and the heat absorption bins 330 and the refrigeration plates 310 are arranged in a one-to-one correspondence; between two adjacent refrigeration bins 320, the first liquid outlet 322 of one refrigeration bin 320 is connected to the first liquid inlet 321 of the other refrigeration bin 320; between two adjacent heat absorption bins 330, the second liquid outlet 332 of one heat absorption bin 330 is connected to the second liquid inlet 331 of the other heat absorption bin 330.

[0044] Please refer to 1 to Figure 2 In one embodiment, the cooling device also includes a heat dissipation mechanism 600, which includes a heat dissipation pipe 610 and a fin 620, one end of the heat dissipation pipe 610 is connected to the second liquid outlet 332, and the other end of the heat dissipation pipe 610 is connected to the second liquid return port 420, and the fin 620 is arranged on the outer wall of the heat dissipation pipe 610.

[0045] The second coolant enters the heat dissipation tube 610 through the second liquid outlet 332, and fully exchanges heat with the surrounding environment under the action of the fins 620 on the outer wall of the heat dissipation tube 610, thereby cooling the second coolant. The cooled second coolant enters the second liquid storage chamber again through the second liquid return port 420 for the next round of heat exchange.

[0046] As an explanation, by providing the fins 620 on the outer wall of the heat dissipation pipe 610 , the heat exchange area can be increased to fully exchange heat for the second coolant.

[0047] See also Figure 2 In one embodiment, at least two fins 620 are provided, and all the fins 620 are spaced apart along the axial direction of the heat pipe 610 .

[0048] By arranging at least two fins 620 at intervals along the axial direction of the heat dissipation pipe 610 , the heat exchange area can be further increased to dissipate the heat of the second coolant more fully.

[0049] See also Figure 1 In one embodiment, the heat dissipation mechanism 600 further includes an assembly frame 630 and a fan 640, the assembly frame 630 has an assembly cavity, the heat dissipation pipe 610 is arranged in the assembly cavity, the fan 640 is arranged on the assembly frame 630 and has an air inlet side and an air supply side, the air inlet side faces the assembly cavity, and the air supply side faces the refrigeration mechanism 300.

[0050] The air inlet side of the fan 640 is directed toward the assembly cavity to drive the gas around the heat dissipation pipe 610 in the assembly cavity to move, thereby improving the heat exchange efficiency of the heat dissipation pipe 610; the air supply side of the fan 640 is directed toward the refrigeration mechanism 300 to drive the gas around the refrigeration plate 310 to move, thereby preventing the refrigeration plate 310 and the components around the refrigeration plate 310 from generating condensed water and causing malfunctions of the electrical components in the cooling device.

[0051] Furthermore, the air supply side of the fan 640 is directed toward the refrigeration mechanism 300 as well as a number of connecting pipes (not shown in the figure). Since condensed water is generated on the outer walls of the connecting pipes when the first coolant and the second coolant flow between the connecting pipes, the fan 640 can accelerate the gas flow speed near the outer walls of the connecting pipes to better suppress the generation of condensed water on the outer walls of the connecting pipes and prevent electrical components in the cooling equipment from malfunctioning.

[0052] Furthermore, the outer wall of the connecting pipe is also covered with a heat insulation layer to further suppress the generation of condensed water on the outer wall of the connecting pipe and prevent the electrical components in the cooling device from malfunctioning.

[0053] During specific implementation, the connecting pipeline should be set on one side of the device as much as possible to facilitate management.

[0054] Specifically, the heat dissipation pipe 610 is coiled and arranged in the assembly cavity, thereby ensuring the heat exchange area while improving the overall structural compactness of the cooling device.

[0055] See also Figure 1 In one embodiment, the heat dissipation mechanism 600 further includes a protective mesh cover 650 , which is disposed on the air supply side of the fan 640 .

[0056] The protective mesh cover 650 can not only prevent the staff from accidentally touching the rotating fan 640, thereby improving the safety of the cooling equipment during use, but also prevent large foreign objects from flying from the air supply side of the fan 640 to other components in the cooling equipment, thereby preventing damage to the cooling equipment and increasing the service life of the cooling equipment.

[0057] See also Figure 1 In one embodiment, at least two fans 640 are provided, and all fans 640 are provided on the assembly frame 630 .

[0058] By providing at least two fans 640, the flow of airflow can be further accelerated, which can not only improve the heat dissipation efficiency of the heat dissipation mechanism 600, but also better suppress the generation of condensed water and prevent the electrical components in the cooling device from malfunctioning.

[0059] Optionally, at least two fans 640 may be provided. Figure 1 In the manner shown, the fans 640 are arranged flat on the assembly frame 630. In other embodiments, at least two fans 640 may also be stacked on each other, which is not specifically limited here.

[0060] See also Figure 1 In one embodiment, the cooling device also includes a base 700, the base 700 includes a first support plate 710, a second support plate 720 and a first mounting plate 750, the first support plate 710 and the second support plate 720 are respectively connected to two sides of the first mounting plate 750, the first support plate 710, the first mounting plate 750 and the second support plate 720 are surrounded to form a first mounting cavity, the first delivery pump 200 is arranged on the first support plate 710 and is located in the first mounting cavity, and the second delivery pump 500 is arranged on the second support plate 720 and is located in the first mounting cavity.

[0061] The first support plate 710, the second support plate 720 and the first mounting plate 750 are arranged to form a first mounting cavity, the first delivery pump 200 is arranged on the first support plate 710, the second delivery pump 500 is arranged on the second support plate 720, and the first delivery pump 200 and the second delivery pump 500 are both arranged in the mounting cavity. In this way, a certain protection effect can be provided for the first delivery pump 200 and the second delivery pump 500 to prevent the first delivery pump 200 and the second delivery pump 500 from colliding during transportation, and the overall structure of the cooling equipment can be made more compact and the space occupancy rate can be reduced.

[0062] See also Figure 1 In one embodiment, the base 700 further includes a third support plate 730, a fourth support plate 740 and a second mounting plate 760, the third support plate 730 and the fourth support plate 740 are respectively connected to two sides of the second mounting plate 760, the third support plate 730 and the fourth support plate 740 are both arranged on the first mounting plate 750, the second mounting plate 760 is spaced apart from the first mounting plate 750 to form a second mounting cavity, the refrigeration mechanism 300 is arranged on the first mounting plate 750 and is located in the second mounting cavity, and the first liquid storage tank 100 and the second liquid storage tank 400 are both arranged on a side of the second mounting plate 760 away from the refrigeration mechanism 300.

[0063] The refrigeration mechanism 300 is located in the second installation cavity, which can provide a certain protection effect for the refrigeration mechanism 300 to prevent the refrigeration mechanism 300 from being hit during transportation, and can also make the overall structure of the cooling device more compact and reduce space occupancy.

[0064] For explanation, the second mounting plate 760 is spaced apart from the first mounting plate 750 , so that the first mounting plate 750 , the third support plate 730 , the second mounting plate 760 and the fourth support plate 740 are sequentially arranged to form a second mounting cavity.

[0065] For further information, see Figure 1 The first installation cavity and the second installation cavity are both through cavities with openings on both sides, and the opening direction is set toward the air supply side of the fan 640. In this way, the fan 640 can drive the air flow in the second installation cavity and the second installation cavity more smoothly to prevent the generation of condensed water.

[0066] Another embodiment provides a tritium carbon sampling device, comprising a cooling device as described in any of the above embodiments.

[0067] In the above tritium carbon sampling device, the first coolant in the first liquid storage cavity flows from the first liquid infusion port 110 to the first liquid extraction port 210 under the action of the first delivery pump 200, and then flows to the first liquid inlet 321 of the refrigeration bin 320 through the first liquid delivery port 220 to enter the refrigeration cavity of the refrigeration bin 320. The refrigeration plate 310 cools the refrigeration bin 320, thereby cooling the first coolant in the refrigeration cavity. The cooled first coolant flows to the heat exchange pipeline through the first liquid outlet 322. The heat exchange pipeline exchanges heat with the absorption liquid to cool the absorption liquid. The first coolant after heat exchange flows back to the first liquid storage cavity through the first liquid return port 120, and so on. Compared with the traditional technology, the above cooling device can continuously cool the absorption liquid, thereby ensuring the cooling effect.

[0068] In one embodiment, the tritium carbon sampling device further includes an absorption bottle, in which an absorption liquid is arranged, and a heat exchange pipeline is arranged in the absorption bottle and in contact with the absorption liquid to absorb heat from the absorption liquid.

[0069] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A cooling device, characterized in that: include: A first liquid storage tank, the first liquid storage tank having a first liquid storage cavity, a first liquid infusion port and a first liquid return port, the first liquid storage cavity is used to store a first cooling liquid, and the first liquid infusion port and the first liquid return port are both connected to the first liquid storage cavity; a first delivery pump, the first delivery pump having a first liquid extraction port and a first liquid delivery port in communication with each other, the first liquid extraction port being in communication with the first liquid delivery port; A refrigeration mechanism, the refrigeration mechanism comprising a refrigeration plate and a refrigeration bin, the refrigeration plate is connected to the refrigeration bin, the refrigeration bin has a first liquid inlet, a first liquid outlet and a refrigeration cavity, the first liquid inlet and the first liquid outlet are both connected to the refrigeration cavity, the first liquid inlet is connected to the first liquid delivery port; and, A heat exchange pipeline, one end of which is connected to the first liquid outlet, and the other end of which is connected to the first liquid return port.

2. The cooling device according to claim 1, characterized in that: The cooling device also includes a second liquid storage tank and a second delivery pump, the second liquid storage tank has a second liquid storage cavity, a second infusion port and a second liquid return port, the second liquid storage cavity is used to store a second cooling liquid, the second infusion port and the second liquid return port are both connected to the second liquid storage cavity, the second delivery pump has a second liquid extraction port and a liquid delivery port that are connected, the second liquid extraction port is connected to the second liquid infusion port, the refrigeration mechanism also includes a heat absorption bin, the refrigeration plate has a refrigeration surface and a heating surface, the refrigeration bin is arranged on the refrigeration surface, the heat absorption bin is arranged on the heating surface, the heat absorption bin has a second liquid inlet, a second liquid outlet and a heat absorption cavity, the second liquid inlet and the second liquid outlet are both connected to the heat absorption cavity, the second liquid inlet is connected to the second liquid delivery port, and the second liquid outlet is connected to the second liquid return port.

3. The cooling device according to claim 2, characterized in that: The cooling device also includes a heat dissipation mechanism, which includes a heat dissipation pipe and fins. One end of the heat dissipation pipe is connected to the second liquid outlet, and the other end of the heat dissipation pipe is connected to the second liquid return port. The fins are arranged on the outer wall of the heat dissipation pipe.

4. The cooling device according to claim 3, characterized in that: At least two fins are provided, and all the fins are spaced apart along the axial direction of the heat dissipation pipe.

5. The cooling device according to claim 3, characterized in that: The heat dissipation mechanism also includes an assembly frame and a fan. The assembly frame has an assembly cavity. The heat dissipation pipe is arranged in the assembly cavity. The fan is arranged on the assembly frame and has an air inlet side and an air supply side. The air inlet side faces the assembly cavity, and the air supply side faces the refrigeration mechanism.

6. The cooling device according to claim 5, characterized in that The heat dissipation mechanism further comprises a protective mesh cover, and the protective mesh cover is arranged on the air supply side of the fan.

7. The cooling device according to claim 5, characterized in that At least two fans are provided, and all the fans are arranged on the assembly frame.

8. The cooling device according to claim 2, characterized in that: The cooling device also includes a base, which includes a first support plate, a second support plate and a first mounting plate, the first support plate and the second support plate are respectively connected to two sides of the first mounting plate, the first support plate, the first mounting plate and the second support plate are arranged to form a first mounting cavity, the first delivery pump is arranged on the first support plate and located in the first mounting cavity, and the second delivery pump is arranged on the second support plate and located in the first mounting cavity.

9. The cooling device according to claim 8, characterized in that The base also includes a third support plate, a fourth support plate and a second mounting plate, the third support plate and the fourth support plate are respectively connected to two sides of the second mounting plate, the third support plate and the fourth support plate are both arranged on the first mounting plate, the second mounting plate is spaced apart from the first mounting plate to form a second mounting cavity, the refrigeration mechanism is arranged on the first mounting plate and located in the second mounting cavity, and the first liquid storage tank and the second liquid storage tank are both arranged on a side of the second mounting plate away from the refrigeration mechanism.

10. A tritium carbon sampling device, characterized in that: Comprising a cooling device as described in any one of claims 1-9.

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